AP2141D/ AP2151D 0.5 SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH WITH OUTPUT DISCHARGE Description Pin Assignments The AP2141D and AP2151D are integrated high-side power switches (((( TTTToooopppp VVVViiiieeeewwww )))) optimized for Universal Serial Bus (USB) and other hot-swap applications. The family of devices complies with USB 2.0 and is GND 1 8 NC available with both polarities of Enable input. They offer current and thermal limiting and short circuit protection as well as controlled rise IN 2 7 OUT time and undervoltage lockout functionality. A 7ms deglitch capability on the open-drain Flag output prevents false over-current reporting and does not require any external components. IN 3 6 OUT All devices are available in SOT25, SO-8, MSOP-8EP, and EN 4 5 FLG U-DFN2018-6 packages. SSSSOOOO----8888 Features • Single USB Port Power Switches with Output Discharge • Over-Current and Thermal Protection • 0.8A Accurate Current Limiting • Fast Transient Response • Reverse Current Blocking • 90mΩ On-Resistance • Input Voltage Range: 2.7V - 5.5V • 0.6ms Typical Rise Time • Very Low Shutdown Current: 1µA (max) • Fault Report (FLG) with Blanking Time (7ms typ) • ESD Protection: 4kV HBM, 300V MM ( Top View ) • Active High (AP2151D) or Active Low (AP2141D) enable • Ambient Temperature Range -40°C to +85°C OUT 1 5 IN • SOT25, SO-8, MSOP-8EP (Exposed Pad), and U-DFN2018-6: Available in “Green” Molding Compound (No Br, Sb) GND 2 • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) FLG 3 4 EN • Halogen and Antimony Free. “Green” Device (Note 3) • 15kV ESD Protection per IEC 61000-4-2 (with external SOT25 capacitance) • UL Recognized, File Number E322375 • IEC60950-1 CB Scheme Certified Applications • Consumer Electronics – LCD TVs & Monitors, Game Machines • Communications – Set-Top-Boxes, GPS, Smartphones • Computing – Laptops, Desktops, Servers, Printers, Docking Stations, HUBs Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. AP2141D/ AP2151D 1 of 18 March 2015 Document number: DS32242 Rev. 6 - 2 www.diodes.com © Diodes Incorporated

AP2141D/ AP2151D Typical Applications Circuit AP2151D Enable Active High Power Supply IN OUT Load 2.7V to 5.5V 10k 10uF 0.1uF 0.1uF 120uF FLG ON EN GND OFF Current Limit Recommended Maximum Part Number Channel Enable Pin (EN) (Typical) Continuous Load Current AP2141D 1 Active Low 0.8A 0.5A AP2151D 1 Active High 0.8A 0.5A Pin Descriptions Pin Pin Number Descriptions Name SO-8 MSOP-8EP SOT25 U-DFN2018-6 GND 1 1 2 1 Ground IN 2, 3 2, 3 5 2 Voltage Input Pin. (all IN pins must be tied together externally) EN 4 4 4 3 Enable Input, active low (AP2141D) or active high (AP2151D). Over-current and over-temperature fault report; open-drain flag is active low when FLG 5 5 3 4 triggered. OUT 6, 7 6, 7 1 5, 6 Voltage Output Pin (all OUT pins must be tied together externally). NC 8 8 N/A N/A No Internal Connection; recommend tie to OUT pins. Exposed pad. Internally connected to GND. It should be externally connected to GND and thermal mass for enhanced Exposed tab - Exposed tab - Exposed tab thermal impedance. It should not be used as electrical ground conduction path. AP2141D/ AP2151D 2 of 18 March 2015 Document number: DS32242 Rev. 6 - 2 www.diodes.com © Diodes Incorporated

