MC74LCX138 Low-Voltage CMOS 3-to-8 Decoder/Demultiplexer With 5 V−Tolerant Inputs The MC74LCX138 is a high performance, 3−to−8 http://onsemi.com decoder/demultiplexer operating from a 2.3 to 3.6 V supply. High impedance TTL compatible inputs significantly reduce current MARKING loading to input drivers while TTL compatible outputs offer improved DIAGRAMS switching noise performance. A VI specification of 5.5 V allows 16 MC74LCX138 inputs to be safely driven from 5 V devices. The MC74LCX138 is suitable for memory address decoding and other SOIC−16 LCX138G TTL level bus−oriented applications. 16 D SUFFIX AWLYWW The MC74LCX138 high−speed 3−to−8 decoder/demultiplexer 1 CASE 751B accepts three binary weighted inputs (A0, A1, A2) and, when enabled, 1 provides eight mutually exclusive active−LOW outputs (O0−O7). The 16 LCX138 features three Enable inputs, two active−LOW (E1, E2) and one active−HIGH (E3). All outputs will be HIGH unless E1 and E2 are LOW, and E3 is HIGH. This multiple enabled function allows easy TSSOP−16 LCX parallel expansion of the device to a 1−of−32 (5 lines to 32 lines) 16 DT SUFFIX 138 decoder with just four LCX138 devices and one inverter (see 1 CASE 948F ALYW(cid:2) (cid:2) Figure 1). The LCX138 can be used as an 8−output demultiplexer by using one of the active−LOW Enable inputs as the data input and the 1 other Enable inputs as strobes. The Enable inputs which are not used must be permanently tied to their appropriate active−HIGH or A = Assembly Location active−LOW state. WL, L = Wafer Lot Current drive capability is 24 mA at the outputs. Y = Year WW, W = Work Week Features G or (cid:2) = Pb−Free Package  Designed for 2.3 V to 3.6 V V Operation (Note: Microdot may be in either location) CC  5 V Tolerant Inputs − Interface Capability With 5 V TTL Logic  LVTTL Compatible ORDERING INFORMATION  LVCMOS Compatible See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet.  24 mA Balanced Output Sink and Source Capability  Near Zero Static Supply Current (10 (cid:2)A) Substantially Reduces System Power Requirements  Latchup Performance Exceeds 500 mA  ESD Performance: Human Body Model >2000 V Machine Model >200 V  NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable  These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant  Semiconductor Components Industries, LLC, 2012 1 Publication Order Number: October, 2012 − Rev. 10 MC74LCX138/D

MC74LCX138 A2 A1 A0 E1 E2 E3 3 2 1 4 5 6 VCC O0 O1 O2 O3 O4 O5 O6 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 A0 A1 A2 E1 E2 E3 O7 GND Figure 1. Pinout: 16−Lead (Top View) 7 9 10 11 12 13 14 15 O7 O6 O5 O4 O3 O2 O1 O0 Figure 2. Logic Diagram PIN NAMES Pins Function A0−A2 Address Inputs E1−E2 Enable Inputs E3 Enable Input O0−O7 Outputs TRUTH TABLE Inputs Outputs E1 E2 E3 A0 A1 A2 O0 O1 O2 O3 O4 O5 O6 O7 H X X X X X H H H H H H H H X H X X X X H H H H H H H H X X L X X X H H H H H H H H L L H L L L L H H H H H H H L L H H L L H L H H H H H H L L H L H L H H L H H H H H L L H H H L H H H L H H H H L L H L L H H H H H L H H H L L H H L H H H H H H L H H L L H L H H H H H H H H L H L L H H H H H H H H H H H L H = High Voltage Level L = Low Voltage Level X = High or Low Voltage Level and Transitions are Acceptable For ICC reasons, DO NOT FLOAT Inputs http://onsemi.com 2

MC74LCX138 A0 A1 A2 ‘04 A3 A4 H 123 123 123 123 A0A1A2 E A0A1A2 E A0A1A2 E A0A1A2 E O0O1O2O3O4O5O6O7 O0O1O2O3O4O5O6O7 O0O1O2O3O4O5O6O7 O0O1O2O3O4O5O6O7 O0 O31 Figure 3. Expansion to 1−of−32 Decoding ORDERING INFORMATION Device Package Shipping† MC74LCX138DR2G SOIC−16 2500 Tape & Reel (Pb−Free) MC74LCX138DTG TSSOP−16 96 Units / Rail (Pb−Free) MC74LCX138DTR2G TSSOP−16 2500 Tape & Reel (Pb−Free) NLV74LCX138DR2G* SOIC−16 2500 Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. MAXIMUM RATINGS Symbol Parameter Value Condition Units VCC DC Supply Voltage −0.5 to +7.0 V VI DC Input Voltage −0.5  VI  +7.0 V VO DC Output Voltage −0.5  VO  VCC + 0.5 Output in HIGH or LOW State (Note 1) V IIK DC Input Diode Current −50 VI < GND mA IOK DC Output Diode Current −50 VO < GND mA +50 VO > VCC mA IO DC Output Source/Sink Current 50 mA ICC DC Supply Current Per Supply Pin 100 mA IGND DC Ground Current Per Ground Pin 100 mA TSTG Storage Temperature Range −65 to +150 C MSL Moisture Sensitivity Level 1 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. IO absolute maximum rating must be observed. http://onsemi.com 3

