DS26LV31T www.ti.com SNLS114C–MARCH1999–REVISEDFEBRUARY2013 DS26LV31T 3V Enhanced CMOS Quad Differential Line Driver CheckforSamples:DS26LV31T FEATURES • StandardMicrocircuitDrawing(SMD)5962- 1 98584 • IndustrialProductMeetsTIA/EIA-422-B(RS- 2 422)andITU-TV.11Recommendation DESCRIPTION • MilitaryProductConformstoTIA/EIA-422-B The DS26LV31T is a high-speed quad differential (RS-422) CMOS driver that meets the requirements of both • InteroperablewithExisting5VRS-422 TIA/EIA-422-B and ITU-T V.11. The CMOS Networks DS26LV31T features low static I of 100 μA MAX CC • IndustrialandMilitarytemperatureRange which makes it ideal for battery powered and power consciousapplications. • GuaranteedV of2VminOverOperating OD Conditions Differential outputs have the same V guarantee OD (≥2V)asthe5Vversion. • BalancedOutputCrossoverforLowEMI (TypicalWithin40mVof50%VoltageLevel) The EN and EN* inputs allow active Low or active • LowPowerDesign(330μW@3.3Vstatic) High control of the TRI-STATE outputs. The enables are common to all four drivers. Protection diodes • ESD≥ 7kVonCableI/OPins(HBM) protect all the driver inputs against electrostatic • GuaranteedACParameter: discharge. Outputs have enhanced ESD protection – MaximumDriverSkew: 2ns providing greater than 7 kV tolerance. The driver and enable inputs (DI, EN, EN*) are compatible with low – MaximumTransitionTime: 10ns voltageLVTTLandLVCMOSdevices. • PinCompatiblewithDS26C31 • AvailableinSOICandCLGAPackaging Connection Diagram Figure1. Dual-In-LinePackage TopView SeePackageD(R-PDSO-G16) 1 Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsof TexasInstrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet. Alltrademarksarethepropertyoftheirrespectiveowners. 2 PRODUCTIONDATAinformationiscurrentasofpublicationdate. Copyright©1999–2013,TexasInstrumentsIncorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarilyincludetestingofallparameters.

DS26LV31T SNLS114C–MARCH1999–REVISEDFEBRUARY2013 www.ti.com Truth Table(1) Enables Input Outputs EN EN* DI DO+ DO− L H X Z Z Allother L L H combinationsof H H L enableinputs (1) L=Lowlogicstate X=Irrelevant H=Highlogicstate Z=TRI-STATE Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. Absolute Maximum Ratings(1)(2) SupplyVoltage(V ) −0.5Vto+7V CC EnableInputVoltage(EN,EN*) −0.5VtoV +0.5V CC DriverInputVoltage(DI) −0.5VtoV +0.5V CC ClampDiodeCurrent ±20mA DCOutputCurrent,perpin ±150mA DriverOutputVoltage (PowerOff:DO+,DO−) −0.5Vto+7V MaximumPackagePowerDissipation@+25°C D0016APackage 1226mW NAD0016APackage 1119mW DerateD0016APackage9.8mW/°Cabove+25°C DerateNAD0016APackage7.5mW/°Cabove+25°C StorageTemperatureRange −65°Cto+150°C LeadTemperatureRangeSoldering(4sec.) +260°C ESDRatings(HBM,1.5kΩ,100pF) DriverOutputs ≥7kV OtherPins ≥2.5kV (1) “AbsoluteMaximumRatings”arethosevaluesbeyondwhichthesafetyofthedevicecannotbeguaranteed.Theyarenotmeantto implythatthedevicesshouldbeoperatedattheselimits.TheElectricalCharacteristicsspecifiesconditionsofdeviceoperation. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTISalesOffice/Distributorsforavailabilityandspecifications. Recommended Operating Conditions Min Typ Max Units SupplyVoltage(V ) 3.0 3.3 3.6 V CC OperatingFreeAirTemperatureRange(T ) A DS26LV31T −40 +25 +85 °C DS26LV31W −55 +25 +125 °C InputRiseandFallTime 500 ns 2 SubmitDocumentationFeedback Copyright©1999–2013,TexasInstrumentsIncorporated ProductFolderLinks:DS26LV31T

