PIC10(L)F320/322 6/8-Pin Flash-Based, 8-Bit Microcontrollers High-Performance RISC CPU eXtreme Low-Power (XLP) Features (PIC10LF320/322) • Only 35 Instructions to Learn: - All single-cycle instructions, except branches • Sleep Current: • Operating Speed: - 20nA @ 1.8V, typical - DC – 16MHz clock input • Operating Current: - DC – 250ns instruction cycle - 25A @ 1MHz, 1.8V, typical • Eight-level Deep Hardware Stack • Watchdog Timer Current: • Interrupt Capability - 500nA @ 1.8V, typical • Processor Self-Write/Read access to Program Memory Peripheral Features • Pinout Compatible to other 6-Pin PIC10FXXX • Four I/O Pins: Microcontrollers - One input-only pin - High current sink/source for LED drivers Memory - Individually selectable weak pull-ups • Up to 512 Words of Flash Program Memory - Interrupt-on-Change • 64 Bytes Data Memory • Timer0: 8-Bit Timer/Counter with 8-Bit • High-Endurance Flash Data Memory (HEF) Programmable Prescaler - 128B of nonvolatile data storage • Timer2: 8-Bit Timer/Counter with 8-Bit Period - 100K erase/write cycles Register, Prescaler and Postscaler • Two PWM modules: Special Microcontroller Features - 10-bit PWM, max. frequency 16kHz - Combined to single 2-phase output • Low-Power 16MHz Internal Oscillator: • A/D Converter: - Software selectable frequency range from - 8-bit resolution with 3 channels 16 MHz to 31 kHz • Configurable Logic Cell (CLC): - Factory calibrated to  1%, typical - 8 selectable input source signals • Wide Operating Range: - Two inputs per module - 1.8V to 3.6V (PIC10LF320/322) - Software selectable logic functions including: - 2.3V to 5.5V (PIC10F320/322) AND/OR/XOR/D Flop/D Latch/SR/JK • Power-On Reset (POR) - External or internal inputs/outputs • Power-up Timer (PWRT) - Operation while in Sleep • Brown-Out Reset (BOR) • Numerically Controlled Oscillator (NCO): • Ultra Low-Power Sleep Regulator - 20-bit accumulator • Extended Watchdog Timer (WDT) - 16-bit increment • Programmable Code Protection - Linear frequency control • Power-Saving Sleep mode - High-speed clock input • Selectable Oscillator Options (EC mode or - Selectable Output modes Internal Oscillator) - Fixed Duty Cycle (FDC) • In-Circuit Serial Programming™ (ICSP™) (via - Pulse Frequency (PF) mode Two Pins) • Complementary Waveform Generator (CWG): • In-Circuit Debugger Support - Selectable falling and rising edge dead-band • Fixed Voltage Reference (FVR) with 1.024V, control 2.048V and 4.096V (‘F’ variant only) Output - Polarity control Levels - Two auto-shutdown sources • Integrated Temperature Indicator - Multiple input sources: PWM, CLC, NCO • 40-year Flash Data Retention  2011-2015 Microchip Technology Inc. DS40001585D-page 1

PIC10(L)F320/322 PIC10(L)F320/322 Family Types s) e Device Data Sheet Index Program MemoryFlash (words) Data SRAM(bytes) ndurance Flash (byt (2)I/O’s 8-Bit ADC (ch) Timers(8-Bit) PWM mplementary WaveGenerator (CWG) onfigurable LogicCell (CLC) Fixed VoltageReference (FVR) merically ControlledOscillator (NCO) (1)Debug XLP h E Co C Nu g Hi PIC10(L)F320 (1) 256 64 128 4 3 2 2 1 1 1 1 H Y PIC10(L)F322 (1) 512 64 128 4 3 2 2 1 1 1 1 H Y Note 1: I - Debugging, Integrated on Chip; H - Debugging, Available using Debug Header; E - Emulation, Available using Emulation Header. 2: One pin is input-only. Data Sheet Index: 1: DS40001585 PIC10(L)F320/322 Data Sheet, 6/8 Pin High Performance, Flash Microcontrollers. Note: For other small form-factor package availability and marking information, please visit http://www.microchip.com/packaging or contact your local sales office. DS40001585D-page 2  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 FIGURE 1: 6-PIN DIAGRAM, PIC10(L)F320/322 SOT-23 ICSPDAT/RA0 1 6 RA3/MCLR/VPP PIC10(L)F320 VSS 2 PIC10(L)F322 5 VDD ICSPCLK/RA1 3 4 RA2 FIGURE 2: 8-PIN DIAGRAM, PIC10(L)F320/322 PDIP, DFN N/C 1 8 RA3/MCLR/VPP 0 2 2 2 VDD 2 F3 F3 7 VSS L) L) RA2 3 10( 10( 6 N/C C C ICSPCLK/RA1 4 PI PI 5 RA0/ICSPDAT TABLE 1: 6 AND 8-PIN ALLOCATION TABLE, PIC10(L)F320/322 I/O 6-Pin 8-Pin Analog Timer PWM Interrupts Pull-ups CWG NCO CLC Basic ICSP RA0 1 5 AN0 — PWM1 IOC0 Y CWG1A — CLC1IN0 — ICSPDAT RA1 3 4 AN1 — PWM2 IOC1 Y CWG1B NCO1CLK CLC1 CLKIN ICSPCLK RA2 4 3 AN2 T0CKI — INT/IOC2 Y CWG1FLT NCO1 CLC1IN1 CLKR RA3 6 8 — — — IOC3 Y — — — MCLR VPP N/C — 1 — — — — — — — — — — N/C — 6 — — — — — — — — — — VDD 5 2 — — — — — — — — VDD — VSS 2 7 — — — — — — — — VSS —  2011-2015 Microchip Technology Inc. DS40001585D-page 3

PIC10(L)F320/322 Table of Contents 1.0 Device Overview..........................................................................................................................................................................6 2.0 Memory Organization...................................................................................................................................................................9 3.0 Device Configuration..................................................................................................................................................................19 4.0 Oscillator Module........................................................................................................................................................................24 5.0 Resets........................................................................................................................................................................................28 6.0 Interrupts....................................................................................................................................................................................35 7.0 Power-Down Mode (Sleep)........................................................................................................................................................44 8.0 Watchdog Timer.........................................................................................................................................................................46 9.0 Flash Program Memory Control.................................................................................................................................................50 10.0 I/O Port.......................................................................................................................................................................................67 11.0 Interrupt-On-Change..................................................................................................................................................................73 12.0 Fixed Voltage Reference (FVR).................................................................................................................................................77 13.0 Internal Voltage Regulator (IVR)................................................................................................................................................79 14.0 Temperature Indicator Module...................................................................................................................................................81 15.0 Analog-to-Digital Converter (ADC) Module................................................................................................................................83 16.0 Timer0 Module...........................................................................................................................................................................93 17.0 Timer2 Module...........................................................................................................................................................................96 18.0 Pulse-Width Modulation (PWM) Module....................................................................................................................................98 19.0 Configurable Logic Cell (CLC)..................................................................................................................................................104 20.0 Numerically Controlled Oscillator (NCO) Module.....................................................................................................................119 21.0 Complementary Waveform Generator (CWG) Module............................................................................................................129 22.0 In-Circuit Serial Programming™ (ICSP™)...............................................................................................................................144 23.0 Instruction Set Summary..........................................................................................................................................................147 24.0 Electrical Specifications............................................................................................................................................................156 25.0 DC and AC Characteristics Graphs and Charts.......................................................................................................................176 26.0 Development Support...............................................................................................................................................................177 27.0 Packaging Information..............................................................................................................................................................181 Appendix A: Data Sheet Revision History..........................................................................................................................................189 DS40001585D-page 4  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Website at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Website; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our website at www.microchip.com to receive the most current information on all of our products.  2011-2015 Microchip Technology Inc. DS40001585D-page 5

PIC10(L)F320/322 1.0 DEVICE OVERVIEW The PIC10(L)F320/322 are described within this data sheet. They are available in 6/8-pin packages. Figure1-1 shows a block diagram of the PIC10(L)F320/322 devices. Table1-2 shows the pinout descriptions. Reference Table1-1 for peripherals available per device. TABLE 1-1: DEVICE PERIPHERAL SUMMARY 0 2 2 2 3 3 F F Peripheral L) L) 0( 0( 1 1 C C PI PI Analog-to-Digital Converter (ADC) ● ● Configurable Logic Cell (CLC) ● ● Complementary Wave Generator (CWG) ● ● Fixed Voltage Reference (FVR) ● ● Numerically Controlled Oscillator (NCO) ● ● Temperature Indicator ● ● PWM Modules PWM1 ● ● PWM2 ● ● Timers Timer0 ● ● Timer2 ● ● DS40001585D-page 6  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 FIGURE 1-1: PIC10(L)F320/322 BLOCK DIAGRAM Program Flash Memory RAM PORTA CLKR Timing Generation CLKIN CPU INTRC Oscillator Figure2-1 MCLR Timer0 Timer2 Temp. ADC Indicator 8-Bit FVR PWM1 PWM2 NCO CLC CWG Note 1: See applicable chapters for more information on peripherals.  2011-2015 Microchip Technology Inc. DS40001585D-page 7

PIC10(L)F320/322 TABLE 1-2: PIC10(L)F320/322 PINOUT DESCRIPTION Input Output Name Function Description Type Type RA0/PWM1/CLC1IN0/CWG1A/ RA0 TTL CMOS General purpose I/O with IOC and WPU. AN0/ICSPDAT PWM1 — CMOS PWM output. CLC1IN0 ST — CLC input. CWG1A — CMOS CWG primary output. AN0 AN — A/D Channel input. ICSPDAT ST CMOS ICSP™ Data I/O. RA1/PWM2/CLC1/CWG1B/AN1/ RA1 TTL CMOS General purpose I/O with IOC and WPU. CLKIN/ICSPCLK/NCO1CLK PWM2 — CMOS PWM output. CLC1 — CMOS CLC output. CWG1B — CMOS CWG complementary output. AN1 AN — A/D Channel input. CLKIN ST — External Clock input (EC mode). ICSPCLK ST — ICSP™ Programming Clock. NCO1CLK ST — Numerical Controlled Oscillator external clock input. RA2/INT/T0CKI/NCO1/CLC1IN1/ RA2 TTL CMOS General purpose I/O with IOC and WPU. CLKR/AN2/CWG1FLT INT ST — External interrupt. T0CKI ST — Timer0 clock input. NCO1 — CMOS Numerically Controlled Oscillator output. CLC1IN1 ST — CLC input. CLKR — CMOS Clock Reference output. AN2 AN — A/D Channel input. CWG1FLT ST — Complementary Waveform Generator Fault 1 source input. RA3/MCLR/VPP RA3 TTL — General purpose input. MCLR ST — Master Clear with internal pull-up. VPP HV — Programming voltage. VDD VDD Power — Positive supply. VSS VSS Power — Ground reference. Legend: AN = Analog input or output CMOS = CMOS compatible input or output TTL = CMOS input with TTL levels ST = CMOS input with Schmitt Trigger levels HV = High Voltage DS40001585D-page 8  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 2.0 MEMORY ORGANIZATION 2.1 Program Memory Organization These devices contain the following types of memory: The mid-range core has a 13-bit program counter capable of addressing 8K x 14 program memory space. • Program Memory This device family only implements up to 512 words of - Configuration Word the 8K program memory space. Table2-1 shows the - Device ID memory sizes implemented for the PIC10(L)F320/322 - User ID family. Accessing a location above these boundaries will - Flash Program Memory cause a wrap-around within the implemented memory space. The Reset vector is at 0000h and the interrupt • Data Memory vector is at 0004h (see Figures2-1, and2-2). - Core Registers - Special Function Registers - General Purpose RAM - Common RAM The following features are associated with access and control of program memory and data memory: • PCL and PCLATH • Stack • Indirect Addressing TABLE 2-1: DEVICE SIZES AND ADDRESSES Program Memory Last Program Memory High-Endurance Flash Device Space (Words) Address Memory Address Range (1) PIC10(L)F320 256 00FFh 0080h-00FFh PIC10(L)F322 512 01FFh 0180h-01FFh Note1: High-endurance Flash applies to low byte of each address in the range.  2011-2015 Microchip Technology Inc. DS40001585D-page 9

PIC10(L)F320/322 FIGURE 2-1: PROGRAM MEMORY MAP FIGURE 2-2: PROGRAM MEMORY MAP AND STACK FOR AND STACK FOR PIC10(L)F320 PIC10(L)F322 PC<12:0> PC<12:0> CALL, CALL 13 13 RETURN, RETLW RETURN, RETLW RETFIE RETFIE Stack Level 0 Stack Level 0 Stack Level 1 Stack Level 1 Stack Level 8 Stack Level 8 Reset Vector 0000h Reset Vector 0000h Interrupt Vector 0004h Interrupt Vector 0004h On-chip 0005h 0005h Program Page 0 On-chip Memory 00FFh Program Page 0 Rollover to Page 0 0100h Memory Wraps to Page 0 01FFh 0200h Rollover to Page 0 Wraps to Page 0 Wraps to Page 0 Wraps to Page 0 Wraps to Page 0 Rollover to Page 0 Rollover to Page 0 FFFh FFFh DS40001585D-page 10  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 2.2 Data Memory Organization 2.2.1 GENERAL PURPOSE REGISTER FILE The data memory is in one bank, which contains the General Purpose Registers (GPR) and the Special The register file is organized as 64 x 8 in the Function Registers (SFR). The RP<1:0> bits of the PIC10(L)F320/322. Each register is accessed, either STATUS register are the bank select bits. directly or indirectly, through the File Select Register (FSR) (see Section2.4 “Indirect Addressing, INDF RP1 RP0 and FSR Registers”). 0 0  Bank 0 is selected 2.2.2 SPECIAL FUNCTION REGISTERS The bank extends up to 7Fh (128 bytes). The lower locations of the bank are reserved for the Special Func- The Special Function Registers are registers used by tion Registers. Above the Special Function Registers the CPU and peripheral functions for controlling the are the General Purpose Registers, implemented as desired operation of the device (see Table2-3). These Static RAM. registers are static RAM. The special registers can be classified into two sets: core and peripheral. The Special Function Registers associated with the “core” are described in this section. Those related to the operation of the peripheral features are described in the section of that peripheral feature.  2011-2015 Microchip Technology Inc. DS40001585D-page 11

PIC10(L)F320/322 2.2.2.1 STATUS Register The STATUS register, shown in Register2-1, contains: • the arithmetic status of the ALU • the Reset status • the bank select bits for data memory (SRAM) The STATUS register can be the destination for any instruction, like any other register. If the STATUS register is the destination for an instruction that affects the Z, DC or C bits, then the write to these three bits is disabled. These bits are set or cleared according to the device logic. Furthermore, the TO and PD bits are not writable. Therefore, the result of an instruction with the STATUS register as destination may be different than intended. For example, CLRF STATUS will clear the upper three bits and set the Z bit. This leaves the STATUS register as ‘000u u1uu’ (where u = unchanged). It is recommended, therefore, that only BCF, BSF, SWAPF and MOVWF instructions are used to alter the STATUS register, because these instructions do not affect any Status bits. For other instructions not affect- ing any Status bits (see Section23.0 “Instruction Set Summary”). Note1: Bits IRP and RP1 of the STATUS register are not used by the PIC10(L)F320 and should be maintained as clear. Use of these bits is not recommended, since this may affect upward compatibility with future products. 2: The C and DC bits operate as a Borrow and Digit Borrow out bit, respectively, in subtraction. DS40001585D-page 12  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 REGISTER 2-1: STATUS: STATUS REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R-1/q R-1/q R/W-x/u R/W-x/u R/W-x/u IRP RP1 RP0 TO PD Z DC C bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7 IRP: Reserved(2) bit 6-5 RP<1:0>: Reserved(2) bit 4 TO: Time-out bit 1 = After power-up, CLRWDT instruction or SLEEP instruction 0 = A WDT time-out occurred bit 3 PD: Power-Down bit 1 = After power-up or by the CLRWDT instruction 0 = By execution of the SLEEP instruction bit 2 Z: Zero bit 1 = The result of an arithmetic or logic operation is zero 0 = The result of an arithmetic or logic operation is not zero bit 1 DC: Digit Carry/Borrow bit (ADDWF, ADDLW, SUBLW, SUBWF instructions)(1) 1 = A carry-out from the 4th low-order bit of the result occurred 0 = No carry-out from the 4th low-order bit of the result bit 0 C: Carry/Borrow bit (ADDWF, ADDLW, SUBLW, SUBWF instructions)(1) 1 = A carry-out from the Most Significant bit of the result occurred 0 = No carry-out from the Most Significant bit of the result occurred Note1: For Borrow, the polarity is reversed. A subtraction is executed by adding the two’s complement of the second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high or low-order bit of the source register. 2: Maintain as ‘0’.  2011-2015 Microchip Technology Inc. DS40001585D-page 13

PIC10(L)F320/322 2.2.3 DEVICE MEMORY MAPS The memory maps for PIC10(L)F320/322 are as shown in Table2-2. TABLE 2-2: PIC10(L)F320/322 MEMORY MAP (BANK 0) INDF(*) 00h PMADRL 20h 40h 60h TMR0 01h PMADRH 21h PCL 02h PMDATL 22h STATUS 03h PMDATH 23h FSR 04h PMCON1 24h PORTA 05h PMCON2 25h TRISA 06h CLKRCON 26h LATA 07h NCO1ACCL 27h ANSELA 08h NCO1ACCH 28h WPUA 09h NCO1ACCU 29h PCLATH 0Ah NCO1INCL 2Ah INTCON 0Bh NCO1INCH 2Bh PIR1 0Ch Reserved 2Ch PIE1 0Dh NCO1CON 2Dh OPTION_REG 0Eh NCO1CLK 2Eh General General Purpose Purpose PCON 0Fh Reserved 2Fh Registers Registers OSCCON 10h WDTCON 30h TMR2 11h CLC1CON 31h 32 Bytes 32 Bytes PR2 12h CLC1SEL1 32h T2CON 13h CLC1SEL2 33h PWM1DCL 14h CLC1POL 34h PWM1DCH 15h CLC1GLS0 35h PWM1CON 16h CLC1GLS1 36h PWM2DCL 17h CLC1GLS2 37h PWM2DCH 18h CLC1GLS3 38h PWM2CON 19h CWG1CON0 39h IOCAP 1Ah CWG1CON1 3Ah IOCAN 1Bh CWG1CON2 3Bh IOCAF 1Ch CWG1DBR 3Ch FVRCON 1Dh CWG1DBF 3Dh ADRES 1Eh VREGCON 3Eh ADCON 1Fh BORCON 3Fh 5Fh 7Fh Legend: = Unimplemented data memory locations, read as ‘0’. * = Not a physical register. DS40001585D-page 14  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 TABLE 2-3: SPECIAL FUNCTION REGISTER SUMMARY (BANK 0) Value on Value on all Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 POR, BOR other resets Bank 0 00h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx xxxx xxxx 01h TMR0 Timer0 Module Register xxxx xxxx uuuu uuuu 02h PCL Program Counter (PC) Least Significant Byte 0000 0000 0000 0000 03h STATUS IRP RP1 RP0 TO PD Z DC C 0001 1xxx 000q quuu 04h FSR Indirect Data Memory Address Pointer xxxx xxxx uuuu uuuu 05h PORTA — — — — RA3 RA2 RA1 RA0 ---- xxxx ---- uuuu 06h TRISA — — — — —(1) TRISA2 TRISA1 TRISA0 ---- 1111 ---- 1111 07h LATA — — — — — LATA2 LATA1 LATA0 ---- -xxx ---- -uuu 08h ANSELA — — — — — ANSA2 ANSA1 ANSA0 ---- -111 ---- -111 09h WPUA — — — — WPUA3 WPUA2 WPUA1 WPUA0 ---- 1111 ---- 1111 0Ah PCLATH — — — — — — — PCLH0 ---- ---0 ---- ---0 0Bh INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 0000 0000 0000 000u 0Ch PIR1 — ADIF — NCO1IF CLC1IF — TMR2IF — -0-0 0-0- -0-0 0-0- 0Dh PIE1 — ADIE — NCO1IE CLC1IE — TMR2IE — -0-0 0-0- -0-0 0-0- 0Eh OPTION_REG WPUEN INTEDG T0CS T0SE PSA PS<2:0> 1111 1111 uuuu uuuu 0Fh PCON — — — — — — POR BOR ---- --qq ---- --uu 10h OSCCON — IRCF<2:0> HFIOFR — LFIOFR HFIOFS -110 0-00 -110 0-00 11h TMR2 Timer2 Module Register 0000 0000 0000 0000 12h PR2 Timer2 Period Register 1111 1111 1111 1111 13h T2CON — TOUTPS<3:0> TMR2ON T2CKPS<1:0> -000 0000 -000 0000 14h PWM1DCL PWM1DCL<1:0> — — — — — — xx-- ---- uu-- ---- 15h PWM1DCH PWM1DCH<7:0> xxxx xxxx uuuu uuuu 16h PWM1CON PWM1EN PWM1OE PWM1OUT PWM1POL — — — — 0000 ---- 0000 ---- 17h PWM2DCL PWM2DCL<1:0> — — — — — — xx-- ---- uu-- ---- 18h PWM2DCH PWM2DCH<7:0> xxxx xxxx uuuu uuuu 19h PWM2CON PWM2EN PWM2OE PWM2OUT PWM2POL — — — — 0000 ---- 0000 ---- 1Ah IOCAP — — — — IOCAP3 IOCAP2 IOCAP1 IOCAP0 ---- 0000 ---- 0000 1Bh IOCAN — — — — IOCAN3 IOCAN2 IOCAN1 IOCAN0 ---- 0000 ---- 0000 1Ch IOCAF — — — — IOCAF3 IOCAF2 IOCAF1 IOCAF0 ---- 0000 ---- 0000 1Dh FVRCON FVREN FVRRDY TSEN TSRNG — — ADFVR<1:0> 0x00 --00 0x00 --00 1Eh ADRES A/D Result Register xxxx xxxx uuuu uuuu GO/ 1Fh ADCON ADCS<2:0> CHS<2:0> ADON 0000 0000 0000 0000 DONE Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: Unimplemented, read as ‘1’.  2011-2015 Microchip Technology Inc. DS40001585D-page 15

PIC10(L)F320/322 TABLE 2-3: SPECIAL FUNCTION REGISTER SUMMARY (BANK 0) (CONTINUED) Value on Value on all Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 POR, BOR other resets Bank 0 (Continued) 20h PMADRL PMADR<7:0> 0000 0000 0000 0000 21h PMADRH — — — — — — — PMADR8 ---- ---0 ---- ---0 22h PMDATL PMDAT<7:0> xxxx xxxx uuuu uuuu 23h PMDATH — — PMDAT<13:8> --xx xxxx --uu uuuu 24h PMCON1 — CFGS LWLO FREE WRERR WREN WR RD 1000 0000 1000 q000 25h PMCON2 Program Memory Control Register 2 (not a physical register) 0000 0000 0000 0000 26h CLKRCON — CLKROE — — — — — — -0-- ---- -0-- ---- 27h NCO1ACCL NCO1 Accumulator <7:0> 0000 0000 0000 0000 28h NCO1ACCH NCO1 Accumulator <15:8> 0000 0000 0000 0000 29h NCO1ACCU — NCO1 Accumulator <19..16> ---- 0000 ---- 0000 2Ah NCO1INCL NCO1 Increment <7:0> 0000 0001 0000 0001 2Bh NCO1INCH NCO1 Increment <15:8> 0000 0000 0000 0000 2Ch — Unimplemented — — 2Dh NCO1CON N1EN N1OE N1OUT N1POL — — — N1PFM 0000 ---0 00x0 ---0 2Eh NCO1CLK N1PWS<2:0> — — — N1CKS<1:0> 000- --00 000- --00 2Fh Reserved Reserved xxxx xxxx uuuu uuuu 30h WDTCON — — WDTPS<4:0> SWDTEN --01 0110 --01 0110 31h CLC1CON LC1EN LC1OE LC1OUT LC1INTP LC1INTN LC1MODE<2:0> 00x0 -000 00x0 -000 32h CLC1SEL0 — LC1D2S<2:0> — LC1D1S<2:0> -xxx -xxx -uuu -uuu 33h CLC1SEL1 — LC1D4S<2:0> — LC1D3S<2:0> -xxx -xxx -uuu -uuu 34h CLC1POL LC1POL — — — LC1G4POL LC1G3POL LC1G2POL LC1G1POL 0--- xxxx 0--- uuuu 35h CLC1GLS0 LC1G1D4T LC1G1D4N LC1G1D3T LC1G1D3N LC1G1D2T LC1G1D2N LC1G1D1T LC1G1D1N xxxx xxxx uuuu uuuu 36h CLC1GLS1 LC1G2D4T LC1G2D4N LC1G2D3T LC1G2D3N LC1G2D2T LC1G2D2N LC1G2D1T LC1G2D1N xxxx xxxx uuuu uuuu 37h CLC1GLS2 LC1G3D4T LC1G3D4N LC1G3D3T LC1G3D3N LC1G3D2T LC1G3D2N LC1G3D1T LC1G3D1N xxxx xxxx uuuu uuuu 38h CLC1GLS3 LC1G4D4T LC1G4D4N LC1G4D3T LC1G4D3N LC1G4D2T LC1G4D2N LC1G4D1T LC1G4D1N xxxx xxxx uuuu uuuu 39h CWG1CON0 G1EN G1OEB G1OEA G1POLB G1POLA — — G1CS0 0000 0--0 0000 0--0 3Ah CWG1CON1 G1ASDLB<1:0> G1ASDLA<1:0> — — G1IS<1:0> xxxx --xx uuuu --uu 3Bh CWG1CON2 G1ASE G1ARSEN — — — — G1ASDCLC1 G1ASDFLT xx-- --xx uu-- --uu 3Ch CWG1DBR — — CWG1DBR<5:0> --xx xxxx --uu uuuu 3Dh CWG1DBF — — CWG1DBF<5:0> --xx xxxx --uu uuuu 3Eh VREGCON — — — — — — VREGPM1 Reserved ---- --01 ---- --01 3Fh BORCON SBOREN BORFS — — — — — BORRDY 10-- ---q uu-- ---u Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: Unimplemented, read as ‘1’. DS40001585D-page 16  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 2.3 PCL and PCLATH 2.3.2 STACK The Program Counter (PC) is 13 bits wide. The low byte All devices have an 8-levelx13-bit wide hardware comes from the PCL register, which is a readable and stack (see Figure2-1). The stack space is not part of writable register. The high byte (PC<12:8>) is not directly either program or data space and the Stack Pointer is readable or writable and comes from PCLATH. On any not readable or writable. The PC is PUSHed onto the Reset, the PC is cleared. Figure2-3 shows the two stack when a CALL instruction is executed or an inter- situations for the loading of the PC. The upper example rupt causes a branch. The stack is POPed in the event in Figure2-3 shows how the PC is loaded on a write to of a RETURN, RETLW or a RETFIE instruction PCL (PCLATH<4:0>  PCH). The lower example in execution. PCLATH is not affected by a PUSH or POP Figure2-3 shows how the PC is loaded during a CALL or operation. GOTO instruction (PCLATH<4:3>  PCH). The stack operates as a circular buffer. This means that after the stack has been PUSHed eight times, the ninth FIGURE 2-3: LOADING OF PC IN push overwrites the value that was stored from the first DIFFERENT SITUATIONS push. The tenth push overwrites the second push (and so on). PCH PCL Instruction with Note1: There are no Status bits to indicate Stack 12 8 7 0 PCL as PC Destination Overflow or Stack Underflow conditions. 2: There are no instructions/mnemonics PCLATH<4:0> 8 5 ALU Result called PUSH or POP. These are actions that occur from the execution of the PCLATH CALL, RETURN, RETLW and RETFIE instructions or the vectoring to an PCH PCL interrupt address. 12 11 10 8 7 0 PC GOTO, CALL 2.4 Indirect Addressing, INDF and PCLATH<4:3> 11 FSR Registers 2 OPCODE <10:0> The INDF register is not a physical register. Addressing PCLATH the INDF register will cause indirect addressing. Indirect addressing is possible by using the INDF 2.3.1 MODIFYING PCL register. Any instruction using the INDF register actually accesses data pointed to by the File Select Executing any instruction with the PCL register as the Register (FSR). Reading INDF itself indirectly will destination simultaneously causes the Program produce 00h. Writing to the INDF register indirectly Counter PC<12:8> bits (PCH) to be replaced by the results in a no operation (although Status bits may be contents of the PCLATH register. This allows the entire affected). An effective 9-bit address is obtained by contents of the program counter to be changed by concatenating the 8-bit FSR and the IRP bit of the writing the desired upper five bits to the PCLATH STATUS register, as shown in Figure2-4. register. When the lower eight bits are written to the PCL register, all 13 bits of the program counter will A simple program to clear RAM location 40h-7Fh using change to the values contained in the PCLATH register indirect addressing is shown in Example2-1. and those being written to the PCL register. A computed GOTO is accomplished by adding an offset EXAMPLE 2-1: INDIRECT ADDRESSING to the program counter (ADDWF PCL). Care should be MOVLW 0x40 ;initialize pointer exercised when jumping into a look-up table or MOVWF FSR ;to RAM program branch table (computed GOTO) by modifying NEXT CLRF INDF ;clear INDF register the PCL register. Assuming that PCLATH is set to the INCF FSR ;inc pointer table start address, if the table length is greater than BTFSS FSR,7 ;all done? 255 instructions or if the lower eight bits of the memory GOTO NEXT ;no clear next CONTINUE ;yes continue address rolls over from 0xFF to 0x00 in the middle of the table, then PCLATH must be incremented for each address rollover that occurs between the table beginning and the target location within the table. For more information refer to Application Note AN556, “Implementing a Table Read” (DS00556).  2011-2015 Microchip Technology Inc. DS40001585D-page 17

PIC10(L)F320/322 FIGURE 2-4: DIRECT/INDIRECT ADDRESSING PIC10(L)F320/322 Direct Addressing Indirect Addressing 6 From Opcode 0 7 File Select Register 0 Location Select Location Select 00h Data Memory 7Fh Bank 0 For memory map detail, see Figure2-2. DS40001585D-page 18  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 3.0 DEVICE CONFIGURATION Device configuration consists of Configuration Word and Device ID. 3.1 Configuration Word There are several Configuration Word bits that allow different oscillator and memory protection options. These are implemented as Configuration Word at 2007h.  2011-2015 Microchip Technology Inc. DS40001585D-page 19

PIC10(L)F320/322 3.2 Register Definitions: Configuration Word REGISTER 3-1: CONFIG: CONFIGURATION WORD U-1 R/P-1/1 R/P-1/1 R/P-1/1 R/P-1/1 R/P-1/1 — WRT<1:0> BORV LPBOR LVP bit 13 bit 8 R/P-1/1 R/P-1/1 R/P-1/1 R/P-1/1 R/P-1/1 R/P-1/1 R/P-1/1 R/P-1/1 CP MCLRE PWRTE WDTE<1:0> BOREN<1:0> FOSC bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared P = Programmable bit bit 13 Unimplemented: Read as ‘1’ bit 12-11 WRT<1:0>: Flash Memory Self-Write Protection bits 256 W Flash memory: PIC10(L)F320: 11 =Write protection off 10 =000h to 03Fh write-protected, 040h to 0FFh may be modified by PMCON control 01 =000h to 07Fh write-protected, 080h to 0FFh may be modified by PMCON control 00 =000h to 0FFh write-protected, no addresses may be modified by PMCON control 512 W Flash memory: PIC10(L)F322: 11 =Write protection off 10 =000h to 07Fh write-protected, 080h to 1FFh may be modified by PMCON control 01 =000h to 0FFh write-protected, 100h to 1FFh may be modified by PMCON control 00 =000h to 1FFh write-protected, no addresses may be modified by PMCON control bit 10 BORV: Brown-out Reset Voltage Selection bit 1 = Brown-out Reset voltage (VBOR), low trip point selected. 0 = Brown-out Reset voltage (VBOR), high trip point selected. bit 9 LPBOR: Low-Power Brown-out Reset Enable bit 1 = Low-power Brown-out Reset is enabled 0 = Low-power Brown-out Reset is disabled bit 8 LVP: Low-Voltage Programming Enable bit 1 = Low-Voltage Programming enabled. MCLR/VPP pin function is MCLR. 0 = High Voltage on MCLR/VPP must be used for programming bit 7 CP: Code Protection bit(2) 1 = Program memory code protection is disabled 0 = Program memory code protection is enabled bit 6 MCLRE: MCLR/VPP Pin Function Select bit If LVP bit = 1: This bit is ignored. If LVP bit = 0: 1 =MCLR/VPP pin function is MCLR; Weak pull-up enabled. 0 =MCLR/VPP pin function is digital input; MCLR internally disabled; Weak pull-up under control of WPUA3 bit. Note 1: Enabling Brown-out Reset does not automatically enable Power-up Timer. 2: Once enabled, code-protect can only be disabled by bulk erasing the device. 3: See VBOR parameter for specific trip point voltages. DS40001585D-page 20  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 REGISTER 3-1: CONFIG: CONFIGURATION WORD (CONTINUED) bit 5 PWRTE: Power-up Timer Enable bit(1) 1 = PWRT disabled 0 = PWRT enabled bit 4-3 WDTE<1:0>: Watchdog Timer Enable bit 11 =WDT enabled 10 =WDT enabled while running and disabled in Sleep 01 =WDT controlled by the SWDTEN bit in the WDTCON register 00 =WDT disabled bit 2-1 BOREN<1:0>: Brown-out Reset Enable bits 11 = Brown-out Reset enabled; SBOREN bit is ignored 10 = Brown-out Reset enabled while running, disabled in Sleep; SBOREN bit is ignored 01 = Brown-out Reset controlled by the SBOREN bit in the BORCON register 00 = Brown-out Reset disabled; SBOREN bit is ignored bit 0 FOSC: Oscillator Selection bit 1 = EC on CLKIN pin 0 = INTOSC oscillator I/O function available on CLKIN pin Note 1: Enabling Brown-out Reset does not automatically enable Power-up Timer. 2: Once enabled, code-protect can only be disabled by bulk erasing the device. 3: See VBOR parameter for specific trip point voltages.  2011-2015 Microchip Technology Inc. DS40001585D-page 21

PIC10(L)F320/322 3.3 Code Protection Code protection allows the device to be protected from unauthorized access. Program memory protection and data memory protection are controlled independently. Internal access to the program memory and data memory are unaffected by any code protection setting. 3.3.1 PROGRAM MEMORY PROTECTION The entire program memory space is protected from external reads and writes by the CP bit in Configuration Word. When CP = 0, external reads and writes of program memory are inhibited and a read will return all ‘0’s. The CPU can continue to read program memory, regardless of the protection bit settings. Writing the program memory is dependent upon the write protection setting. See Section3.4 “Write Protection” for more information. 3.4 Write Protection Write protection allows the device to be protected from unintended self-writes. Applications, such as boot loader software, can be protected while allowing other regions of the program memory to be modified. The WRT<1:0> bits in Configuration Word define the size of the program memory block that is protected. 3.5 User ID Four memory locations (2000h-2003h) are designated as ID locations where the user can store checksum or other code identification numbers. These locations are readable and writable during normal execution. See Section3.6 “Device ID and Revision ID” for more information on accessing these memory locations. For more information on checksum calculation, see the “PIC10(L)F320/322 Flash Memory Programming Specification” (DS41572). DS40001585D-page 22  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 3.6 Device ID and Revision ID The memory location 2006h is where the Device ID and Revision ID are stored. The upper nine bits hold the Device ID. The lower five bits hold the Revision ID. See Section9.4 “User ID, Device ID and Configuration Word Access” for more information on accessing these memory locations. Development tools, such as device programmers and debuggers, may be used to read the Device ID and Revision ID. 3.7 Register Definitions: Device and Revision REGISTER 3-2: DEVID: DEVICE ID REGISTER(1) R R R R R R DEV<8:3> bit 13 bit 8 R R R R R R R R DEV<2:0> REV<4:0> bit 7 bit 0 Legend: R = Readable bit ‘1’ = Bit is set ‘0’ = Bit is cleared bit 13-5 DEV<8:0>: Device ID bits DEVID<13:0> Values Device DEV<8:0> REV<4:0> PIC10F320 10 1001 101 x xxxx PIC10LF320 10 1001 111 x xxxx PIC10F322 10 1001 100 x xxxx PIC10LF322 10 1001 110 x xxxx bit 4-0 REV<4:0>: Revision ID bits These bits are used to identify the revision. Note 1: This location cannot be written.  2011-2015 Microchip Technology Inc. DS40001585D-page 23