AP2141D/ AP2151D Functional Block Diagram Current IN OUT Sense UVLO Discharge Control Current Driver EN Limit FLG Deglitch Thermal Sense GND Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.) Symbol Parameter Ratings Units HBM Human Body Model ESD Protection 4 kV MM Machine Model ESD Protection 300 V ESD Surges per EN61000-4-2. 1999 applied to Air 15 kV IEC System output terminals of EVM (Note 5) Level Surges per EN61000-4-2. 1999 applied to Contact 8 kV output terminals of EVM (Note 5) VIN Input Voltage 6.5 V VOUT Output Voltage VIN +0.3 V VEN , VFLG Enable Voltage 6.5 V ILOAD Maximum Continuous Load Current Internal Limited A TJ(MAX) Maximum Junction Temperature +150 °C TST Storage Temperature Range (Note 4) -65 to +150 °C Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time. Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and transporting these devices Notes: 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C) 5. External capacitors need to be connected to the output, EVM board was tested with capacitor 2.2µF 50V 0805. This level is a pass test only and not a limit. Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.) Symbol Parameter Min Max Unit VIN Input Voltage 2.7 5.5 V IOUT Output Current 0 500 mA TA Operating Ambient Temperature -40 +85 °C VIH High-Level Input Voltage on EN or EN 2.0 VIN V VIL Low-Level Input Voltage on EN or EN 0 0.8 V AP2141D/ AP2151D 3 of 18 March 2015 Document number: DS32242 Rev. 6 - 2 www.diodes.com © Diodes Incorporated

AP2141D/ AP2151D Electrical Characteristics (@TA = +25°C, VIN = +5V, unless otherwise specified.) Symbol Parameter Test Conditions Min Typ Max Unit VUVLO Input UVLO — 1.6 1.9 2.5 V ISHDN Input Shutdown Current Disabled, IOUT = 0 — 0.5 1 µA IQ Input Quiescent Current Enabled, IOUT = 0 — 45 70 µA ILEAK Input Leakage Current Disabled, OUT grounded — 0.1 1 µA IREV Reverse Leakage Current Disabled, VIN = 0V, VOUT = 5V, IREV at VIN — 0.1 1 µA SOT25, MSOP-8, — 95 115 VIN = 5V, TA = +25°C MSOP-8EP, SO-8 IOUT = 0.5A U-DFN2018-6 — 90 110 RDS(ON) Switch On-Resistance -40°C ≤ TA ≤ +85°C — — 140 mΩ VIN = 3.3V, IOUT = TA = +25°C — 120 140 0.5A -40°C ≤ TA ≤ +85°C — — 170 ISHORT Short-Circuit Current Limit Enabled into short circuit, CL = 22µF — 0.6 — A ILIMIT Over-Load Current Limit VIN = 5V, VOUT = 4.0V, CL = 120µF, -40°C ≤ TA ≤ +85°C 0.6 0.8 1.0 A ITRIG Current Limiting Trigger Threshold Output Current Slew Rate (<100A/s) , CL = 22µF — 1.0 — A ISINK EN Input Leakage VEN = 5V — — 1 µA tD(ON) Output Turn-On Delay Time CL = 1µF, RLOAD = 10Ω — 0.05 — ms tR Output Turn-On Rise Time CL = 1µF, RLOAD = 10Ω — 0.6 1.5 ms tD(OFF) Output Turn-Off Delay Time CL = 1µF, RLOAD = 10Ω — 0.05 — ms tF Output Turn-Off Fall Time CL = 1µF, RLOAD = 10Ω — 0.05 0.1 ms RFLG FLG Output FET On-Resistance IFLG =10mA — 20 40 Ω tBLANK FLG Blanking Time CIN = 10µF, CL = 22µF 4 7 15 ms RDIS Discharge Resistance (Note 6) VIN = 5V, disabled, IOUT = 1mA — 100 — Ω tDIS Discharge Time CL = 1µF, VIN = 5V, disabled to VOUT < 0.5V — 0.6 — ms TSHDN Thermal Shutdown Threshold Enabled, RLOAD = 1kΩ — 140 — °C THYS Thermal Shutdown Hysteresis — — 25 — °C SOT25 (Note 7) — 170 — Thermal Resistance Junction-to- SO-8 (Note 7) — 127 — θJA Ambient MSOP-8EP (Note 8) — 67 — °C/W U-DFN2018-6 (Note 8) — 70 — Notes: 6. The discharge function is active when the device is disabled (when enable is de-asserted). The discharge function offers a resistive discharge path for the external storage capacitor. 7. Device mounted on FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout. 8. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground plane. AP2141D/ AP2151D 4 of 18 March 2015 Document number: DS32242 Rev. 6 - 2 www.diodes.com © Diodes Incorporated

