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  • 型号: EE-SX1108
  • 制造商: Omron Electronics LLC
  • 库位|库存: xxxx|xxxx
  • 要求:
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EE-SX1108产品简介:

ICGOO电子元器件商城为您提供EE-SX1108由Omron Electronics LLC设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 EE-SX1108价格参考。Omron Electronics LLCEE-SX1108封装/规格:光学传感器 - 光断续器 - 槽型 - 晶体管输出, Optical Sensor Transmissive 0.079" (2mm) Phototransistor 4-SMD。您可以下载EE-SX1108参考资料、Datasheet数据手册功能说明书,资料中有EE-SX1108 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

传感器,变送器

描述

OPTO SENSOR SLOT TYPE 2MM SMT光学开关(透射型,光电晶体管输出) TRANSMISSIVE

产品分类

光学传感器 - 光断续器 - 槽型 - 晶体管输出

品牌

Omron Electronics Inc-EMC Div

产品手册

点击此处下载产品Datasheet

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

光学开关(透射型,光电晶体管输出),Omron Electronics EE-SX1108-

数据手册

点击此处下载产品Datasheet

产品型号

EE-SX1108

上升时间

10 us

下降时间

10 us

产品目录页面

点击此处下载产品Datasheet

产品种类

光学开关(透射型,光电晶体管输出)

光圈宽度

0.3 mm

其它名称

EESX1108
OR637TR

其它有关文件

点击此处下载产品Datasheet

功率耗散

75 mW

包装

带卷 (TR)

响应时间

10µs, 10µs

商标

Omron Electronics

安装类型

表面贴装

安装风格

SMD/SMT

封装

Reel

封装/外壳

4-SMD

工作温度

-30°C ~ 85°C

工厂包装数量

2000

感应方式

Transmissive, Slotted

感应方法

可传导的

感应距离

0.079"(2mm)

最大工作温度

+ 85 C

最大集电极电流

20 mA

最小工作温度

- 30 C

标准包装

2,000

槽宽

2 mm

正向电流

5 mA

波长

940 nm

特色产品

http://www.digikey.cn/product-highlights/zh/nonamplified-photomicrosensors/52959

电压-集射极击穿(最大值)

20V

电流-DC正向(If)

25mA

电流-集电极(Ic)(最大值)

20mA

类型

无放大

系列

EE-SX1108

输出设备

Phototransistor

输出配置

光电晶体管

集电极—发射极最大电压VCEO

20 V

零件号别名

3168682 367410 EESX1108NC

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PDF Datasheet 数据手册内容提取

Photomicrosensor (Transmissive) EE-SX1108 Be sure to read Precautions on page24. ■ Dimensions ■ Features Note:All units are in millimeters unless otherwise indicated. (cid:129)Ultra-compact with a 5-mm-wide sensor and a 2-mm-wide slot. (cid:129)PCB surface mounting type. (cid:129)High resolution with a 0.3-mm-wide aperture. ■ Absolute Maximum Ratings (Ta = 25°C) Item Symbol Rated value Emitter Forward current I 25 mA F (seenote 1) Pulse forward cur- I 100 mA FP rent (seenote2) Reverse voltage V 5 V R Oaxpistical Detector Collector–Emitter VCEO 20 V voltage Emitter–Collector V 5 V ECO voltage Cross section AA Collector current I 20 mA C Recommended Collector dissipa- P 75 mW Internal Circuit Soldering Pattern tion C (seenote 1) Ambient tem- Operating Topr –30°C to 85°C perature Storage Tstg –40°C to 90°C Reflow soldering Tsol 255°C (see note 3) Terminal No. Name Manual soldering Tsol 350°C A Anode (see note 3) K Cathode Unless otherwise specified, the Note:1. Refer to the temperature rating chart if the ambient temper- C Collector tolerances are ±0.15 mm. ature exceeds 25°C. E Emitter 2. Duty: 1/100; Pulse width: 0.1 ms 3. Complete soldering within 10 seconds for reflow soldering and within 3 seconds for manual soldering. ■ Electrical and Optical Characteristics (Ta = 25°C) Item Symbol Value Condition Emitter Forward voltage V 1.1 V typ., 1.3 V max. I = 5 mA F F Reverse current I 10 μA max. V = 5 V R R Peak emission wavelength λ 940 nm typ. I = 20 mA P F Detector Light current I 50 μA min., 150 μA typ., I = 5 mA, V = 5 V L F CE 500 μA max. Dark current I 100 nA max. V = 10 V, 0 lx D CE Leakage current I --- --- LEAK Collector–Emitter saturated voltage V (sat) 0.1 V typ., 0.4 V max. I = 20 mA, I = 50 μA CE F L Peak spectral sensitivity wavelength λ 900 nm typ. --- P Rising time tr 10 μs typ. V = 5 V, R = 1 kΩ, CC L I = 100μA L Falling time tf 10 μs typ. V = 5 V, R = 1 kΩ, CC L I = 100μA L 32 EE-SX1108 Photomicrosensor (Transmissive)

