N C 7 S Z 1 7 5 T i n y L o g i c NC7SZ175  TinyLogic UHS D-Type Flip-Flop U H S with Asynchronous Clear D - T y General Description Features p e The NC7SZ175 is a single positive edge-triggered D-type (cid:1) Space saving SC70 6-lead package F CStheMem OsipcSao cnedF ulsipcat-voFirln’osgp USlCwtr7ait0 hH i6gA-hlse ySanpdce herpdoa ncSokeuarsgie es.C olTfe haTerin yfdLreoovmgiicc e O iNins (cid:1)(cid:1) UUllttrraa sHmigahl l SMpiecerodP; atPkD 2 l.e6a ndsle Tsys pp ianctkoa 5g0e pF at 5V VCC lip-F fabricated with advanced CMOS technology to achieve (cid:1) High Output Drive; ±24 mA at 3V VCC lo uloltwra shtaigtihc psopweeedr with high output drive while maintaining (cid:1)(cid:1) BMraotacdh eVsC tCh eO ppeerrfaotrinmga Rncaen goef ;L 1C.X65 wVh teon 5 o.5pVerated at p w ddiesvsiicpea tiiso ns poevceifri ead vtoe royp berroaated oVvCeCr tohpee 1ra.6ti5nVg troa n5g.e5.V TVhCeC 3.3VVCC ith range. The inputs and output are high impedance when (cid:1) Power down high impedance inputs/output A VCC is 0V. Inputs tolerate voltages up to 7V independent of (cid:1) Overvoltage tolerant inputs facilitate 5V to 3V translation sy VCC operating voltage. This single flip-flop will store the (cid:1) Proprietary noise/EMI reduction circuitry implemented n state of the D input that meets the setup and hold time c h requirements on the LOW-to-HIGH Clock (CP) transition. A r LOW input to Clear sets the Q output to LOW level. The o n Clear input is independent of clock. o u Ordering Code: s C l Order Package Product Code e Package Description Supplied As a Number Number Top Mark r NC7SZ175P6X MAA06A Z75 6-Lead SC70, EIAJ SC88, 1.25mm Wide 3k Units on Tape and Reel NC7SZ175L6X MAC06A C4 6-Lead MicroPak, 1.0mm Wide 5k Units on Tape and Reel © 2004 Semiconductor Components Industries, LLC. Publication Order Number: October-2017, Rev. 2 NC7SZ175/D

5 7 Logic Symbol Connection Diagrams 1 Z S IEEE/IEC Pin Assignments for SC70 7 C N Function Table Inputs Output CP D C Q (Top View) (cid:17) L H L (cid:17) H H H Pin One Orientation Diagram (cid:16) X H Qn X X L L H = HIGH Logic Level Qn = No change in data L = LOW Logic Level X = Immaterial Pin Descriptions AAA represents Product Code Top Mark - see ordering code Note: Orientation of Top Mark determines Pin One location. Read the top Pin Names Description product code mark left to right, Pin One is the lower left pin (see diagram). D Data Input Pad Assignments for MicroPak CP Clock Pulse Input C Clear Input Q Flip-Flop Output (Top Thru View) www.onsemi.com 2