AP2141D/ AP2151D Typical Performance Characteristics Figure 1 Voltage Waveforms: AP2141D (left), AP2151D (right) All Enable Plots are for AP2151D Active High Turn-On Delay and Rise Time Turn-Off Delay and Fall Time VEN 5V/div VEN 5V/div VOUT 2V/div CL = 1uF TA = +25°C CL = 1uF RL = 10Ω TA = +25°C VOUT RL = 10Ω 2V/div 100µs/div 100µs/div Turn-On Delay and Rise Time Turn-Off Delay and Fall Time VEN 5V/div VEN 5V/div VOUT CL = 120µF 2V/div TA = +25°C RL = 10Ω CL = 120µF TA = +25°C VOUT RL = 10Ω 2V/div 500µs/div 500µs/div AP2141D/ AP2151D 5 of 18 March 2015 Document number: DS32242 Rev. 6 - 2 www.diodes.com © Diodes Incorporated

AP2141D/ AP2151D Typical Performance Characteristics (continued) Short Circuit Current, Device Enabled Into Short Short Circuit with Blanking Time and Recovery VOUT 5V/div VEN 5V/div VFLAG 5V/div I2O0U0Tm A/div VTAIN = = +52V5 °C IOUT VTCAILN == = +2522V5µ °FC CL = 22µF 1A/div 100µs/div 20ms/div 3Ω Load Connected to Enabled Device 2Ω Load Connected to Enabled Device VFLAG 2V/div VIN = 5V VFLAG TA = +25°C 2V/div VIN = 5V CL = 22µF TA = +25°C CL = 22µF 5IO0U0Tm A/div I5O0U0Tm A/div 1ms/div 1ms/div Power On Power Off TA = +25°C CL = 120µF V5VF/LdAivG RL = 10Ω VFLAG 5V/div IOUT TA = +25°C 200mA/div CL = 120µF IOUT RL = 10Ω 200mA/div VEN 5V/div VEN 5V/div VOUT VOUT 5V/div 5V/div 2ms/div 2ms/div AP2141D/ AP2151D 6 of 18 March 2015 Document number: DS32242 Rev. 6 - 2 www.diodes.com © Diodes Incorporated

AP2141D/ AP2151D Typical Performance Characteristics (cont.) UVLO Increasing UVLO Decreasing TA = +25°C TA = +25°C CR LL == 1202ΩµF V2VIN/d iv CRLL == 1202ΩµF VIN 2V/div IOUT 200mA/div IOUT 200mA/div 2ms/div 20ms/div Discharge Time No Load Resistance Inrush Current VOUT TA = +25°C 2V/div CL = 470µF VIN = 5V No Load CL = 680µF Resistance CL = 120µF CL = 220µF VIN = 5V TA = +25°C IIN CL = 100µF RL = 10Ω 200mA/div R = 10Ω VEN CL = 22µF 2V/div VEN 5V/div 1ms/div 100ms/div AP2141D/ AP2151D 7 of 18 March 2015 Document number: DS32242 Rev. 6 - 2 www.diodes.com © Diodes Incorporated

