Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/, use http://www.nexperia.com Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: - © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights reserved Should be replaced with: - © Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e-mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia

PMLL4153 High-speed diode Rev. 3 — 19 August 2010 Product data sheet 1. Product profile 1.1 General description High-speed switching diode fabricated in planar technology, and encapsulated in a small hermetically sealed glass SOD80C Surface-Mounted Device(SMD) package. 1.2 Features and benefits (cid:132) High switching speed: max.4ns (cid:132) General application (cid:132) Reverse voltage: max.50V (cid:132) Repetitive peak reverse voltage: max.75V (cid:132) Repetitive peak forward current: max.450mA (cid:132) Small hermetically sealed glass SMD package 1.3 Applications (cid:132) High-speed switching (cid:132) Military and industrial applications 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit I forward current [1] - - 200 mA F V reverse voltage - - 50 V R V forward voltage I =50mA 740 - 880 mV F F [1] Device mounted on an FR4 Printed-Circuit Board (PCB). 2. Pinning information Table 2. Pinning Pin Description Simplified outline Graphic symbol 1 cathode [1] 2 anode k a 1 2 006aab040 [1] The marking band indicates the cathode.

PMLL4153 NXP Semiconductors High-speed diode 3. Ordering information Table 3. Ordering information Type number Package Name Description Version PMLL4153 - hermetically sealed glass surface-mounted package; SOD80C 2connectors 4. Marking Table 4. Marking codes Type number Marking code PMLL4153 marking band 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V repetitive peak reverse - 75 V RRM voltage V reverse voltage - 50 V R I forward current [1] - 200 mA F I repetitive peak forward - 450 mA FRM current I non-repetitive peak square wave [2] FSM forward current t =1μs - 4 A p t =1ms - 1 A p t =1s - 0.5 A p P total power dissipation T ≤25°C [1] - 500 mW tot amb T junction temperature - 200 °C j T storage temperature −65 +200 °C stg [1] Device mounted on an FR4PCB. [2] Tj=25°C prior to surge. 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit R thermal resistance from - - 300 K/W th(j-t) junction to tie-point R thermal resistance from in free air [1] - - 350 K/W th(j-a) junction to ambient [1] Device mounted on an FR4PCB. PMLL4153 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 19 August 2010 2 of 10

PMLL4153 NXP Semiconductors High-speed diode 7. Characteristics Table 7. Characteristics T =25°C unless otherwise specified. j Symbol Parameter Conditions Min Typ Max Unit V forward voltage I =0.1mA 490 - 550 mV F F I =0.25mA 530 - 590 mV F I =1mA 590 - 670 mV F I =2mA 620 - 700 mV F I =10mA 700 - 810 mV F I =50mA 740 - 880 mV F I reverse current V =50V - - 0.05 μA R R V =50V; T =150°C - - 50 μA R j C diode capacitance V =0V; f=1MHz - - 2 pF d R t reverse recovery time [1] - - 4 ns rr [2] - - 2 ns t forward recovery time [3] - - 10 ns fr [1] When switched from IF=10mA to IR=10mA; RL=100Ω; measured at IR=1mA. [2] When switched from IF=10mA to IR=60mA; RL=100Ω; measured at IR=1mA. [3] When switched to I =200mA; t =0.4ns; measured at V =1V. F r F mbg451 mbg464 300 600 IF IF (mA) (mA) 200 400 (1) (2) (3) 100 200 0 0 0 100 Tamb (°C) 200 0 1 VF (V) 2 Device mounted on an FR4Printed-Circuit Board(PCB). (1) Tj=175°C; typicalvalues (2) Tj=25°C; typicalvalues (3) Tj=25°C; maximumvalues Fig 1. Forward current as a function of ambient Fig 2. Forward current as a function of forward temperature; derating curve voltage PMLL4153 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 19 August 2010 3 of 10