PIC10(L)F320/322 4.0 OSCILLATOR MODULE The system can be configured to use an internal calibrated high-frequency oscillator as clock source, with a choice of selectable speeds via software. 4.1 Overview Clock source modes are configured by the FOSC bit in The oscillator module has a variety of clock sources and Configuration Word (CONFIG). selection features that allow it to be used in a range of 1. EC oscillator from CLKIN. applications while maximizing performance and minimizing power consumption. Figure4-1 illustrates a 2. INTOSC oscillator, CLKIN not enabled. block diagram of the oscillator module. FIGURE 4-1: PIC10(L)F320/322 CLOCK SOURCE BLOCK DIAGRAM IRCF<2:0> 3 HFINTOSC 16 MHz HFIOFR(1) 16 MHz 111 HFIOFS(1) 8 MHz 110 4 MHz 101 D iv 2 MHz 100 id M INTOSC er 1 MHz 011 U X 500 kHz 010 250 kHz 001 FOSC 31 kHz 000 (Configuration LFINTOSC Word) 31 kHz LFIOFR(1) 0 System Clock M U X (CPU and EC Peripherals) CLKIN 1 CLKR CLKROE Note1: HFIOFR, HFIOFS and LFIOFR are Status bits in the OSCCON register. DS40001585D-page 24  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 4.2 Clock Source Modes 4.3.2 FREQUENCY SELECT BITS (IRCF) Clock source modes can be classified as external or The output of the 16 MHz HFINTOSC is connected to internal. a divider and multiplexer (see Figure4-1). The Internal Oscillator Frequency Select bits (IRCF) of the • Internal clock source (INTOSC) is contained OSCCON register select the frequency output of the within the oscillator module, which has eight internal oscillator: selectable output frequencies, with a maximum internal frequency of 16 MHz. • HFINTOSC • The External Clock mode (EC) relies on an - 16 MHz external signal for the clock source. - 8 MHz (default after Reset) - 4 MHz The system clock can be selected between external or internal clock sources via the FOSC bit of the - 2 MHz Configuration Word. - 1 MHz - 500 kHz 4.3 Internal Clock Modes - 250 kHz The internal clock sources are contained within the • LFINTOSC oscillator module. The internal oscillator block has two - 31 kHz internal oscillators that are used to generate all internal Note: Following any Reset, the IRCF<2:0> bits system clock sources: the 16 MHz High-Frequency of the OSCCON register are set to ‘110’ Internal Oscillator (HFINTOSC) and the 31 kHz and the frequency selection is set to (LFINTOSC). 8MHz. The user can modify the IRCF bits The HFINTOSC consists of a primary and secondary to select a different frequency. clock. The secondary clock starts first with rapid start- There is no delay when switching between HFINTOSC up time, but low accuracy. The secondary clock ready frequencies with the IRCF bits. This is because the signal is indicated with the HFIOFR bit of the OSCCON switch involves only a change to the frequency output register. The primary clock follows with slower start-up divider. time and higher accuracy. The primary clock is stable when the HFIOFS bit of the OSCCON register bit goes Start-up delay specifications are located in high. Section24.0 “Electrical Specifications”. 4.3.1 INTOSC MODE When the FOSC bit of the Configuration Word is cleared, the INTOSC mode is selected. When INTOSC is selected, CLKIN pin is available for general purpose I/O. See Section3.0 “Device Configuration” for more information.  2011-2015 Microchip Technology Inc. DS40001585D-page 25

PIC10(L)F320/322 4.4 Register Definitions: Reference Clock Control REGISTER 4-1: CLKRCON – REFERENCE CLOCK CONTROL REGISTER U-0 R/W-0/0 U-0 U-0 U-0 U-0 U-0 U-0 — CLKROE — — — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown q = Value depends on condition bit 7 Unimplemented: Read as ‘0’ bit 6 CLKROE: Reference Clock Output Enable bit 1 = Reference Clock output (CLKR), regardless of TRIS 0 = Reference Clock output disabled bit 5-0 Unimplemented: Read as ‘0’ 4.5 Register Definitions: Oscillator Control REGISTER 4-2: OSCCON: OSCILLATOR CONTROL REGISTER U-0 R/W-1/1 R/W-1/1 R/W-0/0 R-0/0 U-0 R-0/0 R-0/0 — IRCF<2:0> HFIOFR — LFIOFR HFIOFS bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7 Unimplemented: Read as ‘0’ bit 6-4 IRCF<2:0>: INTOSC (FOSC) Frequency Select bits 111 = 16MHz 110 = 8MHz (default value) 101 = 4MHz 100 = 2MHz 011 = 1MHz 010 = 500kHz 001 = 250kHz 000 = 31kHz (LFINTOSC) bit 3 HFIOFR: High-Frequency Internal Oscillator Ready bit 1 = 16MHz Internal Oscillator (HFINTOSC) is ready 0 = 16MHz Internal Oscillator (HFINTOSC) is not ready bit 2 Unimplemented: Read as ‘0’ bit 1 LFIOFR: Low-Frequency Internal Oscillator Ready bit 1 = 31kHz Internal Oscillator (LFINTOSC) is ready 0 = 31kHz Internal Oscillator (LFINTOSC) is not ready bit 0 HFIOFS: High-Frequency Internal Oscillator Stable bit 1 = 16MHz Internal Oscillator (HFINTOSC) is stable 0 = 16MHz Internal Oscillator (HFINTOSC) is not stable DS40001585D-page 26  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 4.6 External Clock Mode 4.6.1 EC MODE The External Clock (EC) mode allows an externally generated logic level as the system clock source. When operating in this mode, an external clock source is connected to the CLKIN input. TABLE 4-1: SUMMARY OF REGISTERS ASSOCIATED WITH CLOCK SOURCES Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page CLKRCON — CLKROE — — — — — — 26 OSCCON — IRCF<2:0> HFIOFR — LFIOFR HFIOFS 26 Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by ECWG. TABLE 4-2: SUMMARY OF CONFIGURATION WORD WITH CLOCK SOURCES Register Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 on Page 13:8 — — — WRT<1:0> BORV LPBOR LVP CONFIG 20 7:0 CP MCLRE PWRTE WDTE<1:0> BOREN<1:0> FOSC Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by clock sources.  2011-2015 Microchip Technology Inc. DS40001585D-page 27

PIC10(L)F320/322 5.0 RESETS There are multiple ways to reset this device: • Power-On Reset (POR) • Brown-Out Reset (BOR) • Low-Power Brown-Out Reset (LPBOR) • MCLR Reset • WDT Reset • Programming mode exit To allow VDD to stabilize, an optional Power-up Timer can be enabled to extend the Reset time after a BOR or POR event. A simplified block diagram of the On-Chip Reset Circuit is shown in Figure5-1. FIGURE 5-1: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT ICSP™ Programming Mode Exit MCLRE Sleep WDT Time-out Device Reset Power-on Reset VDD Brown-out R PWRT Reset Done LPBOR Reset PWRTE LFINTOSC BOR Active(1) Note 1: See Table5-1 for BOR active conditions. DS40001585D-page 28  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 5.1 Power-On Reset (POR) 5.2 Brown-Out Reset (BOR) The POR circuit holds the device in Reset until VDD has The BOR circuit holds the device in Reset when VDD reached an acceptable level for minimum operation. reaches a selectable minimum level. Between the Slow rising VDD, fast operating speeds or analog POR and BOR, complete voltage range coverage for performance may require greater than minimum VDD. execution protection can be implemented. The PWRT, BOR or MCLR features can be used to The Brown-out Reset module has four operating extend the start-up period until all device operation modes controlled by the BOREN<1:0> bits in Configu- conditions have been met. ration Word. The four operating modes are: 5.1.1 POWER-UP TIMER (PWRT) • BOR is always on • BOR is off when in Sleep The Power-up Timer provides a nominal 64ms time- out on POR or Brown-out Reset. • BOR is controlled by software • BOR is always off The device is held in Reset as long as PWRT is active. The PWRT delay allows additional time for the VDD to Refer to Table5-1 for more information. rise to an acceptable level. The Power-up Timer is The Brown-out Reset voltage level is selectable by enabled by clearing the PWRTE bit in Configuration configuring the BORV bit in Register3-1. Word. A VDD noise rejection filter prevents the BOR from trig- The Power-up Timer starts after the release of the POR gering on small events. If VDD falls below VBOR for a and BOR. duration greater than parameter TBORDC, the device For additional information, refer to Application Note will reset. See Figure5-2 for more information. AN607, “Power-up Trouble Shooting” (DS00607). TABLE 5-1: BOR OPERATING MODES Device Operation upon: BOREN<1:0> SBOREN Device Mode BOR Mode Release of POR/Wake- up from Sleep 11 X X Active Waits for BOR ready(1) (BORRDY = 1) Awake Active 10 X Waits for BOR ready (BORRDY = 1) Sleep Disabled 1 X Active Waits for BOR ready(1) (BORRDY = 1) 01 0 X Disabled Begins immediately (BORRDY = x) 00 X X Disabled Note 1: In these specific cases, “Release of POR” and “Wake-up from Sleep”, there is no delay in start-up. The BOR ready flag, (BORRDY = 1), will be set before the CPU is ready to execute instructions because the BOR circuit is forced on by the BOREN<1:0> bits. 5.2.1 BOR IS ALWAYS ON 5.2.3 BOR CONTROLLED BY SOFTWARE When the BOREN bits of Configuration Word are When the BOREN bits of Configuration Word are programmed to ‘11’, the BOR is always on. The device programmed to ‘01’, the BOR is controlled by the start-up will be delayed until the BOR is ready and VDD SBOREN bit of the BORCON register. The device start- is higher than the BOR threshold. up is not delayed by the BOR ready condition or the BOR protection is active during Sleep. The BOR does VDD level. not delay wake-up from Sleep. BOR protection begins as soon as the BOR circuit is ready. The status of the BOR circuit is reflected in the 5.2.2 BOR IS OFF IN SLEEP BORRDY bit of the BORCON register. When the BOREN bits of Configuration Word are BOR protection is unchanged by Sleep. programmed to ‘10’, the BOR is on, except in Sleep. The device start-up will be delayed until the BOR is ready and VDD is higher than the BOR threshold. BOR protection is not active during Sleep. The device wake-up will be delayed until the BOR is ready.  2011-2015 Microchip Technology Inc. DS40001585D-page 29

PIC10(L)F320/322 FIGURE 5-2: BROWN-OUT SITUATIONS VDD VBOR Internal Reset TPWRT(1) VDD VBOR Internal < TPWRT Reset TPWRT(1) VDD VBOR Internal Reset TPWRT(1) Note 1: TPWRT delay only if PWRTE bit is programmed to ‘0’. 5.3 Register Definition: BOR Control REGISTER 5-1: BORCON: BROWN-OUT RESET CONTROL REGISTER R/W-1/u R/W-0/u U-0 U-0 U-0 U-0 U-0 R-q/u SBOREN BORFS(1) — — — — — BORRDY bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7 SBOREN: Software Brown-out Reset Enable bit If BOREN <1:0> in Configuration Word  01: SBOREN is read/write, but has no effect on the BOR. If BOREN <1:0> in Configuration Word = 01: 1 = BOR enabled 0 = BOR disabled bit 6 BORFS: Brown-out Reset Fast Start bit(1) If BOREN<1:0> = 11 (Always on) or BOREN<1:0> = 00 (Always off) BORFS is Read/Write, but has no effect. If BOREN <1:0> = 10 (Disabled in Sleep) or BOREN<1:0> = 01 (Under software control): 1 = Band gap is forced on always (covers Sleep/wake-up/operating cases) 0 = Band gap operates normally, and may turn off bit 5-1 Unimplemented: Read as ‘0’ bit 0 BORRDY: Brown-out Reset Circuit Ready Status bit 1 = The Brown-out Reset circuit is active 0 = The Brown-out Reset circuit is inactive Note 1: BOREN<1:0> bits are located in Configuration Word. DS40001585D-page 30  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 5.4 Low-Power Brown-out Reset 5.6 Watchdog Timer (WDT) Reset (LPBOR) The Watchdog Timer generates a Reset if the firmware The Low-Power Brown-Out Reset (LPBOR) is an does not issue a CLRWDT instruction within the time-out essential part of the Reset subsystem. Refer to period. The TO and PD bits in the STATUS register are Figure5-1 to see how the BOR interacts with other changed to indicate the WDT Reset. See Section8.0 modules. “Watchdog Timer” for more information. The LPBOR is used to monitor the external VDD pin. 5.7 Programming Mode ICSP Exit When too low of a voltage is detected, the device is held in Reset. When this occurs, a register bit (BOR) is Upon exit of Programming mode, the device will changed to indicate that a BOR Reset has occurred. behave as if a POR had just occurred. The same bit is set for both the BOR and the LPBOR. Refer to Register5-2. 5.8 Power-Up Timer 5.4.1 ENABLING LPBOR The Power-up Timer optionally delays device execution The LPBOR is controlled by the LPBOR bit of after a BOR or POR event. This timer is typically used to Configuration Word. When the device is erased, the allow VDD to stabilize before allowing the device to start LPBOR module defaults to enabled. running. The Power-up Timer is controlled by the PWRTE bit of 5.4.1.1 LPBOR Module Output Configuration Word. The output of the LPBOR module is a signal indicating whether or not a Reset is to be asserted. This signal is 5.9 Start-up Sequence OR’d together with the Reset signal of the BOR mod- ule to provide the generic BOR signal which goes to Upon the release of a POR or BOR, the following must the PCON register and to the power control block. occur before the device will begin executing: 1. Power-up Timer runs to completion (if enabled). 5.5 MCLR 2. MCLR must be released (if enabled). The MCLR is an optional external input that can reset The total time-out will vary based on oscillator configu- the device. The MCLR function is controlled by the ration and Power-up Timer configuration. See MCLRE and the LVP bit of Configuration Word (Table5- Section4.0 “Oscillator Module” for more informa- 2). tion. The Power-up Timer runs independently of MCLR Reset. If MCLR is kept low long enough, the Power-up Timer will TABLE 5-2: MCLR CONFIGURATION expire. Upon bringing MCLR high, the device will begin MCLRE LVP MCLR execution after 10 FOSC cycles (see Figure5-3). This is useful for testing purposes or to synchronize more than 0 0 Disabled one device operating in parallel. 1 0 Enabled x 1 Enabled 5.5.1 MCLR ENABLED When MCLR is enabled and the pin is held low, the device is held in Reset. The MCLR pin is connected to VDD through an internal weak pull-up. The device has a noise filter in the MCLR Reset path. The filter will detect and ignore small pulses. Note: A Reset does not drive the MCLR pin low. 5.5.2 MCLR DISABLED When MCLR is disabled, the pin functions as a general purpose input and the internal weak pull-up is under software control.  2011-2015 Microchip Technology Inc. DS40001585D-page 31

PIC10(L)F320/322 FIGURE 5-3: RESET START-UP SEQUENCE VDD Internal POR TPWRT Power-Up Timer MCLR TMCLR Internal RESET Oscillator Modes Internal Oscillator Oscillator FOSC External Clock (EC) CLKIN FOSC DS40001585D-page 32  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 5.10 Determining the Cause of a Reset Upon any Reset, multiple bits in the STATUS and PCON registers are updated to indicate the cause of the Reset. Table5-3 and Table5-4 show the Reset conditions of these registers. TABLE 5-3: RESET STATUS BITS AND THEIR SIGNIFICANCE POR BOR TO PD Condition 0 x 1 1 Power-on Reset u 0 1 1 Brown-out Reset u u 0 u WDT Reset u u 0 0 WDT Wake-up from Sleep u u u u MCLR Reset during normal operation u u 1 0 MCLR Reset during Sleep TABLE 5-4: RESET CONDITION FOR SPECIAL REGISTERS Program STATUS PCON Condition Counter Register Register Power-on Reset 0000h 0001 1000 ---- --0x MCLR Reset during normal operation 0000h 000u uuuu ---- --uu MCLR Reset during Sleep 0000h 0001 0uuu ---- --uu WDT Reset 0000h 0000 uuuu ---- --uu WDT Wake-up from Sleep PC + 1 0000 0uuu ---- --uu Brown-out Reset 0000h 0001 1uuu ---- --u0 Interrupt Wake-up from Sleep PC + 1(1) 0001 0uuu ---- --uu Legend: u = unchanged, x = unknown, - = unimplemented bit, reads as ‘0’. Note1: When the wake-up is due to an interrupt and Global Enable bit (GIE) is set, the return address is pushed on the stack and PC is loaded with the interrupt vector (0004h) after execution of PC + 1.  2011-2015 Microchip Technology Inc. DS40001585D-page 33

PIC10(L)F320/322 5.11 Power Control (PCON) Register The Power Control (PCON) register contains flag bits to differentiate between a: • Power-On Reset (POR) • Brown-Out Reset (BOR) The PCON register bits are shown in Register5-2. 5.12 Register Definition: Power Control REGISTER 5-2: PCON: POWER CONTROL REGISTER U-0 U-0 U-0 U-0 U-0 U-0 R/W/HC-q/u R/W/HC-q/u — — — — — — POR BOR bit 7 bit 0 Legend: HC = Bit is cleared by hardware R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7-2 Unimplemented: Read as ‘0’ bit 1 POR: Power-on Reset Status bit 1 = No Power-on Reset occurred 0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs) bit 0 BOR: Brown-out Reset Status bit 1 = No Brown-out Reset occurred 0 = A Brown-out Reset occurred (must be set in software after a Power-on Reset or Brown-out Reset occurs) TABLE 5-5: SUMMARY OF REGISTERS ASSOCIATED WITH RESETS Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page BORCON SBOREN BORFS — — — — — BORRDY 30 PCON — — — — — — POR BOR 34 STATUS IRP RP1 RP0 TO PD Z DC C 13 WDTCON — — WDTPS<4:0> SWDTEN 48 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Resets. TABLE 5-6: SUMMARY OF CONFIGURATION WORD WITH RESETS Register Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 on Page 13:8 — — — WRT<1:0> BORV LPBOR LVP CONFIG 20 7:0 CP MCLRE PWRTE WDTE<1:0> BOREN<1:0> FOSC Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Reset. DS40001585D-page 34  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 6.0 INTERRUPTS The interrupt feature allows certain events to preempt normal program flow. Firmware is used to determine the source of the interrupt and act accordingly. Some interrupts can be configured to wake the MCU from Sleep mode. This chapter contains the following information for Interrupts: • Operation • Interrupt Latency • Interrupts During Sleep • INT Pin • Context Saving during Interrupts Many peripherals produce interrupts. Refer to the corresponding chapters for details. A block diagram of the interrupt logic is shown in Figure6-1. FIGURE 6-1: INTERRUPT LOGIC Rev.10-000010A 1/13/2014 TMR0IF Wake-up TMR0IE (IfinSleepmode) INTF PeripheralInterrupts INTE (TMR1IF) PIR1<0> IOCIF (TMR1IE) PIE1<0> Interrupt IOCIE toCPU PEIE PIRn<7> GIE PIEn<7>  2011-2015 Microchip Technology Inc. DS40001585D-page 35

PIC10(L)F320/322 6.1 Operation 6.2 Interrupt Latency Interrupts are disabled upon any device Reset. They Interrupt latency is defined as the time from when the are enabled by setting the following bits: interrupt event occurs to the time code execution at the interrupt vector begins. The latency for synchronous • GIE bit of the INTCON register interrupts is three or four instruction cycles. For • Interrupt Enable bit(s) for the specific interrupt asynchronous interrupts, the latency is three to five event(s) instruction cycles, depending on when the interrupt • PEIE bit of the INTCON register (if the Interrupt occurs. See Figure6-2 and Section6.3 “Interrupts Enable bit of the interrupt event is contained in the During Sleep” for more details. PIE1 register) The INTCON and PIR1 registers record individual inter- rupts via interrupt flag bits. Interrupt flag bits will be set, regardless of the status of the GIE, PEIE and individual interrupt enable bits. The following events happen when an interrupt event occurs while the GIE bit is set: • Current prefetched instruction is flushed • GIE bit is cleared • Current Program Counter (PC) is pushed onto the stack • PC is loaded with the interrupt vector 0004h The firmware within the Interrupt Service Routine (ISR) should determine the source of the interrupt by polling the interrupt flag bits. The interrupt flag bits must be cleared before exiting the ISR to avoid repeated interrupts. Because the GIE bit is cleared, any interrupt that occurs while executing the ISR will be recorded through its interrupt flag, but will not cause the processor to redirect to the interrupt vector. The RETFIE instruction exits the ISR by popping the previous address from the stack, and setting the GIE bit. For additional information on a specific interrupt’s operation, refer to its peripheral chapter. Note1: Individual interrupt flag bits are set, regardless of the state of any other enable bits. 2: All interrupts will be ignored while the GIE bit is cleared. Any interrupt occurring while the GIE bit is clear will be serviced when the GIE bit is set again. DS40001585D-page 36  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 FIGURE 6-2: INTERRUPT LATENCY INTOSC Q1Q2Q3 Q4Q1Q2Q3Q4Q1Q2Q3Q4Q1 Q2Q3Q4Q1Q2Q3Q4Q1Q2 Q3Q4Q1Q2Q3Q4Q1Q2Q3Q4 CLKR Interrupt Sampled during Q1 Interrupt GIE PC PC-1 PC PC+1 0004h 0005h Execute 1 Cycle Instruction at PC Inst(PC) NOP NOP Inst(0004h) Interrupt GIE PC+1/FSR New PC/ PC PC-1 PC ADDR PC+1 0004h 0005h Execute 2 Cycle Instruction at PC Inst(PC) NOP NOP Inst(0004h) Interrupt GIE PC PC-1 PC FSR ADDR PC+1 PC+2 0004h 0005h Execute 3 Cycle Instruction at PC INST(PC) NOP NOP NOP Inst(0004h) Inst(0005h) Interrupt GIE PC PC-1 PC FSR ADDR PC+1 PC+2 0004h 0005h Execute 3 Cycle Instruction at PC INST(PC) NOP NOP NOP NOP Inst(0004h)  2011-2015 Microchip Technology Inc. DS40001585D-page 37

PIC10(L)F320/322 FIGURE 6-3: INT PIN INTERRUPT TIMING Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 INTOSC CLKR (3) INT pin (1) (1) (2) INTF (4) Interrupt Latency GIE INSTRUCTION FLOW PC PC PC + 1 PC + 1 0004h 0005h Instruction Fetched Inst (PC) Inst (PC + 1) — Inst (0004h) Inst (0005h) Instruction Inst (PC – 1) Inst (PC) Forced NOP Forced NOP Inst (0004h) Executed Note 1: INTF flag is sampled here (every Q1). 2: Asynchronous interrupt latency = 3-5 TCY. Synchronous latency = 3-4 TCY, where TCY = instruction cycle time. Latency is the same whether Inst (PC) is a single cycle or a 2-cycle instruction. 3: For minimum width of INT pulse, refer to AC specifications in Section24.0 “Electrical Specifications”. 4: INTF is enabled to be set any time during the Q4-Q1 cycles. DS40001585D-page 38  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 6.3 Interrupts During Sleep 6.5 Context Saving During Interrupts Some interrupts can be used to wake from Sleep. To During an interrupt, only the return PC value is saved wake from Sleep, the peripheral must be able to on the stack. Typically, users may wish to save key operate without the system clock. The interrupt source registers during an interrupt (e.g., W and STATUS must have the appropriate Interrupt Enable bit(s) set registers). This must be implemented in software. prior to entering Sleep. Temporary holding registers W_TEMP and On waking from Sleep, if the GIE bit is also set, the STATUS_TEMP should be placed in the last 16 bytes processor will branch to the interrupt vector. Otherwise, of GPR (see Table1-2). This makes context save and the processor will continue executing instructions after restore operations simpler. The code shown in the SLEEP instruction. The instruction directly after the Example6-1 can be used to: SLEEP instruction will always be executed before • Store the W register branching to the ISR. Refer to the Section7.0 “Power- • Store the STATUS register Down Mode (Sleep)” for more details. • Execute the ISR code 6.4 INT Pin • Restore the Status (and Bank Select Bit register) • Restore the W register The INT pin can be used to generate an asynchronous Note: These devices do not require saving the edge-triggered interrupt. This interrupt is enabled by PCLATH. However, if computed GOTOs setting the INTE bit of the INTCON register. The are used in both the ISR and the main INTEDG bit of the OPTION_REG register determines on code, the PCLATH must be saved and which edge the interrupt will occur. When the INTEDG restored in the ISR. bit is set, the rising edge will cause the interrupt. When the INTEDG bit is clear, the falling edge will cause the interrupt. The INTF bit of the INTCON register will be set when a valid edge appears on the INT pin. If the GIE and INTE bits are also set, the processor will redirect program execution to the interrupt vector. EXAMPLE 6-1: SAVING STATUS AND W REGISTERS IN RAM MOVWF W_TEMP ;Copy W to TEMP register SWAPF STATUS,W ;Swap status to be saved into W ;Swaps are used because they do not affect the status bits MOVWF STATUS_TEMP ;Save status to bank zero STATUS_TEMP register : :(ISR) ;Insert user code here : SWAPF STATUS_TEMP,W ;Swap STATUS_TEMP register into W ;(sets bank to original state) MOVWF STATUS ;Move W into STATUS register SWAPF W_TEMP,F ;Swap W_TEMP SWAPF W_TEMP,W ;Swap W_TEMP into W  2011-2015 Microchip Technology Inc. DS40001585D-page 39

PIC10(L)F320/322 6.6 Interrupt Control Registers REGISTER 6-1: INTCON: INTERRUPT CONTROL REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R-0/0 GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 GIE: Global Interrupt Enable bit 1 = Enables all active interrupts 0 = Disables all interrupts bit 6 PEIE: Peripheral Interrupt Enable bit 1 = Enables all active peripheral interrupts 0 = Disables all peripheral interrupts bit 5 TMR0IE: Timer0 Overflow Interrupt Enable bit 1 = Enables the Timer0 interrupt 0 = Disables the Timer0 interrupt bit 4 INTE: INT External Interrupt Enable bit 1 = Enables the INT external interrupt 0 = Disables the INT external interrupt bit 3 IOCIE: Interrupt-on-Change Interrupt Enable bit 1 = Enables the interrupt-on-change interrupt 0 = Disables the interrupt-on-change interrupt bit 2 TMR0IF: Timer0 Overflow Interrupt Flag bit 1 = TMR0 register has overflowed 0 = TMR0 register did not overflow bit 1 INTF: INT External Interrupt Flag bit 1 = The INT external interrupt occurred 0 = The INT external interrupt did not occur bit 0 IOCIF: Interrupt-on-Change Interrupt Flag bit(1) 1 = When at least one of the interrupt-on-change pins changed state 0 = None of the interrupt-on-change pins have changed state Note 1: The IOCIF Flag bit is read-only and cleared when all the Interrupt-on-Change flags in the IOCAF register have been cleared by software. Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Interrupt Enable bit, GIE, of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. DS40001585D-page 40  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 REGISTER 6-2: PIE1: PERIPHERAL INTERRUPT ENABLE REGISTER 1 U-0 R/W-0/0 U-0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 U-0 — ADIE — NCO1IE CLC1IE — TMR2IE — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6 ADIE: A/D Converter Interrupt Enable bit 1 = Enables the A/D converter interrupt 0 = Disables the A/D converter interrupt bit 5 Unimplemented: Read as ‘0’ bit 4 NCO1IE: Numerically Controlled Oscillator Interrupt Enable bit 1 = Enables the NCO overflow interrupt 0 = Disables the NCO overflow interrupt bit 3 CLC1IE: Configurable Logic Block Interrupt Enable bit 1 = Enables the CLC interrupt 0 = Disables the CLC interrupt bit 2 Unimplemented: Read as ‘0’ bit 1 TMR2IE: TMR2 to PR2 Match Interrupt Enable bit 1 = Enables the TMR2 to PR2 Match interrupt 0 = Disables the TMR2 to PR2 Match interrupt bit 0 Unimplemented: Read as ‘0’ Note: Bit PEIE of the INTCON register must be set to enable any peripheral interrupt.  2011-2015 Microchip Technology Inc. DS40001585D-page 41

PIC10(L)F320/322 REGISTER 6-3: PIR1: PERIPHERAL INTERRUPT REQUEST REGISTER 1 U-0 R/W-0/0 U-0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 U-0 — ADIF — NCO1IF CLC1IF — TMR2IF — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6 ADIF: A/D Converter Interrupt Flag bit 1 = The A/D conversion completed 0 = The A/D conversion is not complete bit 5 Unimplemented: Read as ‘0’ bit 4 NCO1IF: Numerically Controlled Oscillator Interrupt Flag bit 1 = NCO1 overflow occurred (must be cleared in software) 0 = No NCO1 overflow bit 3 CLC1IF: Configurable Logic Block Rising Edge Interrupt Flag bit 1 = CLC interrupt occurred (must be cleared in software) 0 = No CLC Interrupt bit 2 Unimplemented: Read as ‘0’ bit 1 TMR2IF: TMR2 to PR2 Match Interrupt Flag bit 1 = TMR2 to PR2 match occurred (must be cleared in software) 0 = No TMR2 to PR2 match Note: The match must occur the number of times specified by the TMR2 postscaler (Register17-1). bit 0 Unimplemented: Read as ‘0’ Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Interrupt Enable bit, GIE, of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. DS40001585D-page 42  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 TABLE 6-1: SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPTS Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 40 IOCAF — — — — IOCAF3 IOCAF2 IOCAF1 IOCAF0 76 IOCAN — — — — IOCAN3 IOCAN2 IOCAN1 IOCAN0 75 IOCAP — — — — IOCAP3 IOCAP2 IOCAP1 IOCAP0 75 OPTION_REG WPUEN INTEDG T0CS T0SE PSA PS<2:0> 95 PIE1 — ADIE — NCO1IE CLC1IE — TMR2IE — 41 PIR1 — ADIF — NCO1IF CLC1IF — TMR2IF — 42 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Interrupts.  2011-2015 Microchip Technology Inc. DS40001585D-page 43

PIC10(L)F320/322 7.0 POWER-DOWN MODE (SLEEP) 7.1 Wake-up from Sleep The Power-Down mode is entered by executing a The device can wake-up from Sleep through one of the SLEEP instruction. following events: Upon entering Sleep mode, the following conditions 1. External Reset input on MCLR pin, if enabled exist: 2. BOR Reset, if enabled 1. WDT will be cleared but keeps running, if 3. POR Reset enabled for operation during Sleep. 4. Watchdog Timer, if enabled 2. PD bit of the STATUS register is cleared. 5. Any external interrupt 3. TO bit of the STATUS register is set. 6. Interrupts by peripherals capable of running 4. CPU clock is disabled. during Sleep (see individual peripheral for more 5. 31 kHz LFINTOSC is unaffected and peripherals information) that operate from it may continue operation in The first three events will cause a device Reset. The Sleep. last three events are considered a continuation of pro- 6. ADC is unaffected, if the dedicated FRC clock is gram execution. To determine whether a device Reset selected. or wake-up event occurred, refer to Section5.10 7. I/O ports maintain the status they had before “Determining the Cause of a Reset”. SLEEP was executed (driving high, low or high- When the SLEEP instruction is being executed, the next impedance). instruction (PC + 1) is prefetched. For the device to 8. Resets other than WDT are not affected by wake-up through an interrupt event, the corresponding Sleep mode. interrupt enable bit must be enabled. Wake-up will occur regardless of the state of the GIE bit. If the GIE Refer to individual chapters for more details on bit is disabled, the device continues execution at the peripheral operation during Sleep. instruction after the SLEEP instruction. If the GIE bit is To minimize current consumption, the following condi- enabled, the device executes the instruction after the tions should be considered: SLEEP instruction, the device will then call the Interrupt • I/O pins should not be floating Service Routine. In cases where the execution of the instruction following SLEEP is not desirable, the user • External circuitry sinking current from I/O pins should have a NOP after the SLEEP instruction. • Internal circuitry sourcing current from I/O pins The WDT is cleared when the device wakes up from • Current draw from pins with internal weak pull-ups Sleep, regardless of the source of wake-up. • Modules using 31 kHz LFINTOSC The Complementary Waveform Generator (CWG) and • CWG and NCO modules using HFINTOSC the Numerically Controlled Oscillator (NCO) modules I/O pins that are high-impedance inputs should be can utilize the HFINTOSC oscillator as their respective pulled to VDD or VSS externally to avoid switching clock source. Under certain conditions, when the currents caused by floating inputs. HFINTOSC is selected for use with the CWG or NCO Examples of internal circuitry that might be sourcing modules, the HFINTOSC will remain active during current include the FVR module. See Section12.0 Sleep. This will have a direct effect on the Sleep mode “Fixed Voltage Reference (FVR)” for more informa- current. Please refer to 21.0 “Complementary Wave- tion on these modules. form Generator (CWG) Module” and 20.0 “Numeri- cally Controlled Oscillator (NCO) Module” for more information. DS40001585D-page 44  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 7.1.1 WAKE-UP USING INTERRUPTS • If the interrupt occurs during or after the execution of a SLEEP instruction When global interrupts are disabled (GIE cleared) and any interrupt source has both its interrupt enable bit - SLEEP instruction will be completely and interrupt flag bit set, one of the following will occur: executed - Device will immediately wake-up from Sleep • If the interrupt occurs before the execution of a SLEEP instruction - WDT and WDT prescaler will be cleared - SLEEP instruction will execute as a NOP. - TO bit of the STATUS register will be set - WDT and WDT prescaler will not be cleared - PD bit of the STATUS register will be cleared. - TO bit of the STATUS register will not be set Even if the flag bits were checked before executing a - PD bit of the STATUS register will not be SLEEP instruction, it may be possible for flag bits to cleared. become set before the SLEEP instruction completes. To determine whether a SLEEP instruction executed, test the PD bit. If the PD bit is set, the SLEEP instruction was executed as a NOP. FIGURE 7-1: WAKE-UP FROM SLEEP THROUGH INTERRUPT Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 CLKIN(1) CLKOUT(2) TOST(3) Interrupt flag Interrupt Latency(4) GIE bit Processor in (INTCON reg.) Sleep Instruction Flow PC PC PC + 1 PC + 2 PC + 2 PC + 2 0004h 0005h Instruction Fetched Inst(PC) = Sleep Inst(PC + 1) Inst(PC + 2) Inst(0004h) Inst(0005h) IEnxsetrcuuctteiodn Inst(PC - 1) Sleep Inst(PC + 1) Forced NOP Forced NOP Inst(0004h) Note 1: External clock. High, Medium, Low mode assumed. 2: CLKOUT is shown here for timing reference. 3: TOST= 1024 TOSC; This delay does not apply to EC, RC and INTOSC Oscillator modes or Two-Speed Start-up (see Section5.4 “Low- Power Brown-out Reset (LPBOR)”.). 4: GIE = 1 assumed. In this case after wake-up, the processor calls the ISR at 0004h. If GIE = 0, execution will continue in-line. TABLE 7-1: SUMMARY OF REGISTERS ASSOCIATED WITH POWER-DOWN MODE Register on Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page STATUS IRP RP1 RP0 TO PD Z DC C 13 WDTCON — — WDTPS<4:0> SWDTEN 48 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used in Power-down mode.  2011-2015 Microchip Technology Inc. DS40001585D-page 45

