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  • 型号: MPX2010D
  • 制造商: Freescale Semiconductor
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MPX2010D产品简介:

ICGOO电子元器件商城为您提供MPX2010D由Freescale Semiconductor设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 MPX2010D价格参考¥134.83-¥134.83。Freescale SemiconductorMPX2010D封装/规格:压力传感器,变送器, 差分 压力 传感器 1.45 PSI(10 kPa) 0 mV ~ 25 mV(10V) 4-SIP 模块。您可以下载MPX2010D参考资料、Datasheet数据手册功能说明书,资料中有MPX2010D 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

传感器,变送器

描述

SENSOR DIFF PRESS 1.45 PSI MAX板机接口压力传感器 PRES SEN COMP 10KPA

产品分类

压力传感器,变送器

品牌

Freescale Semiconductor

产品手册

点击此处下载产品Datasheet

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

板机接口压力传感器,Freescale Semiconductor MPX2010DMPX2010

数据手册

点击此处下载产品Datasheet

产品型号

MPX2010D

产品目录绘图

产品目录页面

点击此处下载产品Datasheet

产品种类

板机接口压力传感器

出厂设置

-

单位重量

1.608 g

压力类型

差分

商标

Freescale Semiconductor

安装风格

Through Hole

封装

Tray

封装/外壳

4-SIP 模块

封装/箱体

Unibody 4-pin

工作压力

1.45 PSI

工作温度

-40°C ~ 125°C

工作电源电压

10 V

工厂包装数量

125

最大工作温度

+ 125 C

最小工作温度

- 40 C

标准包装

500

电压-电源

16V

端口尺寸

母型,0.136"(3.4544mm)

端口类型

No Ports

端子类型

PCB

精度

±1%FSS

系列

MPXx2010

输出

0 mV ~ 25 mV

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PDF Datasheet 数据手册内容提取

Pressure Freescale Semiconductor MPX2010 Rev 13, 10/2008 +10 kPa On-Chip Temperature MPX2010 Compensated and Calibrated Series Silicon Pressure Sensors 0 to 10 kPa (0 to 1.45 psi) The MPX2010 series silicon piezoresistive pressure sensors provide a very 25 mV Full Scale accurate and linear voltage output directly proportional to the applied pressure. (Typical) These sensors house a single monolithic silicon die with the strain gauge and thin film resistor network integrated. The sensor is laser trimmed for precise span, offset calibration and temperature compensation. Application Examples Features • Respiratory Diagnostics • Temperature Compensated over 0°C to +85°C • Air Movement Control • Ratiometric to Supply Voltage • Controllers • Differential and Gauge Options • Pressure Switching • Available in Easy-to-Use Tape & Reel ORDERING INFORMATION Package Case # of Ports Pressure Type Device Name Device Marking Options No. None Single Dual Gauge Differential Absolute Small Outline Package (MPXV2010 Series) MPXV2010GP Tray 1369 • • MPXV2010GP MPXV2010DP Tray 1351 • • MPXV2010DP Unibody Package (MPX2010 Series) MPX2010D Tray 344 • • MPX2010D MPX2010DP Tray 344C • • MPX2010DP MPX2010GP Tray 344B • • MPX2010GP MPX2010GS Tray 344E • • MPX2010D MPX2010GSX Tray 344F • • MPX2010D MPAK Package (MPXM2010 Series) MPXM2010D Rail 1320 • • MPXM2010D MPXM2010DT1 Tape and Reel 1320 • • MPXM2010D MPXM2010GS Rail 1320A • • MPXM2010GS MPXM2010GST1 Tape and Reel 1320A • • MPXM2010GS SMALL OUTLINE PACKAGES MPAK PACKAGES MPXV2010GP MPXV2010DP MPXM2010D/DT1 MPXM2010GS/GST1 CASE 1369-01 CASE 1351-01 CASE 1320-02 CASE 1320A-02 UNIBODY PACKAGES MPX2010D MPX2010GP MPX2010DP MPX2010GS MPX2010GSX CASE 344-15 CASE 344B-01 CASE 344C-01 CASE 344E-01 CASE 344F-01 © Freescale Semiconductor, Inc., 2005-2008. All rights reserved.

Pressure Operating Characteristics Table1. Operating Characteristics (V = 10 V , T = 25°C unless otherwise noted, P1 > P2) S DC A Characteristic Symbol Min Typ Max Units Pressure Range(1) P 0 — 10 kPa OP Supply Voltage(2) V — 10 16 V S DC Supply Current I — 6.0 — mAdc O Full Scale Span(3) V 24 25 26 mV FSS Offset(4) V –1.0 — 1.0 mV OFF Sensitivity ΔV/ΔΡ — 2.5 — mV/kPa Linearity — –1.0 — 1.0 %V FSS Pressure Hysteresis (0 to 10 kPa) — — ±0.1 — %VFSS Temperature Hysteresis (–40°C to +125°C) — — ±0.5 — %VFSS Temperature Coefficient on Full Scale Span TCV –1.0 — 1.0 %V FSS FSS Temperature Coefficient on Offset TCV –1.0 — 1.0 mV OFF Input Impedance ZIN 1300 — 2550 Ω Output Impedance ZOUT 1400 — 3000 Ω Response Time(5) (10% to 90%) t — 1.0 — ms R Warm-Up Time — — 20 — ms Offset Stability(6) — — ±0.5 — %VFSS 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device at a different range may induce additional error due to device self-heating. 3. Full Scale Span (V ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the FSS minimum rated pressure. 4. Offset (V ) is defined as the output voltage at the minimum rated pressure. OFF 5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPX2010 Sensors 2 Freescale Semiconductor