N Absolute Maximum Ratings(Note 1) Recommended Operating C 7 Supply Voltage (VCC) −0.5V to +7.0V Conditions (Note 2) SZ DC Input Voltage (VIN) −0.5V to +7.0V Power Supply 17 DC Output Voltage (VOUT) −0.5V to +7.0V Operating (VCC) 1.65V to 5.5V 5 DC Input Diode Current (IIK) Data Retention 1.5V to 5.5V VIN < 0V −50 mA Input Voltage (VIN) 0V to 5.5V DC Output Diode Current (IOK) Output Voltage (VOUT) 0V to VCC VOUT < 0V −50 mA Input Rise and Fall Time (tr, tf) DC Output (IOUT) Source/Sink Current ±50 mA VCC = 1.8V, 2.5V ± 0.2V 0 to 20 ns/V DC VCC/GND Current (ICC/IGND) ±50 mA VCC = 3.3V ± 0.3V 0 to 10 ns/V Storage Temperature Range (TSTG) −65°C to +150°C VCC = 5.5V ± 0.5V 0 to 5 ns/V Junction Temperature under Bias (TJ) 150°C Operating Temperature (TA) −40°C to +85°C Junction Lead Temperature (TL) Thermal Resistance (θJA) 350° C/W (Soldering, 10 seconds) 260°C Note 1: The “Absolute Maximum Ratings”: are those values beyond which Power Dissipation (PD) @+85°C 180 mW tohpee rsaatfeedty a ot f ththees ed elivmicites .c aTnhneo tp abrea mgueatrriacn vteaelude. sT hdee fidneevdic ien sthhoeu Eldl encotrti cbael Characteristics tables are not guaranteed at the absolute maximum ratings. The “Recommended Operating Conditions” table will define the conditions for actual device operation. Note 2: Unused inputs must be held HIGH or LOW. They may not float. DC Electrical Characteristics VCC TA = +25°C TA = −40°C to +85°C Symbol Parameter Unit Conditions (V) Min Typ Max Min Max VIH HIGH Level Control 1.65 to 1.95 0.75 VCC 0.75 VCC V Input Voltage 2.3 to 5.5 0.7 VCC 0.7 VCC VIL LOW Level Control 1.65 to 1.95 0.25 VCC 0.25 VCC V Input Voltage 2.3 to 5.5 0.3 VCC 0.3 VCC VOH HIGH Level Control 1.65 1.55 1.65 1.55 Output Voltage 1.8 1.7 1.8 1.7 2.3 2.2 2.3 2.2 IOH = −100 µA 3.0 2.9 3.0 2.9 4.5 4.4 4.5 4.4 V VIN = VIH 1.65 1.24 1.52 1.29 or VIL IOH = −4 mA 2.3 1.9 2.15 1.9 IOH = −8 mA 3.0 2.4 2.8 2.4 IOH = −16 mA 3.0 2.3 2.68 2.3 IOH = −24 mA 4.5 3.8 4.2 3.8 IOH = −32 mA VOL LOW Level Control 1.65 0.0 0.1 0.1 Output Voltage 1.8 0.0 0.1 0.1 2.3 0.0 0.1 0.1 IOL = 100 µA 3.0 0.0 0.1 0.1 4.5 0.0 0.1 0.1 V VIN = VIL 1.65 0.08 0.24 0.24 or VIH IOL = 4 mA 2.3 0.10 0.3 0.3 IOL = 8 mA 3.0 0.15 0.4 0.4 IOL = 16 mA 3.0 0.22 0.55 0.55 IOL = 24 mA 4.5 0.22 0.55 0.55 IOL = 32 mA IIN Input Leakage Current 0 to 5.5 ±0.1 ±1.0 µA 0 ≤ VIN ≤ 5.5V IOFF Power Off Leakage Current 0.0 1.0 10 µA VIN or VOUT = 5.5V ICC Quiescent Supply Current 1.65 to 5.5 1.0 10.0 µA VIN = 5.5V, GND www.onsemi.com 3