PIC10(L)F320/322 8.0 WATCHDOG TIMER The Watchdog Timer is a system timer that generates a Reset if the firmware does not issue a CLRWDT instruction within the time-out period. The Watchdog Timer is typically used to recover the system from unexpected events. The WDT has the following features: • Independent clock source • Multiple operating modes - WDT is always on - WDT is off when in Sleep - WDT is controlled by software - WDT is always off • Configurable time-out period is from 1 ms to 256 seconds (typical) • Multiple Reset conditions • Operation during Sleep FIGURE 8-1: WATCHDOG TIMER BLOCK DIAGRAM WDTE<1:0>=01 SWDTEN 23-bit Programmable WDTE<1:0>=11 LFINTOSC WDT Time-out Prescaler WDT WDTE<1:0>=10 Sleep WDTPS<4:0> DS40001585D-page 46  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 8.1 Independent Clock Source 8.3 Time-Out Period The WDT derives its time base from the 31kHz The WDTPS bits of the WDTCON register set the time- LFINTOSC internal oscillator. Time intervals in this out period from 1 ms to 256 seconds (nominal). After a chapter are based on a nominal interval of 1ms. See Reset, the default time-out period is 2 seconds. Section24.0 “Electrical Specifications” for the LFINTOSC tolerances. 8.4 Clearing the WDT 8.2 WDT Operating Modes The WDT is cleared when any of the following conditions occur: The Watchdog Timer module has four operating modes • Any Reset controlled by the WDTE<1:0> bits in Configuration • CLRWDT instruction is executed Word. See Table8-1. • Device enters Sleep 8.2.1 WDT IS ALWAYS ON • Device wakes up from Sleep When the WDTE bits of Configuration Word are set to • Oscillator fail ‘11’, the WDT is always on. • WDT is disabled WDT protection is active during Sleep. See Table8-2 for more information. 8.2.2 WDT IS OFF IN SLEEP 8.5 Operation During Sleep When the WDTE bits of Configuration Word are set to When the device enters Sleep, the WDT is cleared. If ‘10’, the WDT is on, except in Sleep. the WDT is enabled during Sleep, the WDT resumes WDT protection is not active during Sleep. counting. 8.2.3 WDT CONTROLLED BY SOFTWARE When the device exits Sleep, the WDT is cleared again. When the WDTE bits of Configuration Word are set to When a WDT time-out occurs while the device is in ‘01’, the WDT is controlled by the SWDTEN bit of the Sleep, no Reset is generated. Instead, the device WDTCON register. wakes up and resumes operation. The TO and PD bits WDT protection is unchanged by Sleep. See Table8-1 in the STATUS register are changed to indicate the for more details. event. See Section2.0 “Memory Organization” and Register2-1 for more information. TABLE 8-1: WDT OPERATING MODES Device WDT WDTE<1:0> SWDTEN Mode Mode 11 X X Active Awake Active 10 X Sleep Disabled 1 Active 01 X 0 Disabled 00 X X Disabled TABLE 8-2: WDT CLEARING CONDITIONS Conditions WDT WDTE<1:0>=00 WDTE<1:0>=01 and SWDTEN = 0 WDTE<1:0>=10 and enter Sleep Cleared CLRWDT Command Exit Sleep Change INTOSC divider (IRCF bits) Unaffected  2011-2015 Microchip Technology Inc. DS40001585D-page 47

PIC10(L)F320/322 8.6 Watchdog Control Register REGISTER 8-1: WDTCON: WATCHDOG TIMER CONTROL REGISTER U-0 U-0 R/W-0/0 R/W-1/1 R/W-0/0 R/W-1/1 R/W-1/1 R/W-0/0 — — WDTPS<4:0> SWDTEN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-1 WDTPS<4:0>: Watchdog Timer Period Select bits(1) Bit Value = Prescale Rate 11111 = Reserved. Results in minimum interval (1:32) • • • 10011 = Reserved. Results in minimum interval (1:32) 10010 = 1:8388608 (223) (Interval 256s nominal) 10001 = 1:4194304 (222) (Interval 128s nominal) 10000 = 1:2097152 (221) (Interval 64s nominal) 01111 = 1:1048576 (220) (Interval 32s nominal) 01110 = 1:524288 (219) (Interval 16s nominal) 01101 = 1:262144 (218) (Interval 8s nominal) 01100 = 1:131072 (217) (Interval 4s nominal) 01011 = 1:65536 (Interval 2s nominal) (Reset value) 01010 = 1:32768 (Interval 1s nominal) 01001 = 1:16384 (Interval 512ms nominal) 01000 = 1:8192 (Interval 256ms nominal) 00111 = 1:4096 (Interval 128ms nominal) 00110 = 1:2048 (Interval 64ms nominal) 00101 = 1:1024 (Interval 32ms nominal) 00100 = 1:512 (Interval 16ms nominal) 00011 = 1:256 (Interval 8ms nominal) 00010 = 1:128 (Interval 4ms nominal) 00001 = 1:64 (Interval 2ms nominal) 00000 = 1:32 (Interval 1ms nominal) bit 0 SWDTEN: Software Enable/Disable for Watchdog Timer bit If WDTE<1:0> = 00: This bit is ignored. If WDTE<1:0> = 01: 1 = WDT is turned on 0 = WDT is turned off If WDTE<1:0> = 1x: This bit is ignored. Note 1: Times are approximate. WDT time is based on 31 kHz LFINTOSC. DS40001585D-page 48  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 TABLE 8-3: SUMMARY OF REGISTERS ASSOCIATED WITH WATCHDOG TIMER Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page OSCCON — IRCF<2:0> HFIOFR — LFIOFR HFIOFS 26 STATUS IRP RP1 RP0 TO PD Z DC C 13 WDTCON — — WDTPS<4:0> SWDTEN 48 Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by Watchdog Timer. TABLE 8-4: SUMMARY OF CONFIGURATION WORD WITH WATCHDOG TIMER Register Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 on Page 13:8 — — — WRT<1:0> BORV LPBOR LVP CONFIG 20 7:0 CP MCLRE PWRTE WDTE<1:0> BOREN<1:0> FOSC Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Watchdog Timer.  2011-2015 Microchip Technology Inc. DS40001585D-page 49

PIC10(L)F320/322 9.0 FLASH PROGRAM MEMORY 9.1.1 PMCON1 AND PMCON2 CONTROL REGISTERS PMCON1 is the control register for Flash program The Flash program memory is readable and writable memory accesses. during normal operation over the full VDD range. Program memory is indirectly addressed using Special Control bits RD and WR initiate read and write, Function Registers (SFRs). The SFRs used to access respectively. These bits cannot be cleared, only set, in program memory are: software. They are cleared by hardware at completion of the read or write operation. The inability to clear the • PMCON1 WR bit in software prevents the accidental, premature • PMCON2 termination of a write operation. • PMDATL The WREN bit, when set, will allow a write operation to • PMDATH occur. On power-up, the WREN bit is clear. The • PMADRL WRERR bit is set when a write operation is interrupted • PMADRH by a Reset during normal operation. In these situations, following Reset, the user can check the WRERR bit When accessing the program memory, the and execute the appropriate error handling routine. PMDATH:PMDATL register pair forms a 2-byte word that holds the 14-bit data for read/write, and the The PMCON2 register is a write-only register. Attempting PMADRH:PMADRL register pair forms a 2-byte word to read the PMCON2 register will return all ‘0’s. that holds the 9-bit address of the program memory To enable writes to the program memory, a specific location being read. pattern (the unlock sequence), must be written to the The write time is controlled by an on-chip timer. The write/ PMCON2 register. The required unlock sequence erase voltages are generated by an on-chip charge pump prevents inadvertent writes to the program memory rated to operate over the operating voltage range of the write latches and Flash program memory. device. 9.2 Flash Program Memory Overview The Flash program memory can be protected in two ways; by code protection (CP bit in Configuration Word) It is important to understand the Flash program memory and write protection (WRT<1:0> bits in Configuration structure for erase and programming operations. Flash Word). program memory is arranged in rows. A row consists of Code protection (CP = 0)(1), disables access, reading a fixed number of 14-bit program memory words. A row and writing, to the Flash program memory via external is the minimum size that can be erased by user software. device programmers. Code protection does not affect After a row has been erased, the user can reprogram the self-write and erase functionality. Code protection all or a portion of this row. Data to be written into the can only be reset by a device programmer performing program memory row is written to 14-bit wide data write a Bulk Erase to the device, clearing all Flash program latches. These write latches are not directly accessible memory, Configuration bits and User IDs. to the user, but may be loaded via sequential writes to Write protection prohibits self-write and erase to a the PMDATH:PMDATL register pair. portion or all of the Flash program memory as defined Note: If the user wants to modify only a portion by the bits WRT<1:0>. Write protection does not affect of a previously programmed row, then the a device programmers ability to read, write or erase the contents of the entire row must be read device. and saved in RAM prior to the erase. Note 1: Code protection of the entire Flash Then, new data and retained data can be program memory array is enabled by written into the write latches to reprogram clearing the CP bit of Configuration Word. the row of Flash program memory. How- ever, any unprogrammed locations can be 9.1 PMADRL and PMADRH Registers written without first erasing the row. In this case, it is not necessary to save and The PMADRH:PMADRL register pair can address up rewrite the other previously programmed to a maximum of 512 words of program memory. When locations. selecting a program address value, the MSB of the See Table9-1 for Erase Row size and the number of address is written to the PMADRH register and the LSB write latches for Flash program memory. is written to the PMADRL register. DS40001585D-page 50  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 FIGURE 9-1: FLASH PROGRAM TABLE 9-1: FLASH MEMORY MEMORY READ ORGANIZATION BY DEVICE FLOWCHART Write Row Erase Device Latches (words) (words) Start Read Operation PIC10(L)F320 16 16 PIC10(L)F322 Select 9.2.1 READING THE FLASH PROGRAM Program or Configuration Memory MEMORY (CFGS) To read a program memory location, the user must: 1. Write the desired address to the Select PMADRH:PMADRL register pair. Word Address 2. Clear the CFGS bit of the PMCON1 register. (PMADRH:PMADRL) 3. Then, set control bit RD of the PMCON1 register. Once the read control bit is set, the program memory Flash controller will use the second instruction cycle to Initiate Read operation (RD = 1) read the data. This causes the second instruction immediately following the “BSF PMCON1,RD” instruction to be ignored. The data is available in the very next cycle, in the PMDATH:PMDATL register pair; therefore, it can Instruction Fetched ignored be read as two bytes in the following instructions. NOP execution forced PMDATH:PMDATL register pair will hold this value until another read or until it is written to by the user. Instruction Fetched ignored Note: The two instructions following a program NOP execution forced memory read are required to be NOPs. This prevents the user from executing a 2-cycle instruction on the next instruction Data read now in after the RD bit is set. PMDATH:PMDATL End Read Operation  2011-2015 Microchip Technology Inc. DS40001585D-page 51

PIC10(L)F320/322 FIGURE 9-2: FLASH PROGRAM MEMORY READ CYCLE EXECUTION Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Flash ADDR PC PC + 1 PMADRH,PMADRL PPCC ++ 33 PC + 4 PC + 5 Flash Data INSTR (PC) INSTR (PC + 1) PMDATH,PMDATL INSTR (PC + 3) INSTR (PC + 4) INSTR(PC + 1) INSTR(PC + 2) INSTR(PC - 1) BSF PMCON1,RD instruction ignored instruction ignored INSTR(PC + 3) INSTR(PC + 4) executed here executed here Forced NOP Forced NOP executed here executed here executed here executed here RD bit PMDATH PMDATL Register EXAMPLE 9-1: FLASH PROGRAM MEMORY READ * This code block will read 1 word of program * memory at the memory address: PROG_ADDR_HI: PROG_ADDR_LO * data will be returned in the variables; * PROG_DATA_HI, PROG_DATA_LO BANKSEL PMADRL ; not required on devices with 1 Bank of SFRs MOVLW PROG_ADDR_LO ; MOVWF PMADRL ; Store LSB of address MOVLW PROG_ADDR_HI ; MOVWF PMADRH ; Store MSB of address BCF PMCON1,CFGS ; Do not select Configuration Space BSF PMCON1,RD ; Initiate read NOP ; Ignored (Figure 9-2) NOP ; Ignored (Figure 9-2) MOVF PMDATL,W ; Get LSB of word MOVWF PROG_DATA_LO ; Store in user location MOVF PMDATH,W ; Get MSB of word MOVWF PROG_DATA_HI ; Store in user location DS40001585D-page 52  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 9.2.2 FLASH MEMORY UNLOCK FIGURE 9-3: FLASH PROGRAM SEQUENCE MEMORY UNLOCK SEQUENCE FLOWCHART Note: A delay of at least 100s is required after Power-On Reset (POR) before executing a Flash memory unlock sequence. Start The unlock sequence is a mechanism that protects the Unlock Sequence Flash program memory from unintended self-write pro- gramming or erasing. The sequence must be executed and completed without interruption to successfully Write 055h to complete any of the following operations: PMCON2 • Row Erase • Load program memory write latches Write 0AAh to • Write of program memory write latches to PMCON2 program memory • Write of program memory write latches to User IDs Initiate Write or Erase operation The unlock sequence consists of the following steps: (WR = 1) 1. Write 55h to PMCON2 2. Write AAh to PMCON2 Instruction Fetched ignored 3. Set the WR bit in PMCON1 NOP execution forced 4. NOP instruction 5. NOP instruction Instruction Fetched ignored Once the WR bit is set, the processor will always force NOP execution forced two NOP instructions. When an Erase Row or Program Row operation is being performed, the processor will stall internal operations (typical 2 ms), until the operation is End complete and then resume with the next instruction. Unlock Sequence When the operation is loading the program memory write latches, the processor will always force the two NOP instructions and continue uninterrupted with the next instruction. Since the unlock sequence must not be interrupted, global interrupts should be disabled prior to the unlock sequence and re-enabled after the unlock sequence is completed.  2011-2015 Microchip Technology Inc. DS40001585D-page 53

PIC10(L)F320/322 9.2.3 ERASING FLASH PROGRAM FIGURE 9-4: FLASH PROGRAM MEMORY MEMORY ERASE FLOWCHART While executing code, program memory can only be erased by rows. To erase a row: 1. Load the PMADRH:PMADRL register pair with Start any address within the row to be erased. Erase Operation 2. Clear the CFGS bit of the PMCON1 register. 3. Set the FREE and WREN bits of the PMCON1 register. Disable Interrupts (GIE = 0) 4. Write 55h, then AAh, to PMCON2 (Flash programming unlock sequence). 5. Set control bit WR of the PMCON1 register to Select begin the erase operation. Program or Configuration Memory (CFGS) See Example9-2. After the “BSF PMCON1,WR” instruction, the processor requires two cycles to set up the erase operation. The Select Row Address user must place two NOP instructions after the WR bit is (PMADRH:PMADRL) set. The processor will halt internal operations for the typical 2ms erase time. This is not Sleep mode as the clocks and peripherals will continue to run. After the Select Erase Operation erase cycle, the processor will resume operation with (FREE = 1) the third instruction after the PMCON1 write instruction. Enable Write/Erase Operation (WREN = 1) Unlock Sequence (FFIGigUurReE9 x-3-x) CPU stalls while ERASE operation completes (2ms typical) Disable Write/Erase Operation (WREN = 0) Re-enable Interrupts (GIE = 1) End Erase Operation DS40001585D-page 54  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 EXAMPLE 9-2: ERASING ONE ROW OF PROGRAM MEMORY ; This row erase routine assumes the following: ; 1. A valid address within the erase row is loaded in ADDRH:ADDRL ; 2. ADDRH and ADDRL are located in shared data memory 0x70 - 0x7F (common RAM) BCF INTCON,GIE ; Disable ints so required sequences will execute properly BANKSEL PMADRL ; not required on devices with 1 Bank of SFRs MOVF ADDRL,W ; Load lower 8 bits of erase address boundary MOVWF PMADRL MOVF ADDRH,W ; Load upper 6 bits of erase address boundary MOVWF PMADRH BCF PMCON1,CFGS ; Not configuration space BSF PMCON1,FREE ; Specify an erase operation BSF PMCON1,WREN ; Enable writes MOVLW 55h ; Start of required sequence to initiate erase MOVWF PMCON2 ; Write 55h RequiredSequence MMBOOSVVFLWWF 0PPAMMACChOO NN21 ,WR ;;; WSreitt eW RA Abhit to begin erase NOP ; NOP instructions are forced as processor starts NOP ; row erase of program memory. ; ; The processor stalls until the erase process is complete ; after erase processor continues with 3rd instruction BCF PMCON1,WREN ; Disable writes BSF INTCON,GIE ; Enable interrupts  2011-2015 Microchip Technology Inc. DS40001585D-page 55

PIC10(L)F320/322 9.2.4 WRITING TO FLASH PROGRAM The following steps should be completed to load the MEMORY write latches and program a row of program memory. These steps are divided into two parts. First, each write Program memory is programmed using the following latch is loaded with data from the PMDATH:PMDATL steps: using the unlock sequence with LWLO = 1. When the 1. Load the address in PMADRH:PMADRL of the last word to be loaded into the write latch is ready, the row to be programmed. LWLO bit is cleared and the unlock sequence 2. Load each write latch with data. executed. This initiates the programming operation, 3. Initiate a programming operation. writing all the latches into Flash program memory. 4. Repeat steps 1 through 3 until all data is written. Note: The special unlock sequence is required Before writing to program memory, the word(s) to be to load a write latch with data or initiate a written must be erased or previously unwritten. Flash programming operation. If the Program memory can only be erased one row at a time. unlock sequence is interrupted, writing to No automatic erase occurs upon the initiation of the the latches or program memory will not be write. initiated. Program memory can be written one or more words at 1. Set the WREN bit of the PMCON1 register. a time. The maximum number of words written at one 2. Clear the CFGS bit of the PMCON1 register. time is equal to the number of write latches. See 3. Set the LWLO bit of the PMCON1 register. Figure9-5 (row writes to program memory with 16 write When the LWLO bit of the PMCON1 register is latches) for more details. ‘1’, the write sequence will only load the write The write latches are aligned to the Flash row address latches and will not initiate the write to Flash boundary defined by the upper ten bits of program memory. PMADRH:PMADRL, (PMADRH<6:0>:PMADRL<7:5>) 4. Load the PMADRH:PMADRL register pair with with the lower five bits of PMADRL, (PMADRL<4:0>) the address of the location to be written. determining the write latch being loaded. Write opera- 5. Load the PMDATH:PMDATL register pair with tions do not cross these boundaries. At the completion the program memory data to be written. of a program memory write operation, the data in the 6. Execute the unlock sequence (Section9.2.2 write latches is reset to contain 0x3FFF. “Flash Memory Unlock Sequence”). The write latch is now loaded. 7. Increment the PMADRH:PMADRL register pair to point to the next location. 8. Repeat steps 5 through 7 until all but the last write latch has been loaded. 9. Clear the LWLO bit of the PMCON1 register. When the LWLO bit of the PMCON1 register is ‘0’, the write sequence will initiate the write to Flash program memory. 10. Load the PMDATH:PMDATL register pair with the program memory data to be written. 11. Execute the unlock sequence (Section9.2.2 “Flash Memory Unlock Sequence”). The entire program memory latch content is now written to Flash program memory. Note: The program memory write latches are reset to the blank state (0x3FFF) at the completion of every write or erase operation. As a result, it is not necessary to load all the program memory write latches. Unloaded latches will remain in the blank state. An example of the complete write sequence is shown in Example9-3. The initial address is loaded into the PMADRH:PMADRL register pair; the data is loaded using indirect addressing. DS40001585D-page 56  2011-2015 Microchip Technology Inc.

D FIGURE 9-5: BLOCK WRITES TO FLASH PROGRAM MEMORY WITH 16 WRITE LATCHES P S 4 0 I 0 C 01 7 1 0 7 4 3 0 7 5 0 7 0 5 8 1 5 PMADRH PMADRL - - PMDATH PMDATL D 0 -pag - - - - - - - r4 r3 r2 r1 r0 c3 c2 c1 c0 6 8 ( e L 5 7 ) F 14 3 Program Memory Write Latches 2 4 0 14 14 14 14 / 3 2 Write Latch #0 Write Latch #1 Write Latch #14 Write Latch #15 00h 01h 0Eh 0Fh 2 PMADRL<3:0> 5 14 14 14 14 PMADRH<0>: PMADRL<7:4> Row Addr Addr Addr Addr 000h 0000h 0001h 000Eh 000Fh 001h 0010h 0011h 001Eh 001Fh 002h 0020h 0021h 002Eh 002Fh CFGS = 0 01Eh 01E0h 01E1h 01EEh 01EFh  2 Row 01Fh 01F0h 01F1h 01FEh 01FFh 0 1 Address 1-2 Decode Flash Program Memory 0 1 5 M ic ro 000h 2000h - 2003h 2004h - 2005h 2006h 2007h 2008h  c h ip Te CFGS = 1 USER ID 0 - 3 reserved DERVEIVCIEDID ConWfigourrdation reserved c h no Configuration Memory lo g y In c .

PIC10(L)F320/322 FIGURE 9-6: FLASH PROGRAM MEMORY WRITE FLOWCHART Start Write Operation Determine number of words Enable Write/Erase to be written into Program or Operation (WREN = 1) Configuration Memory. The number of words cannot exceed the number of words per row. (word_cnt) Load the value to write (PMDATH:PMDATL) Update the word counter Write Latches to Flash Disable Interrupts (word_cnt--) (LWLO = 0) (GIE = 0) Unlock Sequence Select Program or Config. Memory Last word to Yes F(Figiguurere9 x-3-x) (CFGS) write ? No CPU stalls while Write Select Row Address operation completes (PMADRH:PMADRL) (2ms typical) Unlock Sequence F(Figiguurere9 x-3-x) Select Write Operation (FREE = 0) Disable No delay when writing to Write/Erase Operation Program Memory Latches (WREN = 0) Load Write Latches Only (LWLO = 1) Re-enable Interrupts (GIE = 1) Increment Address (PMADRH:PMADRL++) End Write Operation DS40001585D-page 58  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 EXAMPLE 9-3: WRITING TO FLASH PROGRAM MEMORY ;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;; ; This write routine assumes the following: ; A valid starting address (the least significant bits = '00') ; is loaded in ADDRH:ADDRL ; ADDRH, ADDRL and DATADDR are all located in data memory ; BANKSEL PMADRH MOVF ADDRH,W ;Load initial address MOVWF PMADRH ; MOVF ADDRL,W ; MOVWF PMADRL ; MOVF DATAADDR,W ;Load initial data address MOVWF FSR ; LOOP MOVF INDF,W ;Load first data byte into lower MOVWF PMDATL ; INCF FSR,F ;Next byte MOVF INDF,W ;Load second data byte into upper MOVWF PMDATH ; INCF FSR,F ; BANKSEL PMCON1 BSF PMCON1,WREN ;Enable writes BCF INTCON,GIE ;Disable interrupts (if using) BTFSC INTCON,GIE ;See AN576 GOTO $-2 ;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;; ; Required Sequence MOVLW 55h ;Start of required write sequence: MOVWF PMCON2 ;Write 55h MOVLW 0AAh ; MOVWF PMCON2 ;Write 0AAh BSF PMCON1,WR ;Set WR bit to begin write NOP ;Required to transfer data to the buffer NOP ;registers ;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;; BCF PMCON1,WREN ;Disable writes BSF INTCON,GIE ;Enable interrupts (comment out if not using interrupts) BANKSEL PMADRL MOVF PMADRL, W INCF PMADRL,F ;Increment address ANDLW 0x03 ;Indicates when sixteen words have been programmed SUBLW 0x03 ;Change value for different size write blocks ;0x0F = 16 words ;0x0B = 12 words ;0x07 = 8 words ;0x03 = 4 words BTFSS STATUS,Z ;Exit on a match, GOTO LOOP ;Continue if more data needs to be written  2011-2015 Microchip Technology Inc. DS40001585D-page 59

PIC10(L)F320/322 9.3 Modifying Flash Program Memory FIGURE 9-7: FLASH PROGRAM MEMORY MODIFY When modifying existing data in a program memory FLOWCHART row, and data within that row must be preserved, it must first be read and saved in a RAM image. Program memory is modified using the following steps: Start 1. Load the starting address of the row to be Modify Operation modified. 2. Read the existing data from the row into a RAM image. Read Operation 3. Modify the RAM image to contain the new data F(Figiguurere9 x-2.x) to be written into program memory. 4. Load the starting address of the row to be rewritten. An image of the entire row read 5. Erase the program memory row. must be stored in RAM 6. Load the write latches with data from the RAM image. 7. Initiate a programming operation. Modify Image The words to be modified are changed in the RAM image Erase Operation F(Figiguurere9 x-4.x) Write Operation use RAM image F(Figiugruere9 -x5.x) End Modify Operation DS40001585D-page 60  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 9.4 User ID, Device ID and Configuration Word Access Instead of accessing program memory, the User ID’s, Device ID/Revision ID and Configuration Word can be accessed when CFGS=1 in the PMCON1 register. This is the region that would be pointed to by PC<13>=1, but not all addresses are accessible. Different access may exist for reads and writes. Refer to Table9-2. When read access is initiated on an address outside the parameters listed in Table9-2, the PMDATH:PMDATL register pair is cleared, reading back ‘0’s. TABLE 9-2: USER ID, DEVICE ID AND CONFIGURATION WORD ACCESS (CFGS=1) Address Function Read Access Write Access 2000h-2003h User IDs Yes Yes 2006h Device ID/Revision ID Yes No 2007h Configuration Word Yes No EXAMPLE 9-4: CONFIGURATION WORD AND DEVICE ID ACCESS * This code block will read 1 word of program memory at the memory address: * PROG_ADDR_LO (must be 00h-08h) data will be returned in the variables; * PROG_DATA_HI, PROG_DATA_LO BANKSEL PMADRL ; not required on devices with 1 Bank of SFRs MOVLW PROG_ADDR_LO ; MOVWF PMADRL ; Store LSB of address CLRF PMADRH ; Clear MSB of address BSF PMCON1,CFGS ; Select Configuration Space BCF INTCON,GIE ; Disable interrupts BSF PMCON1,RD ; Initiate read NOP ; Executed (See Figure 9-2) NOP ; Ignored (See Figure 9-2) BSF INTCON,GIE ; Restore interrupts MOVF PMDATL,W ; Get LSB of word MOVWF PROG_DATA_LO ; Store in user location MOVF PMDATH,W ; Get MSB of word MOVWF PROG_DATA_HI ; Store in user location  2011-2015 Microchip Technology Inc. DS40001585D-page 61

PIC10(L)F320/322 9.5 Write Verify It is considered good programming practice to verify that program memory writes agree with the intended value. Since program memory is stored as a full page then the stored program memory contents are compared with the intended data stored in RAM after the last write is complete. FIGURE 9-8: FLASH PROGRAM MEMORY VERIFY FLOWCHART Start Verify Operation This routine assumes that the last row of data written was from an image saved in RAM. This image will be used to verify the data currently stored in Flash Program Memory. Read Operation Fig(Fuirgeur9e- 2x.x) PMDAT = No RAM image ? Yes Fail Verify Operation No Last Word ? Yes End Verify Operation DS40001585D-page 62  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 9.6 Flash Program Memory Control Registers REGISTER 9-1: PMDATL: PROGRAM MEMORY DATA LOW R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u PMDAT<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 PMDAT<7:0>: The value of the program memory word pointed to by PMADRH and PMADRL after a Program Memory Read command. REGISTER 9-2: PMDATH: PROGRAM MEMORY DATA HIGH U-0 U-0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u — — PMDAT<13:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 PMDAT<13:8>: The value of the program memory word pointed to by PMADRH and PMADRL after a Program Memory Read command.  2011-2015 Microchip Technology Inc. DS40001585D-page 63

PIC10(L)F320/322 REGISTER 9-3: PMADRL: PROGRAM MEMORY ADDRESS LOW R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 PMADR<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 PMADR<7:0>: Program Memory Read Address low bits REGISTER 9-4: PMADRH: PROGRAM MEMORY ADDRESS HIGH U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0/0 — — — — — — — PMADR8 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-1 Unimplemented: Read as ‘0’ bit 0 PMADR8: Program Memory Read Address High bit DS40001585D-page 64  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 REGISTER 9-5: PMCON1: PROGRAM MEMORY CONTROL 1 REGISTER U-1(1) R/W-0/0 R/W-0/0 R/W/HC-0/0 R/W/HC-0/q(2) R/W-0/0 R/S/HC-0/0 R/S/HC-0/0 — CFGS LWLO FREE WRERR WREN WR RD bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ S = Bit can only be set x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared HC = Bit is cleared by hardware bit 7 Unimplemented: Read as ‘1’ bit 6 CFGS: Configuration Select bit 1 = Access Configuration, User ID and Device ID Registers 0 = Access Flash program memory bit 5 LWLO: Load Write Latches Only bit(3) 1 = Only the addressed program memory write latch is loaded/updated on the next WR command 0 = The addressed program memory write latch is loaded/updated and a write of all program memory write latches will be initiated on the next WR command bit 4 FREE: Program Flash Erase Enable bit 1 = Performs an erase operation on the next WR command (hardware cleared upon completion) 0 = Performs an write operation on the next WR command bit 3 WRERR: Program/Erase Error Flag bit 1 = Condition indicates an improper program or erase sequence attempt or termination (bit is set automatically on any set attempt (write ‘1’) of the WR bit). 0 = The program or erase operation completed normally. bit 2 WREN: Program/Erase Enable bit 1 = Allows program/erase cycles 0 = Inhibits programming/erasing of program Flash bit 1 WR: Write Control bit 1 = Initiates a program Flash program/erase operation. The operation is self-timed and the bit is cleared by hardware once operation is complete. The WR bit can only be set (not cleared) in software. 0 = Program/erase operation to the Flash is complete and inactive. bit 0 RD: Read Control bit 1 = Initiates a program Flash read. Read takes one cycle. RD is cleared in hardware. The RD bit can only be set (not cleared) in software. 0 = Does not initiate a program Flash read. Note 1: Unimplemented bit, read as ‘1’. 2: The WRERR bit is automatically set by hardware when a program memory write or erase operation is started (WR = 1). 3: The LWLO bit is ignored during a program memory erase operation (FREE = 1).  2011-2015 Microchip Technology Inc. DS40001585D-page 65

PIC10(L)F320/322 REGISTER 9-6: PMCON2: PROGRAM MEMORY CONTROL 2 REGISTER W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 Program Memory Control Register 2 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ S = Bit can only be set x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Flash Memory Unlock Pattern bits To unlock writes, a 55h must be written first, followed by an AAh, before setting the WR bit of the PMCON1 register. The value written to this register is used to unlock the writes. There are specific timing requirements on these writes. TABLE 9-3: SUMMARY OF REGISTERS ASSOCIATED WITH FLASH PROGRAM MEMORY Register on Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 40 PMCON1 — CFGS LWLO FREE WRERR WREN WR RD 65 PMCON2 Program Memory Control Register 2 66 PMADRL PMADR<7:0> 64 PMADRH — — — — — — — PMADR8 64 PMDATL PMDAT<7:0> 63 PMDATH — — PMDAT<13:8> 63 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Flash program memory module. TABLE 9-4: SUMMARY OF CONFIGURATION WORD WITH FLASH PROGRAM MEMORY Register Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 on Page 13:8 — — — WRT<1:0> BORV LPBOR LVP CONFIG 20 7:0 CP MCLR PWRTE WDTE<1:0> BOREN<1:0> FOSC Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Flash program memory. DS40001585D-page 66  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 10.0 I/O PORT FIGURE 10-1: I/O PORT OPERATION Depending on which peripherals are enabled, some or all of the pins may not be available as general purpose I/O. In general, when a peripheral is enabled on a port Read LATA pin, that pin cannot be used as a general purpose TRISA output. However, the pin can still be read. D Q PORTA has three standard registers for its operation. Write LATA These registers are: Write PORTA CK VDD • TRISA register (data direction) • PORTA register (reads the levels on the pins of Data Register the device) Data Bus • LATA register (output latch) I/O pin Some ports may have one or more of the following Read PORTA additional registers. These registers are: To peripherals VSS • ANSELA (analog select) ANSELA • WPUA (weak pull-up) The Data Latch (LATA register) is useful for read- modify-write operations on the value that the I/O pins are driving. A write operation to the LATA register has the same effect as a write to the corresponding PORTA register. A read of the LATA register reads of the values held in the I/O PORT latches, while a read of the PORTA register reads the actual I/O pin value. Ports that support analog inputs have an associated ANSELA register. When an ANSEL bit is set, the digital input buffer associated with that bit is disabled. Disabling the input buffer prevents analog signal levels on the pin between a logic high and low from causing excessive current in the logic input circuitry. A simplified model of a generic I/O port, without the interfaces to other peripherals, is shown in Figure10-1. EXAMPLE 10-1: INITIALIZING PORTA ; This code example illustrates ; initializing the PORTA register. The ; other ports are initialized in the same ; manner. BANKSEL PORTA ;not required on devices with 1 Bank of SFRs CLRF PORTA ;Init PORTA BANKSEL LATA ;not required on devices with 1 Bank of SFRs CLRF LATA ; BANKSEL ANSELA ;not required on devices with 1 Bank of SFRs CLRF ANSELA ;digital I/O BANKSEL TRISA ;not required on devices with 1 Bank of SFRs MOVLW B'00000011' ;Set RA<1:0> as inputs MOVWF TRISA ;and set RA<2:3> as ;outputs  2011-2015 Microchip Technology Inc. DS40001585D-page 67

PIC10(L)F320/322 10.1 PORTA Registers 10.1.3 PORTA FUNCTIONS AND OUTPUT PRIORITIES PORTA is a 8-bit wide, bidirectional port. The corresponding data direction register is TRISA Each PORTA pin is multiplexed with other functions. The (Register10-2). Setting a TRISA bit (= 1) will make the pins, their combined functions and their output priorities corresponding PORTA pin an input (i.e., disable the are shown in Table10-1. output driver). Clearing a TRISA bit (= 0) will make the When multiple outputs are enabled, the actual pin corresponding PORTA pin an output (i.e., enables control goes to the peripheral with the highest priority. output driver and puts the contents of the output latch Digital output functions may control the pin when it is in on the selected pin). Example10-1 shows how to Analog mode with the priority shown in Table10-1. initialize PORTA. Reading the PORTA register (Register10-1) reads the TABLE 10-1: PORTA OUTPUT PRIORITY status of the pins, whereas writing to it will write to the PORT latch. All write operations are read-modify-write Pin Name Function Priority(1) operations. Therefore, a write to a port implies that the RA0 ICSPDAT port pins are read, this value is modified and then CWG1A written to the PORT data latch (LATA). PWM1 The TRISA register (Register10-2) controls the RA0 PORTA pin output drivers, even when they are being RA1 CWG1B used as analog inputs. The user should ensure the bits PWM2 in the TRISA register are maintained set when using CLC1 them as analog inputs. I/O pins configured as analog RA1 input always read ‘0’. RA2 NCO1 10.1.1 WEAK PULL-UPS CLKR RA2 Each of the PORTA pins has an individually configu- rable internal weak pull-up. Control bits WPUA<3:0> RA3 None enable or disable each pull-up (see Register10-5). Note 1: Priority listed from highest to lowest. Each weak pull-up is automatically turned off when the port pin is configured as an output. All pull-ups are dis- abled on a Power-on Reset by the WPUEN bit of the OPTION_REG register. 10.1.2 ANSELA REGISTER The ANSELA register (Register10-4) is used to configure the Input mode of an I/O pin to analog. Setting the appropriate ANSELA bit high will cause all digital reads on the pin to be read as ‘0’ and allow analog functions on the pin to operate correctly. The state of the ANSELA bits has no effect on digital output functions. A pin with TRIS clear and ANSEL set will still operate as a digital output, but the Input mode will be analog. This can cause unexpected behavior when executing read-modify-write instructions on the affected port. Note: The ANSELA bits default to the Analog mode after Reset. To use any pins as digital general purpose or peripheral inputs, the corresponding ANSEL bits must be initialized to ‘0’ by user software. DS40001585D-page 68  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 10.2 Register Definitions: PORTA REGISTER 10-1: PORTA: PORTA REGISTER U-0 U-0 U-0 U-0 R-x/x R/W-x/x R/W-x/x R/W-x/x — — — — RA3 RA2 RA1 RA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 Unimplemented: Read as ‘0’ bit 3-0 RA<3:0>: PORTA I/O Value bits (RA3 is read-only) Note 1: Writes to PORTx are actually written to the corresponding LATx register. Reads from PORTx register return actual I/O pin values. REGISTER 10-2: TRISA: PORTA TRI-STATE REGISTER U-0 U-0 U-0 U-0 U-1 R/W-1/1 R/W-1/1 R/W-1/1 — — — — —(1) TRISA2 TRISA1 TRISA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 Unimplemented: Read as ‘0’. bit 3 Unimplemented: Read as ‘1’. bit 2-0 TRISA<2:0>: RA<2:0> Port I/O Tri-State Control bits 1 =Port output driver is disabled 0 =Port output driver is enabled Note 1: Unimplemented, read as ‘1’.  2011-2015 Microchip Technology Inc. DS40001585D-page 69