Pressure Maximum Ratings Table2. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) P 75 kPa MAX Burst Pressure (P1 > P2) P 100 kPa BURST Storage Temperature TSTG –40 to +125 °C Operating Temperature TA –40 to +125 °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Voltage Output versus Applied Differential Pressure The output voltage of the differential or gauge sensor Figure1. shows a block diagram of the internal circuitry on increases with increasing pressure applied to the pressure the stand-alone pressure sensor chip. side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1). V S 3 Thin Film 2 Temperature +VOUT Sensing Compensation Element and Calibration 4 –V OUT Circuitry 1 GND Figure1. Temperature Compensated and Calibrated Pressure Sensor Schematic MPX2010 Sensors Freescale Semiconductor 3

Pressure On-Chip Temperature Compensation and Calibration Figure2. shows the output characteristics of the MPX2010 performance and long term reliability. Contact the factory for series at 25°C. The output is directly proportional to the information regarding media compatibility in your application. differential pressure and is essentially a straight line. LINEARITY The effects of temperature on full scale span and offset are very small and are shown under Operating Characteristics. Linearity refers to how well a transducer's output follows This performance over temperature is achieved by having the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating both the shear stress strain gauge and the thin-film resistor nonlinearity: (1) end point straight line fit (see Figure4.) or circuitry on the same silicon diaphragm. Each chip is (2)a least squares best line fit. While a least squares fit gives dynamically laser trimmed for precise span and offset calibration and temperature compensation. the “best case” linearity error (lower numerical value), the Figure3. illustrates the differential/gauge die in the basic calculations required are burdensome. chip carrier (Case 344). A silicone gel isolates the die surface Conversely, an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the and wire bonds from the environment, while allowing the calculations are more straightforward for the user. pressure signal to be transmitted to the silicon diaphragm. Freescale’s specified pressure sensor linearities are based The MPX2010 series pressure sensor operating on the end point straight line method measured at the characteristics and internal reliability and qualification tests midrange pressure. are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor V = 10 Vdc 30 S TA = 25°C 25 P1 > P2 20 TYP Vdc) 15 aMAX Span m Range ut ( 10 (Typical) p ut O 5 MIN 0 –5 Offset kPa 2.5 5 7.5 10 (Typical) PSI 0.362 0.725 1.09 1.45 Figure2. Output vs. Pressure Differential Least Least Squares Fit Square Deviation Exaggerated Performance Stainless Steel Curve Straight Line DSiieli cCoonaet Die Metal Cover utput Deviation O P1 Epoxy e g Wire Bond Case olta V e v ati End Point Straight Rel Line Fit Lead Frame RTV Die Bond P2 Offset 0 50 100 Pressure (% Full Scale) Figure3. Unibody Package: Cross Sectional Diagram Figure4. Linearity Specification Comparison (not to scale) MPX2010 Sensors 4 Freescale Semiconductor

Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor Table3. Pressure (P1) Side Delineation as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which Case Part Number Pressure (P1) Side Identifier isolates the die from the environment. The pressure sensor is Type designed to operate with positive differential pressure MPX2010D 344 Stainless Steel Cap applied, P1 > P2. The Pressure (P1) side may be identified by using the MPX2010DP 344C Side with Part Marking following table. MPX2010GP 344B Side with Port Attached MPX2010GS 344E Side with Port Attached MPX2010GSX 344F Side with Port Attached MPXV2010GP 1369 Side with Port Attached MPXV2010DP 1351 Side with Part Marking MPXM2010D/DTI 1320 Side with Part Marking MPXM2010GS/GSTI 1320A Side with Port Attached MPX2010 Sensors Freescale Semiconductor 5