5 7 AC Electrical Characteristics 1 Z S VCC TA = +25°C TA = −40°C to +85°C Figure 7 Symbol Parameter Units Conditions C (V) Min Typ Max Min Max Number N fMAX Maximum Clock 1.65 100 Frequency 1.8 100 2.5 ± 0.2 125 MHz CL = 50 pF Fig1,u r4es 3.3 ± 0.3 150 RL = 500 Ω 5.0 ± 0.5 175 tPLH Propagation Delay 1.65 2.5 9.8 15.0 2.5 16.5 tPHL CP to Q 1.8 2.5 6.5 10.0 2.5 11.0 2.5 ± 0.2 2.0 3.8 6.5 2.0 7.0 CL = 15 pF Fig1,u r3es 3.3 ± 0.3 1.5 2.8 4.5 1.4 5.0 ns RL = 1 MΩ 5.0 ± 0.5 1.0 2.2 3.5 1.0 3.8 3.3 ± 0.3 2.0 3.4 5.5 1.6 6.2 CL = 50 pF Figures 5.0 ± 0.5 1.5 2.6 4.0 1.4 4.7 RL = 500 Ω 1, 3 tPHL Propagation Delay 1.65 2.5 9.8 13.5 2.5 15.0 C to Q 1.8 2.5 6.5 9.0 2.5 10.0 2.5 ± 0.2 2.0 3.8 6.0 2.0 6.4 CL = 15 pF Fig1,u r3es 3.3 ± 0.3 1.5 2.8 4.3 1.2 4.6 ns RL = 1 MΩ 5.0 ± 0.5 1.5 2.2 3.2 1.0 3.5 3.3 ± 0.3 1.5 3.4 5.3 1.5 5.8 CL = 50 pF Figures 5.0 ± 0.5 1.0 2.7 4.0 1.2 4.5 RL = 500 Ω 1, 3 tS Setup Time 2.5 ± 0.2 2.5 CL = 50 pF CP to D 3.3 ± 0.3 2.0 ns RL = 500 Ω Fig1,u r4es 5.0 ± 0.5 1.5 tH Hold Time, 2.5 ± 0.2 1.5 CL = 50 pF CP to D 3.3 ± 0.3 1.5 ns RL = 500 Ω Fig1,u r4es 5.0 ± 0.5 1.5 tW Pulse Width, CP 2.5 ± 0.2 3.0 CL = 50 pF 3.3 ± 0.3 2.8 ns RL = 500 Ω Fig1,u r4es 5.0 ± 0.5 2.5 Pulse Width, C 2.5 ± 0.2 3.0 Clock HIGH or LOW 3.3 ± 0.3 2.8 ns CL = 50 pF Fig1,u r4es 5.0 ± 0.5 2.5 RL = 500 Ω trec Recovery Time, 2.5 ± 0.2 1.0 CL = 50 pF C to CP 3.3 ± 0.3 1.0 ns RL = 500 Ω Fig1,u r4es 5.0 ± 0.5 1.0 Capacitance (Note 3) Symbol Parameter Typ Max Units Conditions CIN Input Capacitance 3 pF VCC = Open, VIN = 0V or VCC COUT Output Capacitance 4 pF VCC = 3.3V, VIN = 0V or VCC CPD Power Dissipation Capacitance 10 pF VCC = 3.3V (Note 4) 12 VCC = 5.0V Note 3: TA = +25C, f = 1MHz. Note 4: CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at no output loading and operating at 50% duty cycle. (See Figure 2) CPD is related to ICCD dynamic operating current by the expression: ICCD = (CPD)(VCC)(fIN) + (ICCstatic). www.onsemi.com 4

N AC Loading and Waveforms C 7 S Z 1 7 5 CL includes load and stray capacitance CP Input = AC Waveform; tr = tf = 1.8 ns; Input PRR = 1.0 MHz, tw = 500 ns CP Input PRR = 10 MHz; Duty Cycle = 50% FIGURE 1. AC Test Circuit D Input PRR = 5MHz; Duty Cycle = 50% FIGURE 2. ICCD Test Circuit FIGURE 3. AC Waveforms FIGURE 4. AC Waveforms www.onsemi.com 5

5 7 Tape and Reel Specification 1 Z TAPE FORMAT for SC70 S 7 Package Tape Number Cavity Cover Tape C Designator Section Cavities Status Status N Leader (Start End) 125 (typ) Empty Sealed P6X Carrier 3000 Filled Sealed Trailer (Hub End) 75 (typ) Empty Sealed TAPE DIMENSIONS inches (millimeters) Package Tape Size DIM A DIM B DIM F DIM Ko DIM P1 DIM W 0.093 0.096 0.138 ± 0.004 0.053 ± 0.004 0.157 0.315 ± 0.004 SC70-6 8 mm (2.35) (2.45) (3.5 ± 0.10) (1.35 ± 0.10) (4) (8 ± 0.1) www.onsemi.com 6

N Tape and Reel Specification (Continued) C 7 TAPE FORMAT for MicroPak S Package Tape Number Cavity Cover Tape Z 1 Designator Section Cavities Status Status 7 Leader (Start End) 125 (typ) Empty Sealed 5 L6X Carrier 5000 Filled Sealed Trailer (Hub End) 75 (typ) Empty Sealed REEL DIMENSIONS inches (millimeters) Tape A B C D N W1 W2 W3 Size 7.0 0.059 0.512 0.795 2.165 0.331 + 0.059/−0.000 0.567 W1 + 0.078/−0.039 8 mm (177.8) (1.50) (13.00) (20.20) (55.00) (8.40 + 1.50/−0.00) (14.40) (W1 + 2.00/−1.00) www.onsemi.com 7

5 7 Physical Dimensions 1 inches (millimeters) unless otherwise noted Z S 7 C N 6-Lead SC70, EIAJ SC88, 1.25mm Wide Package Number MAA06A www.onsemi.com 8

N Physical Dimensions inches (millimeters) unless otherwise noted (Continued) C 7 S Z 1 7 5 T i n y L o g i c  U H S D - T y p e F li p - F l o p w i t h A s y n c h r o n o u s C l e a r 6-Lead MicroPak, 1.0mm Wide Package Number MAC06A www.onsemi.com 9

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