PIC10(L)F320/322 REGISTER 10-3: LATA: PORTA DATA LATCH REGISTER U-0 U-0 U-0 U-0 U-0 R/W-x/u R/W-x/u R/W-x/u — — — — — LATA2 LATA1 LATA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-3 Unimplemented: Read as ‘0’. bit 2-0 LATA<2:0>: RA<2:0> Output Latch Value bits Note 1: Writes to PORTx are actually written to the corresponding LATx register. Reads from LATx register return register values, not I/O pin values. REGISTER 10-4: ANSELA: PORTA ANALOG SELECT REGISTER U-0 U-0 U-0 U-0 U-0 R/W-1/1 R/W-1/1 R/W-1/1 — — — — — ANSA2 ANSA1 ANSA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-3 Unimplemented: Read as ‘0’. bit 2-0 ANSA<2:0>: Analog Select between Analog or Digital Function on Pins RA<2:0>, respectively 1 = Analog input. Pin is assigned as analog input(1). Digital Input buffer disabled. 0 = Digital I/O. Pin is assigned to port or Digital special function. Note 1: Setting a pin to an analog input automatically disables the digital input circuitry. Weak pull-ups, if available, are unaffected. The corresponding TRIS bit must be set to Input mode by the user in order to allow external control of the voltage on the pin. DS40001585D-page 70  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 REGISTER 10-5: WPUA: WEAK PULL-UP PORTA REGISTER U-0 U-0 U-0 U-0 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 — — — — WPUA3 WPUA2 WPUA1 WPUA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 Unimplemented: Read as ‘0’. bit 3-0 WPUA<3:0>: Weak Pull-up PORTA Control bits 1 =Weak Pull-up enabled(1) 0 =Weak Pull-up disabled. Note 1: Enabling weak pull-ups also requires that the WPUEN bit of the OPTION_REG register be cleared (Register16-1).  2011-2015 Microchip Technology Inc. DS40001585D-page 71

PIC10(L)F320/322 TABLE 10-2: SUMMARY OF REGISTERS ASSOCIATED WITH PORTA Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page ANSELA — — — — — ANSA2 ANSA1 ANSA0 70 IOCAF — — — — IOCAF3 IOCAF2 IOCAF1 IOCAF0 76 IOCAN — — — — IOCAN3 IOCAN2 IOCAN1 IOCAN0 75 IOCAP — — — — IOCAP3 IOCAP2 IOCAP1 IOCAP0 75 LATA — — — — — LATA2 LATA1 LATA0 70 PORTA — — — — RA3 RA2 RA1 RA0 69 TRISA — — — — —(1) TRISA2 TRISA1 TRISA0 69 WPUA — — — — WPUA3 WPUA2 WPUA1 WPUA0 71 Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by PORTA. Note 1: Unimplemented, read as ‘1’. DS40001585D-page 72  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 11.0 INTERRUPT-ON-CHANGE 11.3 Interrupt Flags The PORTA pins can be configured to operate as The IOCAFx bits located in the IOCAF register are Interrupt-On-Change (IOC) pins. An interrupt can be status flags that correspond to the interrupt-on-change generated by detecting a signal that has either a rising pins of PORTA. If an expected edge is detected on an edge or a falling edge. Any individual PORTA pin, or appropriately enabled pin, then the status flag for that pin combination of PORTA pins, can be configured to will be set, and an interrupt will be generated if the IOCIE generate an interrupt. The Interrupt-on-change module bit is set. The IOCIF bit of the INTCON register reflects has the following features: the status of all IOCAFx bits. • Interrupt-on-Change enable (Master Switch) 11.4 Clearing Interrupt Flags • Individual pin configuration • Rising and falling edge detection The individual status flags, (IOCAFx bits), can be • Individual pin interrupt flags cleared by resetting them to zero. If another edge is detected during this clearing operation, the associated Figure11-1 is a block diagram of the IOC module. status flag will be set at the end of the sequence, regardless of the value actually being written. 11.1 Enabling the Module In order to ensure that no detected edge is lost while To allow individual PORTA pins to generate an interrupt, clearing flags, only AND operations masking out known the IOCIE bit of the INTCON register must be set. If the changed bits should be performed. The following IOCIE bit is disabled, the edge detection on the pin will sequence is an example of what should be performed. still occur, but an interrupt will not be generated. EXAMPLE 11-1: CLEARING INTERRUPT 11.2 Individual Pin Configuration FLAGS For each PORTA pin, a rising edge detector and a falling MOVLW 0xff edge detector are present. To enable a pin to detect a XORWF IOCAF, W rising edge, the associated IOCAPx bit of the IOCAP ANDWF IOCAF, F register is set. To enable a pin to detect a falling edge, the associated IOCANx bit of the IOCAN register is set. 11.5 Operation in Sleep A pin can be configured to detect rising and falling edges simultaneously by setting both the IOCAPx bit The interrupt-on-change interrupt sequence will wake and the IOCANx bit of the IOCAP and IOCAN registers, the device from Sleep mode, if the IOCIE bit is set. respectively. If an edge is detected while in Sleep mode, the IOCAF register will be updated prior to the first instruction executed out of Sleep.  2011-2015 Microchip Technology Inc. DS40001585D-page 73

PIC10(L)F320/322 FIGURE 11-1: INTERRUPT-ON-CHANGE BLOCK DIAGRAM IOCANx D Q Q4Q1 CK Edge Detect R RAx Data Bus = S To Data Bus IOCAPx D Q 0 or 1 D Q IOCAFx CK CK IOCIE R Write IOCAFx R Q2 From all other IOCAFx individual IOC Interrupt pin detectors to CPU Core Q1 Q1 Q1 Q2 Q2 Q2 Q3 Q3 Q3 DS40001585D-page 74  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 11.6 Interrupt-On-Change Registers REGISTER 11-1: IOCAP: INTERRUPT-ON-CHANGE PORTA POSITIVE EDGE REGISTER U-0 U-0 U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — — — — IOCAP3 IOCAP2 IOCAP1 IOCAP0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 Unimplemented: Read as ‘0’. bit 3-0 IOCAP<3:0>: Interrupt-on-Change PORTA Positive Edge Enable bits 1 = Interrupt-on-Change enabled on the pin for a positive going edge. Associated Status bit and interrupt flag will be set upon detecting an edge.(1) 0 = Interrupt-on-Change disabled for the associated pin. Note 1: Interrupt-on-change also requires that the IOCIE bit of the INTCON register be set (Register6-1). REGISTER 11-2: IOCAN: INTERRUPT-ON-CHANGE PORTA NEGATIVE EDGE REGISTER U-0 U-0 U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — — — — IOCAN3 IOCAN2 IOCAN1 IOCAN0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 Unimplemented: Read as ‘0’. bit 3-0 IOCAN<3:0>: Interrupt-on-Change PORTA Negative Edge Enable bits 1 = Interrupt-on-Change enabled on the pin for a negative going edge. Associated Status bit and interrupt flag will be set upon detecting an edge.(1) 0 = Interrupt-on-Change disabled for the associated pin. Note 1: Interrupt-on-change also requires that the IOCIE bit of the INTCON register be set (Register6-1).  2011-2015 Microchip Technology Inc. DS40001585D-page 75

PIC10(L)F320/322 REGISTER 11-3: IOCAF: INTERRUPT-ON-CHANGE PORTA FLAG REGISTER U-0 U-0 U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — — — — IOCAF3 IOCAF2 IOCAF1 IOCAF0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared HS - Bit is set in hardware bit 7-4 Unimplemented: Read as ‘0’. bit 3-0 IOCAF<3:0>: Interrupt-on-Change PORTA Flag bits 1 = An enable change was detected on the associated pin. Set when IOCAPx = 1 and a rising edge was detected on RAx, or when IOCANx = 1 and a falling edge was detected on RAx.(1) 0 = No change was detected, or the user cleared the detected change. Note 1: Interrupt-on-change also requires that the IOCIE bit of the INTCON register be set (Register6-1). TABLE 11-1: SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPT-ON-CHANGE Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 40 IOCAF — — — — IOCAF3 IOCAF2 IOCAF1 IOCAF0 76 IOCAN — — — — IOCAN3 IOCAN2 IOCAN1 IOCAN0 75 IOCAP — — — — IOCAP3 IOCAP2 IOCAP1 IOCAP0 75 TRISA — — — — —(1) TRISA2 TRISA1 TRISA0 69 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Interrupt-on-Change. Note 1: Unimplemented, read as ‘1’. DS40001585D-page 76  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 12.0 FIXED VOLTAGE REFERENCE 12.1 Independent Gain Amplifiers (FVR) The output of the FVR supplied to the ADC is routed through an independent programmable gain amplifier. The Fixed Voltage Reference, or FVR, is a stable The amplifier can be configured to amplify the voltage reference, independent of VDD, with 1.024V, reference voltage by 1x, 2x or 4x, to produce the three 2.048V or 4.096V selectable output levels. The output possible voltage levels. of the FVR can be configured to supply a reference voltage to the following: The ADFVR<1:0> bits of the FVRCON register are used to enable and configure the gain amplifier settings • ADC input channel for the reference supplied to the ADC module. Refer- The FVR can be enabled by setting the FVREN bit of ence Section15.0 “Analog-to-Digital Converter the FVRCON register. (ADC) Module” for additional information. To minimize current consumption when the FVR is disabled, the FVR buffers should be turned off by clearing the ADFVR<1:0> bits. 12.2 FVR Stabilization Period When the Fixed Voltage Reference module is enabled, it requires time for the reference and amplifier circuits to stabilize. Once the circuits stabilize and are ready for use, the FVRRDY bit of the FVRCON register will be set. See Section24.0 “Electrical Specifications” for the minimum delay requirement. FIGURE 12-1: VOLTAGE REFERENCE BLOCK DIAGRAM ADFVR<1:0> 2 x1 FVR x2 (To ADC Module) x4 1.024V Fixed Reference FVREN + FVRRDY - Any peripheral requiring the Fixed Reference (See Table12-1) TABLE 12-1: PERIPHERALS REQUIRING THE FIXED VOLTAGE REFERENCE (FVR) Peripheral Conditions Description HFINTOSC FOSC = 1 EC on CLKIN pin. BOREN<1:0> = 11 BOR always enabled. BOR BOREN<1:0> = 10 and BORFS = 1 BOR disabled in Sleep mode, BOR Fast Start enabled. BOREN<1:0> = 01 and BORFS = 1 BOR under software control, BOR Fast Start enabled. IVR All PIC10F320/322 devices, when The device runs off of the Power-Save mode regulator when VREGPM1 = 1 and not in Sleep in Sleep mode.  2011-2015 Microchip Technology Inc. DS40001585D-page 77

PIC10(L)F320/322 12.3 FVR Control Registers REGISTER 12-1: FVRCON: FIXED VOLTAGE REFERENCE CONTROL REGISTER R/W-0/0 R-q/q R/W-0/0 R/W-0/0 U-0 U-0 R/W-0/0 R/W-0/0 FVREN FVRRDY(1) TSEN(3) TSRNG(3) — — ADFVR<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7 FVREN: Fixed Voltage Reference Enable bit 1 = Fixed Voltage Reference is enabled 0 = Fixed Voltage Reference is disabled bit 6 FVRRDY: Fixed Voltage Reference Ready Flag bit(1) 1 = Fixed Voltage Reference output is ready for use 0 = Fixed Voltage Reference output is not ready or not enabled bit 5 TSEN: Temperature Indicator Enable bit(3) 1 = Temperature Indicator is enabled 0 = Temperature Indicator is disabled bit 4 TSRNG: Temperature Indicator Range Selection bit(3) 1 = VOUT = VDD - 4VT (High Range) 0 = VOUT = VDD - 2VT (Low Range) bit 3-2 Unimplemented: Read as ‘0 ‘ bit 1-0 ADFVR<1:0>: ADC Fixed Voltage Reference Selection bit 11 =ADC Fixed Voltage Reference Peripheral output is 4x (4.096V)(2) 10 =ADC Fixed Voltage Reference Peripheral output is 2x (2.048V)(2) 01 =ADC Fixed Voltage Reference Peripheral output is 1x (1.024V) 00 =ADC Fixed Voltage Reference Peripheral output is off. Note 1: FVRRDY indicates the true state of the FVR. 2: Fixed Voltage Reference output cannot exceed VDD. 3: See Section14.0 “Temperature Indicator Module” for additional information. TABLE 12-2: SUMMARY OF REGISTERS ASSOCIATED WITH FIXED VOLTAGE REFERENCE Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on page FVRCON FVREN FVRRDY TSEN TSRNG — — ADFVR<1:0> 78 Legend: Shaded cells are not used with the Fixed Voltage Reference. DS40001585D-page 78  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 13.0 INTERNAL VOLTAGE REGULATOR (IVR) The Internal Voltage Regulator (IVR), which provides operation above 3.6V is available on: • PIC10F320 • PIC10F322 This circuit regulates a voltage for the internal device logic while permitting the VDD and I/O pins to operate at a higher voltage. When VDD approaches the regulated voltage, the IVR output automatically tracks the input voltage. The IVR operates in one of three power modes based on user configuration and peripheral selection. The operating power modes are: - High - Low - Power-Save Sleep mode Power modes are selected automatically depending on the device operation, as shown in Table13-1. Tracking mode is selected automatically when VDD drops below the safe operating voltage of the core. Note: IVR is disabled in Tracking mode, but will consume power. See Section24.0 “Electrical Specifications” for more information. TABLE 13-1: IVR POWER MODES - REGULATED VREGPM1 Bit Sleep Mode Memory Bias Power Mode IVR Power Mode EC Mode or INTOSC = 16 MHz (HP Bias) High x No INTOSC = 1 to 8 MHz (MP Bias) INTOSC = 31 kHz to 500 kHz (LP Bias) Low 0 Yes Don’t Care Low No HFINTOSC 1 Yes Power Save(1) No Peripherals Note 1: Forced to Low-Power mode by any of the following conditions: • BOR is enabled • HFINTOSC is an active peripheral source • Self-write is active • ADC is in an active conversion  2011-2015 Microchip Technology Inc. DS40001585D-page 79

PIC10(L)F320/322 REGISTER 13-1: VREGCON: VOLTAGE REGULATOR CONTROL REGISTER U-0 U-0 U-0 U-0 U-0 U-0 R/W-0/0 R/W-1/1 — — — — — — VREGPM1 Reserved bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-2 Unimplemented: Read as ‘0’. bit 1 VREGPM1: Voltage Regulator Power Mode Selection bit 1 = Power-Save Sleep mode enabled in Sleep. Draws lowest current in Sleep, slower wake-up. 0 = Low-Power mode enabled in Sleep. Draws higher current in Sleep, faster wake-up. bit 0 Reserved: Maintain this bit set. DS40001585D-page 80  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 14.0 TEMPERATURE INDICATOR FIGURE 14-1: TEMPERATURE CIRCUIT MODULE DIAGRAM This family of devices is equipped with a temperature Rev. 10-000069A circuit designed to measure the operating temperature VDD 7/31/2013 of the silicon die. The circuit’s range of operating temperature falls between of -40°C and +85°C. The TSEN output is a voltage that is proportional to the device temperature. The output of the temperature indicator is internally connected to the device ADC. The circuit may be used as a temperature threshold detector or a more accurate temperature indicator, TSRNG depending on the level of calibration performed. A one- point calibration allows the circuit to indicate a temperature closely surrounding that point. A two-point calibration allows the circuit to sense the entire range of temperature more accurately. Reference Application VOUT Note AN1333, “Use and Calibration of the Internal To ADC Temp. Indicator Temperature Indicator” (DS01333) for more details regarding the calibration process. 14.1 Circuit Operation Figure14-1 shows a simplified block diagram of the temperature circuit. The proportional voltage output is 14.2 Minimum Operating VDD vs. achieved by measuring the forward voltage drop across Minimum Sensing Temperature multiple silicon junctions. When the temperature circuit is operated in low range, Equation14-1 describes the output characteristics of the device may be operated at any operating voltage the temperature indicator. that is within specifications. When the temperature circuit is operated in high range, EQUATION 14-1: VOUT RANGES the device operating voltage, VDD, must be high enough to ensure that the temperature circuit is High Range: VOUT = VDD - 4VT correctly biased. Table14-1 shows the recommended minimum VDD vs. Low Range: VOUT = VDD - 2VT range setting. TABLE 14-1: RECOMMENDED VDD VS. The temperature sense circuit is integrated with the RANGE Fixed Voltage Reference (FVR) module. See Section12.0 “Fixed Voltage Reference (FVR)” for Min. VDD, TSRNG = 1 Min. VDD, TSRNG = 0 more information. 3.6V 1.8V The circuit is enabled by setting the TSEN bit of the FVRCON register. When disabled, the circuit draws no 14.3 Temperature Output current. The output of the circuit is measured using the internal The circuit operates in either high or low range. The high Analog-to-Digital Converter. A channel is reserved for range, selected by setting the TSRNG bit of the the temperature circuit output. Refer to Section15.0 FVRCON register, provides a wider output voltage. This “Analog-to-Digital Converter (ADC) Module” for provides more resolution over the temperature range, detailed information. but may be less consistent from part to part. This range requires a higher bias voltage to operate and thus, a higher VDD is needed. 14.4 ADC Acquisition Time The low range is selected by clearing the TSRNG bit of To ensure accurate temperature measurements, the the FVRCON0 register. The low range generates a user must wait at least 200s after the ADC input lower voltage drop and thus, a lower bias voltage is multiplexer is connected to the temperature indicator needed to operate the circuit. The low range is provided output before the conversion is performed. In addition, for low voltage operation. the user must wait 200s between sequential conversions of the temperature indicator output.  2011-2015 Microchip Technology Inc. DS40001585D-page 81

PIC10(L)F320/322 TABLE 14-2: SUMMARY OF REGISTERS ASSOCIATED WITH THE TEMPERATURE INDICATOR Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page FVRCON FVREN FVRRDY TSEN TSRNG — — ADFVR<1:0> 78 ADCON GO/ 88 ADCS<2:0> CHS<2:0> ADON DONE ADRES A/D Result Register 89 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by the temperature indicator module. DS40001585D-page 82  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 15.0 ANALOG-TO-DIGITAL CONVERTER (ADC) MODULE The Analog-to-Digital Converter (ADC) converts an analog input signal to an 8-bit binary representation of that signal. This device uses three analog input channels, which are multiplexed into a single sample and hold circuit. The output of the sample and hold is connected to the input of the converter. The converter generates an 8-bit binary result via successive approximation and stores the conversion result into the ADC result register (ADRES). Figure15-1 shows the block diagram of the ADC. The ADC voltage reference is software selectable to be internally generated. The ADC can generate an interrupt upon completion of a conversion. This interrupt can be used to wake-up the device from Sleep. FIGURE 15-1: ADC SIMPLIFIED BLOCK DIAGRAM VREF- = Vss AN0 000 VREF+ = VDD AN1 001 AN2 010 Reserved 011 ADC Reserved 100 Reserved 101 GO/DONE 8 Temp Indicator 110 ADRES FVR 111 ADON(1) VSS CHS<2:0>(2) Note 1: When ADON = 0, all multiplexer inputs are disconnected. 2: See ADCON register (Register15-1) for detailed analog channel selection per device.  2011-2015 Microchip Technology Inc. DS40001585D-page 83

PIC10(L)F320/322 15.1 ADC Configuration 15.1.4 CONVERSION CLOCK When configuring and using the ADC the following The source of the conversion clock is software select- functions must be considered: able via the ADCS bits of the ADCON register (Register15-1). There are seven possible clock • Port configuration options: • Channel selection • FOSC/2 • ADC conversion clock source • FOSC/4 • Interrupt control • FOSC/8 15.1.1 PORT CONFIGURATION • FOSC/16 The ADC can be used to convert both analog and • FOSC/32 digital signals. When converting analog signals, the I/O • FOSC/64 pin should be configured for analog by setting the • FRC (dedicated internal RC oscillator) associated TRIS and ANSEL bits. Refer to The time to complete one bit conversion is defined as Section10.0 “I/O Port” for more information. TAD. One full 8-bit conversion requires 9.5 TAD periods Note: Analog voltages on any pin that is defined as shown in Figure15-2. as a digital input may cause the input buf- For correct conversion, the appropriate TAD specifica- fer to conduct excess current. tion must be met. Refer to the A/D conversion require- ments in Section24.0 “Electrical Specifications” for 15.1.2 CHANNEL SELECTION more information. Table15-1 gives examples of There are up to five channel selections available: appropriate ADC clock selections. • AN<2:0> pins Note: Unless using the FRC, any changes in the • Temperature Indicator system clock frequency will change the ADC clock frequency, which may • FVR (Fixed Voltage Reference) Output adversely affect the ADC result. Refer to Section12.0 “Fixed Voltage Reference (FVR)” and Section14.0 “Temperature Indicator Module” for more information on these channel selec- tions. The CHS bits of the ADCON register determine which channel is connected to the sample and hold circuit. When changing channels, a delay is required before starting the next conversion. Refer to Section15.2 “ADC Operation” for more information. 15.1.3 ADC VOLTAGE REFERENCE There is no external voltage reference connections to the ADC. Only VDD can be used as a reference source. The FVR is only available as an input channel and not a VREF+ input to the ADC. DS40001585D-page 84  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 TABLE 15-1: ADC CLOCK PERIOD (TAD) VS. DEVICE OPERATING FREQUENCIES ADC Clock Period (TAD) Device Frequency (FOSC) ADC ADCS<2:0> 16 MHz 8 MHz 4 MHz 1 MHz Clock Source FOSC/2 000 125 ns(1) 250 ns(1) 500 ns(1) 2.0 s FOSC/4 100 250 ns(1) 500 ns(1) 1.0 s 4.0 s FOSC/8 001 0.5 s(1) 1.0 s 2.0 s 8.0 s(2) FOSC/16 101 1.0 s 2.0 s 4.0 s 16.0 s(2) FOSC/32 010 2.0 s 4.0 s 8.0 s(2) 32.0 s(2) FOSC/64 110 4.0 s 8.0 s(2) 16.0 s(2) 64.0 s(2) FRC x11 1.0-6.0 s(1,3) 1.0-6.0 s(1,3) 1.0-6.0 s(1,3) 1.0-6.0 s(1,3) Legend: Shaded cells are outside of recommended range. Note 1: These values violate the minimum required TAD time. 2: For faster conversion times, the selection of another clock source is recommended. 3: The ADC clock period (TAD) and total ADC conversion time can be minimized when the ADC clock is derived from the system clock FOSC. However, the FRC clock source must be used when conversions are to be performed with the device in Sleep mode. FIGURE 15-2: ANALOG-TO-DIGITAL CONVERSION TAD CYCLES TCY - TADTAD1 TAD2 TAD3 TAD4 TAD5 TAD6 TAD7 TAD8 TAD9 b7 b6 b5 b4 b3 b2 b1 b0 Conversion starts Holding capacitor is disconnected from analog input (typically 100 ns) Set GO bit On the following cycle: ADRES is loaded, GO bit is cleared, ADIF bit is set, holding capacitor is connected to analog input.  2011-2015 Microchip Technology Inc. DS40001585D-page 85

PIC10(L)F320/322 15.1.5 INTERRUPTS 15.2 ADC Operation The ADC module allows for the ability to generate an 15.2.1 STARTING A CONVERSION interrupt upon completion of an Analog-to-Digital conversion. The ADC Interrupt Flag is the ADIF bit in To enable the ADC module, the ADON bit of the the PIR1 register. The ADC Interrupt Enable is the ADCON register must be set to a ‘1’. Setting the GO/ ADIE bit in the PIE1 register. The ADIF bit must be DONE bit of the ADCON register to a ‘1’ will start the cleared in software. Analog-to-Digital conversion. Note: The ADIF bit is set at the completion of Note: The GO/DONE bit should not be set in the every conversion, regardless of whether same instruction that turns on the ADC. or not the ADC interrupt is enabled. Refer to Section15.2.5 “A/D Conver- sion Procedure”. This interrupt can be generated while the device is operating or while in Sleep. If the device is in Sleep, the 15.2.2 COMPLETION OF A CONVERSION interrupt will wake-up the device. Upon waking from Sleep, the next instruction following the SLEEP instruc- When the conversion is complete, the ADC module will: tion is always executed. If the user is attempting to • Clear the GO/DONE bit wake-up from Sleep and resume in-line code execu- • Set the ADIF Interrupt Flag bit tion, the GIE and PEIE bits of the INTCON register • Update the ADRES register with new conversion must be disabled. If the GIE and PEIE bits of the result INTCON register are enabled, execution will switch to the Interrupt Service Routine. 15.2.3 TERMINATING A CONVERSION If a conversion must be terminated before completion, the GO/DONE bit can be cleared in software. The ADRES register will be updated with the partially com- plete Analog-to-Digital conversion sample. Incomplete bits will match the last bit converted. Note: A device Reset forces all registers to their Reset state. Thus, the ADC module is turned off and any pending conversion is terminated. 15.2.4 ADC OPERATION DURING SLEEP The ADC module can operate during Sleep. This requires the ADC clock source to be set to the FRC option. When the FRC clock source is selected, the ADC waits one additional instruction before starting the conversion. This allows the SLEEP instruction to be executed, which can reduce system noise during the conversion. If the ADC interrupt is enabled, the device will wake-up from Sleep when the conversion completes. If the ADC interrupt is disabled, the ADC module is turned off after the conversion completes, although the ADON bit remains set. When the ADC clock source is something other than FRC, a SLEEP instruction causes the present conver- sion to be aborted and the ADC module is turned off, although the ADON bit remains set. DS40001585D-page 86  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 15.2.5 A/D CONVERSION PROCEDURE This is an example procedure for using the ADC to perform an Analog-to-Digital conversion: 1. Configure Port: • Disable pin output driver (Refer to the TRIS register) • Configure pin as analog (Refer to the ANSEL register) • Disable weak pull-ups either globally (Refer to the OPTION_REG register) or individually (Refer to the appropriate WPUX register) 2. Configure the ADC module: • Select ADC conversion clock • Select ADC input channel • Turn on ADC module 3. Configure ADC interrupt (optional): • Clear ADC interrupt flag • Enable ADC interrupt • Enable peripheral interrupt • Enable global interrupt(1) 4. Wait the required acquisition time(2). 5. Start conversion by setting the GO/DONE bit. 6. Wait for ADC conversion to complete by one of the following: • Polling the GO/DONE bit • Waiting for the ADC interrupt (interrupts enabled) 7. Read ADC Result. 8. Clear the ADC interrupt flag (required if interrupt is enabled). Note1: The global interrupt can be disabled if the user is attempting to wake-up from Sleep and resume in-line code execution. 2: Refer to Section15.4 “A/D Acquisition Requirements”.  2011-2015 Microchip Technology Inc. DS40001585D-page 87

PIC10(L)F320/322 15.3 ADC Register Definitions The following registers are used to control the operation of the ADC. REGISTER 15-1: ADCON: A/D CONTROL REGISTER 0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 ADCS<2:0> CHS<2:0> GO/DONE ADON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-5 ADCS<2:0>: A/D Conversion Clock Select bits 111 =FRC 110 =FOSC/64 101 =FOSC/16 100 =FOSC/4 011 =FRC 010 =FOSC/32 001 =FOSC/8 000 =FOSC/2 bit 4-2 CHS<2:0>: Analog Channel Select bits 111 = FVR (Fixed Voltage Reference) Buffer Output(2) 110 = Temperature Indicator(1) 101 = Reserved. No channel connected. 100 = Reserved. No channel connected. 011 = Reserved. No channel connected. 010 = AN2 001 = AN1 000 = AN0 bit 1 GO/DONE: A/D Conversion Status bit If ADON = 1: 1 = A/D conversion in progress (Setting this bit starts the A/D conversion) 0 = A/D conversion not in progress (This bit is automatically cleared by hardware when the A/D conversion is complete.) If this bit is cleared while a conversion is in progress, the conversion will stop and the results of the conversion up to this point will be transferred to the result registers, but the ADIF interrupt flag bit will not be set. If ADON = 0: 0 = A/D conversion not in progress bit 0 ADON: ADC Enable bit 1 = ADC is enabled 0 = ADC is disabled and consumes no operating current Note 1: See Section14.0 “Temperature Indicator Module” for more information. 2: See Section12.0 “Fixed Voltage Reference (FVR)” for more information. DS40001585D-page 88  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 REGISTER 15-2: ADRES: ADC RESULT REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u ADRES<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 ADRES<7:0>: ADC Result Register bits 8-bit result  2011-2015 Microchip Technology Inc. DS40001585D-page 89

PIC10(L)F320/322 15.4 A/D Acquisition Requirements source impedance is decreased, the acquisition time may be decreased. After the analog input channel is For the ADC to meet its specified accuracy, the charge selected (or changed), an A/D acquisition must be holding capacitor (CHOLD) must be allowed to fully done before the conversion can be started. To calculate charge to the input channel voltage level. The Analog the minimum acquisition time, Equation15-1 may be Input model is shown in Figure15-3. The source used. This equation assumes that 1/2 LSb error is used impedance (RS) and the internal sampling switch (RSS) (511 steps for the ADC). The 1/2 LSb error is the impedance directly affect the time required to charge maximum error allowed for the ADC to meet its the capacitor CHOLD. The sampling switch (RSS) specified resolution. impedance varies over the device voltage (VDD), refer to Figure15-3. The maximum recommended impedance for analog sources is 10 k. As the EQUATION 15-1: ACQUISITION TIME EXAMPLE Assumptions: Temperature = 50°C and external impedance of 10k 5.0V VDD TACQ = Amplifier Settling Time +Hold Capacitor Charging Time+Temperature Coefficient = TAMP+TC+TCOFF = 2µs+TC+Temperature - 25°C0.05µs/°C The value for TC can be approximated with the following equations:  1  VAPPLIED1– ------n----+----1------------ = VCHOLD ;[1] VCHOLD charged to within 1/2 lsb 2 –1 –TC  ---------- RC VAPPLIED1–e  = VCHOLD ;[2] VCHOLD charge response to VAPPLIED   –Tc  -R----C----  1  VAPPLIED1–e  = VAPPLIED1– ------n---+-----1------------ ;combining [1] and [2]   2  –1 Note: Where n = number of bits of the ADC. Solving for TC: TC = –CHOLDRIC+RSS+RS ln(1/511) = –10pF1k+7k+10k ln(0.001957) = 1.12µs Therefore: TACQ = 2µs+1.12µs+50°C- 25°C0.05µs/°C = 4.37µs Note1: The reference voltage (VREF) has no effect on the equation, since it cancels itself out. 2: The charge holding capacitor (CHOLD) is not discharged after each conversion. 3: The maximum recommended impedance for analog sources is 10k. This is required to meet the pin leakage specification. DS40001585D-page 90  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 FIGURE 15-3: ANALOG INPUT MODEL VDD Analog Sampling Input Switch VT  0.6V Rs pin RIC  1k SS Rss VA C5 PpIFN VT  0.6V I LEAKAGE(1) CHOLD = 10 pF VSS/VREF- 6V 5V RSS Legend: CHOLD = Sample/Hold Capacitance VDD4V 3V CPIN = Input Capacitance 2V I LEAKAGE = Leakage current at the pin due to various junctions 5 6 7 891011 RIC = Interconnect Resistance Sampling Switch RSS = Resistance of Sampling Switch (k) SS = Sampling Switch VT = Threshold Voltage Note 1: Refer to Section24.0 “Electrical Specifications”. FIGURE 15-4: ADC TRANSFER FUNCTION Full-Scale Range FFh FEh FDh FCh e od FBh C ut p ut O C D 03h A 02h 01h 00h Analog Input Voltage 0.5 LSB 1.5 LSB Zero-Scale VREF- Transition Full-Scale Transition VREF+  2011-2015 Microchip Technology Inc. DS40001585D-page 91

PIC10(L)F320/322 TABLE 15-2: SUMMARY OF REGISTERS ASSOCIATED WITH ADC Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page ADCON ADCS<2:0> CHS<2:0> GO/DONE ADON 88 ADRES ADRES<7:0> 89 ANSELA — — — — — ANSA2 ANSA1 ANSA0 70 FVRCON FVREN FVRRDY TSEN TSRNG — — ADFVR<1:0> 78 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 40 PIE1 — ADIE — NCO1IE CLC1IE — TMR2IE — 41 PIR1 — ADIF — NCO1IF CLC1IF — TMR2IF — 42 TRISA — — — — — TRISA2 TRISA1 TRISA0 69 Legend: x = unknown, u = unchanged, — = unimplemented read as ‘0’, q = value depends on condition. Shaded cells are not used for ADC module. DS40001585D-page 92  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 16.0 TIMER0 MODULE When TMR0 is written, the increment is inhibited for two instruction cycles immediately following the write. The Timer0 module is an 8-bit timer/counter with the following features: Note: The value written to the TMR0 register can be adjusted, in order to account for • 8-bit timer/counter register (TMR0) the two instruction cycle delay when • 8-bit prescaler (independent of Watchdog Timer) TMR0 is written. • Programmable internal or external clock source • Programmable external clock edge selection 16.1.2 8-BIT COUNTER MODE • Interrupt on overflow In 8-Bit Counter mode, the Timer0 module will increment Figure16-1 is a block diagram of the Timer0 module. on every rising or falling edge of the T0CKI pin. 8-Bit Counter mode using the T0CKI pin is selected by 16.1 Timer0 Operation setting the T0CS bit in the OPTION_REG register to ‘1’. The rising or falling transition of the incrementing edge The Timer0 module can be used as either an 8-bit timer for the external input source is determined by the T0SE or an 8-bit counter. bit in the OPTION_REG register. 16.1.1 8-BIT TIMER MODE The Timer0 module will increment every instruction cycle, if used without a prescaler. 8-Bit Timer mode is selected by clearing the T0CS bit of the OPTION_REG register. FIGURE 16-1: BLOCK DIAGRAM OF THE TIMER0 PRESCALER FOSC/4 Data Bus 0 8 T0CKI 1 SYNC 1 2 TCY TMR0 0 T0SE T0CS 8-bit Set Flag bit TMR0IF Prescaler PSA on Overflow 8 PS<2:0>  2011-2015 Microchip Technology Inc. DS40001585D-page 93