AP2141D/ AP2151D Typical Performance Characteristics (cont.) Turn-On Time vs Input Voltage Turn-Off Time vs Input Voltage 800 31 700 31 600 s) s) 30 u u me ( 500 me ( 30 CL = 1µF Turn-On Ti 234000000 CRTALL === +11µ02Ω5F° C Turn-Off Ti 2299 RT AL == +102Ω5° C 100 28 0 28 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 Input Voltage (V) Input Voltage (V) Rise Time vs Input Voltage Fall Time vs Input Voltage 600 25 500 24 Rise Time (us) 234000000 CRTALL === +11µ02Ω5F° C Fall Time (us) 222123 CRT ALL === +11µ02Ω5F° C 100 20 0 19 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 Input Voltage (V) Input Voltage (V) Supply Current, Output Enabled vs Ambient Temperature Supply Current, Output Disabled vs Ambient Temperature 65 1.60 A) A) VIN = 5.5V utput Enabled (u 556050 VIN = 5.5V VIN = 5.0V utput Disabled (u 0111....80240000 VIN = 3.3V VIN = 5.0V O O Current, 4405 VIN = 2.7V Current, 00..4600 VIN = 2.7V pply 35 VIN = 3.3V pply 0.20 u u S S 30 0.00 -60 -40 -20 0 20 40 60 80 100 -45 -25 -5 15 35 55 75 95 Ambient Temperature (°C) Ambient Temperature (°C) AP2141D/ AP2151D 8 of 18 March 2015 Document number: DS32242 Rev. 6 - 2 www.diodes.com © Diodes Incorporated

AP2141D/ AP2151D Typical Performance Characteristics (cont.) Static Drain-Source On-State Resistance vs Ambient Short-Circuit Output Current vs Ambient Temperature Temperature 200 710 Static Drain-Source On-State ΩResistance (m) 111111111123456789000000000 VIN = 2.7V VIN = 3.3V VIN = 5V Short-Circuit Output Current (mA) 666666745678900000000 VIN = 2.7V VIN = 3.3V VIN = 5V VINV =IN 5 =.5 5VV 100 630 -60 -40 -20 0 20 40 60 80 100 -60 -40 -20 0 20 40 60 80 100 Ambient Temperature (°C) Ambient Temperature (°C) Undervoltage Lockout vs Ambient Temperature Threshold Trip Current vs Input Voltage 2.05 1.15 2.04 ervoltage Lockout (V) 112222......990000890123 UUVVLLOO RFaislliinngg shold Trip Current (A) 111...111234 TA = +25°C Und 1.97 Thre 1.11 CL = 22µF 1.96 1.95 1.10 -60 -40 -20 0 20 40 60 80 100 2.8 3.3 3.8 4.3 4.8 5.3 Ambient Temperature (°C) Input Voltage (V) AP2141D/ AP2151D 9 of 18 March 2015 Document number: DS32242 Rev. 6 - 2 www.diodes.com © Diodes Incorporated