MC74LCX138 RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Typ Max Units VCC Supply Voltage Operating Data Retention Only 2.0 2.5, 3.3 3.6 V 1.5 2.5, 3.3 3.6 VI Input Voltage 0 5.5 V VO Output Voltage (HIGH or LOW State) (3−State) 0 VCC V IOH HIGH Level Output Current VCC = 3.0 V − 3.6 V −24 mA VCC = 2.7 V − 3.0 V −12 VCC = 2.3 V − 2.7 V −8 IOL LOW Level Output Voltage VCC = 3.0 V − 3.6 V +24 mA VCC = 2.7 V − 3.0 V +12 VCC = 2.3 V − 2.7 V +8 TA Operating Free−Air Temperature −40 +85 C (cid:3)t/(cid:3)V Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V 0 10 ns/V DC ELECTRICAL CHARACTERISTICS TA = −40C to +85C Symbol Characteristic Condition Min Max Units VIH HIGH Level Input Voltage (Note 2) 2.3 V  VCC  2.7 V 1.7 V 2.7 V  VCC  3.6 V 2.0 VIL LOW Level Input Voltage (Note 2) 2.3 V  VCC  2.7 V 0.7 V 2.7 V  VCC  3.6 V 0.8 VOH HIGH Level Output Voltage 2.3 V  VCC  3.6 V; IOH = −100 (cid:2)A VCC−0.2 V VCC = 2.3 V; IOH = −8 mA 1.8 VCC = 2.7 V; IOH = −12 mA 2.2 VCC = 3.0 V; IOH = −18 mA 2.4 VCC = 3.0 V; IOH = −24 mA 2.2 VOL LOW Level Output Voltage 2.3 V  VCC  3.6 V; IOL = 100 (cid:2)A 0.2 V VCC = 2.3 V; IOL = 8 mA 0.6 VCC = 2.7 V; IOL = 12 mA 0.4 VCC = 3.0 V; IOL = 16 mA 0.4 VCC = 3.0 V; IOL = 24 mA 0.55 IOFF Power Off Leakage Current VCC = 0, VIN = 5.5 V or VOUT = 5.5 V 10 (cid:2)A IIN Input Leakage Current VCC = 3.6 V, VIN = 5.5 V or GND 5 (cid:2)A ICC Quiescent Supply Current VCC = 3.6 V, VIN = 5.5 V or GND 10 (cid:2)A (cid:3)ICC Increase in ICC per Input 2.3  VCC  3.6 V; VIH = VCC − 0.6 V 500 (cid:2)A 2. These values of VI are used to test DC electrical characteristics only. AC CHARACTERISTICS (tR = tF = 2.5 ns; RL = 500 (cid:4)) Limits TA = −40C to +85C VCC = 3.3 V  0.3 V VCC = 2.7 V VCC = 2.5 V  0.2 V CL = 50 pF CL = 50 pF CL = 30 pF Symbol Parameter Waveform Min Max Min Max Min Max Units tPLH Propagation Delay 1, 2 1.5 6.0 1.5 7.0 1.5 7.2 ns tPHL An to On 1.5 6.0 1.5 7.0 1.5 7.2 tPLH Propagation Delay 2 1.5 6.5 1.5 7.5 1.5 8.4 ns tPHL E1, E2 to On 1.5 6.5 1.5 7.5 1.5 8.4 tPLH Propagation Delay 1 1.5 6.0 1.5 7.0 1.5 7.2 ns tPHL E3 to On 1.5 6.0 1.5 7.0 1.5 7.2 tOSHL Output−to−Output Skew 1.0 ns tOSLH (Note 3) 1.0 3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter guaranteed by design. http://onsemi.com 4