PIC10(L)F320/322 16.1.3 SOFTWARE PROGRAMMABLE 16.1.4 TIMER0 INTERRUPT PRESCALER Timer0 will generate an interrupt when the TMR0 A single software programmable prescaler is available register overflows from FFh to 00h. The TMR0IF for use with Timer0. The prescaler assignment is interrupt flag bit of the INTCON register is set every controlled by the PSA bit of the OPTION_REG register. time the TMR0 register overflows, regardless of To assign the prescaler to Timer0, the PSA bit must be whether or not the Timer0 interrupt is enabled. The cleared to a ‘0’. TMR0IF bit can only be cleared in software. The Timer0 interrupt enable is the TMR0IE bit of the INTCON There are eight prescaler options for the Timer0 register. module ranging from 1:2 to 1:256. The prescale values are selectable via the PS<2:0> bits of the Note: The Timer0 interrupt cannot wake the OPTION_REG register. processor from Sleep since the timer is frozen during Sleep. The prescaler is not readable or writable. When assigned to the Timer0 module, all instructions writing to 16.1.5 8-BIT COUNTER MODE the TMR0 register will clear the prescaler. SYNCHRONIZATION When in 8-Bit Counter mode, the incrementing edge on the T0CKI pin must be synchronized to the instruction clock. Synchronization can be accomplished by sampling the prescaler output on the Q2 and Q4 cycles of the instruction clock. The high and low periods of the external clocking source must meet the timing requirements as shown in Section24.0 “Electrical Specifications”. DS40001585D-page 94  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 REGISTER 16-1: OPTION_REG: OPTION REGISTER R/W-1/u R/W-1/u R/W-1/u R/W-1/u R/W-1/u R/W-1/u R/W-1/u R/W-1/u WPUEN(1) INTEDG T0CS T0SE PSA PS<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 WPUEN: Weak Pull-up Enable bit(1) 1 = Weak pull-ups are disabled 0 = Weak pull-ups are enabled by individual PORT latch values bit 6 INTEDG: Interrupt Edge Select bit 1 = Interrupt on rising edge of INT pin 0 = Interrupt on falling edge of INT pin bit 5 T0CS: TMR0 Clock Source Select bit 1 = Transition on T0CKI pin 0 = Internal instruction cycle clock (FOSC/4) bit 4 T0SE: TMR0 Source Edge Select bit 1 = Increment on high-to-low transition on T0CKI pin 0 = Increment on low-to-high transition on T0CKI pin bit 3 PSA: Prescaler Assignment bit 1 = Prescaler is inactive and has no effect on the Timer 0 module 0 = Prescaler is assigned to the Timer0 module bit 2-0 PS<2:0>: Prescaler Rate Select bits Bit Value TMR0 Rate 000 1 : 2 001 1 : 4 010 1 : 8 011 1 : 16 100 1 : 32 101 1 : 64 110 1 : 128 111 1 : 256 Note 1: WPUEN does not disable the pull-up for the MCLR input when MCLR = 1. TABLE 16-1: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER0 Register on Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 40 OPTION_REG WPUEN INTEDG T0CS T0SE PSA PS<2:0> 95 TMR0 Timer0 module Register 40 TRISA — — — — — TRISA2 TRISA1 TRISA0 69 Legend: – = Unimplemented locations, read as ‘0’, u = unchanged, x = unknown. Shaded cells are not used by the Timer0 module.  2011-2015 Microchip Technology Inc. DS40001585D-page 95

PIC10(L)F320/322 17.0 TIMER2 MODULE The TMR2 and PR2 registers are both fully readable and writable. On any Reset, the TMR2 register is set to The Timer2 module is an 8-bit timer with the following 00h and the PR2 register is set to FFh. features: Timer2 is turned on by setting the TMR2ON bit in the • 8-bit timer register (TMR2) T2CON register to a ‘1’. Timer2 is turned off by clearing • 8-bit period register (PR2) the TMR2ON bit to a ‘0’. • Interrupt on TMR2 match with PR2 The Timer2 prescaler is controlled by the T2CKPS bits • Software programmable prescaler (1:1, 1:4, 1:16, in the T2CON register. The Timer2 postscaler is 1:64) controlled by the TOUTPS bits in the T2CON register. • Software programmable postscaler (1:1 to 1:16) The prescaler and postscaler counters are cleared when: See Figure17-1 for a block diagram of Timer2. • A write to TMR2 occurs. 17.1 Timer2 Operation • A write to T2CON occurs. • Any device Reset occurs (Power-on Reset, MCLR The clock input to the Timer2 module is the system Reset, Watchdog Timer Reset, or Brown-out instruction clock (FOSC/4). The clock is fed into the Reset). Timer2 prescaler, which has prescale options of 1:1, 1:4 or 1:64. The output of the prescaler is then used to Note: TMR2 is not cleared when T2CON is increment the TMR2 register. written. The values of TMR2 and PR2 are constantly compared to determine when they match. TMR2 will increment from 00h until it matches the value in PR2. When a match occurs, two things happen: • TMR2 is reset to 00h on the next increment cycle. • The Timer2 postscaler is incremented. The match output of the Timer2/PR2 comparator is then fed into the Timer2 postscaler. The postscaler has postscale options of 1:1 to 1:16 inclusive. The output of the Timer2 postscaler is used to set the TMR2IF interrupt flag bit in the PIR1 register. FIGURE 17-1: TIMER2 BLOCK DIAGRAM Sets Flag TMR2 bit TMR2IF Output Prescaler Reset FOSC/4 TMR2 1:1, 1:4, 1:16, 1:64 2 Comparator Postscaler EQ 1:1 to 1:16 T2CKPS<1:0> PR2 4 TOUTPS<3:0> DS40001585D-page 96  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 REGISTER 17-1: T2CON: TIMER2 CONTROL REGISTER U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — TOUTPS<3:0> TMR2ON T2CKPS<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6-3 TOUTPS<3:0>: Timer2 Output Postscaler Select bits 1111 = 1:16 Postscaler 1110 = 1:15 Postscaler 1101 = 1:14 Postscaler 1100 = 1:13 Postscaler 1011 = 1:12 Postscaler 1010 = 1:11 Postscaler 1001 = 1:10 Postscaler 1000 = 1:9 Postscaler 0111 = 1:8 Postscaler 0110 = 1:7 Postscaler 0101 = 1:6 Postscaler 0100 = 1:5 Postscaler 0011 = 1:4 Postscaler 0010 = 1:3 Postscaler 0001 = 1:2 Postscaler 0000 = 1:1 Postscaler bit 2 TMR2ON: Timer2 On bit 1 = Timer2 is on 0 = Timer2 is off bit 1-0 T2CKPS<1:0>: Timer2 Clock Prescale Select bits 11 = Prescaler is 64 10 = Prescaler is 16 01 = Prescaler is 4 00 = Prescaler is 1 TABLE 17-1: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER2 Register on Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 40 PIE1 — ADIE — NCO1IE CLC1IE — TMR2IE — 41 PIR1 — ADIF — NCO1IF CLC1IF — TMR2IF — 42 PR2 Timer2 module Period Register 96 TMR2 Timer2 module Register 96 T2CON — TOUTPS<3:0> TMR2ON T2CKPS<1:0> 97 Legend: x = unknown, u = unchanged, - = unimplemented read as ‘0’. Shaded cells are not used for Timer2 module.  2011-2015 Microchip Technology Inc. DS40001585D-page 97

PIC10(L)F320/322 18.0 PULSE-WIDTH MODULATION Figure18-1 shows a simplified block diagram of PWM (PWM) MODULE operation. Figure18-2 shows a typical waveform of the PWM The PWM module generates a Pulse-Width Modulated signal. signal determined by the duty cycle, period, and resolution that are configured by the following registers: • PR2 • T2CON • PWMxDCH • PWMxDCL • PWMxCON FIGURE 18-1: SIMPLIFIED PWM BLOCK DIAGRAM PWMxDCL<7:6> Duty Cycle registers PWMxDCH PWMxOUT to other peripherals: CLC and CWG Latched (Not visible to user) Output Enable (PWMxOE) TRIS Control Comparator R Q 0 PWMx S Q 1 TMR2 Module TMR2 (1) Output Polarity (PWMxPOL) Comparator Clear Timer, PR2 PWMx pin and latch Duty Cycle Note 1: 8-bit timer is concatenated with the two Least Significant bits of 1/FOSC adjusted by the Timer2 prescaler to create a 10-bit time base. For a step-by-step procedure on how to set up this module for PWM operation, refer to Section18.1.9 “Setup for PWM Operation using PWMx Pins”. FIGURE 18-2: PWM OUTPUT Period Pulse Width TMR2 = PR2 TMR2 = PWMxDCH<7:0>:PWMxDCL<7:6> TMR2 = 0 DS40001585D-page 98  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 18.1 PWMx Pin Configuration When TMR2 is equal to PR2, the following three events occur on the next increment cycle: All PWM outputs are multiplexed with the PORT data • TMR2 is cleared latch. The user must configure the pins as outputs by clearing the associated TRIS bits. • The PWM output is active. (Exception: When the PWM duty cycle=0%, the PWM output will Note: Clearing the PWMxOE bit will relinquish remain inactive.) control of the PWMx pin. • The PWMxDCH and PWMxDCL register values are latched into the buffers. 18.1.1 FUNDAMENTAL OPERATION The PWM module produces a 10-bit resolution output. Note: The Timer2 postscaler has no effect on the Timer2 and PR2 set the period of the PWM. The PWM operation. PWMxDCL and PWMxDCH registers configure the duty cycle. The period is common to all PWM modules, 18.1.4 PWM DUTY CYCLE whereas the duty cycle is independently controlled. The PWM duty cycle is specified by writing a 10-bit value Note: The Timer2 postscaler is not used in the to the PWMxDCH and PWMxDCL register pair. The determination of the PWM frequency. The PWMxDCH register contains the eight MSbs and the postscaler could be used to have a servo PWMxDCL<7:6>, the two LSbs. The PWMxDCH and update rate at a different frequency than the PWMxDCL registers can be written to at any time. PWM output. Equation18-2 is used to calculate the PWM pulse All PWM outputs associated with Timer2 are set when width. TMR2 is cleared. Each PWMx is cleared when TMR2 Equation18-3 is used to calculate the PWM duty cycle is equal to the value specified in the corresponding ratio. PWMxDCH (8MSb) and PWMxDCL<7:6> (2LSb) registers. When the value is greater than or equal to EQUATION 18-2: PULSE WIDTH PR2, the PWM output is never cleared (100% duty cycle). Pulse Width = PWMxDCH:PWMxDCL<7:6>  Note: The PWMxDCH and PWMxDCL registers are double buffered. The buffers are updated TOSC  (TMR2 Prescale Value) when Timer2 matches PR2. Care should be taken to update both registers before the Note: TOSC = 1/FOSC timer match occurs. EQUATION 18-3: DUTY CYCLE RATIO 18.1.2 PWM OUTPUT POLARITY The output polarity is inverted by setting the PWMxPOL PWMxDCH:PWMxDCL<7:6> bit of the PWMxCON register. Duty Cycle Ratio = ---------------------------4------P----R-----2----+------1------------------------------- 18.1.3 PWM PERIOD The 8-bit timer TMR2 register is concatenated with the The PWM period is specified by the PR2 register of two Least Significant bits of 1/FOSC, adjusted by the Timer2. The PWM period can be calculated using the Timer2 prescaler to create the 10-bit time base. The formula of Equation18-1. system clock is used if the Timer2 prescaler is set to 1:1. EQUATION 18-1: PWM PERIOD PWM Period = PR2+14TOSC (TMR2 Prescale Value) Note: TOSC = 1/FOSC  2011-2015 Microchip Technology Inc. DS40001585D-page 99

PIC10(L)F320/322 18.1.5 PWM RESOLUTION The resolution determines the number of available duty cycles for a given period. For example, a 10-bit resolution will result in 1024 discrete duty cycles, whereas an 8-bit resolution will result in 256 discrete duty cycles. The maximum PWM resolution is ten bits when PR2 is 255. The resolution is a function of the PR2 register value as shown by Equation18-4. EQUATION 18-4: PWM RESOLUTION log4PR2+1 Resolution = ------------------------------------------ bits log2 Note: If the pulse-width value is greater than the period the assigned PWM pin(s) will remain unchanged. TABLE 18-1: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 20 MHz) PWM Frequency 0.31 kHz 4.88 kHz 19.53 kHz 78.12 kHz 156.3 kHz 208.3 kHz Timer Prescale (1, 4, 64) 64 4 1 1 1 1 PR2 Value 0xFF 0xFF 0xFF 0x3F 0x1F 0x17 Maximum Resolution (bits) 10 10 10 8 7 6.6 TABLE 18-2: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 8 MHz) PWM Frequency 0.31 kHz 4.90 kHz 19.61 kHz 76.92 kHz 153.85 kHz 200.0 kHz Timer Prescale (1, 4, 64) 64 4 1 1 1 1 PR2 Value 0x65 0x65 0x65 0x19 0x0C 0x09 Maximum Resolution (bits) 8 8 8 6 5 5 18.1.6 OPERATION IN SLEEP MODE In Sleep mode, the TMR2register will not increment and the state of the module will not change. If the PWMx pin is driving a value, it will continue to drive that value. When the device wakes up, TMR2 will continue from its previous state. 18.1.7 CHANGES IN SYSTEM CLOCK FREQUENCY The PWM frequency is derived from the system clock frequency (FOSC). Any changes in the system clock frequency will result in changes to the PWM frequency. Refer to Section4.0 “Oscillator Module” for additional details. 18.1.8 EFFECTS OF RESET Any Reset will force all ports to Input mode and the PWM registers to their Reset states. DS40001585D-page 100  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 18.1.9 SETUP FOR PWM OPERATION USING PWMx PINS The following steps should be taken when configuring the module for PWM operation using the PWMx pins: 1. Disable the PWMx pin output driver(s) by setting the associated TRIS bit(s). 2. Clear the PWMxCON register. 3. Load the PR2 register with the PWM period value. 4. Clear the PWMxDCH register and bits <7:6> of the PWMxDCL register. 5. Configure and start Timer2: • Clear the TMR2IF interrupt flag bit of the PIR1 register. See Note below. • Configure the T2CKPS bits of the T2CON register with the Timer2 prescale value. • Enable Timer2 by setting the TMR2ON bit of the T2CON register. 6. Enable PWM output pin and wait until Timer2 overflows, TMR2IF bit of the PIR1 register is set. See Note below. 7. Enable the PWMx pin output driver(s) by clear- ing the associated TRIS bit(s) and setting the PWMxOE bit of the PWMxCON register. 8. Configure the PWM module by loading the PWMxCON register with the appropriate values. Note1: In order to send a complete duty cycle and period on the first PWM output, the above steps must be followed in the order given. If it is not critical to start with a complete PWM signal, then move Step 8 to replace Step 4. 2: For operation with other peripherals only, disable PWMx pin outputs.  2011-2015 Microchip Technology Inc. DS40001585D-page 101

PIC10(L)F320/322 18.2 PWM Register Definitions REGISTER 18-1: PWMxCON: PWM CONTROL REGISTER R/W-0/0 R/W-0/0 R-0/0 R/W-0/0 U-0 U-0 U-0 U-0 PWMxEN PWMxOE PWMxOUT PWMxPOL — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 PWMxEN: PWM Module Enable bit 1 = PWM module is enabled 0 = PWM module is disabled bit 6 PWMxOE: PWM Module Output Enable bit 1 = Output to PWMx pin is enabled 0 = Output to PWMx pin is disabled bit 5 PWMxOUT: PWM Module Output Value bit bit 4 PWMxPOL: PWMx Output Polarity Select bit 1 = PWM output is active-low. 0 = PWM output is active-high. bit 3-0 Unimplemented: Read as ‘0’ DS40001585D-page 102  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 REGISTER 18-2: PWMxDCH: PWM DUTY CYCLE HIGH BITS R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u PWMxDCH<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 PWMxDCH<7:0>: PWM Duty Cycle Most Significant bits These bits are the MSbs of the PWM duty cycle. The two LSbs are found in the PWMxDCL Register. REGISTER 18-3: PWMxDCL: PWM DUTY CYCLE LOW BITS R/W-x/u R/W-x/u U-0 U-0 U-0 U-0 U-0 U-0 PWMxDCL<7:6> — — — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 PWMxDCL<7:6>: PWM Duty Cycle Least Significant bits These bits are the LSbs of the PWM duty cycle. The MSbs are found in the PWMxDCH Register. bit 5-0 Unimplemented: Read as ‘0’ TABLE 18-3: SUMMARY OF REGISTERS ASSOCIATED WITH PWM Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page ANSELA — — — — — ANSA2 ANSA1 ANSA0 70 LATA — — — — — LATA2 LATA1 LATA0 70 PORTA — — — — RA3 RA2 RA1 RA0 69 PR2 Timer2 module Period Register 96 PWM1CON PWM1EN PWM1OE PWM1OUT PWM1POL — — — — 102 PWM1DCH PWM1DCH<7:0> 103 PWM1DCL PWM1DCL<7:6> — — — — — — 103 PWM2CON PWM2EN PWM2OE PWM2OUT PWM2POL — — — — 102 PWM2DCH PWM2DCH<7:0> 103 PWM2DCL PWM2DCL<7:6> — — — — — — 103 T2CON — TOUTPS<3:0> TMR2ON T2CKPS<1:0> 97 TMR2 Timer2 module Register 96 TRISA — — — — — TRISA2 TRISA1 TRISA0 69 Legend: - = Unimplemented locations, read as ‘0’, u = unchanged, x = unknown. Shaded cells are not used by the PWM.  2011-2015 Microchip Technology Inc. DS40001585D-page 103

PIC10(L)F320/322 19.0 CONFIGURABLE LOGIC CELL Refer to Figure19-1 for a simplified diagram showing (CLC) signal flow through the CLCx. Possible configurations include: The Configurable Logic Cell (CLCx) provides program- • Combinatorial Logic mable logic that operates outside the speed limitations of software execution. The logic cell selects any combi- - AND nation of the eight input signals and through the use of - NAND configurable gates reduces the selected inputs to four - AND-OR logic lines that drive one of eight selectable single-out- - AND-OR-INVERT put logic functions. - OR-XOR Input sources are a combination of the following: - OR-XNOR • Two I/O pins • Latches • Internal clocks - S-R • Peripherals - Clocked D with Set and Reset • Register bits - Transparent D with Set and Reset The output can be directed internally to peripherals and - Clocked J-K with Reset to an output pin. FIGURE 19-1: CLCx SIMPLIFIED BLOCK DIAGRAM D Q LCxOUT CLCxIN[0] Q1 LE CLCxIN[1] See Figure19-3 CLCxIN[2] s LCxOE e LCxEN CLCxIN[3] Gat lcxg1 TRIS Control on lcxg2 Logic lcxq lcx_out CLCxIN[4] ecti lcxg3 Function CLCx el CLCxIN[5] S lcxg4 a at LCxPOL CLCxIN[6] D Interrupt ut LCxMODE<2:0> det p CLCxIN[7] n I LCxINTP sets CLCxIF LCxINTN flag See Figure19-2 Interrupt det DS40001585D-page 104  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 19.1 CLCx Setup 19.1.2 DATA GATING Programming the CLCx module is performed by Outputs from the input multiplexers are directed to the configuring the four stages in the logic signal flow. The desired logic function input through the data gating four stages are: stage. Each data gate can direct any combination of the four selected inputs. • Data selection Note: Data gating is undefined at power-up. • Data gating • Logic function selection The gate stage is more than just signal direction. The gate • Output polarity can be configured to direct each input signal as inverted or non-inverted data. Directed signals are ANDed Each stage is setup at run time by writing to the corre- together in each gate. The output of each gate can be sponding CLCx Special Function Registers. This has inverted before going on to the logic function stage. the added advantage of permitting logic reconfiguration on-the-fly during program execution. The gating is in essence a 1-to-4 input AND/NAND/OR/ NOR gate. When every input is inverted and the output 19.1.1 DATA SELECTION is inverted, the gate is an OR of all enabled data inputs. When the inputs and output are not inverted, the gate There are eight signals available as inputs to the is an AND or all enabled inputs. configurable logic. Four 8-input multiplexers are used to select the inputs to pass on to the next stage. Table19-2 summarizes the basic logic that can be obtained in gate 1 by using the gate logic select bits. Data inputs are selected with the CLCxSEL0 and The table shows the logic of four input variables, but CLCxSEL1 registers (Register19-3 and Register19-4, each gate can be configured to use less than four. If no respectively). inputs are selected, the output will be zero or one, Data selection is through four multiplexers as indicated depending on the gate output polarity bit. on the left side of Figure19-2. Data inputs in the figure are identified by a generic numbered input name. TABLE 19-2: DATA GATING LOGIC Table19-1 correlates the generic input name to the actual signal for each CLC module. The columns CLCxGLS0 LCxGyPOL Gate Logic labeled lcxd1 through lcxd4 indicate the MUX output for 0x55 1 AND the selected data input. D1S through D4S are abbreviations for the MUX select input codes: 0x55 0 NAND LCxD1S<2:0> through LCxD4S<2:0>, respectively. 0xAA 1 NOR Selecting a data input in a column excludes all other inputs in that column. 0xAA 0 OR 0x00 0 Logic 0 Note: Data selections are undefined at power-up. 0x00 1 Logic 1 TABLE 19-1: CLCx DATA INPUT It is possible (but not recommended) to select both the SELECTION true and negated values of an input. When this is done, the gate output is zero, regardless of the other inputs, lcxd1 lcxd2 lcxd3 lcxd4 Data Input CLC 1 but may emit logic glitches (transient-induced pulses). If D1S D2S D3S D4S the output of the channel must be zero or one, the CLCxIN[0] 000 000 000 000 CLCx recommended method is to set all gate bits to zero and CLCxIN[1] 001 001 001 001 CLCxIN1 use the gate polarity bit to set the desired level. CLCxIN[2] 010 010 010 010 CLCxIN2 Data gating is configured with the logic gate select CLCxIN[3] 011 011 011 011 PWM1 registers as follows: CLCxIN[4] 100 100 100 100 PWM2 • Gate 1: CLCxGLS0 (Register19-5) CLCxIN[5] 101 101 101 101 NCOx • Gate 2: CLCxGLS1 (Register19-6) CLCxIN[6] 110 110 110 110 FOSC • Gate 3: CLCxGLS2 (Register19-7) CLCxIN[7] 111 111 111 111 LFINTOSC • Gate 4: CLCxGLS3 (Register19-8) Register number suffixes are different than the gate numbers because other variations of this module have multiple gate selections in the same register. Data gating is indicated in the right side of Figure19-2. Only one gate is shown in detail. The remaining three gates are configured identically with the exception that the data enables correspond to the enables for that gate.  2011-2015 Microchip Technology Inc. DS40001585D-page 105

PIC10(L)F320/322 19.1.3 LOGIC FUNCTION 19.1.5 CLCX SETUP STEPS There are eight available logic functions including: The following steps should be followed when setting up • AND-OR the CLCx: • OR-XOR • Disable CLCx by clearing the LCxEN bit. • AND • Select desired inputs using CLCxSEL0 and CLCxSEL1 registers (See Table19-1). • S-R Latch • Clear any associated ANSEL bits. • D Flip-Flop with Set and Reset • Set all TRIS bits associated with inputs. • D Flip-Flop with Reset • Clear all TRIS bits associated with outputs. • J-K Flip-Flop with Reset • Enable the chosen inputs through the four gates • Transparent Latch with Set and Reset using CLCxGLS0, CLCxGLS1, CLCxGLS2, and Logic functions are shown in Figure19-3. Each logic CLCxGLS3 registers. function has four inputs and one output. The four inputs • Select the gate output polarities with the are the four data gate outputs of the previous stage. The LCxPOLy bits of the CLCxPOL register. output is fed to the inversion stage and from there to other • Select the desired logic function with the peripherals, an output pin, and back to the CLCx itself. LCxMODE<2:0> bits of the CLCxCON register. 19.1.4 OUTPUT POLARITY • Select the desired polarity of the logic output with the LCxPOL bit of the CLCxPOL register. (This The last stage in the configurable logic cell is the output step may be combined with the previous gate polarity. Setting the LCxPOL bit of the CLCxCON reg- output polarity step). ister inverts the output signal from the logic stage. • If driving the CLCx pin, set the LCxOE bit of the Changing the polarity while the interrupts are enabled CLCxCON register and also clear the TRIS bit will cause an interrupt for the resulting output transition. corresponding to that output. • If interrupts are desired, configure the following bits: - Set the LCxINTP bit in the CLCxCON register for rising event. - Set the LCxINTN bit in the CLCxCON register or falling event. - Set the CLCxIE bit of the associated PIE registers. - Set the GIE and PEIE bits of the INTCON register. • Enable the CLCx by setting the LCxEN bit of the CLCxCON register. DS40001585D-page 106  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 19.2 CLCx Interrupts An interrupt will be generated upon a change in the output value of the CLCx when the appropriate interrupt enables are set. A rising edge detector and a falling edge detector are present in each CLC for this purpose. The CLCxIF bit of the associated PIR registers will be set when either edge detector is triggered and its asso- ciated enable bit is set. The LCxINTP enables rising edge interrupts and the LCxINTN bit enables falling edge interrupts. Both are located in the CLCxCON register. To fully enable the interrupt, set the following bits: • LCxON bit of the CLCxCON register • CLCxIE bit of the associated PIE registers • LCxINTP bit of the CLCxCON register (for a rising edge detection) • LCxINTN bit of the CLCxCON register (for a falling edge detection) • PEIE and GIE bits of the INTCON register The CLCxIF bit of the associated PIR registers must be cleared in software as part of the interrupt service. If another edge is detected while this flag is being cleared, the flag will still be set at the end of the sequence. 19.3 Effects of a Reset The CLCxCON register is cleared to zero as the result of a Reset. All other selection and gating values remain unchanged. 19.4 Operation During Sleep The selection, gating, and logic functions are not affected by Sleep. Operation will continue provided that the source signals are also not affected by Sleep.  2011-2015 Microchip Technology Inc. DS40001585D-page 107

PIC10(L)F320/322 FIGURE 19-2: INPUT DATA SELECTION AND GATING Data Selection CLCxIN[0] 000 CLCxIN[1] Data GATE 1 CLCxIN[2] CLCxIN[3] lcxd1T LCxD1G1T CLCxIN[4] CLCxIN[5] lcxd1N LCxD1G1N CLCxIN[6] CLCxIN[7] 111 LCxD2G1T LCxD1S<2:0> LCxD2G1N lcxg1 CLCxIN[0] 000 CLCxIN[1] LCxD3G1T CLCxIN[2] LCxG1POL CLCxIN[3] lcxd2T LCxD3G1N CLCxIN[4] lcxd2N CLCxIN[5] CLCxIN[6] LCxD4G1T CLCxIN[7] 111 LCxD2S<2:0> LCxD4G1N CLCxIN[0] 000 CLCxIN[1] Data GATE 2 CLCxIN[2] lcxg2 CLCxIN[3] lcxd3T (Same as Data GATE 1) CLCxIN[4] lcxd3N CLCxIN[5] CLCxIN[6] Data GATE 3 CLCxIN[7] 111 lcxg3 LCxD3S<2:0> (Same as Data GATE 1) CLCxIN[0] 000 Data GATE 4 CLCxIN[1] lcxg4 CLCxIN[2] CLCxIN[3] lcxd4T (Same as Data GATE 1) CLCxIN[4] lcxd4N CLCxIN[5] CLCxIN[6] CLCxIN[7] 111 LCxD4S<2:0> Note: All controls are undefined at power-up. DS40001585D-page 108  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 FIGURE 19-3: PROGRAMMABLE LOGIC FUNCTIONS AND - OR OR - XOR lcxg1 lcxg1 lcxg2 lcxg2 lcxq lcxq lcxg3 lcxg3 lcxg4 lcxg4 LCxMODE<2:0>= 000 LCxMODE<2:0>= 001 4-Input AND S-R Latch lcxg1 lcxg1 S Q lcxq lcxg2 lcxg2 lcxq lcxg3 lcxg3 R lcxg4 lcxg4 LCxMODE<2:0>= 010 LCxMODE<2:0>= 011 1-Input D Flip-Flop with S and R 2-Input D Flip-Flop with R lcxg4 lcxg4 S D Q lcxq lcxg2 D Q lcxq lcxg2 lcxg1 lcxg1 R R lcxg3 lcxg3 LCxMODE<2:0>= 100 LCxMODE<2:0>= 101 J-K Flip-Flop with R 1-Input Transparent Latch with S and R lcxg4 lcxg2 J Q lcxq S lcxg2 D Q lcxq lcxg1 lcxg4 K R lcxg1 LE R lcxg3 lcxg3 LCxMODE<2:0>= 110 LCxMODE<2:0>= 111  2011-2015 Microchip Technology Inc. DS40001585D-page 109

PIC10(L)F320/322 19.5 CLC Control Registers REGISTER 19-1: CLCxCON: CONFIGURABLE LOGIC CELL CONTROL REGISTER R/W-0/0 R/W-0/0 R-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 LCxEN LCxOE LCxOUT LCxINTP LCxINTN LCxMODE<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Reset ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 LCxEN: Configurable Logic Cell Enable bit 1 = Configurable Logic Cell is enabled and mixing input signals 0 = Configurable Logic Cell is disabled and has logic zero output bit 6 LCxOE: Configurable Logic Cell Output Enable bit 1 = Configurable Logic Cell port pin output enabled 0 = Configurable Logic Cell port pin output disabled bit 5 LCxOUT: Configurable Logic Cell Data Output bit Read-only: logic cell output data, after LCxPOL; sampled from lcx_out wire. bit 4 LCxINTP: Configurable Logic Cell Positive Edge Going Interrupt Enable bit 1 = CLCxIF will be set when a rising edge occurs on lcx_out 0 = CLCxIF will not be set bit 3 LCxINTN: Configurable Logic Cell Negative Edge Going Interrupt Enable bit 1 = CLCxIF will be set when a falling edge occurs on lcx_out 0 = CLCxIF will not be set bit 2-0 LCxMODE<2:0>: Configurable Logic Cell Functional Mode bits 111 = Cell is 1-input transparent latch with S and R 110 = Cell is J-K Flip-Flop with R 101 = Cell is 2-input D Flip-Flop with R 100 = Cell is 1-input D Flip-Flop with S and R 011 = Cell is S-R latch 010 = Cell is 4-input AND 001 = Cell is OR-XOR 000 = Cell is AND-OR DS40001585D-page 110  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 REGISTER 19-2: CLCxPOL: SIGNAL POLARITY CONTROL REGISTER R/W-x/u U-0 U-0 U-0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u LCxPOL — — — LCxG4POL LCxG3POL LCxG2POL LCxG1POL bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Reset ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 LCxPOL: LCOUT Polarity Control bit 1 = The output of the logic cell is inverted 0 = The output of the logic cell is not inverted bit 6-4 Unimplemented: Read as ‘0’ bit 3 LCxG4POL: Gate 4 Output Polarity Control bit 1 = The output of gate 4 is inverted when applied to the logic cell 0 = The output of gate 4 is not inverted bit 2 LCxG3POL: Gate 3 Output Polarity Control bit 1 = The output of gate 3 is inverted when applied to the logic cell 0 = The output of gate 3 is not inverted bit 1 LCxG2POL: Gate 2 Output Polarity Control bit 1 = The output of gate 2 is inverted when applied to the logic cell 0 = The output of gate 2 is not inverted bit 0 LCxG1POL: Gate 1 Output Polarity Control bit 1 = The output of gate 1 is inverted when applied to the logic cell 0 = The output of gate 1 is not inverted  2011-2015 Microchip Technology Inc. DS40001585D-page 111

PIC10(L)F320/322 REGISTER 19-3: CLCxSEL0: MULTIPLEXER DATA 1 AND 2 SELECT REGISTER U-0 R/W-x/u R/W-x/u R/W-x/u U-0 R/W-x/u R/W-x/u R/W-x/u — LCxD2S<2:0>(1) — LCxD1S<2:0>(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6-4 LCxD2S<2:0>: Input Data 2 Selection Control bits(1) 111 = CLCxIN[7] is selected for lcxd2. 110 = CLCxIN[6] is selected for lcxd2. 101 = CLCxIN[5] is selected for lcxd2. 100 = CLCxIN[4] is selected for lcxd2. 011 = CLCxIN[3] is selected for lcxd2. 010 = CLCxIN[2] is selected for lcxd2. 001 = CLCxIN[1] is selected for lcxd2. 000 = CLCxIN[0] is selected for lcxd2. bit 3 Unimplemented: Read as ‘0’ bit 2-0 LCxD1S<2:0>: Input Data 1 Selection Control bits(1) 111 = CLCxIN[7] is selected for lcxd1. 110 = CLCxIN[6] is selected for lcxd1. 101 = CLCxIN[5] is selected for lcxd1. 100 = CLCxIN[4] is selected for lcxd1. 011 = CLCxIN[3] is selected for lcxd1. 010 = CLCxIN[2] is selected for lcxd1. 001 = CLCxIN[1] is selected for lcxd1. 000 = CLCxIN[0] is selected for lcxd1. Note 1: See Table19-1 for signal names associated with inputs. DS40001585D-page 112  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 REGISTER 19-4: CLCxSEL1: MULTIPLEXER DATA 3 AND 4 SELECT REGISTER U-0 R/W-x/u R/W-x/u R/W-x/u U-0 R/W-x/u R/W-x/u R/W-x/u — LCxD4S<2:0>(1) — LCxD3S<2:0>(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6-4 LCxD4S<2:0>: Input Data 4 Selection Control bits(1) 111 = CLCxIN[7] is selected for lcxd4. 110 = CLCxIN[6] is selected for lcxd4. 101 = CLCxIN[5] is selected for lcxd4 100 = CLCxIN[4] is selected for lcxd4. 011 = CLCxIN[3] is selected for lcxd4. 010 = CLCxIN[2] is selected for lcxd4. 001 = CLCxIN[1] is selected for lcxd4. 000 = CLCxIN[0] is selected for lcxd4. bit 3 Unimplemented: Read as ‘0’ bit 2-0 LCxD3S<2:0>: Input Data 3 Selection Control bits(1) 111 = CLCxIN[7] is selected for lcxd3. 110 = CLCxIN[6] is selected for lcxd3. 101 = CLCxIN[5] is selected for lcxd3. 100 = CLCxIN[4] is selected for lcxd3. 011 = CLCxIN[3] is selected for lcxd3. 010 = CLCxIN[2] is selected for lcxd3. 001 = CLCxIN[1] is selected for lcxd3. 000 = CLCxIN[0] is selected for lcxd3. Note 1: See Table19-1 for signal names associated with inputs.  2011-2015 Microchip Technology Inc. DS40001585D-page 113

PIC10(L)F320/322 REGISTER 19-5: CLCxGLS0: GATE 1 LOGIC SELECT REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u LCxG1D4T LCxG1D4N LCxG1D3T LCxG1D3N LCxG1D2T LCxG1D2N LCxG1D1T LCxG1D1N bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 LCxG1D4T: Gate 1 Data 4 True (non-inverted) bit 1 = lcxd4T is gated into lcxg1 0 = lcxd4T is not gated into lcxg1 bit 6 LCxG1D4N: Gate 1 Data 4 Negated (inverted) bit 1 = lcxd4N is gated into lcxg1 0 = lcxd4N is not gated into lcxg1 bit 5 LCxG1D3T: Gate 1 Data 3 True (non-inverted) bit 1 = lcxd3T is gated into lcxg1 0 = lcxd3T is not gated into lcxg1 bit 4 LCxG1D3N: Gate 1 Data 3 Negated (inverted) bit 1 = lcxd3N is gated into lcxg1 0 = lcxd3N is not gated into lcxg1 bit 3 LCxG1D2T: Gate 1 Data 2 True (non-inverted) bit 1 = lcxd2T is gated into lcxg1 0 = lcxd2T is not gated into lcxg1 bit 2 LCxG1D2N: Gate 1 Data 2 Negated (inverted) bit 1 = lcxd2N is gated into lcxg1 0 = lcxd2N is not gated into lcxg1 bit 1 LCxG1D1T: Gate 1 Data 1 True (non-inverted) bit 1 = lcxd1T is gated into lcxg1 0 = lcxd1T is not gated into lcxg1 bit 0 LCxG1D1N: Gate 1 Data 1 Negated (inverted) bit 1 = lcxd1N is gated into lcxg1 0 = lcxd1N is not gated into lcxg1 DS40001585D-page 114  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 REGISTER 19-6: CLCxGLS1: GATE 2 LOGIC SELECT REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u LCxG2D4T LCxG2D4N LCxG2D3T LCxG2D3N LCxG2D2T LCxG2D2N LCxG2D1T LCxG2D1N bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 LCxG2D4T: Gate 2 Data 4 True (non-inverted) bit 1 = lcxd4T is gated into lcxg2 0 = lcxd4T is not gated into lcxg2 bit 6 LCxG2D4N: Gate 2 Data 4 Negated (inverted) bit 1 = lcxd4N is gated into lcxg2 0 = lcxd4N is not gated into lcxg2 bit 5 LCxG2D3T: Gate 2 Data 3 True (non-inverted) bit 1 = lcxd3T is gated into lcxg2 0 = lcxd3T is not gated into lcxg2 bit 4 LCxG2D3N: Gate 2 Data 3 Negated (inverted) bit 1 = lcxd3N is gated into lcxg2 0 = lcxd3N is not gated into lcxg2 bit 3 LCxG2D2T: Gate 2 Data 2 True (non-inverted) bit 1 = lcxd2T is gated into lcxg2 0 = lcxd2T is not gated into lcxg2 bit 2 LCxG2D2N: Gate 2 Data 2 Negated (inverted) bit 1 = lcxd2N is gated into lcxg2 0 = lcxd2N is not gated into lcxg2 bit 1 LCxG2D1T: Gate 2 Data 1 True (non-inverted) bit 1 = lcxd1T is gated into lcxg2 0 = lcxd1T is not gated into lcxg2 bit 0 LCxG2D1N: Gate 2 Data 1 Negated (inverted) bit 1 = lcxd1N is gated into lcxg2 0 = lcxd1N is not gated into lcxg2  2011-2015 Microchip Technology Inc. DS40001585D-page 115

