NXP Semiconductors Document Number: MPXH6400A Data Sheet: Technical Data Rev. 6, 03/2017 MPXH6400A, 20 to 400 kPa, Absolute, Integrated Pressure Sensor MPXH6400A The NXP MPXxx6400A series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on-chip integration Super small outline package make this pressure sensor a logical and economical choice for the system designer. The MPXxx6400A series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. MPXHZ6400A6T1 MPXH6400AC6U/6T1/ Features Case 98ARH99066A MPXHZ6400AC6T1 Case 98ARH99089A • Improved accuracy at high temperature • Available in super small outline package • 1.5% maximum error over 0 °C to 85°C Top view • Fully calibrated and compensated • Ideally suited for microprocessor or microcontroller-based systems DNC 5 4 V OUT • Temperature compensated from -40°C to +125°C DNC 6 3 GND • Durable thermoplastic surface mount package DNC 7 2 V S • Package porting and mounting options enable tube attachment for liquefied DNC 8 1 DNC natural gas (LPG) or remote sensing applications Typical applications • Fuel injected car engines Pin 1 identification, chamfered corner. • Vehicles powered by green gases (for example LPG and CNG) Pinout • Small engines • Industrial controls Ordering information # of Ports Pressure type Device Part number Shipping Package None Single Dual Gauge Differential Absolute marking Super Small Outline Package (Media resistant gel) MPXH6400AC6U Rail 98ARH99089A • • MPXH6400A MPXH6400AC6T1 Tape and Reel 98ARH99089A • • MPXH6400A MPXHZ6400A6T1 Tape and Reel 98ARH99066A • • MPXHZ6400A MPXHZ6400AC6T1 Tape and Reel 98ARH99089A • • MPXHZ6400A NXP reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. © NXP B.V. 2017

Contents 1 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Mechanical and Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.2 Operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 On-chip Temperature Compensation and Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 Package Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.1 Minimum recommended footprint for surface mounted applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.2 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Related Documentation The MPXxx6400A device features and operations are described in a variety of reference manuals, user guides, and application notes. To find the most-current versions of these documents: 1. Go to the MPXx6400 web page at http://www.nxp.com/products/:MPXx6400. 2. Click the Documentation tab. MPXH6400A Sensors 2 NXP B.V.

1 General Description 1.1 Block diagram Figure1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. V S Thin Film Gain Stage #2 Temperature and ESleenmseinngt Compensation Ground VOUT and Gain Reference Stage #1 Shift Circuitry Pins 1, 5, 6, 7, and 8 are internal device connections. GND Do not connect to external circuitry or ground. Figure1. Integrated pressure sensor block diagram 1.2 Pinout DNC 5 4 V OUT DNC 6 3 GND DNC 7 2 V S DNC 8 1 DNC Pin 1 identification, chamfered corner. Figure2. Device pinout (top view) Table1. Pin functions Pin Name Function 1 DNC Do not connect to external circuitry or ground. Pin 1 is notated by chamfered corner. 2 V Voltage supply S 3 GND Ground 4 V Output voltage OUT 5 DNC Do not connect to external circuitry or ground. 6 DNC Do not connect to external circuitry or ground. 7 DNC Do not connect to external circuitry or ground. 8 DNC Do not connect to external circuitry or ground. MPXH6400A Sensors NXP B.V. 3

2 Mechanical and Electrical Specifications 2.1 Maximum ratings Table2. Maximum ratings(1) Parametrics Symbol Value Units Maximum pressure (P1 > P2) PMAX 1600 kPa Storage temperature TSTG -40° to +125° °C Operating temperature TA -40° to +125° °C Output source current @ full-scale output(2) IO+ 0.5 mAdc Output sink current @ minimum pressure offset(2) IO- -0.5 mAdc 1.Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2.Maximum output current is controlled by effective impedance from V to GND or V to V in the application circuit. OUT OUT S 2.2 Operating characteristics Table3. Operating characteristics (V = 5.0 V , T = 25 °C unless otherwise noted, P1 > P2.) S DC A Characteristic Symbol Min Typ Max Unit Pressure range P 20 — 400 kPa OP Supply voltage(1) V 4.64 5.0 5.36 V S DC Supply current I — 6.0 10 mAdc O Minimum pressure offset(2) (0 to 85°C) @ VS = 5.0 Volts VOFF 0.133 0.2 0.267 VDC Full-scale output(3) (0 to 85°C) @ VS = 5.0 Volts VFSO 4.733 4.8 4.866 VDC Full-scale span(4) (0 to 85°C) @ VS = 5.0 Volts VFSS 4.467 4.6 4.733 VDC Accuracy(5) (0 to 85°C) — — — ±1.5 %V FSS Sensitivity V/P — 12.1 — mV/kPa Response time(6) t — 1.0 — ms R Warm-up time(7) — — 20 — ms Offset stability(8) — — ±0.25 — %V FSS 1.Device is ratiometric within this specified excitation range. 2.Offset (V ) is defined as the output voltage at the minimum rated pressure. OFF 3.Full-scale output (V ) is defined as the output voltage at the maximum or full-rated pressure. FSO 4.Full-scale span (V ) is defined as the algebraic difference between the output voltage at full-rated pressure and the output voltage at the FSS minimum rated pressures 5.Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25°C due to all sources of error including the following: Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. Temperature hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C TcSpan: Output deviation over the temperature range of 0 to 85°C, relative to 25°C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85 °C, relative to 25 °C. Variation from Nominal: The variation from nominal values, for offset or full-scale span, as a percent of V , at 25°C. FSS 6.Response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7.Warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 8.Offset stability is the product's output deviation when subjected to 1000 cycles of pulsed pressure, temperature cycling with bias test. MPXH6400A Sensors 4 NXP B.V.