AP2141D/ AP2151D Application Information The AP2141D and AP2151D are integrated high-side power switches optimized for Universal Serial Bus (USB) that require protection functions. The power switches are equipped with a driver that controls the gate voltage and incorporates slew-rate limitation. This, along with the various protection features and special functions, make these power switches ideal for hot-swap or hot-plug applications. Protection Features: Undervoltage Lockout (UVLO) Undervoltage lockout function (UVLO) guarantees that the internal power switch is initially off during start-up. The UVLO functions only when the switch is enabled. Even if the switch is enabled, the switch is not turned ON until the power supply has reached at least 1.9V. Whenever the input voltage falls below approximately 1.9V, the power switch is turned off. This facilitates the design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed. Over-Current and Short Circuit Protection An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting. The different overload conditions and the corresponding response of the AP2141D/2151D are outlined below: S.NO Conditions Explanation Behavior of the AP2141D/2151D Output is shorted before input The IC senses the short circuit and immediately clamps output 1 Short circuit condition at start-up voltage is applied or before the part is enabled current to a certain safe level namely ILIMIT. At the instance the overload occurs, higher current may flow for a very short period of time before the current limit function can Short-Circuit or Overload condition Short-circuit or Overcurrent react. 2 that occurs when the part is condition After the current limit function has tripped (reached the over- enabled. current trip threshold), the device switches into current limiting mode and the current is clamped at ILIMIT. Gradual increase from nominal Load increases gradually until the The current rises until ITRIG or thermal limit. Once the threshold 3 has been reached, the device switches into its current limiting operating current to ILIMIT current-limit threshold.(ITRIG) mode and is set at ILIMIT. Note that when the output has been shorted to GND at extremely low temperatures (< -20oC), a minimum 120 µF electrolytic capacitor on the output pin is recommended. A correct capacitor type with capacitor voltage rating and temperature characteristics must be properly chosen so that capacitance value does not drop too low at the extremely low temperature operation. A recommended capacitor should have temperature characteristics of less than a 10% variation of capacitance change when operated at extremely low temperatures. Our recommended aluminum electrolytic capacitor type is Panasonic FC series. Thermal Protection Thermal protection prevents the IC from damage when the die temperature exceeds safe margins. This mainly occurs when heavy-overload or short- circuit faults are present for extended periods of time. The AP2141D/AP2151D implements thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die temperature rises to approximately 140°C, the Thermal protection feature gets activated as follows: The internal thermal sense circuitry turns the power switch off and the FLG output is asserted thus preventing the power switch from damage. Hysteresis in the thermal sense circuit allows the device to cool down to approximately 25°C before the output is turned back on. The built- in thermal hysteresis feature avoids undesirable oscillations of the thermal protection circuit. The switch continues to cycle in this manner until the load fault is removed, resulting in a pulsed output. The FLG open-drain output is asserted when an over-current occurs with 7-ms deglitch. Reverse Current Protection In a normal MOSFET switch, current can flow in reverse direction (from the output side to the input side) when the output side voltage is higher than the input side, even when the switch is turned off. A reverse-current blocking feature is implemented in the AP21x1 series to prevent such back currents. This circuit is activated by the difference between the output voltage and the input voltage. When the switch is disabled, this feature blocks reverse current flow from the output back to the input. AP2141D/ AP2151D 10 of 18 March 2015 Document number: DS32242 Rev. 6 - 2 www.diodes.com © Diodes Incorporated

AP2141D/ AP2151D Application Information (continued) Special Functions: Discharge Function When enable is de-asserted, the discharge function is active. The output capacitor is discharged through an internal NMOS that has a discharge resistance of 100Ω. Hence, the output voltage drops down to zero. The time taken for discharge is dependent on the RC time constant of the resistance and the output capacitor. FLG Response The FLG open-drain output goes active low for any of the two conditions: Over-Current or Over-Temperature. The time from when a fault condition is encountered to when the FLG output goes low is 7-ms (typ). The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy capacitive load to the output of the device can cause a momentary Over-current condition, which does not trigger the FLG due to the 7-ms deglitch timeout. The 7-ms timeout is also applicable for Over-current recovery and Thermal recovery. The AP2141D/AP2151D are designed to eliminate erroneous Over-current reporting without the need for external components, such as an RC delay network. Power Supply Considerations A 0.01-µF to 0.1-µF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. This limits the input voltage drop during line transients. Placing a high-value electrolytic capacitor on the input (10-µF minimum) and output pin(s) is recommended when the output load is heavy. This precaution also reduces power-supply transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-µF to 0.1-µF ceramic capacitor improves the immunity of the device to short-circuit transients. This capacitor also prevents the output from going negative during turn-off due to inductive parasitics. Power Dissipation and Junction Temperature The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by: PD = RDS(ON)× I2 The junction temperature can be calculated by: TJ = PD x RθJA + TA Where: TA= Ambient Temperature °C RθJA = Thermal Resistance PD = Total Power Dissipation Generic Hot-Plug Applications In many applications it may be necessary to remove modules or PC boards while the main unit is still operating. These are considered hot-plug applications. Such implementations require the control of current surges as seen by the main power supply and the card being inserted. The most effective way to control these surges is to limit and slowly ramp up the current and voltage being applied to the card, similar to the way in which a power supply normally turns on. Due to the controlled rise and fall times of the AP2141D/AP2151D, these devices can be used to provide a softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2141D/AP2151D also ensures that the switch is off after the card has been removed, and that the switch is off during the next insertion. By placing the AP2141D/AP2151D between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion. The typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls the system surge current and provides a hot-plugging mechanism for any device. Dual-Purpose Port Applications AP2141D/AP2151D is not recommended for use in dual-purpose port applications in which a single port is used for data communication between the host and peripheral devices while simultaneously maintaining a charge to the battery of the peripheral device. An example of such a non- recommended application is a shared HDMI/MHL (Mobile High-definition Link) port that allows streaming video between an HDTV or set-top box and a smartphone or tablet while maintaining a charge to the smartphone or tablet battery. Since the AP2141D/AP2151D includes an embedded discharge feature that discharges the output load of the device when the device is disabled, the batteries of the connected peripheral device will be subject to continual discharge whenever the AP2141D/AP2151D is disabled. An overstress condition to the device's discharge MOS transistor may result. In addition, if the output of the AP2141D/AP2151D is subjected to a constant voltage that would be present during a dual-purpose port application such as MHL, an overstress condition to the device may result. AP2141D/ AP2151D 11 of 18 March 2015 Document number: DS32242 Rev. 6 - 2 www.diodes.com © Diodes Incorporated

