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  • 型号: ATS-51330D-C1-R0
  • 制造商: ADVANCED THERMAL SOLUTIONS
  • 库位|库存: xxxx|xxxx
  • 要求:
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ATS-51330D-C1-R0产品简介:

ICGOO电子元器件商城为您提供ATS-51330D-C1-R0由ADVANCED THERMAL SOLUTIONS设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 提供ATS-51330D-C1-R0价格参考以及ADVANCED THERMAL SOLUTIONSATS-51330D-C1-R0封装/规格参数等产品信息。 你可以下载ATS-51330D-C1-R0参考资料、Datasheet数据手册功能说明书, 资料中有ATS-51330D-C1-R0详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
品牌

Advanced Thermal Solutions

产品目录

热管理产品

描述

散热片 MAXIGRIP HTSNK 33 X 33 X 9.5 (MM)

产品分类

散热片

产品手册

产品图片

rohs

符合RoHS

产品系列

Advanced Thermal Solutions ATS-51330D-C1-R0

mouser_ship_limit

该产品可能需要其他文件才能进口到中国。

产品型号

ATS-51330D-C1-R0

产品

Heat Sinks

产品种类

散热片

商标

Advanced Thermal Solutions

安装风格

Clip

宽度

33 mm

封装

Bulk

工厂包装数量

100

散热片材料

Aluminum

散热片样式

Angled

热阻

5.87 C/W

系列

maxiGRIP

设计目的

BGA

长度

33 mm

颜色

Black

高度

9.5 mm

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PDF Datasheet 数据手册内容提取

BGA Heat Sink - High Performance maxiFLOW/maxiGRIP-Low Profile ATS Part#: ATS-51330D-C1-R0 Description: 33.00 x 33.00 x 9.50 mm BGA Heat Sink - High Performance maxiFLOW/maxiGRIP- Low Profile Heat Sink Type: maxiFLOW Heat Sink Attachment: maxiGRIP Equivalent Part Number: ATS-51330D-C2-R0 Discontinued *Image above is for illustration purpose only. Features & Benefits maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB Meets Telcordia GR-63-Core Office Vibration; ETSI 300 019 Transportation Vibration; and MIL-STD-810 Shock and Unpackaged Drop Testing standards Comes preassembled with high performance, phase changing, thermal interface material Designed for low profile components from 1.5 to 2.99mm Thermal Performance @200 LFM @300 LFM @400 LFM @500 LFM @600 LFM @700 LFM @800 LFM AIR VELOCITY 1.0 M/S 1.5 M/S 2.0 M/S 2.5 M/S 3.0 M/S 3.5 M/S 4.0 M/S Unducted Flow 5.9 °C/W 4.5 °C/W 3.9 °C/W 3.5 °C/W 3.2 °C/W 2.9 °C/W 2.7 °C/W THERMAL RESISTANCE Ducted Flow 3.8 N/A N/A N/A N/A N/A N/A Product Detail Schematic Image Dimension A Dimension B Dimension C Dimension D TIM Finish 33.00 mm 33.00 mm 9.50 mm 45.5 mm T766 BLACK- ANODIZED Notes: Dimension A and B refer to component size. Dimension C is the heat sink height from the bottom of the base to the top of the fin field. ATS-51330D-C2-R0 is the exact heat sink assembly with an equivalent thermal interface material (Saint Gobain C1100F). NOTE: Saint Gobain C1100F is discontinued effective 12/31/10. Thermal performance data are provided for reference only. Actual performance may vary by application. ATS reserves the right to update or change its products without notice to improve the design or performance. ATS certifies that this heat sink assembly is RoHS-6 and REACH compliant. Optional maxiGRIP™ Installation/Removal Tool Set P/N: MGT330 Contact ATS to learn about custom options available. *Image above is for illustration purpose only. For more information, to find a distributor or to place an order, please contact us at 781-769-2800 (North America), sales@qats.com or www.qats.com. © 2013 Advanced Thermal Solutions, Inc. | 89-27 Access Road | Norwood MA | 02062 | USA Rev - 011217

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