PMLL4153 NXP Semiconductors High-speed diode 102 mbg704 IFSM (A) 10 1 10−1 1 10 102 103 104 tp (μs) Based on square wave currents. Tj=25°C prior to surge Fig 3. Non-repetitive peak forward current as a function of pulse duration; maximum values 103 mgd006 1.2 mgd004 (μIRA) Cd (pF) 102 1.0 (1) (2) (3) 10 0.8 1 0.6 10−1 10−2 0.4 0 100 200 0 10 20 Tj (°C) VR (V) (1) VR=75V; maximumvalues f=1MHz; Tj=25°C (2) V =75V; typicalvalues R (3) V =20V; typicalvalues R Fig 4. Reverse current as a function of junction Fig 5. Diode capacitance as a function of reverse temperature voltage; typical values PMLL4153 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 19 August 2010 4 of 10

PMLL4153 NXP Semiconductors High-speed diode 8. Test information tr tp t D.U.T. 10 % RS = 50 Ω IF SAMPLING + IF trr t OSCILLOSCOPE V = VR + IF × RS Ri = 50 Ω 90 % (1) VR mga881 input signal output signal Fig 6. Reverse recovery voltage test circuit and waveforms I 1 kΩ 450 Ω I 1.0 90% VF RS = 50 Ω D.U.T. OSCILLOSCOPE (V) Vfr Ri = 50 Ω 10% t tfr t tr tp input output signal signal mbh181 Input signal: forward pulse rise time tr=0.4ns; forward pulse duration tp=100ns; duty factor δ=0.01 Fig 7. Forward recovery time test circuit and waveforms 9. Package outline 1.60 0.3 0.3 1.45 3.7 3.3 Dimensions in mm 06-03-16 Fig 8. Package outline SOD80C PMLL4153 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 19 August 2010 5 of 10

PMLL4153 NXP Semiconductors High-speed diode 10. Packing information Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 2500 10000 PMLL4153 SOD80C 4mm pitch, 8mm tape and reel -115 -135 [1] For further information and the availability of packing methods, see Section14. 11. Soldering 4.55 4.30 2.30 solder lands solder paste 2.25 1.70 1.60 solder resist occupied area Dimensions in mm 0.90 sod080c (2x) Fig 9. Reflow soldering footprint SOD80C 6.30 4.90 2.70 1.90 solder lands solder resist 2.90 1.70 occupied area tracks Dimensions in mm sod080c Fig 10. Wave soldering footprint SOD80C PMLL4153 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 19 August 2010 6 of 10

PMLL4153 NXP Semiconductors High-speed diode 12. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes PMLL4153v.3 20100819 Product data sheet - PMLL4150_2 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Type numbers PMLL4150 and PMLL4151 removed. • Legal texts have been adapted to the new company name where appropriate. • Table 1 “Quick reference data”: added • Section 4 “Marking”: added • Figure1: updated • Figure8: superseded by minimized package outline drawing • Section 10 “Packing information”: added • Section 11 “Soldering”: added • Section 13 “Legal information”: updated PMLL4150_2 19960918 Product specification - PMLL4150_1 PMLL4150_1 19960423 Product specification - - PMLL4153 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 19 August 2010 7 of 10