DS26LV31T www.ti.com SNLS114C–MARCH1999–REVISEDFEBRUARY2013 Electrical Characteristics(1) (2) Oversupplyvoltageandoperatingtemperatureranges,unlessotherwisespecified Parameter TestConditions Pin Min Typ Max Units V OutputDifferentialVoltage R =∞(NoLoad) DO+, 3.3 4 V OD1 L DO− V OutputDifferentialVoltage R =100Ω(Figure2) 2 2.6 V OD2 L ΔV ChangeinMagnitudeof I ≥20mA OD2 O −400 7 400 mV OutputDifferentialVoltage V OutputDifferentialVoltage R =3900Ω(V.11) 3.2 3.6 V OD3 L Figure2and (3) V CommonModeVoltage R =100Ω(Figure2) 1.5 2 V OC L ΔV ChangeinMagnitudeof OC −400 6 400 mV CommonModeVoltage I TRI-STATELeakage V =V orGND OZ OUT CC ±0.5 ±20 μA Current DriversDisabled I OutputShortCircuitCurrent V =0V T =-40°Cto+85°C −40 −70 −150 mA SC OUT A V =V or IN CC T =-55°Cto -30 -160 mA GND (4) +1A25°C (5) I OutputLeakageCurrent V =0V,V =3Vor6V 0.03 100 μA OFF CC OUT V =0V,V = T =-40°Cto+85°C −0.08 −100 μA CC OUT A −0.25V T =-55°Cto -200 μA A +125°C V HighLevelInputVoltage DI, 2.0 V V IH CC V LowLevelInputVoltage EN, GND 0.8 V IL I HighLevelInputCurrent V =V EN* 10 μA IH IN CC I LowLevelInputCurrent V =GND −10 μA IL IN V InputClampVoltage I =−18mA −1.5 V CL IN I PowerSupplyCurrent NoLoad,V (all)=V T =-40°Cto+85°C V 100 μA CC IN CC A CC orGND T =-55°Cto 125 μA A +125°C (1) Currentintodevicepinsisdefinedaspositive.Currentoutofdevicepinsisdefinedasnegative.Allvoltagesarereferencedtoground exceptdifferentialvoltagesV ,V ,V . OD1 OD2 OD3 (2) AlltypicalsaregivenforV =+3.3V,T =+25°C. CC A (3) ThisspecificationlimitisforcompliancewithTIA/EIA-422-BandITU-TV.11. (4) Onlyoneoutputshortedatatime.Theoutput(trueorcomplement)isconfiguredHigh. (5) ThisparameterdoesnotmeettheTIA/EIA-422-Bspecification. Switching Characteristics - Industrial (1) (2) Oversupplyvoltageand-40°Cto+85°Coperatingtemperaturerange,unlessotherwisespecified Parameter TestConditions Min Typ Max Units t DifferentialPropagationDelayHightoLow R =100Ω,C =50pF PHLD L L 6 10.5 16 ns (Figure3andFigure4) t DifferentialPropagationDelayLowtoHigh 6 11 16 ns PLHD t DifferentialSkew(same SKD 0.5 2.0 ns channel)|t −t | PHLD PLHD t Skew,PintoPin(samedevice) 1.0 2.0 ns SK1 t Skew,ParttoPart (3) 3.0 5.0 ns SK2 t DifferentialTransitionTime TLH 4.2 10 ns LowtoHigh(20%to80%) t DifferentialTransitionTime THL 4.7 10 ns HightoLow(80%to20%) t DisableTimeHightoZ (Figure5Figure6) 12 20 ns PHZ t DisableTimeLowtoZ 9 20 ns PLZ (1) f=1MHz,t andt ≤6ns,10%to90%. r f (2) SeeTIA/EIA-422-Bspecificationsforexacttestconditions. (3) DevicesareatthesameV andwithin5°Cwithintheoperatingtemperaturerange CC Copyright©1999–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:DS26LV31T