■ Engineering Data Forward Current vs. Collector Forward Current vs. Forward Light Current vs. Forward Current Dissipation Temperature Rating Voltage Characteristics (Typical) Characteristics (Typical) Forward current I (mA)F ollector dissipation P (mW)C Forward current I (mA)F μLight current I (A)L TVaC E= = 2 55 °VC C Ambient temperature Ta (°C) Forward voltage VF (V) Forward current IF (mA) Light Current vs. Collector−Emitter Relative Light Current vs. Ambient Dark Current vs. Ambient Tem- Voltage Characteristics (Typical) Temperature Characteristics (Typical)perature Characteristics (Typical) Ta = 25°C %) μLight current I (A)L IIFF == 150 m mAA ative light current I (L VIFC =E 5= m5 AV Dark current I (nA)D VCE = 10 V VCE = 2 V el R Collector−Emitter voltage VCE (V) Ambient temperature Ta (°C) Ambient temperature Ta (°C) Response Time vs. Load Resist- Sensing Position Characteristics Sensing Position Characteristics ance Characteristics (Typical) (Typical) (Typical) s) VTaC C= = 2 55° VC %) IVFC =E 5= m5 AV %) IVFC =E 5= m5 AV μResponse time tr, tf ( Relative light current I (L Relative light current I (L Load resistance RL (kΩ) Distance d (mm) Distance d (mm) Response Time Measurement Circuit Input 90 % Output 10 % Input Output EE-SX1108 Photomicrosensor (Transmissive) 33

Unit: mm (inch) ■ Tape and Reel Reel 21±0.8 dia. 2±0.5 330±2 dia. 13± 0.5 dia. 80±1 dia. Product name Quantity Lot number 12.4+02 18.4 max. Tape 1.5 dia. Tape configuration Terminating part Parts mounted Leading part (40 mm min.) (400 mm min.) Empty Pull-out direction (40 mm min.) Tape quantity 2,000 pcs./reel 34 EE-SX1108 Photomicrosensor (Transmissive)

Precautions ■ Soldering Information Reflow soldering (cid:129)The following soldering paste is recommended: Melting temperature: 216 to 220°C Composition: Sn 3.5 Ag 0.75 Cu (cid:129)The recommended thickness of the metal mask for screen printing is between 0.2 and 0.25 mm. (cid:129)Set the reflow oven so that the temperature profile shown in the following chart is obtained for the upper surface of the product being soldered. 260°C max. 1 to 5°C/s 255°C max. 230°C max. ure 1 to 5°C/s 150 to 180°C at er p m Te 10 sec max. 120 sec 40 sec max. Time Manual soldering (cid:129)Use ”Sn 60” (60% tin and 40% lead) or solder with silver content. (cid:129)Use a soldering iron of less than 25 W, and keep the temperature of the iron tip at 300°C or below. (cid:129)Solder each point for a maximum of three seconds. (cid:129)After soldering, allow the product to return to room temperature before handling it. Storage To protect the product from the effects of humidity until the package is opened, dry-box storage is recommended. If this is not possible, store the product under the following conditions: Temperature: 10 to 30°C Humidity: 60% max. The product is packed in a humidity-proof envelope. Reflow soldering must be done within 48 hours after opening the envelope, during which time the product must be stored under 30°C at 80% maximum humidity. If it is necessary to store the product after opening the envelope, use dry-box storage or reseal the envelope. Baking If a product has remained packed in a humidity-proof envelope for six months or more, or if more than 48 hours have lapsed since the envelope was opened, bake the product under the following conditions before use: Reel: 60°C for 24 hours or more Bulk: 80°C for 4 hours or more EE-SX1108 Photomicrosensor (Transmissive) 35