MC74LCX138 CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Units CIN Input Capacitance VCC = 3.3 V, VI = 0 V or VCC 7 pF COUT Output Capacitance VCC = 3.3 V, VI = 0 V or VCC 8 pF CPD Power Dissipation Capacitance 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 25 pF VCC An, E3 Vmi Vmi 0 V tPHL tPLH VOH On Vmo Vmo VOL WAVEFORM 1: PROPAGATION DELAYS FOR INVERTING OUTPUTS 2.7 V Vmi Vmi An, E1, E2 0 V tPHL tPLH VOH On Vmo Vmo VOL WAVEFORM 2: PROPAGATION DELAYS FOR NON−INVERTING OUTPUTS Vcc Symbol 3.3 V + 0.3 V 2.7 V 2.5 V + 0.2 V Vmi 1.5 V 1.5 V Vcc/2 Vmo 1.5 V 1.5 V Vcc/2 Figure 4. AC Waveforms VCC PULSE DUT GENERATOR RT CL RL CL= 50 pF at VCC = 3.3  0.3 V or equivalent (includes jig and probe capacitance) CL= 30 pF at VCC = 2.5  0.2 V or equivalent (includes jig and probe capacitance) RL= R1 = 500 (cid:4) or equivalent RT= ZOUT of pulse generator (typically 50 (cid:4)) Figure 5. Test Circuit http://onsemi.com 5

MC74LCX138 PACKAGE DIMENSIONS TSSOP−16 DT SUFFIX CASE 948F ISSUE B 16X K REF NOTES: 0.10 (0.004) M T U S V S 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 0.15 (0.006) T U S K 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD K1 FLASH. PROTRUSIONS OR GATE BURRS. ÇÉÇÉÇÉ MOLD FLASH OR GATE BURRS SHALL NOT 16 9 EXCEED 0.15 (0.006) PER SIDE. 2XL/2 J1 ÇÉÇÉÇÉ 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL B SECTION N−N NOT EXCEED 0.25 (0.010) PER SIDE. L −U− J 5D.ADMIMBAERN SPIROONT KR UDSOIEOSN N. AOLTL OINWCALUBLDEE DAMBAR PROTRUSION SHALL BE 0.08 PIN 1 (0.003) TOTAL IN EXCESS OF THE K IDENT. N DIMENSION AT MAXIMUM MATERIAL 1 8 0.25 (0.010) CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. M 7. DIMENSION A AND B ARE TO BE 0.15 (0.006) T U S DETERMINED AT DATUM PLANE −W−. A N MILLIMETERS INCHES −V− DIM MIN MAX MIN MAX F A 4.90 5.10 0.193 0.200 B 4.30 4.50 0.169 0.177 DETAIL E C −−− 1.20 −−− 0.047 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC C −W− H 0.18 0.28 0.007 0.011 J 0.09 0.20 0.004 0.008 J1 0.09 0.16 0.004 0.006 0.10 (0.004) K 0.19 0.30 0.007 0.012 −T− SEATING H DETAIL E K1 0.19 0.25 0.007 0.010 PLANE D G ML 06 .(cid:3) 4 0 BSC8 (cid:3) 00. 2(cid:3) 52 BSC8 (cid:3) SOLDERING FOOTPRINT* 7.06 1 0.65 PITCH 16X 16X 0.36 1.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6

MC74LCX138 PACKAGE DIMENSIONS SOIC−16 D SUFFIX CASE 751B−05 −A− ISSUE K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE 16 9 MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) −B− P8 PL PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR 0.25 (0.010) M B S PROTRUSION. ALLOWABLE DAMBAR 1 8 PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. G MILLIMETERS INCHES DIM MIN MAX MIN MAX A 9.80 10.00 0.386 0.393 B 3.80 4.00 0.150 0.157 K R X 45(cid:3) F CD 10..3355 10..7459 00..005144 00..006189 F 0.40 1.25 0.016 0.049 C G 1.27 BSC 0.050 BSC J 0.19 0.25 0.008 0.009 −T− SEATING K 0.10 0.25 0.004 0.009 PLANE M J M 0 (cid:3) 7 (cid:3) 0 (cid:3) 7 (cid:3) P 5.80 6.20 0.229 0.244 D 16 PL R 0.25 0.50 0.010 0.019 0.25 (0.010) M T B S A S SOLDERING FOOTPRINT* 8X 6.40 16X1.12 1 16 16X 0.58 1.27 PITCH 8 9 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free ON Semiconductor Website: www.onsemi.com Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 5163, Denver, Colorado 80217 USA Europe, Middle East and Africa Technical Support: Order Literature: http://www.onsemi.com/orderlit Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Japan Customer Focus Center For additional information, please contact your local Email: orderlit@onsemi.com Phone: 81−3−5817−1050 Sales Representative http://onsemi.com MC74LCX138/D 7