DS26LV31T SNLS114C–MARCH1999–REVISEDFEBRUARY2013 www.ti.com Switching Characteristics - Industrial (1) (2) (continued) Oversupplyvoltageand-40°Cto+85°Coperatingtemperaturerange,unlessotherwisespecified Parameter TestConditions Min Typ Max Units t EnableTimeZtoHigh 22 32 ns PZH t EnableTimeZtoLow 22 32 ns PZL f MaximumOperating 32 max Frequency (4) MHz (4) Allchannelsswitching,outputdutycyclecriteriais40%/60%measuredat50%.Thisparameterisguaranteedbydesignand characterization. Switching Characteristics - Military (1) (2) Oversupplyvoltageand-55°Cto+125°Coperatingtemperaturerange,unlessotherwisespecified Parameter TestConditions Min Max Units t DifferentialPropagationDelayHightoLow R =100Ω,C =50pF PHLD L L 5 25 ns (Figure3Figure4) t DifferentialPropagationDelayLowtoHigh 5 25 ns PLHD t DifferentialSkew(same SKD 5.0 ns channel)|t −t | PHLD PLHD t Skew,PintoPin(samedevice) 5.0 ns SK1 t DisableTimeHightoZ (Figure5Figure6) 35 ns PHZ t DisableTimeLowtoZ 35 ns PLZ t EnableTimeZtoHigh 40 ns PZH t EnableTimeZtoLow 40 ns PZL (1) f=1MHz,t andt ≤6ns,10%to90%. r f (2) SeeTIA/EIA-422-Bspecificationsforexacttestconditions. 4 SubmitDocumentationFeedback Copyright©1999–2013,TexasInstrumentsIncorporated ProductFolderLinks:DS26LV31T

DS26LV31T www.ti.com SNLS114C–MARCH1999–REVISEDFEBRUARY2013 PARAMETER MEASUREMENT INFORMATION Figure2. DifferentialDriverDCTestCircuit Figure3. DifferentialDriverPropagationDelayandTransitionTimeTestCircuit A. Generatorwaveformforalltestsunlessotherwisespecified:f=1MHz,DutyCycle=50%Z =50Ω,t ≤10ns,t ≤ o r f 10. B. C includesprobeandfixturecapacitance. L Figure4. DifferentialDriverPropagationDelayandTransitionTimeWaveforms Copyright©1999–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:DS26LV31T

DS26LV31T SNLS114C–MARCH1999–REVISEDFEBRUARY2013 www.ti.com IfENistheinput,thenEN*=High IfEN*istheinput,thenEN=Low Figure5. DriverSingle-EndedTRI-STATETestCircuit Figure6. DriverSingle-EndedTRI-STATEWaveforms 6 SubmitDocumentationFeedback Copyright©1999–2013,TexasInstrumentsIncorporated ProductFolderLinks:DS26LV31T

DS26LV31T www.ti.com SNLS114C–MARCH1999–REVISEDFEBRUARY2013 Typical Application Information General application guidelines and hints for differential drivers and receivers may be found in the following applicationnotes: • AN-214 • AN-457 • AN-805 • AN-847 • AN-903 • AN-912 • AN-916 PowerDecouplingRecommendations: Bypass caps must be used on power pins. High frequency ceramic (surface mount is recommended) 0.1 μF in parallel with 0.01 μF at the power supply pin. A 10 μF or greater solid tantalum or electrolytic should be connectedatthepowerentrypointontheprintedcircuitboard. R isoptionalalthoughhighlyrecommendedtoreducereflection. T Figure7. TypicalDriverConnection Figure8. TypicalDriverOutputWaveforms Copyright©1999–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:DS26LV31T

DS26LV31T SNLS114C–MARCH1999–REVISEDFEBRUARY2013 www.ti.com REVISION HISTORY ChangesfromRevisionB(February2013)toRevisionC Page • ChangedlayoutofNationalDataSheettoTIformat............................................................................................................ 7 8 SubmitDocumentationFeedback Copyright©1999–2013,TexasInstrumentsIncorporated ProductFolderLinks:DS26LV31T

PACKAGE OPTION ADDENDUM www.ti.com 23-Aug-2017 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) DS26LV31TM LIFEBUY SOIC D 16 48 TBD Call TI Call TI -40 to 85 DS26LV31 TM DS26LV31TM/NOPB ACTIVE SOIC D 16 48 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 DS26LV31 & no Sb/Br) TM DS26LV31TMX LIFEBUY SOIC D 16 2500 TBD Call TI Call TI -40 to 85 DS26LV31 TM DS26LV31TMX/NOPB ACTIVE SOIC D 16 2500 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 DS26LV31 & no Sb/Br) TM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 23-Aug-2017 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2018 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) DS26LV31TMX/NOPB SOIC D 16 2500 330.0 16.4 6.5 10.3 2.3 8.0 16.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2018 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) DS26LV31TMX/NOPB SOIC D 16 2500 367.0 367.0 35.0 PackMaterials-Page2

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