PIC10(L)F320/322 REGISTER 19-7: CLCxGLS2: GATE 3 LOGIC SELECT REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u LCxG3D4T LCxG3D4N LCxG3D3T LCxG3D3N LCxG3D2T LCxG3D2N LCxG3D1T LCxG3D1N bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 LCxG3D4T: Gate 3 Data 4 True (non-inverted) bit 1 = lcxd4T is gated into lcxg3 0 = lcxd4T is not gated into lcxg3 bit 6 LCxG3D4N: Gate 3 Data 4 Negated (inverted) bit 1 = lcxd4N is gated into lcxg3 0 = lcxd4N is not gated into lcxg3 bit 5 LCxG3D3T: Gate 3 Data 3 True (non-inverted) bit 1 = lcxd3T is gated into lcxg3 0 = lcxd3T is not gated into lcxg3 bit 4 LCxG3D3N: Gate 3 Data 3 Negated (inverted) bit 1 = lcxd3N is gated into lcxg3 0 = lcxd3N is not gated into lcxg3 bit 3 LCxG3D2T: Gate 3 Data 2 True (non-inverted) bit 1 = lcxd2T is gated into lcxg3 0 = lcxd2T is not gated into lcxg3 bit 2 LCxG3D2N: Gate 3 Data 2 Negated (inverted) bit 1 = lcxd2N is gated into lcxg3 0 = lcxd2N is not gated into lcxg3 bit 1 LCxG3D1T: Gate 3 Data 1 True (non-inverted) bit 1 = lcxd1T is gated into lcxg3 0 = lcxd1T is not gated into lcxg3 bit 0 LCxG3D1N: Gate 3 Data 1 Negated (inverted) bit 1 = lcxd1N is gated into lcxg3 0 = lcxd1N is not gated into lcxg3 DS40001585D-page 116  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 REGISTER 19-8: CLCxGLS3: GATE 4 LOGIC SELECT REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u LCxG4D4T LCxG4D4N LCxG4D3T LCxG4D3N LCxG4D2T LCxG4D2N LCxG4D1T LCxG4D1N bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 LCxG4D4T: Gate 4 Data 4 True (non-inverted) bit 1 = lcxd4T is gated into lcxg4 0 = lcxd4T is not gated into lcxg4 bit 6 LCxG4D4N: Gate 4 Data 4 Negated (inverted) bit 1 = lcxd4N is gated into lcxg4 0 = lcxd4N is not gated into lcxg4 bit 5 LCxG4D3T: Gate 4 Data 3 True (non-inverted) bit 1 = lcxd3T is gated into lcxg4 0 = lcxd3T is not gated into lcxg4 bit 4 LCxG4D3N: Gate 4 Data 3 Negated (inverted) bit 1 = lcxd3N is gated into lcxg4 0 = lcxd3N is not gated into lcxg4 bit 3 LCxG4D2T: Gate 4 Data 2 True (non-inverted) bit 1 = lcxd2T is gated into lcxg4 0 = lcxd2T is not gated into lcxg4 bit 2 LCxG4D2N: Gate 4 Data 2 Negated (inverted) bit 1 = lcxd2N is gated into lcxg4 0 = lcxd2N is not gated into lcxg4 bit 1 LCxG4D1T: Gate 4 Data 1 True (non-inverted) bit 1 = lcxd1T is gated into lcxg4 0 = lcxd1T is not gated into lcxg4 bit 0 LCxG4D1N: Gate 4 Data 1 Negated (inverted) bit 1 = lcxd1N is gated into lcxg4 0 = lcxd1N is not gated into lcxg4  2011-2015 Microchip Technology Inc. DS40001585D-page 117

PIC10(L)F320/322 TABLE 19-3: SUMMARY OF REGISTERS ASSOCIATED WITH CLCx Register Name Bit7 Bit6 Bit5 Bit4 BIt3 Bit2 Bit1 Bit0 on Page CLC1CON LC1EN LC1OE LC1OUT LC1INTP LC1INTN LC1MODE<2:0> 110 CLC1GLS0 LC1G1D4T LC1G1D4N LC1G1D3T LC1G1D3N LC1G1D2T LC1G1D2N LC1G1D1T LC1G1D1N 114 CLC1GLS1 LC1G2D4T LC1G2D4N LC1G2D3T LC1G2D3N LC1G2D2T LC1G2D2N LC1G2D1T LC1G2D1N 115 CLC1GLS2 LC1G3D4T LC1G3D4N LC1G3D3T LC1G3D3N LC1G3D2T LC1G3D2N LC1G3D1T LC1G3D1N 116 CLC1GLS3 LC1G4D4T LC1G4D4N LC1G4D3T LC1G4D3N LC1G4D2T LC1G4D2N LC1G4D1T LC1G4D1N 117 CLC1POL LC1POL — — — LC1G4POL LC1G3POL LC1G2POL LC1G1POL 111 CLC1SEL0 — LC1D2S<2:0> — LC1D1S<2:0> 112 CLC1SEL1 — LC1D4S<2:0> — LC1D3S<2:0> 113 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 40 PIE1 — ADIE — NCO1IE CLC1IE — TMR2IE — 41 PIR1 — ADIF — NCO1IF CLC1IF — TMR2IF — 42 TRISA — — — — — TRISA2 TRISA1 TRISA0 69 Legend: — = unimplemented read as ‘0’. Shaded cells are not used for CLC module. DS40001585D-page 118  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 20.0 NUMERICALLY CONTROLLED OSCILLATOR (NCO) MODULE The Numerically Controlled Oscillator (NCOx) module is a timer that uses the overflow from the addition of an increment value to divide the input frequency. The advantage of the addition method over simple counter driven timer is that the resolution of division does not vary with the divider value. The NCOx is most useful for applications that requires frequency accuracy and fine resolution at a fixed duty cycle. Features of the NCOx include: • 16-bit increment function • Fixed Duty Cycle (FDC) mode • Pulse Frequency (PF) mode • Output pulse width control • Multiple clock input sources • Output polarity control • Interrupt capability Figure20-1 is a simplified block diagram of the NCOx module.  2011-2015 Microchip Technology Inc. DS40001585D-page 119

D FIGURE 20-1: NUMERICALLY CONTROLLED OSCILLATOR (NCOx) MODULE SIMPLIFIED BLOCK DIAGRAM P S 4 0 I 0 C 0 1 5 8 1 5 D-page (1)NCOxINCH N16COxINCL Rev.107-0/3000/022081A3 0(L 1 INCBUFH INCBUFL 20 16 20 )F 3 2 NCO_overflow Adder HFINTOSC 00 0 20 FOSC 01 NCOx_clk NCOxACCU NCOxACCH NCOxACCL /3 LCx_out 10 20 2 NCO1CLK 11 2 NCO_interrupt setbit NxCKS<1:0> 2 NCOxIF FixedDuty CycleMode Circuitry NxOE D Q D Q 0 TRISbit _ 1 NCOx Q NxPFM NxPOL NCOx_out ToPeripherals EN S Q  2 0 _ D Q NxOUT 11 Ripple R Q -2 Counter 0 1 5 M Pulse Q1 icro R 3 MoFdreeqCueirncucyitry c NxPWS<2:0> h ip T ec Note1: Theincrementregistersaredouble-bufferedtoallowforvaluechangestobemadewithoutfirstdisablingtheNCOmodule.Thefullincrementvalueisloadedintothebufferregistersonthe hn secondrisingedgeoftheNCOx_clksignalthatoccursimmediatelyafterawritetoNCOxINCLregister.Thebuffersarenotuser-accessibleandareshownhereforreference. o lo g y In c .

PIC10(L)F320/322 20.1 NCOx OPERATION 20.1.3 ADDER The NCOx operates by repeatedly adding a fixed value The NCOx Adder is a full adder, which operates to an accumulator. Additions occur at the input clock asynchronously to the clock source selected. The rate. The accumulator will overflow with a carry addition of the previous result and the increment value periodically, which is the raw NCOx output. This replaces the accumulator value on the rising edge of effectively reduces the input clock by the ratio of the each input clock. addition value to the maximum accumulator value. See 20.1.4 INCREMENT REGISTERS Equation20-1. The Increment value is stored in two 8-bit registers The NCOx output can be further modified by stretching making up a 16-bit increment. In order of LSB to MSB the pulse or toggling a flip-flop. The modified NCOx they are: output is then distributed internally to other peripherals and optionally output to a pin. The accumulator overflow • NCOxINCL also generates an interrupt. • NCOxINCH The NCOx output creates an instantaneous frequency, Both of the registers are readable and writable. The which may cause uncertainty. This output depends on Increment registers are double-buffered to allow for the ability of the receiving circuit (i.e., CWG or external value changes to be made without first disabling the resonant converter circuitry) to average the NCOx module. instantaneous frequency to reduce uncertainty. The buffer loads are immediate when the module is 20.1.1 NCOx CLOCK SOURCES disabled. Writing to the MS register first is necessary because then the buffer is loaded synchronously with Clock sources available to the NCOx include: the NCOx operation after the write is executed on the • HFINTOSC lower increment register. • FOSC Note: The increment buffer registers are not user- • LC1OUT accessible. • NCO1CLK pin The NCOx clock source is selected by configuring the NxCKS<1:0> bits in the NCOxCLK register. 20.1.2 ACCUMULATOR The Accumulator is a 20-bit register. Read and write access to the Accumulator is available through three registers: • NCOxACCL • NCOxACCH • NCOxACCU EQUATION 20-1: NCO Clock Frequency Increment Value FOVERFLOW= ---------------------------------------------------------------------------------------------------------------- n 2 n = Accumulator width in bits  2011-2015 Microchip Technology Inc. DS40001585D-page 121

PIC10(L)F320/322 20.2 FIXED DUTY CYCLE (FDC) MODE In Fixed Duty Cycle (FDC) mode, every time the Accumulator overflows, the output is toggled. This provides a 50% duty cycle, provided that the increment value remains constant. For more information, see Figure20-2. The FDC mode is selected by clearing the NxPFM bit in the NCOxCON register. 20.3 PULSE FREQUENCY (PF) MODE In Pulse Frequency (PF) mode, every time the Accu- mulator overflows, the output becomes active for one or more clock periods. See Section20.3.1 “OUTPUT PULSE WIDTH CONTROL” for more information. Once the clock period expires, the output returns to an inactive state. This provides a pulsed output. The output becomes active on the rising clock edge immediately following the overflow event. For more information, see Figure20-2. The value of the active and inactive states depends on the Polarity bit, NxPOL in the NCOxCON register. The PF mode is selected by setting the NxPFM bit in the NCOxCON register. 20.3.1 OUTPUT PULSE WIDTH CONTROL When operating in PF mode, the active state of the out- put can vary in width by multiple clock periods. Various pulse widths are selected with the NxPWS<2:0> bits in the NCOxCLK register. When the selected pulse width is greater than the Accumulator overflow time frame, then NCOx operation is undefined. 20.4 OUTPUT POLARITY CONTROL The last stage in the NCOx module is the output polar- ity. The NxPOL bit in the NCOxCON register selects the output polarity. Changing the polarity while the inter- rupts are enabled will cause an interrupt for the result- ing output transition. The NCOx output can be used internally by source code or other peripherals. This is done by reading the NxOUT (read-only) bit of the NCOxCON register. DS40001585D-page 122  2011-2015 Microchip Technology Inc.

 FIGURE 20-2: NCO – FIXED DUTY CYCLE (FDC) AND PULSE FREQUENCY MODE (PFM) OUTPUT OPERATION DIAGRAM 2 0 Rev. 10-000029A 1 11/7/2013 1 NCOx -2 0 Clock 1 5 Source M ic ro c h ip NCOx T e Increment 4000h 4000h 4000h c hn Value o lo g y In c NCOx . Accumulator 00000h 04000h 08000h FC000h 00000h 04000h 08000h FC000h 00000h 04000h 08000h Value NCO_overflow NCO_interrupt P I C NCOx Output FDC Mode 1 0 ( L NCOx Output ) D PF Mode F S 4 NCOxPWS = 3 000 000 2 1 5 0 8 5 D NCOx Output / -p PF Mode 3 a ge NCOxPWS = 2 1 001 2 2 3

PIC10(L)F320/322 20.5 Interrupts When the Accumulator overflows, the NCOx Interrupt Flag bit, NCOxIF, of the PIR1 register is set. To enable this interrupt event, the following bits must be set: • NxEN bit of the NCOxCON register • NCOxIE bit of the PIE1 register • PEIE bit of the INTCON register • GIE bit of the INTCON register The interrupt must be cleared by software by clearing the NCOxIF bit in the Interrupt Service Routine. 20.6 Effects of a Reset All of the NCOx registers are cleared to zero as the result of a Reset. 20.7 Operation In Sleep The NCO module operates independently from the system clock and will continue to run during Sleep, provided that the clock source selected remains active. The HFINTOSC remains active during Sleep when the NCO module is enabled and the HFINTOSC is selected as the clock source, regardless of the system clock source selected. In other words, if the HFINTOSC is simultaneously selected as the system clock and the NCO clock source, when the NCO is enabled, the CPU will go idle during Sleep, but the NCO will continue to operate and the HFINTOSC will remain active. This will have a direct effect on the Sleep mode current. DS40001585D-page 124  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 20.8 NCOx Control Registers REGISTER 20-1: NCOxCON: NCOx CONTROL REGISTER R/W-0/0 R/W-0/0 R-0/0 R/W-0/0 U-0 U-0 U-0 R/W-0/0 NxEN NxOE NxOUT NxPOL — — — NxPFM bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 NxEN: NCOx Enable bit 1 = NCOx module is enabled 0 = NCOx module is disabled bit 6 NxOE: NCOx Output Enable bit 1 = NCOx output pin is enabled 0 = NCOx output pin is disabled bit 5 NxOUT: NCOx Output bit 1 = NCOx output is high 0 = NCOx output is low bit 4 NxPOL: NCOx Polarity bit 1 = NCOx output signal is active-low (inverted) 0 = NCOx output signal is active-high (non-inverted) bit 3-1 Unimplemented: Read as ‘0’. bit 0 NxPFM: NCOx Pulse Frequency mode bit 1 = NCOx operates in Pulse Frequency mode 0 = NCOx operates in Fixed Duty Cycle mode REGISTER 20-2: NCOxCLK: NCOx INPUT CLOCK CONTROL REGISTER R/W-0/0 R/W-0/0 R/W-0/0 U-0 U-0 U-0 R/W-0/0 R/W-0/0 NxPWS<2:0>(1,2) — — — NxCKS<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-5 NxPWS<2:0>: NCOx Output Pulse Width Select bits(1, 2) 111 = 128 NCOx clock periods 110 = 64 NCOx clock periods 101 = 32 NCOx clock periods 100 = 16 NCOx clock periods 011 = 8 NCOx clock periods 010 = 4 NCOx clock periods 001 = 2 NCOx clock periods 000 = 1 NCOx clock periods bit 4-2 Unimplemented: Read as ‘0’ bit 1-0 NxCKS<1:0>: NCOx Clock Source Select bits 11 = LC1OUT 10 = HFINTOSC (16 MHz) 01 = FOSC 00 = NCO1CLK pin Note 1: NxPWS applies only when operating in Pulse Frequency mode. 2: If NCOx pulse width is greater than NCOx overflow period, operation is undefined.  2011-2015 Microchip Technology Inc. DS40001585D-page 125

PIC10(L)F320/322 REGISTER 20-3: NCOxACCL: NCOx ACCUMULATOR REGISTER – LOW BYTE R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 NCOxACC<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 NCOxACC<7:0>: NCOx Accumulator, low byte Note1: NxPWS applies only when operating in Pulse Frequency mode. 2: If NCOx pulse width is greater than NCOx overflow period, operation is undefined. REGISTER 20-4: NCOxACCH: NCOx ACCUMULATOR REGISTER – HIGH BYTE R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 NCOxACC<15:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 NCOxACC<15:8>: NCOx Accumulator, high byte REGISTER 20-5: NCOxACCU: NCOx ACCUMULATOR REGISTER – UPPER BYTE U-0 U-0 U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — — — — NCOxACC<19:16> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 Unimplemented: Read as ‘0’ bit 3-0 NCOxACC<19:16>: NCOx Accumulator, upper byte DS40001585D-page 126  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 REGISTER 20-6: NCOxINCL: NCOx INCREMENT REGISTER – LOW BYTE R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-1/1 NCOxINC<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 NCOxINC<7:0>: NCOx Increment, low byte REGISTER 20-7: NCOxINCH: NCOx INCREMENT REGISTER – HIGH BYTE R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 NCOxINC<15:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 NCOxINC<15:8>: NCOx Increment, high byte  2011-2015 Microchip Technology Inc. DS40001585D-page 127

PIC10(L)F320/322 TABLE 20-1: SUMMARY OF REGISTERS ASSOCIATED WITH NCOx Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page CLC1SEL0 — LC1D2S2 LC1D2S1 LC1D2S0 — LC1D1S2 LC1D1S1 LC1D1S0 112 CLC1SEL1 — LC1D4S2 LC1D4S1 LC1D4S0 — LC1D3S2 LC1D3S1 LC1D3S0 113 CWG1CON1 G1ASDLB<1:0> G1ASDLA<1:0> — — G1IS<1:0> 140 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 40 NCO1ACCH NCO1ACCH<15:8> 126 NCO1ACCL NCO1ACCL<7:0> 126 NCO1ACCU — NCO1ACCU<19:16 126 NCO1CLK N1PWS<2:0> — — — N1CKS<1:0> 125 NCO1CON N1EN N1OE N1OUT N1POL — — — N1PFM 125 NCO1INCH NCO1INCH<15:8> 127 NCO1INCL NCO1INCL<7:0> 127 PIE1 — ADIE — NCO1IE CLC1IE — TMR2IE — 41 PIR1 — ADIF — NCO1IF CLC1IF — TMR2IF — 42 TRISA — — — — — TRISA2 TRISA1 TRISA0 69 Legend: x = unknown, u = unchanged, — = unimplemented read as ‘0’, q = value depends on condition. Shaded cells are not used for NCO module. DS40001585D-page 128  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 21.0 COMPLEMENTARY WAVEFORM GENERATOR (CWG) MODULE The Complementary Waveform Generator (CWG) produces a complementary waveform with dead-band delay from a selection of input sources. The CWG module has the following features: • Selectable dead-band clock source control • Selectable input sources • Output enable control • Output polarity control • Dead-band control with Independent 6-bit rising and falling edge dead-band counters • Auto-shutdown control with: - Selectable shutdown sources - Auto-restart enable - Auto-shutdown pin override control  2011-2015 Microchip Technology Inc. DS40001585D-page 129

D FIGURE 21-1: CWG BLOCK DIAGRAM P S 4 0 I 0 C 0 1 5 8 1 5 D 0 -p 2 ag GxASDLA ( e L 1 30 2 00 ) GxCS ‘0’ 10 F FOSC cwg_clock 1 ‘1’ 11 GxASDLA = 01 32 CWGxDBR GxOEA HFINTOSC 0 6 / 3 1 2 EN = 2 GxIS R 0 TRISx CWGxA 2 PWM1OUT S Q GxPOLA PWM2OUT Input Source N1OUT LC1OUT R Q CWGxDBF 6 GxOEB TRISx EN = R 0 GxPOLB 1 CWGxB GxASDLB = 01 00 ‘0’ 10  ‘1’ 11 2 0 CWG1FLT (INT pin) GxASE 1 Auto-Shutdown GxASDLB 1-2015 GxLACS1DOFULTT Source S Q D S Q shutdown 2 M GxASDCLC1 icro R Q c hip GxASE Data Bit GxARSEN set dominate T WRITE e c h no x = CWG module number lo g y In c .

PIC10(L)F320/322 FIGURE 21-2: TYPICAL CWG OPERATION WITH PWM1 (NO AUTO-SHUTDOWN) cwg_clock PWM1 CWGxA Rising Edge Rising Edge Dead Band Rising Edge D Dead Band Falling Edge Dead Band Falling Edge Dead Band CWGxB  2011-2015 Microchip Technology Inc. DS40001585D-page 131

PIC10(L)F320/322 21.1 Fundamental Operation 21.4.2 POLARITY CONTROL The CWG generates a two output complementary The polarity of each CWG output can be selected waveform from one of four selectable input sources. independently. When the output polarity bit is set, the corresponding output is active-high. Clearing the output The off-to-on transition of each output can be delayed polarity bit configures the corresponding output as from the on-to-off transition of the other output, thereby, active-low. However, polarity does not affect the creating a time delay immediately where neither output override levels. Output polarity is selected with the is driven. This is referred to as dead time and is covered GxPOLA and GxPOLB bits of the CWGxCON0 register. in Section21.5 “Dead-Band Control”. A typical operating waveform, with dead band, generated from a 21.5 Dead-Band Control single input signal is shown in Figure21-2. It may be necessary to guard against the possibility of Dead-band control provides for non-overlapping output circuit faults or a feedback event arriving too late or not signals to prevent shoot-through current in power at all. In this case, the active drive must be terminated switches. The CWG contains two 6-bit dead-band before the Fault condition causes damage. This is counters. One dead-band counter is used for the rising referred to as auto-shutdown and is covered in edge of the input source control. The other is used for Section21.9 “Auto-shutdown Control”. the falling edge of the input source control. Dead band is timed by counting CWG clock periods 21.2 Clock Source from zero up to the value in the rising or falling dead- band counter registers. See CWGxDBR and The CWG module allows the following clock sources CWGxDBF registers (Register21-4 and Register21-5, to be selected: respectively). • Fosc (system clock) • HFINTOSC (16 MHz only) 21.6 Rising Edge Dead Band The clock sources are selected using the G1CS0 bit of The rising edge dead band delays the turn-on of the the CWGxCON0 register (Register21-1). CWGxA output from when the CWGxB output is turned off. The rising edge dead-band time starts when the 21.3 Selectable Input Sources rising edge of the input source signal goes true. When this happens, the CWGxB output is immediately turned The CWG can generate the complementary waveform off and the rising edge dead-band delay time starts. for the following input sources: When the rising edge dead-band delay time is reached, • PWM1 the CWGxA output is turned on. • PWM2 The CWGxDBR register sets the duration of the dead- • N1OUT band interval on the rising edge of the input source • LC1OUT signal. This duration is from 0 to 64 counts of dead band. The input sources are selected using the GxIS<1:0> Dead band is always counted off the edge on the input bits in the CWGxCON1 register (Register21-2). source signal. A count of 0 (zero), indicates that no dead band is present. 21.4 Output Control If the input source signal is not present for enough time Immediately after the CWG module is enabled, the for the count to be completed, no output will be seen on complementary drive is configured with both CWGxA the respective output. and CWGxB drives cleared. 21.4.1 OUTPUT ENABLES Each CWG output pin has individual output enable control. Output enables are selected with the GxOEA and GxOEB bits of the CWGxCON0 register. When an output enable control is cleared, the module asserts no control over the pin. When an output enable is set, the override value or active PWM waveform is applied to the pin per the port priority selection. The output pin enables are dependent on the module enable bit, GxEN. When GxEN is cleared, CWG output enables and CWG drive levels have no effect. DS40001585D-page 132  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 21.7 Falling Edge Dead Band The falling edge dead band delays the turn-on of the CWGxB output from when the CWGxA output is turned off. The falling edge dead-band time starts when the falling edge of the input source goes true. When this happens, the CWGxA output is immediately turned off and the falling edge dead-band delay time starts. When the falling edge dead-band delay time is reached, the CWGxB output is turned on. The CWGxDBF register sets the duration of the dead- band interval on the falling edge of the input source signal. This duration is from 0 to 64 counts of dead band. Dead band is always counted off the edge on the input source signal. A count of 0 (zero), indicates that no dead band is present. If the input source signal is not present for enough time for the count to be completed, no output will be seen on the respective output. Refer to Figure21-3 and Figure21-4 for examples. 21.8 Dead-Band Uncertainty When the rising and falling edges of the input source triggers the dead-band counters, the input may be asynchronous. This will create some uncertainty in the dead-band time delay. The maximum uncertainty is equal to one CWG clock period. Refer to Equation21-1 for more detail.  2011-2015 Microchip Technology Inc. DS40001585D-page 133

D FIGURE 21-3: DEAD-BAND OPERATION, CWGxDBR = 01H, CWGxDBF = 02H P S 4 0 I 0 C 0 1 5 8 1 5 D-p cwg_clock 0 ag ( e L 134 Input Source ) F CWGxA 3 2 0 CWGxB / 3 2 FIGURE 21-4: DEAD-BAND OPERATION, CWGxDBR = 03H, CWGxDBF = 04H, SOURCE SHORTER THAN DEAD BAND 2 cwg_clock Input Source CWGxA source shorter than dead band CWGxB  2 0 1 1 -2 0 1 5 M ic ro c h ip T e c h n o lo g y In c .

PIC10(L)F320/322 EQUATION 21-1: DEAD-BAND DELAY TIME UNCERTAINTY 1 TDEADBAND_UNCERTAINTY = ----------------------------- Fcwg_clock EXAMPLE 21-1: DEAD-BAND DELAY TIME UNCERTAINTY Fcwg_clock = 16 MHz Therefore: 1 TDEADBAND_UNCERTAINTY = ----------------------------- Fcwg_clock 1 = ------------------- 16 MHz = 625ns  2011-2015 Microchip Technology Inc. DS40001585D-page 135

PIC10(L)F320/322 21.9 Auto-shutdown Control 21.10 Operation During Sleep Auto-shutdown is a method to immediately override the The CWG module operates independently from the CWG output levels with specific overrides that allow for system clock and will continue to run during Sleep, safe shutdown of the circuit. The shutdown state can be provided that the clock and input sources selected either cleared automatically or held until cleared by remain active. software. The HFINTOSC remains active during Sleep, provided that the CWG module is enabled, the input source is 21.9.1 SHUTDOWN active, and the HFINTOSC is selected as the clock The Shutdown state can be entered by either of the source, regardless of the system clock source following two methods: selected. • Software generated In other words, if the HFINTOSC is simultaneously • External Input selected as the system clock and the CWG clock source, when the CWG is enabled and the input source 21.9.1.1 Software Generated Shutdown is active, the CPU will go idle during Sleep, but the CWG will continue to operate and the HFINTOSC will Setting the GxASE bit of the CWGxCON2 register will remain active. force the CWG into the shutdown state. This will have a direct effect on the Sleep mode current. When auto-restart is disabled, the shutdown state will persist as long as the GxASE bit is set. When auto-restart is enabled, the GxASE bit will clear automatically and resume operation on the next rising edge event. See Figure21-6. 21.9.1.2 External Input Source External shutdown inputs provide the fastest way to safely suspend CWG operation in the event of a Fault condition. When any of the selected shutdown inputs goes high, the CWG outputs will immediately go to the selected override levels without software delay. Any combination of two input sources can be selected to cause a shutdown condition. The two sources are: • LC1OUT • CWG1FLT Shutdown inputs are selected using the GxASDS0 and GxASDS1 bits of the CWGxCON2 register. (Register21-3). Note: Shutdown inputs are level sensitive, not edge sensitive. The shutdown state can- not be cleared, except by disabling auto- shutdown, as long as the shutdown input level persists. DS40001585D-page 136  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 21.11 Configuring the CWG 21.11.2.1 Software controlled restart The following steps illustrate how to properly configure When the GxARSEN bit of the CWGxCON2 register is the CWG to ensure a synchronous start: cleared, the CWG must be restarted after an auto-shut- down event by software. 1. Ensure that the TRIS control bits corresponding to CWGxA and CWGxB are set so that both are The CWG will resume operation on the first rising edge configured as inputs. event after the GxASE bit is cleared. Clearing the shut- down state requires all selected shutdown inputs to be 2. Clear the GxEN bit, if not already cleared. low, otherwise the GxASE bit will remain set. 3. Set desired dead-band times with the CWGxDBR and CWGxDBF registers. 21.11.2.2 Auto-Restart 4. Setup the following controls in CWGxCON2 When the GxARSEN bit of the CWGxCON2 register is auto-shutdown register: set, the CWG will restart from the auto-shutdown state • Select desired shutdown source. automatically. • Select both output overrides to the desired After the shutdown event clears, the GxASE bit will levels (this is necessary even if not using clear automatically and the CWG will resume operation auto-shutdown because start-up will be from on the first rising edge event. a shutdown state). • Set the GxASE bit and clear the GxARSEN bit. 5. Select the desired input source using the CWGxCON1 register. 6. Configure the following controls in CWGxCON0 register: • Select desired clock source. • Select the desired output polarities. • Set the output enables for the outputs to be used. 7. Set the GxEN bit. 8. Clear TRIS control bits corresponding to CWGxA and CWGxB to be used to configure those pins as outputs. 9. If auto-restart is to be used, set the GxARSEN bit and the GxASE bit will be cleared automati- cally. Otherwise, clear the GxASE bit to start the CWG. 21.11.1 PIN OVERRIDE LEVELS The levels driven to the output pins, while the shutdown input is true, are controlled by the GxASDLA and GxASDLB bits of the CWGxCON1 register (Register21-2). GxASDLA controls the CWG1A override level and GxASDLB controls the CWG1B override level. The control bit logic level corresponds to the output logic drive level while in the shutdown state. The polarity control does not apply to the override level. 21.11.2 AUTO-SHUTDOWN RESTART After an auto-shutdown event has occurred, there are two ways to have resume operation: • Software controlled • Auto-restart The restart method is selected with the GxARSEN bit of the CWGxCON2 register. Waveforms of software controlled and automatic restarts are shown in Figure21-5 and Figure21-6.  2011-2015 Microchip Technology Inc. DS40001585D-page 137

D FIGURE 21-5: SHUTDOWN FUNCTIONALITY, AUTO-RESTART DISABLED (GxARSEN = 0) P S 4 0 I 0 C 01 Shutdown Event Ceases GxASE Cleared by Software 5 8 1 5 D 0 -page CWGS oInuprcuet (L 1 38 Shutdown Source ) F 3 GxASE 2 0 CWG1A Tri-State (No Pulse) / 3 2 CWG1B Tri-State (No Pulse) 2 No Shutdown Shutdown Output Resumes FIGURE 21-6: SHUTDOWN FUNCTIONALITY, AUTO-RESTART ENABLED (GxARSEN = 1) Shutdown Event Ceases GxASE auto-cleared by hardware CWG Input Source Shutdown Source  2 0 1 1 -2 GxASE 0 1 5 M ic CWG1A Tri-State (No Pulse) ro c h ip T CWG1B Tri-State (No Pulse) e c h No Shutdown n olo Shutdown Output Resumes g y In c .