Pressure PACKAGE DIMENSIONS C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME R Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD M STOP RING. MOLD STOP RING NOT TO EXCEED Z 16.00 (0.630). 1 4 B -A- 2 3 INCHES MILLIMETERS DIM MIN MAX MIN MAX A 0.595 0.630 15.11 16.00 N B 0.514 0.534 13.06 13.56 PIN 1 1 2 3 4 L C 0.200 0.220 5.08 5.59 D 0.016 0.020 0.41 0.51 -T- F 0.048 0.064 1.22 1.63 SEATING G 0.100 BSC 2.54 BSC PLANE F J 0.014 0.016 0.36 0.40 J G L 0.695 0.725 17.65 18.42 F Y M 30˚ NOM 30˚ NOM D4 PL N 0.475 0.495 12.07 12.57 0.136 (0.005) M T A M DAMBAR TRIM ZONE: R 0.430 0.450 10.92 11.43 THIS IS INCLUDED Y 0.048 0.052 1.22 1.32 WITHIN DIM. "F" 8 PL Z 0.106 0.118 2.68 3.00 STYLE 1: STYLE 2: STYLE 3: PIN 1. GROUND PIN 1. VCC PIN 1. GND 2. + OUTPUT 2. - SUPPLY 2. -VOUT 3. + SUPPLY 3. + SUPPLY 3. VS 4. - OUTPUT 4. GROUND 4. +VOUT CASE 344-15 ISSUE AA UNIBODY PACKAGE NOTES: SEATING -T- -A- 1. DIMENSIONING AND TOLERANCING PER ANSI PLANE U Y14.5M, 1982. R L 2. CONTROLLING DIMENSION: INCH. H INCHES MILLIMETERS DIM MIN MAX MIN MAX A 1.145 1.175 29.08 29.85 N B 0.685 0.715 17.40 18.16 PORT #1 -Q- C 0.305 0.325 7.75 8.26 POSITIVE PRESSURE D 0.016 0.020 0.41 0.51 (P1) F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC B H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 1 2 3 4 L 0.290 0.300 7.37 7.62 PIN 1 K N 0.420 0.440 10.67 11.18 -P- P 0.153 0.159 3.89 4.04 0.25 (0.010) M T Q S S QR 00..125330 00..125590 35..8894 46..0345 J F US 0.202.0910 B0S.2C40 5.2539.11 BS6C.10 C G D4 PL 0.13 (0.005) M T S S Q S STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT CASE 344B-01 ISSUE B UNIBODY PACKAGE MPX2010 Sensors 6 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS -A- NOTES: V U 1. DY1IM4.E5NMS, I1O9N8I2N.G AND TOLERANCING PER ANSI R PORT #1 W L 2. CONTROLLING DIMENSION: INCH. H INCHES MILLIMETERS PORT #2 PORT #2 PORT #1 DIM MIN MAX MIN MAX N V(PA2C)UUM (PPO1S)ITIVE PRESSURE AB 10..164855 10..177155 2197..0480 2198..8156 -Q- C 0.405 0.435 10.29 11.05 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 SEATING B SEATING G 0.100 BSC 2.54 BSC PLANE PLANE H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 PIN 1 1 2 3 4 K 0.695 0.725 17.65 18.42 K -P- L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 -T- -T- 0.25 (0.010)M T Q S S P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 J F R 0.063 0.083 1.60 2.11 C G S 0.220 0.240 5.59 6.10 D4 PL U 0.910 BSC 23.11 BSC V 0.248 0.278 6.30 7.06 0.13 (0.005) M T S S Q S W 0.310 0.330 7.87 8.38 STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT CASE 344C-01 ISSUE B UNIBODY PACKAGE CASE 344E-01 ISSUE B UNIBODY PACKAGE MPX2010 Sensors Freescale Semiconductor 7

Pressure PACKAGE DIMENSIONS -T- NOTES: C A 1. DIMENSIONING AND TOLERANCING PER ANSI -Q- Y14.5M, 1982. E U 2. CONTROLLING DIMENSION: INCH. INCHES MILLIMETERS DIM MIN MAX MIN MAX A 1.080 1.120 27.43 28.45 B 0.740 0.760 18.80 19.30 C 0.630 0.650 16.00 16.51 N D 0.016 0.020 0.41 0.51 V B E 0.160 0.180 4.06 4.57 F 0.048 0.064 1.22 1.63 R G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.41 PORT #1 PIN 1 K 0.220 0.240 5.59 6.10 POSITIVE -P- N 0.070 0.080 1.78 2.03 PRESSURE P 0.150 0.160 3.81 4.06 (P1) 0.25 (0.010) M T Q M 4 3 2 1 S Q 0.150 0.160 3.81 4.06 R 0.440 0.460 11.18 11.68 S 0.695 0.725 17.65 18.42 K U 0.840 0.860 21.34 21.84 V 0.182 0.194 4.62 4.92 J F G D4 PL STYPLINE 11.: GROUND 0.13 (0.005) M T P S Q S 2. V (+) OUT 3. V SUPPLY 4. V (-) OUT CASE 344F-01 ISSUE B UNIBODY PACKAGE MPX2010 Sensors 8 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX2010 Sensors Freescale Semiconductor 9

Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX2010 Sensors 10 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX2010 Sensors Freescale Semiconductor 11

Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX2010 Sensors 12 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS CASE 1320-02 ISSUE B MPAK MPX2010 Sensors Freescale Semiconductor 13

Pressure PACKAGE DIMENSIONS CASE 1320-02 ISSUE A MPAK MPX2010 Sensors 14 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS PIN 4 PIN 1 CASE 1320A-02 ISSUE A MPAK MPX2010 Sensors Freescale Semiconductor 15

Pressure PACKAGE DIMENSIONS CASE 1320-02 ISSUE A MPAK MPX2010 Sensors 16 Freescale Semiconductor

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Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: N XP: MPX2010D MPXM2010DT1 MPXV2010DP MPX2010DP MPXV2010GP MPXM2010D MPXM2010GST1 MPXM2010GS MPX2010GSX MPX2010GP