AAPP22114411DD// AAPP22115511DD Ordering Information 7”/1133”” TTaappee aanndd RReeeell Part Number Package Code Packaging Quantity Part Number Suffix AP21X1DSG-13 S SO-8 2,500/Tape & Reel -13 AP21X1DMPG-13 MP MSOP-8EP 2,500/Tape & Reel -13 AP21X1DWG-7 W SOT25 3,000/Tape & Reel -7 AP21X1DFMG-7 FM U-DFN2018-6 3,000/Tape & Reel -7 Note: 9. For packaging detaaiillss,, ggoo ttoo oouurr wweebbssiittee aatt hhttttpp:://www.diodes.com/products/packages.html. Marking Information (1) SO-8 ( Top View ) 8 7 6 5 Logo 1 : 1 Channel YY : Year : 08, 09,10~ Part Number AP21XXD WW : Week : 01~52; 52 4 : Active Low 5 : Active High YY WW X X represents 52 and 53 wweeeekk X : Internal Code G : Green 1 2 3 4 AP2141D/ AP2151D 12 of 18 March 2015 Document number: DS32242 Rev. 6 - 2 www.diodes.com © Diodes Incorporated

AAPP22114411DD// AAPP22115511DD Marking Information (continued) (2) MSOP-8EP (3) SOT25 ( TToopp VViieeww ) 5 4 7 XX : Identification code Y : Year 0~9 XXXX Y W X W : Week : A~Z : 1~26 week; a~z : 27~52 week; zz rreepprreesseennttss 52 and 53 week 1 2 3 X : A~Z : Green DDeevviiccee Package Type Identification Code AAPP22114411DDW SOT25 JA AAPP22115511DDW SOT25 JB (4) U-DFN2018-6 DDeevviiccee Package type Identification Code AAPP22114411DDFFMM U-DFN2018-6 JA AAPP22115511DDFFMM U-DFN2018-6 JB AP2141D/ AP2151D 13 of 18 March 2015 Document number: DS32242 Rev. 6 - 2 www.diodes.com © Diodes Incorporated

AP2141D/ AP2151D Package Outline Dimensions (All dimensions in mm.) Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version. (1) Package type: SO-8 SO-8 Dim Min Max A - 1.75 54 A1 0.10 0.20 E1 E 0.2 Gauge Plane A2 1.30 1.50 A1 Seating Plane A3 0.15 0.25 L b 0.3 0.5 Detail ‘A’ D 4.85 4.95 E 5.90 6.10 E1 3.85 3.95 h 7°~9° 45° e 1.27 Typ h - 0.35 Detail ‘A’ A2 A A3 L 0.62 0.82 θθθθ 0° 8° e b All Dimensions in mm D (2) Package Type: MSOP-8EP D MSOP-8EP Dim Min Max Typ A - 1.10 - A1 0.05 0.15 0.10 D1 4X10° A2 0.75 0.95 0.86 x 25 A3 0.29 0.49 0.39 E E2 Gauge Plane0. b 0.22 0.38 0.30 c 0.08 0.23 0.15 y Seating Plane a D 2.90 3.10 3.00 1 e 8Xb 4X10° L DEE11 142...679000 253...011000 143...890000 E3 Detail C E2 1.30 1.70 1.50 A1 A3 c E3 2.85 3.05 2.95 A A2 e - - 0.65 L 0.40 0.80 0.60 D E1 a 0° 8° 4° x - - 0.750 See Detail C y - - 0.750 All Dimensions in mm AP2141D/ AP2151D 14 of 18 March 2015 Document number: DS32242 Rev. 6 - 2 www.diodes.com © Diodes Incorporated