PIC10(L)F320/322 21.12 CWG Control Registers REGISTER 21-1: CWGxCON0: CWG CONTROL REGISTER 0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 U-0 R/W-0/0 GxEN GxOEB GxOEA GxPOLB GxPOLA — — GxCS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7 GxEN: CWGx Enable bit 1 = Module is enabled 0 = Module is disabled bit 6 GxOEB: CWGxB Output Enable bit 1 = CWGxB is available on appropriate I/O pin 0 = CWGxB is not available on appropriate I/O pin bit 5 GxOEA: CWGxA Output Enable bit 1 = CWGxA is available on appropriate I/O pin 0 = CWGxA is not available on appropriate I/O pin bit 4 GxPOLB: CWGxB Output Polarity bit 1 = Output is inverted polarity 0 = Output is normal polarity bit 3 GxPOLA: CWGxA Output Polarity bit 1 = Output is inverted polarity 0 = Output is normal polarity bit 2-1 Unimplemented: Read as ‘0’ bit 0 GxCS0: CWGx Clock Source Select bit 1 = HFINTOSC 0 = FOSC  2011-2015 Microchip Technology Inc. DS40001585D-page 139

PIC10(L)F320/322 REGISTER 21-2: CWGxCON1: CWG CONTROL REGISTER 1 R/W-x/u R/W-x/u R/W-x/u R/W-x/u U-0 U-0 R/W-0/0 R/W-0/0 GxASDLB<1:0> GxASDLA<1:0> — — GxIS<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7-6 GxASDLB<1:0>: CWGx Shutdown State for CWGxB When an auto shutdown event is present (GxASE=1): 11 = CWGxB pin is driven to ‘1’, regardless of the setting of the GxPOLB bit. 10 = CWGxB pin is driven to ‘0’, regardless of the setting of the GxPOLB bit. 01 = CWGxB pin is tri-stated 00 = CWGxB pin is driven to its inactive state after the selected dead-band interval. GxPOLB still will control the polarity of the output. bit 5-4 GxASDLA<1:0>: CWGx Shutdown State for CWGxA When an auto shutdown event is present (GxASE=1): 00 = CWGxA pin is driven to its inactive state after the selected dead-band interval. GxPOLA still will control the polarity of the output. 01 = CWGxA pin is tri-stated 10 = CWGxA pin is driven to ‘0’, regardless of the setting of the GxPOLA bit. 11 = CWGxA pin is driven to ‘1’, regardless of the setting of the GxPOLA bit. bit 3-2 Unimplemented: Read as ‘0’ bit 1-0 GxIS<1:0>: CWGx Dead-band Source Select bits 11 = LC1OUT 10 = N1OUT 01 = PWM2OUT 00 = PWM1OUT DS40001585D-page 140  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 REGISTER 21-3: CWGxCON2: CWG CONTROL REGISTER 2 R/W/HC/HS-0/0 R/W-0/0 U-0 U-0 U-0 U-0 R/W-0/0 R/W-0/0 GxASE GxARSEN — — — — GxASDCLC1 GxASDFLT bit 7 bit 0 Legend: HC = Bit is cleared by hardware HS = Bit is set by hardware R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7 GxASE: Auto-Shutdown Event Status bit 1 = An Auto-Shutdown event has occurred. GxOEB/GxOEA Output Controls overridden, Outputs disabled. 0 = No Auto-Shutdown event has occurred, or an Auto-restart has occurred. GxOEB/GxOEA Output Controls enabled. bit 6 GxARSEN: Auto-Restart Enable bit 1 = Auto-restart is enabled 0 = Auto-restart is disabled bit 5-2 Unimplemented: Read as ‘0’ bit 1 GxASDCLC1: CWG Auto-shutdown Source Enable bit 1 1 = Shutdown when LC1OUT is high 0 = LC1OUT has no effect on shutdown bit 0 GxASDFLT: CWG Auto-shutdown Source Enable bit 0 1 = Shutdown when CWG1FLT input is low 0 = CWG1FLT input has no effect on shutdown  2011-2015 Microchip Technology Inc. DS40001585D-page 141

PIC10(L)F320/322 REGISTER 21-4: CWGxDBR: COMPLEMENTARY WAVEFORM GENERATOR (CWGx) RISING DEAD-BAND COUNT REGISTER U-0 U-0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u — — CWGxDBR<5:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 CWGxDBR<5:0>: Complementary Waveform Generator (CWGx) Rising Counts bits 11 1111 = 63-64 counts of dead band 11 1110 = 62-63 counts of dead band    00 0010 = 2-3 counts of dead band 00 0001 = 1-2 counts of dead band 00 0000 = 0 counts of dead band REGISTER 21-5: CWGxDBF: COMPLEMENTARY WAVEFORM GENERATOR (CWGx) FALLING DEAD-BAND COUNT REGISTER U-0 U-0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u — — CWGxDBF<5:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 CWGxDBF<5:0>: Complementary Waveform Generator (CWGx) Falling Counts bits 11 1111 = 63-64 counts of dead band 11 1110 = 62-63 counts of dead band    00 0010 = 2-3 counts of dead band 00 0001 = 1-2 counts of dead band 00 0000 = 0 counts of dead band. Dead-band generation is bypassed. DS40001585D-page 142  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 TABLE 21-1: SUMMARY OF REGISTERS ASSOCIATED WITH CWG Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page ANSELA — — — — — ANSA2 ANSA1 ANSA0 70 CWG1CON0 G1EN G1OEB G1OEA G1POLB G1POLA — — G1CS0 139 CWG1CON1 G1ASDLB<1:0> G1ASDLA<1:0> — — G1IS<1:0> 140 CWG1CON2 G1ASE G1ARSEN — — — — G1ASDCLC1 G1ASDFLT 141 CWG1DBF — — CWG1DBF<5:0> 142 CWG1DBR — — CWG1DBR<5:0> 142 LATA — — — — — LATA2 LATA1 LATA0 70 TRISA — — — — — TRISA2 TRISA1 TRISA0 69 Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by CWG.  2011-2015 Microchip Technology Inc. DS40001585D-page 143

PIC10(L)F320/322 22.0 IN-CIRCUIT SERIAL 22.3 Common Programming Interfaces PROGRAMMING™ (ICSP™) Connection to a target device is typically done through an ICSP™ header. A commonly found connector on ICSP™ programming allows customers to manufacture development tools is the RJ-11 in the 6P6C (6-pin, 6 circuit boards with unprogrammed devices. Programming connector) configuration. See Figure22-1. can be done after the assembly process allowing the device to be programmed with the most recent firmware FIGURE 22-1: ICD RJ-11 STYLE or a custom firmware. Five pins are needed for ICSP™ programming: CONNECTOR INTERFACE • ICSPCLK • ICSPDAT • MCLR/VPP • VDD • VSS ICSPDAT 2 4 6 NC In Program/Verify mode the Program Memory, User VDD ICSPCLK IDs and the Configuration Words are programmed 1 3 5 Target through serial communications. The ICSPDAT pin is a VPP/MCLR VSS PC Board bidirectional I/O used for transferring the serial data Bottom Side and the ICSPCLK pin is the clock input. For more information on ICSP™ refer to the “PIC10(L)F320/322 Flash Memory Programming Specification" (DS41572). Pin Description* 1 = VPP/MCLR 22.1 High-Voltage Programming Entry 2 = VDD Target Mode 3 = VSS (ground) The device is placed into High-Voltage Programming 4 = ICSPDAT Entry mode by holding the ICSPCLK and ICSPDAT 5 = ICSPCLK pins low then raising the voltage on MCLR/VPP to VIHH. 6 = No Connect 22.2 Low-Voltage Programming Entry Another connector often found in use with the PICkit™ Mode programmers is a standard 6-pin header with 0.1inch spacing. Refer to Figure22-2. The Low-Voltage Programming Entry mode allows the PIC® Flash MCUs to be programmed using VDD only, without high voltage. When the LVP bit of Configuration Word is set to ‘1’, the low-voltage ICSP programming entry is enabled. To disable the Low-Voltage ICSP mode, the LVP bit must be programmed to ‘0’. Entry into the Low-Voltage Programming Entry mode requires the following steps: 1. MCLR is brought to VIL. 2. A 32-bit key sequence is presented on ICSPDAT, while clocking ICSPCLK. Once the key sequence is complete, MCLR must be held at VIL for as long as Program/Verify mode is to be maintained. If low-voltage programming is enabled (LVP = 1), the MCLR Reset function is automatically enabled and cannot be disabled. See Section5.4 “Low-Power Brown-out Reset (LPBOR)” for more information. The LVP bit can only be reprogrammed to ‘0’ by using the High-Voltage Programming mode. DS40001585D-page 144  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 FIGURE 22-2: PICkit™ STYLE CONNECTOR INTERFACE Pin 1 Indicator Pin Description* 1 1 = VPP/MCLR 2 2 = VDD Target 3 4 3 = VSS (ground) 5 4 = ICSPDAT 6 5 = ICSPCLK 6 = No Connect * The 6-pin header (0.100" spacing) accepts 0.025" square pins.  2011-2015 Microchip Technology Inc. DS40001585D-page 145

PIC10(L)F320/322 For additional interface recommendations, refer to your specific device programmer manual prior to PCB design. It is recommended that isolation devices be used to separate the programming pins from other circuitry. The type of isolation is highly dependent on the specific application and may include devices such as resistors, diodes, or even jumpers. See Figure22-3 for more information. FIGURE 22-3: TYPICAL CONNECTION FOR ICSP™ PROGRAMMING External Programming VDD Device to be Signals Programmed VDD VDD VPP MCLR/VPP VSS VSS Data ICSPDAT Clock ICSPCLK * * * To Normal Connections * Isolation devices (as required). DS40001585D-page 146  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 23.0 INSTRUCTION SET SUMMARY TABLE 23-1: OPCODE FIELD DESCRIPTIONS The PIC10(L)F320/322 instruction set is highly orthog- onal and is comprised of three basic categories: Field Description • Byte-oriented operations f Register file address (0x00 to 0x7F) • Bit-oriented operations W Working register (accumulator) • Literal and control operations b Bit address within an 8-bit file register Each PIC16 instruction is a 14-bit word divided into an k Literal field, constant data or label opcode, which specifies the instruction type and one or x Don’t care location (= 0 or 1). more operands, which further specify the operation of The assembler will generate code with x = 0. the instruction. The formats for each of the categories It is the recommended form of use for is presented in Figure23-1, while the various opcode compatibility with all Microchip software tools. fields are summarized in Table23-1. d Destination select; d = 0: store result in W, Table23-2 lists the instructions recognized by the d = 1: store result in file register f. MPASMTM assembler. Default is d = 1. For byte-oriented instructions, ‘f’ represents a file PC Program Counter register designator and ‘d’ represents a destination TO Time-out bit designator. The file register designator specifies which C Carry bit file register is to be used by the instruction. DC Digit carry bit The destination designator specifies where the result of the operation is to be placed. If ‘d’ is zero, the result is Z Zero bit placed in the W register. If ‘d’ is one, the result is placed PD Power-down bit in the file register specified in the instruction. For bit-oriented instructions, ‘b’ represents a bit field FIGURE 23-1: GENERAL FORMAT FOR designator, which selects the bit affected by the INSTRUCTIONS operation, while ‘f’ represents the address of the file in which the bit is located. Byte-oriented file register operations 13 8 7 6 0 For literal and control operations, ‘k’ represents an OPCODE d f (FILE #) 8-bit or 11-bit constant, or literal value. d = 0 for destination W One instruction cycle consists of four oscillator periods; d = 1 for destination f for an oscillator frequency of 4 MHz, this gives a normal f = 7-bit file register address instruction execution time of 1s. All instructions are executed within a single instruction cycle, unless a Bit-oriented file register operations conditional test is true, or the program counter is 13 10 9 7 6 0 changed as a result of an instruction. When this occurs, OPCODE b (BIT #) f (FILE #) the execution takes two instruction cycles, with the second cycle executed as a NOP. b = 3-bit bit address f = 7-bit file register address All instruction examples use the format ‘0xhh’ to represent a hexadecimal number, where ‘h’ signifies a Literal and control operations hexadecimal digit. General 23.1 Read-Modify-Write Operations 13 8 7 0 OPCODE k (literal) Any instruction that specifies a file register as part of the instruction performs a Read-Modify-Write (RMW) k = 8-bit immediate value operation. The register is read, the data is modified, and the result is stored according to either the instruc- CALL and GOTO instructions only tion or the destination designator ‘d’. A read operation 13 11 10 0 is performed on a register even if the instruction writes OPCODE k (literal) to that register. k = 11-bit immediate value For example, a CLRF PORTA instruction will read PORTA, clear all the data bits, then write the result back to PORTA. This example would have the unintended consequence of clearing the condition that set the IOCIF flag.  2011-2015 Microchip Technology Inc. DS40001585D-page 147

PIC10(L)F320/322 TABLE 23-2: INSTRUCTION SET 14-Bit Opcode Mnemonic, Status Description Cycles Notes Operands Affected MSb LSb BYTE-ORIENTED FILE REGISTER OPERATIONS ADDWF f, d Add W and f 1 00 0111 dfff ffff C, DC, Z 1, 2 ANDWF f, d AND W with f 1 00 0101 dfff ffff Z 1, 2 CLRF f Clear f 1 00 0001 lfff ffff Z 2 CLRW – Clear W 1 00 0001 0xxx xxxx Z COMF f, d Complement f 1 00 1001 dfff ffff Z 1, 2 DECF f, d Decrement f 1 00 0011 dfff ffff Z 1, 2 DECFSZ f, d Decrement f, Skip if 0 1(2) 00 1011 dfff ffff 1, 2, 3 INCF f, d Increment f 1 00 1010 dfff ffff Z 1, 2 INCFSZ f, d Increment f, Skip if 0 1(2) 00 1111 dfff ffff 1, 2, 3 IORWF f, d Inclusive OR W with f 1 00 0100 dfff ffff Z 1, 2 MOVF f, d Move f 1 00 1000 dfff ffff Z 1, 2 MOVWF f Move W to f 1 00 0000 lfff ffff NOP – No Operation 1 00 0000 0xx0 0000 RLF f, d Rotate Left f through Carry 1 00 1101 dfff ffff C 1, 2 RRF f, d Rotate Right f through Carry 1 00 1100 dfff ffff C 1, 2 SUBWF f, d Subtract W from f 1 00 0010 dfff ffff C, DC, Z 1, 2 SWAPF f, d Swap nibbles in f 1 00 1110 dfff ffff 1, 2 XORWF f, d Exclusive OR W with f 1 00 0110 dfff ffff Z 1, 2 BIT-ORIENTED FILE REGISTER OPERATIONS BCF f, b Bit Clear f 1 01 00bb bfff ffff 1, 2 BSF f, b Bit Set f 1 01 01bb bfff ffff 1, 2 BTFSC f, b Bit Test f, Skip if Clear 1 (2) 01 10bb bfff ffff 3 BTFSS f, b Bit Test f, Skip if Set 1 (2) 01 11bb bfff ffff 3 LITERAL AND CONTROL OPERATIONS ADDLW k Add literal and W 1 11 111x kkkk kkkk C, DC, Z ANDLW k AND literal with W 1 11 1001 kkkk kkkk Z CALL k Call Subroutine 2 10 0kkk kkkk kkkk CLRWDT – Clear Watchdog Timer 1 00 0000 0110 0100 TO, PD GOTO k Go to address 2 10 1kkk kkkk kkkk IORLW k Inclusive OR literal with W 1 11 1000 kkkk kkkk Z MOVLW k Move literal to W 1 11 00xx kkkk kkkk RETFIE – Return from interrupt 2 00 0000 0000 1001 RETLW k Return with literal in W 2 11 01xx kkkk kkkk RETURN – Return from Subroutine 2 00 0000 0000 1000 SLEEP – Go into Standby mode 1 00 0000 0110 0011 TO, PD SUBLW k Subtract W from literal 1 11 110x kkkk kkkk C, DC, Z XORLW k Exclusive OR literal with W 1 11 1010 kkkk kkkk Z Note 1: When an I/O register is modified as a function of itself (e.g., MOVF PORTA, 1), the value used will be that value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an external device, the data will be written back with a ‘0’. 2: If this instruction is executed on the TMR0 register (and where applicable, d = 1), the prescaler will be cleared if assigned to the Timer0 module. 3: If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. DS40001585D-page 148  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 23.2 Instruction Descriptions ADDLW Add literal and W BCF Bit Clear f Syntax: [ label ] ADDLW k Syntax: [ label ] BCF f,b Operands: 0  k  255 Operands: 0  f  127 0  b  7 Operation: (W) + k  (W) Operation: 0  (f<b>) Status Affected: C, DC, Z Status Affected: None Description: The contents of the W register are added to the 8-bit literal ‘k’ Description: Bit ‘b’ in register ‘f’ is cleared. and the result is placed in the W register. ADDWF Add W and f BSF Bit Set f Syntax: [ label ] ADDWF f,d Syntax: [ label ] BSF f,b Operands: 0  f  127 Operands: 0  f  127 d 0,1 0  b  7 Operation: (W) + (f)  (destination) Operation: 1  (f<b>) Status Affected: C, DC, Z Status Affected: None Description: Add the contents of the W register Description: Bit ‘b’ in register ‘f’ is set. with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. ANDLW AND literal with W BTFSC Bit Test f, Skip if Clear Syntax: [ label ] ANDLW k Syntax: [ label ] BTFSC f,b Operands: 0  k  255 Operands: 0  f  127 0  b  7 Operation: (W) .AND. (k)  (W) Operation: skip if (f<b>) = 0 Status Affected: Z Status Affected: None Description: The contents of W register are AND’ed with the 8-bit literal ‘k’. Description: If bit ‘b’ in register ‘f’ is ‘1’, the next The result is placed in the W instruction is executed. register. If bit ‘b’ in register ‘f’ is ‘0’, the next instruction is discarded, and a NOP is executed instead, making this a 2-cycle instruction. ANDWF AND W with f Syntax: [ label ] ANDWF f,d Operands: 0  f  127 d 0,1 Operation: (W) .AND. (f)  (destination) Status Affected: Z Description: AND the W register with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’.  2011-2015 Microchip Technology Inc. DS40001585D-page 149

PIC10(L)F320/322 BTFSS Bit Test f, Skip if Set CLRWDT Clear Watchdog Timer Syntax: [ label ] BTFSS f,b Syntax: [ label ] CLRWDT Operands: 0  f  127 Operands: None 0  b < 7 Operation: 00h  WDT Operation: skip if (f<b>) = 1 0  WDT prescaler, 1  TO Status Affected: None 1  PD Description: If bit ‘b’ in register ‘f’ is ‘0’, the next Status Affected: TO, PD instruction is executed. If bit ‘b’ is ‘1’, then the next Description: CLRWDT instruction resets the instruction is discarded and a NOP Watchdog Timer. It also resets the is executed instead, making this a prescaler of the WDT. 2-cycle instruction. Status bits TO and PD are set. CALL Call Subroutine COMF Complement f Syntax: [ label ] CALL k Syntax: [ label ] COMF f,d Operands: 0  k  2047 Operands: 0  f  127 Operation: (PC)+ 1 TOS, d  [0,1] k  PC<10:0>, Operation: (f)  (destination) (PCLATH<4:3>)  PC<12:11> Status Affected: Z Status Affected: None Description: The contents of register ‘f’ are Description: Call Subroutine. First, return complemented. If ‘d’ is ‘0’, the address (PC + 1) is pushed onto result is stored in W. If ‘d’ is ‘1’, the stack. The 11-bit immediate the result is stored back in address is loaded into PC bits register ‘f’. <10:0>. The upper bits of the PC are loaded from PCLATH. CALL is a 2-cycle instruction. CLRF Clear f DECF Decrement f Syntax: [ label ] CLRF f Syntax: [ label ] DECF f,d Operands: 0  f  127 Operands: 0  f  127 d  [0,1] Operation: 00h  (f) 1  Z Operation: (f) - 1  (destination) Status Affected: Z Status Affected: Z Description: The contents of register ‘f’ are Description: Decrement register ‘f’. If ‘d’ is ‘0’, cleared and the Z bit is set. the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. CLRW Clear W Syntax: [ label ] CLRW Operands: None Operation: 00h  (W) 1  Z Status Affected: Z Description: W register is cleared. Zero bit (Z) is set. DS40001585D-page 150  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 DECFSZ Decrement f, Skip if 0 INCFSZ Increment f, Skip if 0 Syntax: [ label ] DECFSZ f,d Syntax: [ label ] INCFSZ f,d Operands: 0  f  127 Operands: 0  f  127 d  [0,1] d  [0,1] Operation: (f) - 1  (destination); Operation: (f) + 1  (destination), skip if result = 0 skip if result = 0 Status Affected: None Status Affected: None Description: The contents of register ‘f’ are Description: The contents of register ‘f’ are decremented. If ‘d’ is ‘0’, the result incremented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is is placed in the W register. If ‘d’ is ‘1’, the result is placed back in ‘1’, the result is placed back in register ‘f’. register ‘f’. If the result is ‘1’, the next If the result is ‘1’, the next instruction is executed. If the instruction is executed. If the result is ‘0’, then a NOP is result is ‘0’, a NOP is executed executed instead, making it a instead, making it a 2-cycle 2-cycle instruction. instruction. GOTO Unconditional Branch IORLW Inclusive OR literal with W Syntax: [ label ] GOTO k Syntax: [ label ] IORLW k Operands: 0  k  2047 Operands: 0  k  255 Operation: k  PC<10:0> Operation: (W) .OR. k  (W) PCLATH<4:3>  PC<12:11> Status Affected: Z Status Affected: None Description: The contents of the W register are Description: GOTO is an unconditional branch. OR’ed with the 8-bit literal ‘k’. The The 11-bit immediate value is result is placed in the loaded into PC bits <10:0>. The W register. upper bits of PC are loaded from PCLATH<4:3>. GOTO is a 2-cycle instruction. INCF Increment f IORWF Inclusive OR W with f Syntax: [ label ] INCF f,d Syntax: [ label ] IORWF f,d Operands: 0  f  127 Operands: 0  f  127 d  [0,1] d  [0,1] Operation: (f) + 1  (destination) Operation: (W) .OR. (f)  (destination) Status Affected: Z Status Affected: Z Description: The contents of register ‘f’ are Description: Inclusive OR the W register with incremented. If ‘d’ is ‘0’, the result register ‘f’. If ‘d’ is ‘0’, the result is is placed in the W register. If ‘d’ is placed in the W register. If ‘d’ is ‘1’, the result is placed back in ‘1’, the result is placed back in register ‘f’. register ‘f’.  2011-2015 Microchip Technology Inc. DS40001585D-page 151

PIC10(L)F320/322 MOVF Move f MOVWF Move W to f Syntax: [ label ] MOVF f,d Syntax: [ label ] MOVWF f Operands: 0  f  127 Operands: 0  f  127 d  [0,1] Operation: (W)  (f) Operation: (f)  (dest) Status Affected: None Status Affected: Z Description: Move data from W register to Description: The contents of register ‘f’ is register ‘f’. moved to a destination dependent Words: 1 upon the status of ‘d’. If d = 0, Cycles: 1 destination is W register. If d = 1, the destination is file register ‘f’ Example: MOVW OPTION_REG itself. d = 1 is useful to test a file F register since Status flag Z is Before Instruction affected. OPTION_REG = 0xFF Words: 1 W = 0x4F After Instruction Cycles: 1 OPTION_REG = 0x4F Example: MOVF FSR, 0 W = 0x4F After Instruction W = value in FSR register Z = 1 MOVLW Move literal to W NOP No Operation Syntax: [ label ] MOVLW k Syntax: [ label ] NOP Operands: 0  k  255 Operands: None Operation: k  (W) Operation: No operation Status Affected: None Status Affected: None Description: The 8-bit literal ‘k’ is loaded into W Description: No operation. register. The “don’t cares” will Words: 1 assemble as ‘0’s. Cycles: 1 Words: 1 Example: NOP Cycles: 1 Example: MOVLW 0x5A After Instruction W = 0x5A DS40001585D-page 152  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 RETFIE Return from Interrupt RETLW Return with literal in W Syntax: [ label ] RETFIE Syntax: [ label ] RETLW k Operands: None Operands: 0  k  255 Operation: TOS  PC, Operation: k  (W); 1  GIE TOS  PC Status Affected: None Status Affected: None Description: Return from Interrupt. Stack is Description: The W register is loaded with the POPed and Top-of-Stack (TOS) is 8-bit literal ‘k’. The program loaded in the PC. Interrupts are counter is loaded from the top of enabled by setting Global the stack (the return address). Interrupt Enable bit, GIE (INT- This is a 2-cycle instruction. CON<7>). This is a 2-cycle Words: 1 instruction. Cycles: 2 Words: 1 Example: CALL TABLE;W contains Cycles: 2 ;table offset Example: RETFIE ;value GOTO DONE After Interrupt TABLE • PC = TOS • GIE= 1 ADDWF PC ;W = offset RETLW k1 ;Begin table RETLW k2 ; • • • RETLW kn ;End of table DONE Before Instruction W = 0x07 After Instruction W = value of k8 RETURN Return from Subroutine Syntax: [ label ] RETURN Operands: None Operation: TOS  PC Status Affected: None Description: Return from subroutine. The stack is POPed and the top of the stack (TOS) is loaded into the program counter. This is a 2-cycle instruc- tion.  2011-2015 Microchip Technology Inc. DS40001585D-page 153

PIC10(L)F320/322 RLF Rotate Left f through Carry SLEEP Enter Sleep mode Syntax: [ label ] RLF f,d Syntax: [ label ] SLEEP Operands: 0  f  127 Operands: None d  [0,1] Operation: 00h  WDT, Operation: See description below 0  WDT prescaler, 1  TO, Status Affected: C 0  PD Description: The contents of register ‘f’ are Status Affected: TO, PD rotated one bit to the left through the Carry flag. If ‘d’ is ‘0’, the Description: The power-down Status bit, PD is result is placed in the W register. cleared. Time-out Status bit, TO If ‘d’ is ‘1’, the result is stored is set. Watchdog Timer and its back in register ‘f’. prescaler are cleared. The processor is put into Sleep C Register f mode with the oscillator stopped. Words: 1 Cycles: 1 Example: RLF REG1,0 Before Instruction REG1 = 1110 0110 C = 0 After Instruction REG1 = 1110 0110 W = 1100 1100 C = 1 RRF Rotate Right f through Carry SUBLW Subtract W from literal Syntax: [ label ] RRF f,d Syntax: [ label ] SUBLW k Operands: 0  f  127 Operands: 0 k 255 d  [0,1] Operation: k - (W) W) Operation: See description below Status Affected: C, DC, Z Status Affected: C Description: The W register is subtracted (2’s Description: The contents of register ‘f’ are complement method) from the 8-bit rotated one bit to the right through literal ‘k’. The result is placed in the the Carry flag. If ‘d’ is ‘0’, the W register. result is placed in the W register. If ‘d’ is ‘1’, the result is placed Result Condition back in register ‘f’. C = 0 W  k C Register f C = 1 W  k DC = 0 W<3:0>  k<3:0> DC = 1 W<3:0>  k<3:0> DS40001585D-page 154  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 SUBWF Subtract W from f XORWF Exclusive OR W with f Syntax: [ label ] SUBWF f,d Syntax: [ label ] XORWF f,d Operands: 0 f 127 Operands: 0  f  127 d  [0,1] d  [0,1] Operation: (f) - (W) destination) Operation: (W) .XOR. (f) destination) Status Affected: C, DC, Z Status Affected: Z Description: Subtract (2’s complement method) Description: Exclusive OR the contents of the W register from register ‘f’. If ‘d’ is W register with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. stored back in register ‘f’. C = 0 W  f C = 1 W  f DC = 0 W<3:0>  f<3:0> DC = 1 W<3:0>  f<3:0> SWAPF Swap Nibbles in f Syntax: [ label ] SWAPF f,d Operands: 0  f  127 d  [0,1] Operation: (f<3:0>)  (destination<7:4>), (f<7:4>)  (destination<3:0>) Status Affected: None Description: The upper and lower nibbles of register ‘f’ are exchanged. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed in register ‘f’. XORLW Exclusive OR literal with W Syntax: [ label ] XORLW k Operands: 0 k 255 Operation: (W) .XOR. k W) Status Affected: Z Description: The contents of the W register are XOR’ed with the 8-bit literal ‘k’. The result is placed in the W register.  2011-2015 Microchip Technology Inc. DS40001585D-page 155

PIC10(L)F320/322 24.0 ELECTRICAL SPECIFICATIONS 24.1 Absolute Maximum Ratings(†) Ambient temperature under bias...................................................................................................... -40°C to +125°C Storage temperature........................................................................................................................ -65°C to +150°C Voltage on pins with respect to VSS on VDD pin PIC10F320/322 ......................................................................................................... -0.3V to +6.5V PIC10LF320/322 ....................................................................................................... -0.3V to +4.0V on MCLR pin ........................................................................................................................... -0.3V to +9.0V on all other pins ............................................................................................................ -0.3V to (VDD + 0.3V) Maximum current on VSS pin(1) -40°C  TA  +85°C .............................................................................................................. 250 mA +85°C  TA  +125°C ............................................................................................................. 85 mA on VDD pin(1) -40°C  TA  +85°C .............................................................................................................. 250 mA +85°C  TA  +125°C ............................................................................................................. 85 mA Sunk by any I/O pin .............................................................................................................................. 50 mA Sourced by any I/O pin ......................................................................................................................... 50 mA Clamp current, IK (VPIN < 0 or VPIN > VDD) ................................................................................................... 20 mA Total power dissipation(2)...............................................................................................................................800 mW Note 1: Maximum current rating requires even load distribution across I/O pins. Maximum current rating may be limited by the device package power dissipation characterizations, see Section24.4 “Thermal Considerations” to calculate device specifications. 2: Power dissipation is calculated as follows: PDIS = VDD x {IDD –  IOH} +  {(VDD – VOH) x IOH} + (VOl x IOL). † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for extended periods may affect device reliability. DS40001585D-page 156  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 24.2 Standard Operating Conditions The standard operating conditions for any device are defined as: Operating Voltage: VDDMIN VDD VDDMAX Operating Temperature: TA_MIN TA TA_MAX VDD — Operating Supply Voltage(1) PIC10LF320/322 VDDMIN (Fosc  16 MHz)......................................................................................................... +1.8V VDDMIN (16 MHz < Fosc  20 MHz)......................................................................................... +2.5V VDDMAX.................................................................................................................................... +3.6V PIC10F320/322 VDDMIN (Fosc  16 MHz)......................................................................................................... +2.3V VDDMIN (16 MHz < Fosc  20 MHz)......................................................................................... +2.5V VDDMAX.................................................................................................................................... +5.5V TA — Operating Ambient Temperature Range Industrial Temperature TA_MIN...................................................................................................................................... -40°C TA_MAX.................................................................................................................................... +85°C Extended Temperature TA_MIN...................................................................................................................................... -40°C TA_MAX.................................................................................................................................. +125°C Note 1: See Parameter D001, DC Characteristics: Supply Voltage.  2011-2015 Microchip Technology Inc. DS40001585D-page 157

PIC10(L)F320/322 FIGURE 24-1: PIC10F320/322 VOLTAGE FREQUENCY GRAPH, -40°C  TA +125°C 5.5 ) V ( D D V 2.5 2.3 0 4 10 16 20 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: Refer to Table24-6 for each Oscillator mode’s supported frequencies. FIGURE 24-2: PIC10LF320/322 VOLTAGE FREQUENCY GRAPH, -40°C  TA +125°C V) 3.6 ( D D V 2.5 1.8 0 4 10 16 20 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: Refer to Table24-6 for each Oscillator mode’s supported frequencies. DS40001585D-page 158  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 24.3 DC Characteristics TABLE 24-1: SUPPLY VOLTAGE PIC10LF320/322 Standard Operating Conditions (unless otherwise stated) PIC10F320/322 Param. Sym. Characteristic Min. Typ† Max. Units Conditions No. D001 VDD Supply Voltage 1.8 — 3.6 V FOSC  16MHz: 2.5 — 3.6 V FOSC  20MHz D001 2.3 — 5.5 V FOSC  16MHz: 2.5 — 5.5 V FOSC  20MHz D002* VDR RAM Data Retention Voltage(1) 1.5 — — V Device in Sleep mode D002* 1.7 — — V Device in Sleep mode VPOR* Power-on Reset Release Voltage — 1.6 — V VPORR* Power-on Reset Rearm Voltage — 0.8 — V Device in Sleep mode — 1.7 — V Device in Sleep mode D003 VFVR Fixed Voltage Reference Voltage 1x gain (1.024V nominal) VDD 2.5V, -40°C  TA  +85°C 2x gain (2.048V nominal) -8 — +6 % VDD 2.5V, -40°C  TA  +85°C 4x gain (4.096V nominal) VDD 4.75V, -40°C  TA  +85°C D004* SVDD VDD Rise Rate to ensure internal 0.05 — — V/ms See Section5.1 “Power-On Reset Power-on Reset signal (POR)” for details. * These parameters are characterized but not tested. † Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data.  2011-2015 Microchip Technology Inc. DS40001585D-page 159

PIC10(L)F320/322 FIGURE 24-3: POR AND POR REARM WITH SLOW RISING VDD VDD VPOR VPORR SVDD VSS NPOR(1) POR REARM VSS TVLOW(3) TPOR(2) Note 1: When NPOR is low, the device is held in Reset. 2: TPOR 1s typical. 3: TVLOW 2.7s typical. DS40001585D-page 160  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 TABLE 24-2: SUPPLY VOLTAGE (IDD)(1,2) PIC10LF320/322 Standard Operating Conditions (unless otherwise stated) PIC10F320/322 Conditions Param Device Min. Typ† Max. Units No. Characteristics VDD Note D013 — 34 45 A 1.8 FOSC = 500kHz — 60 105 A 3.0 EC mode D013 — 76 101 A 2.3 FOSC = 500kHz EC mode — 110 148 A 3.0 — 153 211 A 5.0 D014 — 190 290 A 1.8 FOSC = 8MHz — 350 500 A 3.0 EC mode D014 — 290 430 A 2.3 FOSC = 8MHz EC mode — 395 600 A 3.0 — 480 775 A 5.0 D015 — 0.8 1.3 mA 3.0 FOSC = 20MHz — 1.1 1.8 mA 3.6 EC mode D015 — 0.8 1.4 mA 3.0 FOSC = 20MHz — 1.1 1.8 mA 5.0 EC mode D016 — 2.2 4.1 A 1.8 FOSC = 32kHz — 3.9 6.5 A 3.0 LFINTOSC mode, 85°C D016 — 31 44 A 2.3 FOSC = 32kHz LFINTOSC mode, 85°C — 40 57 A 3.0 — 71 117 A 5.0 D016A — 3.2 4.5 A 1.8 FOSC = 32kHz — 4.8 7.0 A 3.0 LFINTOSC mode, 125°C D016A — 31 44 A 2.3 FOSC = 32kHz — 40 57 A 3.0 LFINTOSC mode,125°C — 71 117 A 5.0 Note 1: The test conditions for all IDD measurements in active operation mode are: CLKIN = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption.  2011-2015 Microchip Technology Inc. DS40001585D-page 161

PIC10(L)F320/322 TABLE 24-2: SUPPLY VOLTAGE (IDD)(1,2) (CONTINUED) PIC10LF320/322 Standard Operating Conditions (unless otherwise stated) PIC10F320/322 Conditions Param Device Min. Typ† Max. Units No. Characteristics VDD Note D017 — 213 290 A 1.8 FOSC = 500kHz — 264 360 A 3.0 HFINTOSC mode D017 — 272 368 A 2.3 FOSC = 500kHz HFINTOSC mode — 310 422 A 3.0 — 372 515 A 5.0 D018 — 0.33 0.50 mA 1.8 FOSC = 8MHz — 0.43 0.70 mA 3.0 HFINTOSC mode D018 — 0.45 1.0 mA 2.3 FOSC = 8MHz — 0.56 1.1 mA 3.0 HFINTOSC mode — 0.64 1.2 mA 5.0 D019 — 0.46 1.1 mA 1.8 FOSC = 16MHz — 0.73 1.2 mA 3.0 HFINTOSC mode D019 — 0.60 1.1 mA 2.3 FOSC = 16MHz HFINTOSC mode — 0.76 1.2 mA 3.0 — 0.85 1.3 mA 5.0 Note 1: The test conditions for all IDD measurements in active operation mode are: CLKIN = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. DS40001585D-page 162  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 TABLE 24-3: POWER-DOWN CURRENTS (IPD)(1,2) PIC10LF320/322 Standard Operating Conditions (unless otherwise stated) PIC10F320/322 Conditions Param Max. Max. Device Characteristics Min. Typ† Units No. +85°C +125°C VDD Note D023 — 0.06 1.1 2 A 1.8 WDT, BOR, and FVR disabled, — 0.08 1.3 2 A 3.0 all Peripherals Inactive D023 — 0.20 1.1 2 A 2.3 WDT, BOR, and FVR disabled, all Peripherals Inactive — 0.30 1.4 2 A 3.0 — 0.40 2.4 2.4 A 5.0 D024 — 0.5 9 11 A 1.8 WDT Current (Note 1) — 0.8 11 13 A 3.0 D024 — 4.0 10 12 A 2.3 WDT Current (Note 1) — 4.2 12 14 A 3.0 — 4.3 14 16 A 5.0 D025 — 30 96 120 A 1.8 FVR current — 39 106 123 A 3.0 D025 — 32 96 120 A 2.3 FVR current — 39 106 133 A 3.0 — 70 136 170 A 5.0 D026 — 7.5 16 18 A 3.0 BOR Current (Note 1) D026 — 8 18 20 A 3.0 BOR Current (Note 1) — 9 20 20.2 A 5.0 D026A — 2.7 10 15 A 3.0 LPBOR Current D026A — 3.0 10 15 A 3.0 LPBOR Current — 3.2 15 20 A 5.0 D028 — 0.1 4 5 A 1.8 A/D Current (Note 1, Note 3), no — 0.1 5 6 A 3.0 conversion in progress D028 — 3.4 6 7 A 2.3 A/D Current (Note 1, Note 3), no conversion in progress — 3.6 7 8 A 3.0 — 3.8 8 9 A 5.0 D029 — 250 — — A 1.8 A/D Current (Note 1, Note 3), — 250 — — A 3.0 conversion in progress D029 — 280 — — A 2.3 A/D Current (Note 1, Note 3), conversion in progress — 280 — — A 3.0 — 280 — — A 5.0 * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this peripheral is enabled. The peripheral  current can be determined by subtracting the base IDD or IPD current from this limit. Max values should be used when calculating total current consumption. 2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD. 3: A/D oscillator source is FRC.  2011-2015 Microchip Technology Inc. DS40001585D-page 163

