Effective August 2017 Technical Data 4314 Supersedes November 2011 SD6030 Low profile shielded drum core power inductors Applications • Notebook, laptop computers • Digital cameras • LED Drivers • TFT LCD Bias supplies • Wireless handsets • Handheld instruments • Gaming consoles Product features • GPS devices • 6.0 mm x 6.0 mm x 3.0 mm surface mount • Battery backup/power package Environmental data • Ferrite core material • Shielded drum core reduces EMI • Storage temperature range (component): • Inductance range from 2.7 µH to 660 µH -40 °C to +125 °C • Current range from 0.16 A to 4.08 A • Operating temperature range: -40 °C to +125 °C • Frequency range up to 1 MHz (ambient plus self-temperature rise) • Solder reflow temperature: J-STD-020 (latest revision) compliant HALOGEN Pb HF FREE

SD6030 Technical Data 4314 Low profile shielded drum core power inductors Effective August 2017 Product specifications Part Number5 OCL1 µH ± 30% Irms2 (A) Isat3.(A) Typ. DCR mW(cid:0)@ +20 °C Max DCR mW @ +20 °C K-factor4 SD6030-2R7-R 2.7 4.08 2.60 13 18 34 SD6030-3R3-R 3.3 3.54 2.40 18 24 30 SD6030-4R2-R 4.1 3.11 2.20 23 31 27 SD6030-5R0-R 4.9 2.81 1.90 28 38 24 SD6030-5R8-R 5.8 2.58 1.80 33 45 22 SD6030-7R8-R 7.8 2.38 1.60 39 53 19 SD6030-100-R 9.3 2.15 1.30 48 65 17 SD6030-120-R 11.3 1.99 1.20 56 76 16 SD6030-150-R 14.1 1.71 1.10 76 103 14 SD6030-180-R 17.1 1.65 1.00 82 110 13 SD6030-220-R 20.4 1.57 0.90 90 122 12 SD6030-270-R 26.0 1.31 0.85 130 175 11 SD6030-330-R 32.4 1.26 0.75 140 189 9.3 SD6030-360-R 34.4 1.19 0.70 157 212 8.7 SD6030-440-R 44.0 1.10 0.62 185 250 7.9 SD6030-520-R 52.0 0.99 0.58 226 305 7.2 SD6030-680-R 65.6 0.92 0.52 263 355 6.5 SD6030-820-R 81.6 0.80 0.46 343 463 5.9 SD6030-101-R 94.4 0.76 0.42 385 520 5.6 SD6030-121-R 110.1 0.70 0.40 517 620 5.6 SD6030-151-R 144.5 0.64 0.35 608 730 5.0 SD6030-181-R 175.7 0.55 0.32 817 980 4.5 SD6030-221-R 210.9 0.50 0.30 1000 1200 4.0 SD6030-271-R 264.2 0.44 0.27 1300 1560 3.6 SD6030-331-R 313.5 0.38 0.25 1733 2080 3.3 SD6030-391-R 373.7 0.35 0.22 2083 2500 3.0 SD6030-471-R 460.0 0.33 0.20 2250 2700 2.8 SD6030-561-R 546.2 0.30 0.18 2767 3320 2.5 SD6030-681-R 659.4 0.27 0.16 3458 4150 2.3 1)Open Circuit Inductance Test Parameters: 100 kHz, 0.1 Vrms, 0.0 Adc. 4 K-factor: Used to determine Bp-pfor core loss (see graph). Bp-p= K*L*DI, Bp-p(mT), K: 2I rms: DC current for an approximate DT of 40 °C without core loss. Derating is necessary (K factor from table), L: (Inductance in mH), DI (Peak to peak ripple current in Amps). for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other 5 Part Number Definition: SD6030-xxx-R heat generating components will affect the temperature rise. It is recommended that the SD6030 = Product code and size; -xxx = Inductance value in mH; temperature of the part not exceed +125 °C under worst case operating conditions veri- R = decimal point; If no R is present, third character equals fied in the end application. number of zeros. -R suffix = RoHS compliant 3 Isat Amps peak for 35% rolloff (@ +25 °C) Dimensions-mm arts per reel. Part Marking: xxx = Inductance value in uH. R = decimal point. If no R is present third character = # of zeros, wwlly or wwllyy = Date code, R = Revision level. Do not route traces or vias underneath the inductor Packaging information-mm Parts packaged on 13" diameter reel, 2000 parts per reel. 2 www.eaton.com/electronics

SD6030 Technical Data 4314 Low profile shielded drum core power inductors Effective August 2017 Core loss vs Bp-p 500kHz 1MHz 300kHz 1 200kHz 100kHz 0.1 W) ss ( o 0.01 ore L C 0.001 0.0001 1 10 100 1000 Bp-p (mT) Temperature rise vs total loss Inductance characteristics -40°C +25°C +85°C www.eaton.com/electronics 3

SD6030 Technical Data 4314 Low profile shielded drum core power inductors Effective August 2017 Solder Reflow Profile TP TTaabbllee 11 -- SSttaannddaarrdd SSnnPPbb SSoollddeerr ((TTcc)) TC -5°C Max. Ramp Up Rate = 3°C/s tP Volume Volume Max. Ramp Down Rate = 6°C/s Package mm3 mm3 Thickness <350 >_350 TL <2.5mm 235°C 220°C Preheat t A >_2.5mm 220°C 220°C e Tsmax atur TTaabbllee 22 -- LLeeaadd ((PPbb)) FFrreeee SSoollddeerr ((TTcc)) per Volume Volume Volume Tem Tsmin ts Package mm3 mm3 mm3 Thickness <350 350 - 2000 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak (cid:129)Temperature min.(Tsmin) 100°C 150°C (cid:129)Temperature max.(Tsmax) 150°C 200°C (cid:129)Time (Tsminto Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmaxto Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (TL) 183°C 217°C Time at liquidous (tL) 60-150 Seconds 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp)** within 5 °C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds** Average ramp-down rate (Tpto Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. *Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Eaton is a registered trademark. Printed in USA Publication No. 4314 BU-SB111167 All other trademarks are property August 2017 of their respective owners.