NT *RoHS VCEOARVMSIAPILOLINAASB LE Features Applications NT MPLIA n Lead free device n Portable electronics O HS C n RoHS compliant* n Cellular phones *Ro n Protects four lines n Video/graphics cards A 38 n ESD and EFT protection n USB 2.0 interface 0 1 L n Low capacitance: <5 pF n Sensor interface REE D F LEA CDSOT23-SR208 — Steering Diode Array General Information Tcchohamel lpmeonangrekinnegttss t. h oef psoermtaicbolen dcuocmtomr uinndicuasttioryn stoL,VE EAcdRDH oSeISF OmRvCNEOeSE pMAlPuoRLIE tpAiNn Ti*gn carneda svinidgelyo semquailplemr eenlet catrroen ic I/O6 4 RE5F 2 I/O4 3 Ro Bourns offers Transient Voltage Suppressor Array diodes for EFT and ESD protection applications, in compact chip package SOT23-6 size format. Bourns® Chip Diodes conform to JEDEC standards, are easy to handle on standard pick and place equipment and their flat configuration minimizes roll away. The Bourns® device will meet IEC 61000-4-2 (ESD) and IEC 61000-4-4 (EFT) requirements. 1 2 3 I/O 1 REF 1 I/O 2 Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted) Parameter Symbol Min. Nom. Max. Unit Repetitive Peak Forward Current (tp = 5 µs, F = 50 KHz) IFRM 700 mA Continuous Power Dissipation PPC 500 mW Forward Voltage @ 50 mA VF 1.2 V Repetitive Peak Reverse Voltage @ 10 µA VRRM 20 V Reverse Leakage Current @ VRRM 5 V IR 1 µA Capacitance 1 Cj(SD) 5 pF Forward Surge Rating (1/20 s @ 25 °C, IF = 10 mA) VF 1.5 V Note: 1. Apply a 5 V bias between pin 2 (REF 1) to pin 5 (REF 2). Measure Cj between any I/O pins to pin 5 (REF 2) and divide by two. Thermal Characteristics (@ TA = 25 °C Unless Otherwise Noted) Parameter Symbol Min. Nom. Max. Unit Operating Temperature TJ -55 +25 +150 °C Storage Temperature TSTG -55 +25 +150 °C *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.

CDSOT23-SR208 — Steering Diode Array Mechanical Characteristics This is a molded JEDEC SOT23-6 package with lead free 100 % Tin (Sn) on the lead frame. It weighs approximately 15 mg and has a flammability rating of UL 94V-0. Product Dimensions Recommended Footprint 0.35 - 0.50 2.40 (0.014 - 0.020) (0.094) 0.85 - 1.05 (0.033 - 0.040) 6 5 4 0.20 2.60 - 3.00 (0.007) 0 - 10 ° (0.102 - 0.118) 1.90 1 2 3 (0.074) 1.50 - 1.75 0.09 - 0.20 0.95 1.70 - 2.10 (0.059 - 0.070) (0.004 - 0.008) (0.037) (0.067 - 0.083) 0.35 - 0.55 0.70 2.80 - 3.05 (0.014 - 0.022) (0.028) (0.110 - 0.120) 1.00 0.90 - 1.30 0.90 - 1.45 (0.039) (0.035 - 0.051) (0.036 - 0.057) DIMENSIONS =MILLIMETERS (INCHES) DIMENSIONS =MILLIMETERS (INCHES) How to Order Typical Part Marking CD SOT23 - SR 208 2-DIGIT PRODUCT CODE Common Code CD = Chip Diode MANUFACTURING DATE CODE: Package Y = YEAR SOT23 = SOT23-6 Package WW = WEEK Model A3YWWL L = LOT CODE SR = Steering Diode Model Number 208 Environmental Specifications Moisture Sensitivity Level ................................................................1 ESD Classification (HBM)................................................................2 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.

CDSOT23-SR208 — Steering Diode Array Performance Graphs Peak Forward Current vs. Forward Voltage Low Forward Current vs. Forward Voltage 10 110 10 110 I – Forward Current (A)F 6842 I – Forward Current (A)I – Forward Current (mA)FF 357900006842 I – Forward Current (mA)F 35790000 0 10 0 10 0 1 2 3 4 5 6 7 8 9 10 800 840 880 920 960 1000 0 1 2 3 4 5 6 7 8 9 10 800 840 880 920 960 1000 VF – Forward Voltage (V) VF –V FF o–r Fwoarrwda Vrdo lVtaogltea (gme V(V)) VF – Forward Voltage (mV) Block Diagram Power Derating Curve I/O 4 REF 2 I/O 3 100 100 6 5 4 Peak Pulse Power Peak Pulse Power Power 80 8/20 µs d Power 6800 8/20 µs % of Rated 4600 % of Rate 40 20 20 Average Power Average Power 0 0 1 2 3 0 25 50 75 100 125 150 0 I/O 215 50 REF 1 75 10I0/O 2 125 150 TL – Lead Temperature (°C) TL – Lead Temperature (°C) Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.

CDSOT23-SR208 — Steering Diode Array Packaging Information The product is packaged in tape and reel format per EIA-481 standard. P0 PART ORIENTATION d P1 E T Index Hole 120 ° F D2 W B PIN 1 D1 D P A C Trailer Device Leader ....... ....... ....... ....... W1 End ....... ....... ....... ....... Start 10 pitches (min.) 10 pitches (min.) Direction of Feed Item Symbol SOT23-6 3.90 ± 0.10 Carrier Width A (0.154 ± 0.004) 3.90 ± 0.10 Carrier Length B (0.154 ± 0.004) 0.90 ± 0.10 Carrier Depth C (0.035 ± 0.004) 1.55 ± 0.05 Sprocket Hole d (0.061 ± 0.002) 178 Reel Outside Diameter D (7.008) 50.0 Reel Inner Diameter D1 (1.969) MIN. 13.0 ± 0.20 Feed Hole Diameter D2 (0.512 ± 0.008) 1.75 ± 0.10 Asia-Pacific: Sprocket Hole Position E (0.069 ± 0.004) Tel: +886-2 2562-4117 3.50 ± 0.05 Fax: +886-2 2562-4116 Punch Hole Position F (0.138 ± 0.002) Europe: 4.00 ± 0.10 Tel: +41-41 768 5555 Punch Hole Pitch P (0.157 ± 0.004) Fax: +41-41 768 5510 4.00 ± 0.10 The Americas: Sprocket Hole Pitch P0 (0.157 ± 0.004) Tel: +1-951 781-5500 2.00 ± 0.05 Fax: +1-951 781-5700 Embossment Center P1 (0.079 ± 0.002) www.bourns.com 0.20 ± 0.10 Overall Tape Thickness T (0.008 ± 0.004) 8.00 ± 0.20 Tape Width W (0.315 ± 0.008) REV. 01/18 14.4 Reel Width W1 (0.567) MAX. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different Quantity per Reel -- 3000 applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.