PIC10(L)F320/322 TABLE 24-4: I/O PORTS Standard Operating Conditions (unless otherwise stated) Param Sym. Characteristic Min. Typ† Max. Units Conditions No. VIL Input Low Voltage I/O PORT: D032 with TTL buffer — — 0.8 V 4.5V  VDD  5.5V D032A — — 0.15VDD V 1.8V  VDD  4.5V D033 with Schmitt Trigger buffer — — 0.2VDD V 2.0V  VDD  5.5V D034 MCLR — — 0.2VDD V VIH Input High Voltage I/O ports: D040 with TTL buffer 2.0 — — V 4.5V  VDD 5.5V D040A 0.25VDD + — — V 1.8V  VDD  4.5V 0.8 D041 with Schmitt Trigger buffer 0.8VDD — — V 2.0V  VDD  5.5V D042 MCLR 0.8VDD — — V IIL Input Leakage Current(2) D060 I/O ports — ± 5 ± 125 nA VSS  VPIN  VDD, Pin at high-impedance @ 85°C ± 5 ± 1000 nA 125°C D061 MCLR — ± 50 ± 200 nA VSS  VPIN  VDD @ 85°C IPUR Weak Pull-up Current D070* 25 100 200 VDD = 3.3V, VPIN = VSS 25 140 300 A VDD = 5.0V, VPIN = VSS VOL Output Low Voltage D080 I/O ports IOL = 8mA, VDD = 5V — — 0.6 V IOL = 6mA, VDD = 3.3V IOL = 1.8mA, VDD = 1.8V VOH Output High Voltage D090 I/O ports IOH = 3.5mA, VDD = 5V VDD - 0.7 — — V IOH = 3mA, VDD = 3.3V IOH = 1mA, VDD = 1.8V * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Negative current is defined as current sourced by the pin. 2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. DS40001585D-page 164  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 TABLE 24-5: MEMORY PROGRAMMING REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Param Sym. Characteristic Min. Typ† Max. Units Conditions No. Program Memory Programming Specifications D110 VIHH Voltage on MCLR/VPP pin 8.0 — 9.0 V (Note 2) D111 IDDP Supply Current during Programming — — 10 mA D112 VDD for Bulk Erase 2.7 — VDD V max. D113 VPEW VDD for Write or Row Erase VDD — VDD V min. max. D114 IPPPGM Current on MCLR/VPP during — — 1.0 mA Erase/Write D115 IDDPGM Current on VDD during Erase/Write — 5.0 mA Program Flash Memory D121 EP Cell Endurance 10K — — E/W -40C to +85C (Note 1) D122 VPR VDD for Read VDD — VDD V min. max. D123 TIW Self-timed Write Cycle Time — 2 2.5 ms D124 TRETD Characteristic Retention 40 — — Year Provided no other specifications are violated D125 EHEFC High-Endurance Flash Cell 100K — — E/W 0°C  TA  60, lower byte last 128 addresses † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Self-write and Block Erase. 2: Required only if single-supply programming is disabled.  2011-2015 Microchip Technology Inc. DS40001585D-page 165

PIC10(L)F320/322 24.4 Thermal Considerations Standard Operating Conditions (unless otherwise stated) Param Sym. Characteristic Typ. Units Conditions No. TH01 JA Thermal Resistance Junction to Ambient 60 C/W 6-pin SOT-23 package 80 C/W 8-pin PDIP package 90 C/W 8-pin DFN package TH02 JC Thermal Resistance Junction to Case 31.4 C/W 6-pin SOT-23 package 24 C/W 8-pin PDIP package 24 C/W 8-pin DFN package TH03 TJMAX Maximum Junction Temperature 150 C TH04 PD Power Dissipation — W PD = PINTERNAL + PI/O TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD(1) TH06 PI/O I/O Power Dissipation — W PI/O =  (IOL * VOL) +  (IOH * (VDD - VOH)) TH07 PDER Derated Power — W PDER = PDMAX (TJ - TA)/JA(2) Note 1: IDD is current to run the chip alone without driving any load on the output pins. 2: TA = Ambient Temperature 3: TJ = Junction Temperature DS40001585D-page 166  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 24.5 AC Characteristics Timing Parameter Symbology has been created with one of the following formats: 1. TppS2ppS 2. TppS T F Frequency T Time Lowercase letters (pp) and their meanings: pp cc CCP1 osc CLKIN ck CLKR rd RD cs CS rw RD or WR di SDI sc SCK do SDO ss SS dt Data in t0 T0CKI io I/O PORT t1 T1CKI mc MCLR wr WR Uppercase letters and their meanings: S F Fall P Period H High R Rise I Invalid (High-impedance) V Valid L Low Z High-impedance FIGURE 24-4: LOAD CONDITIONS Rev. 10-000133A 8/1/2013 Load Condition Pin CL VSS Legend: CL=50 pF for all pins  2011-2015 Microchip Technology Inc. DS40001585D-page 167

PIC10(L)F320/322 FIGURE 24-5: CLOCK TIMING Q4 Q1 Q2 Q3 Q4 Q1 CLKIN OS02 OS03 CLKR (CLKROE = 1) TABLE 24-6: CLOCK OSCILLATOR TIMING REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Param Sym. Characteristic Min. Typ† Max. Units Conditions No. OS01 FOSC External CLKIN Frequency(1) DC — 20 MHz EC mode OS02 TOSC External CLKIN Period(1) 31.25 —  ns EC Oscillator mode OS03 TCY Instruction Cycle Time(1) 200 TCY DC ns TCY = 4/FOSC * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current con- sumption. All devices are tested to operate at “min” values with an external clock applied to CLKIN pin. When an external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices. TABLE 24-7: OSCILLATOR PARAMETERS Standard Operating Conditions (unless otherwise stated) Param Freq. Sym. Characteristic Min. Typ† Max. Units Conditions No. Tolerance OS08 HFOSC Internal Calibrated HFINTOSC ±3% — 16.0 — MHz 0°C  TA  +85°C, VDD 2.3V Frequency(1) -8 to +4% — 16.0 — MHz -40°C TA 125°C OS09 LFOSC Internal LFINTOSC Frequency ±25% — 31 — kHz OS10* TWARM HFINTOSC — — 5 8 s Wake-up from Sleep Start-up Time * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: To ensure these oscillator frequency tolerances, VDD and VSS must be capacitively decoupled as close to the device as possible. 0.1F and 0.01F values in parallel are recommended. DS40001585D-page 168  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 FIGURE 24-6: HFINTOSC FREQUENCY ACCURACY OVER DEVICE VDD AND TEMPERATURE Rev. 10-000135D 2/11/2014 125 -(cid:27)% to +(cid:23)% 85 C) e (° 60 ur at ±(cid:22)% per 25 m e T 0 -(cid:27)% to +(cid:23)% -40 1.8 2.3 5.5 VDD(V)  2011-2015 Microchip Technology Inc. DS40001585D-page 169

PIC10(L)F320/322 FIGURE 24-7: CLKR AND I/O TIMING Cycle Write Fetch Read Execute Q4 Q1 Q2 Q3 FOSC OS11 OS12 OS20 CLKR OS21 OS19 OS18 OS16 OS13 OS17 I/O pin (Input) OS15 OS14 I/O pin Old Value New Value (Output) OS18, OS19 TABLE 24-8: CLKR AND I/O TIMING PARAMETERS Standard Operating Conditions (unless otherwise stated) Param. Sym. Characteristic Min. Typ† Max. Units Conditions No. OS11 TosH2ckL FOSC to CLKOUT(1) — — 70 ns 3.3V  VDD 5.0V OS12 TosH2ckH FOSC to CLKOUT(1) — — 72 ns 3.3V  VDD 5.0V OS13 TckL2ioV CLKOUT to Port out valid(1) — — 20 ns OS14 TioV2ckH Port input valid before CLKOUT(1) TOSC + 200 ns — — ns OS15 TosH2ioV Fosc (Q1 cycle) to Port out valid — 50 70* ns 3.3V  VDD 5.0V OS16 TosH2ioI Fosc (Q2 cycle) to Port input invalid 50 — — ns 3.3V  VDD 5.0V (I/O in setup time) OS17 TioV2osH Port input valid to Fosc(Q2 cycle) 20 — — ns (I/O in setup time) OS18* TioR Port output rise time — 40 72 ns VDD = 1.8V — 15 32 3.3V  VDD 5.0V OS19* TioF Port output fall time — 28 55 ns VDD = 1.8V — 15 30 3.3V  VDD 5.0V OS20* Tinp INT pin input high or low time 25 — — ns OS21* Tioc Interrupt-on-change new input level time 25 — — ns * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25C unless otherwise stated. Note 1: Measurements are taken in EXTRC mode where CLKOUT output is 4 x TOSC. DS40001585D-page 170  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 FIGURE 24-8: RESET, WATCHDOG TIMER, AND POWER-UP TIMER TIMING VDD MCLR 30 Internal POR 33 PWRT Time-out Internal Reset(1) Watchdog Timer Reset(1) 31 34 34 I/O pins Note1: Asserted low. FIGURE 24-9: BROWN-OUT RESET TIMING AND CHARACTERISTICS VDD VBOR and VHYST VBOR (Device in Brown-out Reset) (Device not in Brown-out Reset) 37 Reset 33 (due to BOR)  2011-2015 Microchip Technology Inc. DS40001585D-page 171

PIC10(L)F320/322 TABLE 24-9: RESET, WATCHDOG TIMER, POWER-UP TIMER AND BROWN-OUT RESET PARAMETERS Standard Operating Conditions (unless otherwise stated) Param Sym. Characteristic Min. Typ† Max. Units Conditions No. 30 TMCL MCLR Pulse Width (low) 2 — — s VDD = 3.3-5V, -40°C to +85°C 5 — — s VDD = 3.3-5V 31 TWDTLP Low-Power Watchdog Timer 10 16 27 ms VDD = 3.3V-5V Time-out Period 1:16 Prescaler used 33* TPWRT Power-up Timer Period, PWRTE=0 40 64 140 ms 34* TIOZ I/O high-impedance from MCLR Low — — 2.0 s or Watchdog Timer Reset 35 VBOR Brown-out Reset Voltage(1) 2.55 2.70 2.85 V BORV = 0 2.30 2.40 2.55 V BORV = 1 (PIC10F320/322) 1.80 1.90 2.05 V BORV = 1 (PIC10LF320/322) 36* VHYST Brown-out Reset Hysteresis 0 25 50 mV -40°C to +85°C 37* TBORDC Brown-out Reset DC Response Time 1 3 5 s VDD  VBOR 38 VLPBOR Low-Power Brown-Out Reset Voltage 1.8 2.1 2.5 V LPBOR = 1 * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: To ensure these voltage tolerances, VDD and VSS must be capacitively decoupled as close to the device as possible. 0.1F and 0.01F values in parallel are recommended. FIGURE 24-10: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS T0CKI 40 41 42 TMR0 TABLE 24-10: TIMER0 EXTERNAL CLOCK REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Param Sym. Characteristic Min. Typ† Max. Units Conditions No. 40* TT0H T0CKI High Pulse Width No Prescaler 0.5 TCY + 20 — — ns With Prescaler 10 — — ns 41* TT0L T0CKI Low Pulse Width No Prescaler 0.5 TCY + 20 — — ns With Prescaler 10 — — ns 42* TT0P T0CKI Period Greater of: — — ns N = prescale value 20 or TCY + 40 (2, 4, ..., 256) N * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. DS40001585D-page 172  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 FIGURE 24-11: CLC PROPAGATION TIMING Rev.10-000031A 7/30/2013 CLC LCx_in[n](1) CLC CLC CLCxINn CLCx Inputtime Module LCx_out(1) Outputtime CLC CLC CLC CLCxINn CLCx Inputtime LCx_in[n](1) Module LCx_out(1) Outputtime CLC01 CLC02 CLC03 Note 1: See FIGURE 19-1: CLCx Simplified Block Diagram, to identify specific CLC signals. TABLE 24-11: CONFIGURATION LOGIC CELL (CLC) CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Param. Sym. Characteristic Min. Typ† Max. Units Conditions No. CLC01* TCLCIN CLC input time — 7 — ns CLC02* TCLC CLC module input to output propagation time — 24 — ns VDD = 1.8V — 12 — ns VDD > 3.6V CLC03* TCLCOUT CLC output time Rise Time — OS18 — — (Note 1) Fall Time — OS19 — — (Note 1) CLC04* FCLCMAX CLC maximum switching frequency — 45 — MHz * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note1:See Table24-8 for OS18 and OS19 rise and fall times.  2011-2015 Microchip Technology Inc. DS40001585D-page 173

PIC10(L)F320/322 TABLE 24-12: A/D CONVERTER (ADC) CHARACTERISTICS: Standard Operating Conditions (unless otherwise stated) Param Sym. Characteristic Min. Typ† Max. Units Conditions No. AD01 NR Resolution — — 8 bit AD02 EIL Integral Error — — ±1.7 LSb VREF = 3.0V AD03 EDL Differential Error — — ±1 LSb No missing codes VREF = 3.0V AD04 EOFF Offset Error — — ±2.5 LSb VREF = 3.0V AD05 EGN Gain Error — — ±2.0 LSb VREF = 3.0V AD06 VREF Reference Voltage 1.8 — VDD V VREF = (VREF+ minus VREF-) AD07 VAIN Full-Scale Range VSS — VREF V AD08 ZAIN Recommended Impedance of — — 10 k Can go higher if external 0.01F capacitor is Analog Voltage Source present on input pin. * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Total Absolute Error includes integral, differential, offset and gain errors. 2: The A/D conversion result never decreases with an increase in the input voltage and has no missing codes. 3: When ADC is off, it will not consume any current other than leakage current. The power-down current specification includes any such leakage from the ADC module. TABLE 24-13: A/D CONVERSION REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Param Sym. Characteristic Min. Typ† Max. Units Conditions No. AD130* TAD A/D Clock Period 1.0 — 6.0 s TOSC-based A/D Internal FRC Oscillator Period 1.0 1.6 6.0 s ADCS<1:0> = 11 (ADRC mode) AD131 TCNV Conversion Time (not including — 9.5 — TAD Set GO/DONE bit to conversion Acquisition Time)(1) complete AD132* TACQ Acquisition Time — 5.0 — s AD133* THCD Holding Capacitor Disconnect Time — 1/2 TAD — FOSC-based — 1/2 TAD + 1TCY — ADCS<2:0> = x11 (ADC FRC mode) * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The ADRES register may be read on the following TCY cycle. DS40001585D-page 174  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 FIGURE 24-12: A/D CONVERSION TIMING (NORMAL MODE) BSF ADCON, GO 1 Tcy AD134 (TOSC/2(1)) AD131 Q4 AD130 A/D CLK A/D Data 7 6 5 4 3 2 1 0 ADRES OLD_DATA NEW_DATA ADIF 1 Tcy GO DONE Sampling Stopped AD132 Sample Note 1: If the A/D clock source is selected as FRC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. FIGURE 24-13: A/D CONVERSION TIMING (SLEEP MODE) BSF ADCON, GO AD134 (TOSC/2 + TCY(1)) 1 Tcy AD131 Q4 AD130 A/D CLK A/D Data 7 6 5 4 3 2 1 0 ADRES OLD_DATA NEW_DATA ADIF 1 Tcy GO DONE Sampling Stopped AD132 Sample Note 1: If the A/D clock source is selected as FRC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed.  2011-2015 Microchip Technology Inc. DS40001585D-page 175

PIC10(L)F320/322 25.0 DC AND AC CHARACTERISTICS GRAPHS AND CHARTS Graphs and charts are not available at this time. DS40001585D-page 176  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 26.0 DEVELOPMENT SUPPORT 26.1 MPLAB X Integrated Development Environment Software The PIC® microcontrollers (MCU) and dsPIC® digital signal controllers (DSC) are supported with a full range The MPLAB X IDE is a single, unified graphical user of software and hardware development tools: interface for Microchip and third-party software, and • Integrated Development Environment hardware development tool that runs on Windows®, Linux and Mac OS® X. Based on the NetBeans IDE, - MPLAB® X IDE Software MPLAB X IDE is an entirely new IDE with a host of free • Compilers/Assemblers/Linkers software components and plug-ins for high- - MPLAB XC Compiler performance application development and debugging. - MPASMTM Assembler Moving between tools and upgrading from software - MPLINKTM Object Linker/ simulators to hardware debugging and programming MPLIBTM Object Librarian tools is simple with the seamless user interface. - MPLAB Assembler/Linker/Librarian for With complete project management, visual call graphs, Various Device Families a configurable watch window and a feature-rich editor • Simulators that includes code completion and context menus, MPLAB X IDE is flexible and friendly enough for new - MPLAB X SIM Software Simulator users. With the ability to support multiple tools on • Emulators multiple projects with simultaneous debugging, MPLAB - MPLAB REAL ICE™ In-Circuit Emulator X IDE is also suitable for the needs of experienced • In-Circuit Debuggers/Programmers users. - MPLAB ICD 3 Feature-Rich Editor: - PICkit™ 3 • Color syntax highlighting • Device Programmers • Smart code completion makes suggestions and - MPLAB PM3 Device Programmer provides hints as you type • Low-Cost Demonstration/Development Boards, • Automatic code formatting based on user-defined Evaluation Kits and Starter Kits rules • Third-party development tools • Live parsing User-Friendly, Customizable Interface: • Fully customizable interface: toolbars, toolbar buttons, windows, window placement, etc. • Call graph window Project-Based Workspaces: • Multiple projects • Multiple tools • Multiple configurations • Simultaneous debugging sessions File History and Bug Tracking: • Local file history feature • Built-in support for Bugzilla issue tracker  2011-2015 Microchip Technology Inc. DS40001585D-page 177

PIC10(L)F320/322 26.2 MPLAB XC Compilers 26.4 MPLINK Object Linker/ MPLIB Object Librarian The MPLAB XC Compilers are complete ANSI C compilers for all of Microchip’s 8, 16, and 32-bit MCU The MPLINK Object Linker combines relocatable and DSC devices. These compilers provide powerful objects created by the MPASM Assembler. It can link integration capabilities, superior code optimization and relocatable objects from precompiled libraries, using ease of use. MPLAB XC Compilers run on Windows, directives from a linker script. Linux or MAC OS X. The MPLIB Object Librarian manages the creation and For easy source level debugging, the compilers provide modification of library files of precompiled code. When debug information that is optimized to the MPLAB X a routine from a library is called from a source file, only IDE. the modules that contain that routine will be linked in The free MPLAB XC Compiler editions support all with the application. This allows large libraries to be devices and commands, with no time or memory used efficiently in many different applications. restrictions, and offer sufficient code optimization for The object linker/library features include: most applications. • Efficient linking of single libraries instead of many MPLAB XC Compilers include an assembler, linker and smaller files utilities. The assembler generates relocatable object • Enhanced code maintainability by grouping files that can then be archived or linked with other relo- related modules together catable object files and archives to create an execut- • Flexible creation of libraries with easy module able file. MPLAB XC Compiler uses the assembler to listing, replacement, deletion and extraction produce its object file. Notable features of the assem- bler include: 26.5 MPLAB Assembler, Linker and • Support for the entire device instruction set Librarian for Various Device • Support for fixed-point and floating-point data Families • Command-line interface • Rich directive set MPLAB Assembler produces relocatable machine code from symbolic assembly language for PIC24, • Flexible macro language PIC32 and dsPIC DSC devices. MPLAB XC Compiler • MPLAB X IDE compatibility uses the assembler to produce its object file. The assembler generates relocatable object files that can 26.3 MPASM Assembler then be archived or linked with other relocatable object files and archives to create an executable file. Notable The MPASM Assembler is a full-featured, universal features of the assembler include: macro assembler for PIC10/12/16/18 MCUs. • Support for the entire device instruction set The MPASM Assembler generates relocatable object files for the MPLINK Object Linker, Intel® standard HEX • Support for fixed-point and floating-point data files, MAP files to detail memory usage and symbol • Command-line interface reference, absolute LST files that contain source lines • Rich directive set and generated machine code, and COFF files for • Flexible macro language debugging. • MPLAB X IDE compatibility The MPASM Assembler features include: • Integration into MPLAB X IDE projects • User-defined macros to streamline assembly code • Conditional assembly for multipurpose source files • Directives that allow complete control over the assembly process DS40001585D-page 178  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 26.6 MPLAB X SIM Software Simulator 26.8 MPLAB ICD 3 In-Circuit Debugger System The MPLAB X SIM Software Simulator allows code development in a PC-hosted environment by simulat- The MPLAB ICD 3 In-Circuit Debugger System is ing the PIC MCUs and dsPIC DSCs on an instruction Microchip’s most cost-effective, high-speed hardware level. On any given instruction, the data areas can be debugger/programmer for Microchip Flash DSC and examined or modified and stimuli can be applied from MCU devices. It debugs and programs PIC Flash a comprehensive stimulus controller. Registers can be microcontrollers and dsPIC DSCs with the powerful, logged to files for further run-time analysis. The trace yet easy-to-use graphical user interface of the MPLAB buffer and logic analyzer display extend the power of IDE. the simulator to record and track program execution, The MPLAB ICD 3 In-Circuit Debugger probe is actions on I/O, most peripherals and internal registers. connected to the design engineer’s PC using a high- The MPLAB X SIM Software Simulator fully supports speed USB 2.0 interface and is connected to the target symbolic debugging using the MPLAB XCCompilers, with a connector compatible with the MPLAB ICD 2 or and the MPASM and MPLAB Assemblers. The soft- MPLAB REAL ICE systems (RJ-11). MPLAB ICD 3 ware simulator offers the flexibility to develop and supports all MPLAB ICD 2 headers. debug code outside of the hardware laboratory envi- ronment, making it an excellent, economical software 26.9 PICkit 3 In-Circuit Debugger/ development tool. Programmer 26.7 MPLAB REAL ICE In-Circuit The MPLAB PICkit 3 allows debugging and program- Emulator System ming of PIC and dsPIC Flash microcontrollers at a most affordable price point using the powerful graphical user The MPLAB REAL ICE In-Circuit Emulator System is interface of the MPLAB IDE. The MPLAB PICkit 3 is Microchip’s next generation high-speed emulator for connected to the design engineer’s PC using a full- Microchip Flash DSC and MCU devices. It debugs and speed USB interface and can be connected to the tar- programs all 8, 16 and 32-bit MCU, and DSC devices get via a Microchip debug (RJ-11) connector (compati- with the easy-to-use, powerful graphical user interface of ble with MPLAB ICD 3 and MPLAB REAL ICE). The the MPLAB X IDE. connector uses two device I/O pins and the Reset line The emulator is connected to the design engineer’s to implement in-circuit debugging and In-Circuit Serial PC using a high-speed USB 2.0 interface and is Programming™ (ICSP™). connected to the target with either a connector compatible with in-circuit debugger systems (RJ-11) 26.10 MPLAB PM3 Device Programmer or with the new high-speed, noise tolerant, Low- The MPLAB PM3 Device Programmer is a universal, Voltage Differential Signal (LVDS) interconnection CE compliant device programmer with programmable (CAT5). voltage verification at VDDMIN and VDDMAX for The emulator is field upgradable through future firmware maximum reliability. It features a large LCD display downloads in MPLAB X IDE. MPLAB REAL ICE offers (128 x 64) for menus and error messages, and a mod- significant advantages over competitive emulators ular, detachable socket assembly to support various including full-speed emulation, run-time variable package types. The ICSP cable assembly is included watches, trace analysis, complex breakpoints, logic as a standard item. In Stand-Alone mode, the MPLAB probes, a ruggedized probe interface and long (up to PM3 Device Programmer can read, verify and program three meters) interconnection cables. PIC devices without a PC connection. It can also set code protection in this mode. The MPLAB PM3 connects to the host PC via an RS-232 or USB cable. The MPLAB PM3 has high-speed communications and optimized algorithms for quick programming of large memory devices, and incorporates an MMC card for file storage and data applications.  2011-2015 Microchip Technology Inc. DS40001585D-page 179

PIC10(L)F320/322 26.11 Demonstration/Development 26.12 Third-Party Development Tools Boards, Evaluation Kits, and Microchip also offers a great collection of tools from Starter Kits third-party vendors. These tools are carefully selected to offer good value and unique functionality. A wide variety of demonstration, development and evaluation boards for various PIC MCUs and dsPIC • Device Programmers and Gang Programmers DSCs allows quick application development on fully from companies, such as SoftLog and CCS functional systems. Most boards include prototyping • Software Tools from companies, such as Gimpel areas for adding custom circuitry and provide applica- and Trace Systems tion firmware and source code for examination and • Protocol Analyzers from companies, such as modification. Saleae and Total Phase The boards support a variety of features, including LEDs, • Demonstration Boards from companies, such as temperature sensors, switches, speakers, RS-232 MikroElektronika, Digilent® and Olimex interfaces, LCD displays, potentiometers and additional • Embedded Ethernet Solutions from companies, EEPROM memory. such as EZ Web Lynx, WIZnet and IPLogika® The demonstration and development boards can be used in teaching environments, for prototyping custom circuits and for learning about various microcontroller applications. In addition to the PICDEM™ and dsPICDEM™ demonstration/development board series of circuits, Microchip has a line of evaluation kits and demonstra- tion software for analog filter design, KEELOQ® security ICs, CAN, IrDA®, PowerSmart battery management, SEEVAL® evaluation system, Sigma-Delta ADC, flow rate sensing, plus many more. Also available are starter kits that contain everything needed to experience the specified device. This usually includes a single application and debug capability, all on one board. Check the Microchip web page (www.microchip.com) for the complete list of demonstration, development and evaluation kits. DS40001585D-page 180  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 27.0 PACKAGING INFORMATION 27.1 Package Marking Information 6-Lead SOT-23 Example XXNN LA11 8-Lead PDIP (300 mil) Example XXXXXXXX 10F320 XXXXXNNN I/P e3 07Q YYWW 1110 8-Lead DFN (2x3x0.9 mm) Example BAA 110 20 Legend: XX...X Product-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code e3 Pb-free JEDEC® designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( e 3 ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.  2011-2015 Microchip Technology Inc. DS40001585D-page 181

PIC10(L)F320/322 TABLE 27-1: 8-LEAD 2x3 DFN (MC) TOP TABLE 27-2: 6-LEAD SOT-23 (OT) MARKING PACKAGE TOP MARKING Part Number Marking Part Number Marking PIC10F322(T)-I/MC BAA PIC10F322(T)-I/OT LA/LJ PIC10F322(T)-E/MC BAB PIC10F322(T)-E/OT LB/LK PIC10F320(T)-I/MC BAC PIC10F320(T)-I/OT LC PIC10F320(T)-E/MC BAD PIC10F320(T)-E/OT LD PIC10LF322(T)-I/MC BAF PIC10LF322(T)-I/OT LE PIC10LF322(T)-E/MC BAG PIC10LF322(T)-E/OT LF PIC10LF320(T)-I/MC BAH PIC10LF320(T)-I/OT LG PIC10LF320(T)-E/MC BAJ PIC10LF320(T)-E/OT LH DS40001585D-page 182  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 27.2 Package Details The following sections give the technical details of the packages. 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DS40001585D-page 183

PIC10(L)F320/322 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS40001585D-page 184  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A N B E1 NOTE 1 1 2 TOP VIEW E C A A2 PLANE L c A1 e eB 8X b1 8X b .010 C SIDE VIEW END VIEW Microchip Technology Drawing No. C04-018D Sheet 1 of 2  2011-2015 Microchip Technology Inc. DS40001585D-page 185

PIC10(L)F320/322 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging ALTERNATE LEAD DESIGN (VENDOR DEPENDENT) DATUM A DATUM A b b e e 2 2 e e Units INCHES Dimension Limits MIN NOM MAX Number of Pins N 8 Pitch e .100 BSC Top to Seating Plane A - - .210 Molded Package Thickness A2 .115 .130 .195 Base to Seating Plane A1 .015 - - Shoulder to Shoulder Width E .290 .310 .325 Molded Package Width E1 .240 .250 .280 Overall Length D .348 .365 .400 Tip to Seating Plane L .115 .130 .150 Lead Thickness c .008 .010 .015 Upper Lead Width b1 .040 .060 .070 Lower Lead Width b .014 .018 .022 Overall Row Spacing § eB - - .430 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing No. C04-018D Sheet 2 of 2 DS40001585D-page 186  2011-2015 Microchip Technology Inc.

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DS40001585D-page 187

PIC10(L)F320/322 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS40001585D-page 188  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 APPENDIX A: DATA SHEET REVISION HISTORY Revision A (07/2011) Original release. Revision B (02/2014) Electrical Specifications update and new formats; Minor edits. Revision C (05/2015) Updated Figures 7-1 and 11-1. Update Sections 5.4.1, 24.1, and 24.3. Updated Tables 24-2 and 24-9. Revision D (11/2015) Updated the “eXtreme Low-Power (XLP) Features” section; added “Memory” section. Updated “Family Types” table; Updated Table 2-1, 24-5, 24-7, 24-9, 24-12 and 24-13; Updated Figure 7-1, 24-6 and section 15.2.5; Other minor corrections.  2011-2015 Microchip Technology Inc. DS40001585D-page 189

PIC10(L)F320/322 THE MICROCHIP WEBSITE CUSTOMER SUPPORT Microchip provides online support via our website at Users of Microchip products can receive assistance www.microchip.com. This website is used as a means through several channels: to make files and information easily available to • Distributor or Representative customers. Accessible by using your favorite Internet • Local Sales Office browser, the website contains the following information: • Field Application Engineer (FAE) • Product Support – Data sheets and errata, • Technical Support application notes and sample programs, design resources, user’s guides and hardware support Customers should contact their distributor, documents, latest software releases and archived representative or Field Application Engineer (FAE) for software support. Local sales offices are also available to help customers. A listing of sales offices and locations is • General Technical Support – Frequently Asked included in the back of this document. Questions (FAQ), technical support requests, online discussion groups, Microchip consultant Technical support is available through the website program member listing at: http://www.microchip.com/support • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip website at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. DS40001585D-page 190  2011-2015 Microchip Technology Inc.

PIC10(L)F320/322 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. [X](1) - X /XX XXX Examples: Device Tape and Reel Temperature Package Pattern a) PIC10LF320T - I/OT Option Range Tape and Reel, Industrial temperature, SOT-23 package b) PIC10F322 - I/P Device: PIC10F320, PIC10LF320, PIC10F322, PIC10LF322 Industrial temperature PDIP package c) PIC10F322 - E/MC Tape and Reel Blank = Standard packaging (tube or tray) Extended temperature, Option: T = Tape and Reel(1) DFN package Temperature I = -40C to +85C (Industrial) Range: E = -40C to +125C (Extended) Package: OT = SOT-23 P = PDIP MC = DFN Note1: Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is Pattern: QTP, SQTP, Code or Special Requirements not printed on the device package. Check (blank otherwise) with your Microchip Sales Office for package availability with the Tape and Reel option.  2011-2015 Microchip Technology Inc. DS40001585D-page 191

Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device Trademarks applications and the like is provided only for your convenience The Microchip name and logo, the Microchip logo, dsPIC, and may be superseded by updates. It is your responsibility to FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, ensure that your application meets with your specifications. LANCheck, MediaLB, MOST, MOST logo, MPLAB, MICROCHIP MAKES NO REPRESENTATIONS OR OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, WARRANTIES OF ANY KIND WHETHER EXPRESS OR SST, SST Logo, SuperFlash and UNI/O are registered IMPLIED, WRITTEN OR ORAL, STATUTORY OR trademarks of Microchip Technology Incorporated in the OTHERWISE, RELATED TO THE INFORMATION, U.S.A. and other countries. INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR The Embedded Control Solutions Company and mTouch are FITNESS FOR PURPOSE. Microchip disclaims all liability registered trademarks of Microchip Technology Incorporated arising from this information and its use. Use of Microchip in the U.S.A. devices in life support and/or safety applications is entirely at Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, the buyer’s risk, and the buyer agrees to defend, indemnify and CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit hold harmless Microchip from any and all damages, claims, Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet, suits, or expenses resulting from such use. No licenses are KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB conveyed, implicitly or otherwise, under any Microchip Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, intellectual property rights unless otherwise stated. Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2011-2015, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-5224-0020-2 QUALITY MANAGEMENT SYSTEM Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and CERTIFIED BY DNV Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures == ISO/TS 16949 == are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS40001585D-page 192  2011-2015 Microchip Technology Inc.

Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office Asia Pacific Office China - Xiamen Austria - Wels 2355 West Chandler Blvd. Suites 3707-14, 37th Floor Tel: 86-592-2388138 Tel: 43-7242-2244-39 Chandler, AZ 85224-6199 Tower 6, The Gateway Fax: 86-592-2388130 Fax: 43-7242-2244-393 Tel: 480-792-7200 Harbour City, Kowloon China - Zhuhai Denmark - Copenhagen Fax: 480-792-7277 Hong Kong Tel: 86-756-3210040 Tel: 45-4450-2828 Technical Support: Tel: 852-2943-5100 Fax: 86-756-3210049 Fax: 45-4485-2829 http://www.microchip.com/ Fax: 852-2401-3431 India - Bangalore France - Paris support Australia - Sydney Tel: 91-80-3090-4444 Tel: 33-1-69-53-63-20 Web Address: Tel: 61-2-9868-6733 Fax: 91-80-3090-4123 Fax: 33-1-69-30-90-79 www.microchip.com Fax: 61-2-9868-6755 India - New Delhi Germany - Dusseldorf Atlanta China - Beijing Tel: 91-11-4160-8631 Tel: 49-2129-3766400 Duluth, GA Tel: 86-10-8569-7000 Fax: 91-11-4160-8632 Tel: 678-957-9614 Germany - Karlsruhe Fax: 678-957-1455 Fax: 86-10-8528-2104 India - Pune Tel: 49-721-625370 China - Chengdu Tel: 91-20-3019-1500 Germany - Munich ATeul:s 5ti1n2, -T2X57-3370 Tel: 86-28-8665-5511 Japan - Osaka Tel: 49-89-627-144-0 Fax: 86-28-8665-7889 Tel: 81-6-6152-7160 Fax: 49-89-627-144-44 BWoessttobonrough, MA China - Chongqing Fax: 81-6-6152-9310 Italy - Milan Tel: 774-760-0087 Tel: 86-23-8980-9588 Japan - Tokyo Tel: 39-0331-742611 Fax: 86-23-8980-9500 Tel: 81-3-6880- 3770 Fax: 39-0331-466781 Fax: 774-760-0088 China - Dongguan Fax: 81-3-6880-3771 Italy - Venice CItahsiccaa,g IoL Tel: 86-769-8702-9880 Korea - Daegu Tel: 39-049-7625286 Tel: 630-285-0071 China - Hangzhou Tel: 82-53-744-4301 Netherlands - Drunen Fax: 630-285-0075 Tel: 86-571-8792-8115 Fax: 82-53-744-4302 Tel: 31-416-690399 Fax: 86-571-8792-8116 Korea - Seoul Fax: 31-416-690340 Cleveland Independence, OH China - Hong Kong SAR Tel: 82-2-554-7200 Poland - Warsaw Tel: 216-447-0464 Tel: 852-2943-5100 Fax: 82-2-558-5932 or Tel: 48-22-3325737 Fax: 852-2401-3431 82-2-558-5934 Fax: 216-447-0643 Spain - Madrid China - Nanjing Malaysia - Kuala Lumpur Tel: 34-91-708-08-90 Dallas Addison, TX Tel: 86-25-8473-2460 Tel: 60-3-6201-9857 Fax: 34-91-708-08-91 Fax: 86-25-8473-2470 Fax: 60-3-6201-9859 Tel: 972-818-7423 Sweden - Stockholm Fax: 972-818-2924 China - Qingdao Malaysia - Penang Tel: 46-8-5090-4654 Tel: 86-532-8502-7355 Tel: 60-4-227-8870 Detroit UK - Wokingham Fax: 86-532-8502-7205 Fax: 60-4-227-4068 Novi, MI Tel: 44-118-921-5800 Tel: 248-848-4000 China - Shanghai Philippines - Manila Fax: 44-118-921-5820 Tel: 86-21-5407-5533 Tel: 63-2-634-9065 Houston, TX Fax: 86-21-5407-5066 Fax: 63-2-634-9069 Tel: 281-894-5983 China - Shenyang Singapore Indianapolis Tel: 86-24-2334-2829 Tel: 65-6334-8870 Noblesville, IN Fax: 86-24-2334-2393 Fax: 65-6334-8850 Tel: 317-773-8323 Fax: 317-773-5453 China - Shenzhen Taiwan - Hsin Chu Tel: 86-755-8864-2200 Tel: 886-3-5778-366 Los Angeles Fax: 86-755-8203-1760 Fax: 886-3-5770-955 Mission Viejo, CA Tel: 949-462-9523 China - Wuhan Taiwan - Kaohsiung Fax: 949-462-9608 Tel: 86-27-5980-5300 Tel: 886-7-213-7828 Fax: 86-27-5980-5118 New York, NY Taiwan - Taipei Tel: 631-435-6000 China - Xian Tel: 886-2-2508-8600 Tel: 86-29-8833-7252 Fax: 886-2-2508-0102 San Jose, CA Fax: 86-29-8833-7256 Tel: 408-735-9110 Thailand - Bangkok Tel: 66-2-694-1351 Canada - Toronto Fax: 66-2-694-1350 Tel: 905-673-0699 Fax: 905-673-6509 07/14/15  2011-2015 Microchip Technology Inc. DS40001585D-page 193