3 On-chip Temperature Compensation and Calibration Figure3 illustrates the absolute sensing chip in the basic super small outline chip carrier (case 98ARH99066A). Figure4 shows a typical application circuit (output source current operation). Figure5 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0 to 85°C temperature range. The output will saturate outside of the rated pressure range. A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXH6400A/MPXHZ6400A pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Fluorosilicone Die Gel Die Coat Stainless Steel Cap P1 Thermoplastic Wire Case Bond Lead Frame Absolute Sealed Vacuum Die Bond Reference Figure3. Cross-sectional diagram (not-to-scale) +5.1 V V S VOUT To ADC 100 nF 1 μF GND 47 pF 51 K Figure4. Recommended power supply decoupling and output filtering MPXH6400A Sensors NXP B.V. 5

5.0 Transfer Function: 4.5 V = V x (0.002421xP–0.00842 ± Error OUT S 4.0 VS = 5.0 VDC Temperature = 0 to 85°C 3.5 s) 3.0 Volt MAX ut ( 2.5 p ut 2.0 O TYP 1.5 1.0 0.5 MIN 0 00000000000000000000 24680246802468024680 1111122222333334 Pressure (Reference to Sealed Vacuum) in kPa Figure5. Output vs. absolute pressure Normal Transfer Value: V = V x (0.002421 x P – 0.00842) OUT S ± Pressure Error x Temp. Factor x 0.002421 x V S V = 5.0 ± 0.36 V S DC Figure6. Transfer function 4.0 or ct Fa 3.0 or Err e 2.0 Break Points ur at er p m 1.0 e T Temp Multiplier 0.0 -40 -20 0 20 40 60 80 100 120 140 - 40 3 Temperature in °C 0 to 85 1 125 1.75 NOTE: The Temperature Multiplier is a linear response from 0°C to -40°C and from 85°C to 125°C Figure7. Temperature error band MPXH6400A Sensors 6 NXP B.V.

Error Limits for Pressure 6.0 ±5.5 (kPa) 5.0 4.0 3.0 a) 2.0 P or (k 1.0 Err 0.0 e 20 40 60 80 100120140160 180200220 240260280300320340 360380400 sur -1.0 s e Pr -2.0 -3.0 -4.0 - 5.0 Pressure (in kPa) - 6.0 Pressure Error (Max) 20 to 400 (kPa) ±5.5 (kPa) Figure8. Pressure error band MPXH6400A Sensors NXP B.V. 7

4 Package Information 4.1 Minimum recommended footprint for surface mounted applications Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. 0.050 0.387 1.27 9.83 TYP 0.150 3.81 0.027 TYP 8X 0.69 0.053 TYP 8X inch 1.35 mm Figure9. SSOP footprint MPXH6400A Sensors 8 NXP B.V.

4.2 Package Dimensions This drawing is located at http://cache.nxp.com/assets/documents/data/en/package-information/98ARH99066A.pdf. Case 98ARH99066A, super small outline package, surface mount MPXH6400A Sensors NXP B.V. 9

Case 98ARH99066A, super small outline package, surface mount MPXH6400A Sensors 10 NXP B.V.

Case 98ARH99066A, super small outline package, surface mount MPXH6400A Sensors NXP B.V. 11

This drawing is located at http://cache.nxp.com/assets/documents/data/en/package-information/98ARH99089A.pdf. Case 98ARH99089A, small outline package, surface mount MPXH6400A Sensors 12 NXP B.V.

Case 98ARH99089A, small outline package, surface mount MPXH6400A Sensors NXP B.V. 13

5 Revision History Table4. Revision history Document ID Release Date Data sheet status Change notice Supersedes MPXH6400A Rev. 6 2017 March Technical data — MPXH6400A Rev. 5.0 • Revised V = 10.0 V value to V = 5.0 V inTable3. S DC S DC • The format of this data sheet has been redesigned to comply with current identity guidelines of NXP Modifications Semiconductors. Legal texts have been adapted to the new company name where appropriate. • Updated package outlines Section4.2, “Package Dimensions” to comply with current identity guidelines of NXP Semiconductors. MPXH6400A Rev. 5.0 2015 September Technical data — MPXH64-00A Rev. MPXH6400A Sensors 14 NXP B.V.

How to Reach Us: Information in this document is provided solely to enable system and software implementers to use NXP products. There are no expressed or implied copyright Home Page: NXP.com licenses granted hereunder to design or fabricate any integrated circuits based on the Web Support: information in this document. NXP reserves the right to make changes without further http://www.nxp.com/support notice to any products herein. NXP makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does NXP assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation, consequential or incidental damages. "Typical" parameters that may be provided in NXP data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including "typicals," must be validated for each customer application by the customer's technical experts. NXP does not convey any license under its patent rights nor the rights of others. NXP sells products pursuant to standard terms and conditions of sale, which can be found at the following address: http://www.nxp.com/terms-of-use.html. NXP, the NXP logo, Freescale, the Freescale logo, and the Energy Efficient Solutions logo are trademarks of NXP B.V. All other product or service names are the property of their respective owners. All rights reserved. © NXP B.V. 2017. Document Number: MPXH6400A Rev. 6 03/2017

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