AP2141D/ AP2151D Package Outline Dimensions (continued) (All dimensions in mm.) Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version. (3) Package Type: SOT25 A SOT25 Dim Min Max Typ A 0.35 0.50 0.38 B C B 1.50 1.70 1.60 C 2.70 3.00 2.80 D   0.95 H 2.90 3.10 3.00 H J 0.013 0.10 0.05 K 1.00 1.30 1.10 K N M L 0.35 0.55 0.40 M 0.10 0.20 0.15 N 0.70 0.80 0.75 J D L αααα 0° 8°  All Dimensions in mm (4) Package Type: U-DFN2018-6 A3 A SEATING PLANE U-DFN2018-6 Dim Min Max Typ A1 A 0.545 0.605 0.575 Pin#1 ID D A1 0 0.05 0.02 A3   0.13 D2 b 0.15 0.25 0.20 L D 1.750 1.875 1.80 D2 1.30 1.50 1.40 e   0.50 E 1.95 2.075 2.00 E E2 E2 0.90 1.10 1.00 L 0.20 0.30 0.25 z   0.30 z All Dimensions in mm e b AP2141D/ AP2151D 15 of 18 March 2015 Document number: DS32242 Rev. 6 - 2 www.diodes.com © Diodes Incorporated

AP2141D/ AP2151D Suggested Pad Layout Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. (1) Package Type: SO-8 X Dimensions Value (in mm) X 0.60 Y 1.55 C1 C1 5.4 C2 1.27 C2 Y (2) Package Type: MSOP-8EP X C Value Dimensions (in mm) C 0.650 G Y G 0.450 X 0.450 X1 2.000 Y 1.350 Y2 Y1 Y1 1.700 X1 Y2 5.300 (3) Package Type: SOT25 C2 C2 Dimensions Value (in mm) Z 3.20 G 1.60 X 0.55 G C1 Y 0.80 Z C1 2.40 C2 0.95 Y X AP2141D/ AP2151D 16 of 18 March 2015 Document number: DS32242 Rev. 6 - 2 www.diodes.com © Diodes Incorporated

AP2141D/ AP2151D Suggested Pad Layout (continued) Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. (4) Package type: U-DFN2018-6 X C Y Dimensions Value (in mm) C 0.50 G 0.20 Y1 X 0.25 X1 1.60 Y 0.35 G Y1 1.20 X1 Taping Orientation (Note 10) For U-DFN2018-6 Note: 10. The taping orientation of the other package type can be found on our website at http://www.diodes.com/datasheets/ap02007.pdf. AP2141D/ AP2151D 17 of 18 March 2015 Document number: DS32242 Rev. 6 - 2 www.diodes.com © Diodes Incorporated

AP2141D/ AP2151D IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2015, Diodes Incorporated www.diodes.com AP2141D/ AP2151D 18 of 18 March 2015 Document number: DS32242 Rev. 6 - 2 www.diodes.com © Diodes Incorporated

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: D iodes Incorporated: AP2141DFMG-7 AP2141DMPG-13 AP2141DSG-13 AP2141DWG-7 AP2151DFMG-7 AP2151DMPG-13 AP2151DSG-13 AP2151DWG-7 AP2141DM8G-13 AP2151DM8G-13 AP2151AFM-7 AP2151AS-13 AP2151AMP-13