PMLL4153 NXP Semiconductors High-speed diode 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URLhttp://www.nxp.com. 13.2 Definitions malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of Draft — The document is a draft version only. The content is still under NXP Semiconductors products in such equipment or applications and internal review and subject to formal approval, which may result in therefore such inclusion and/or use is at the customer’s own risk. modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of Applications — Applications that are described herein for any of these information included herein and shall have no liability for the consequences of products are for illustrative purposes only. NXP Semiconductors makes no use of such information. representation or warranty that such applications will be suitable for the specified use without further testing or modification. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended Customers are responsible for the design and operation of their applications for quick reference only and should not be relied upon to contain detailed and and products using NXP Semiconductors products, and NXP Semiconductors full information. For detailed and full information see the relevant full data accepts no liability for any assistance with applications or customer product sheet, which is available on request via the local NXP Semiconductors sales design. It is customer’s sole responsibility to determine whether the NXP office. In case of any inconsistency or conflict with the short data sheet, the Semiconductors product is suitable and fit for the customer’s applications and full data sheet shall prevail. products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate Product specification — The information and data provided in a Product design and operating safeguards to minimize the risks associated with their data sheet shall define the specification of the product as agreed between applications and products. NXP Semiconductors and its customer, unless NXP Semiconductors and NXP Semiconductors does not accept any liability related to any default, customer have explicitly agreed otherwise in writing. In no event however, damage, costs or problem which is based on any weakness or default in the shall an agreement be valid in which the NXP Semiconductors product is customer’s applications or products, or the application or use by customer’s deemed to offer functions and qualities beyond those described in the third party customer(s). Customer is responsible for doing all necessary Product data sheet. testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and 13.3 Disclaimers the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limited warranty and liability — Information in this document is believed to Limiting values — Stress above one or more limiting values (as defined in be accurate and reliable. However, NXP Semiconductors does not give any the Absolute Maximum Ratings System of IEC60134) will cause permanent representations or warranties, expressed or implied, as to the accuracy or damage to the device. Limiting values are stress ratings only and (proper) completeness of such information and shall have no liability for the operation of the device at these or any other conditions above those given in consequences of use of such information. the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or In no event shall NXP Semiconductors be liable for any indirect, incidental, repeated exposure to limiting values will permanently and irreversibly affect punitive, special or consequential damages (including - without limitation - lost the quality and reliability of the device. profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such Terms and conditions of commercial sale — NXP Semiconductors damages are based on tort (including negligence), warranty, breach of products are sold subject to the general terms and conditions of commercial contract or any other legal theory. sale, as published at http://www.nxp.com/profile/terms, unless otherwise Notwithstanding any damages that customer might incur for any reason agreed in a valid written individual agreement. In case an individual whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards agreement is concluded only the terms and conditions of the respective customer for the products described herein shall be limited in accordance agreement shall apply. NXP Semiconductors hereby expressly objects to with the Terms and conditions of commercial sale of NXP Semiconductors. applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without No offer to sell or license — Nothing in this document may be interpreted or limitation specifications and product descriptions, at any time and without construed as an offer to sell products that is open for acceptance or the grant, notice. This document supersedes and replaces all information supplied prior conveyance or implication of any license under any copyrights, patents or to the publication hereof. other industrial or intellectual property rights. Suitability for use — NXP Semiconductors products are not designed, Export control — This document as well as the item(s) described herein authorized or warranted to be suitable for use in life support, life-critical or may be subject to export control regulations. Export might require a prior safety-critical systems or equipment, nor in applications where failure or authorization from national authorities. PMLL4153 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 19 August 2010 8 of 10

PMLL4153 NXP Semiconductors High-speed diode Quick reference data — The Quick reference data is an extract of the product for such automotive applications, use and specifications, and (b) product data given in the Limiting values and Characteristics sections of this whenever customer uses the product for automotive applications beyond document, and as such is not complete, exhaustive or legally binding. NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any Non-automotive qualified products — Unless this data sheet expressly liability, damages or failed product claims resulting from customer design and states that this specific NXP Semiconductors product is automotive qualified, use of the product for automotive applications beyond NXP Semiconductors’ the product is not suitable for automotive use. It is neither qualified nor tested standard warranty and NXP Semiconductors’ product specifications. in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. 13.4 Trademarks In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer Notice: All referenced brands, product names, service names and trademarks (a) shall use the product without NXP Semiconductors’ warranty of the are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com PMLL4153 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 19 August 2010 9 of 10

PMLL4153 NXP Semiconductors High-speed diode 15. Contents 1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2 4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Thermal characteristics . . . . . . . . . . . . . . . . . . 2 7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 5 9 Package outline. . . . . . . . . . . . . . . . . . . . . . . . . 5 10 Packing information . . . . . . . . . . . . . . . . . . . . . 6 11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7 13 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8 13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8 13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 14 Contact information. . . . . . . . . . . . . . . . . . . . . . 9 15 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 19 August 2010 Document identifier: PMLL4153