SL Modular Connector System With its large number of options and configurations, SL Modular Connectors and Assemblies deliver ideal wire-to-wire solutions and its varying PCB termination methods, including reflow process capable versions, support a range of wire-to-board applications Features and Advantages Low-profile, stackable housing, Positive lock vertical and right-angle headers Provides secure Two independent points of contact Provides design flexibility with or retention between Offers redundant, secondary current without panel mounting headers and receptacles paths for long-term electrical performance and reliability Connector position assurance (CPA) lock Ensures wire-to-wire and wire-to-board mating interface will not disengage in high-vibration Terminal position assurance (TPA) environments lock for male and female housings Reduces the risk of terminal back-out in high-vibration environments High-temperature LCP headers available Reflow process capable. Enables automated termination to PCBs. Reduces labor costs. 2.54mm pitch Enables intermatability with C-Grid and KK 2.54mm-pitch product families for the largest number of configurations in the industry Applications High-temperature headers available, made with liquid crystal polymer (LCP) Consumer Reflow process capable. Enables automated Computer Peripherals termination to PCBs. Reduces labor costs. Copiers HVAC Equipment Modems Printers Scanners Automotive Airbag Sensors Interior Lighting Sound Systems Steering Controls Automotive Interior Lighting Copiers and Printers Portable Diagnostics Medical and Sound System Panel Displays on Portable Medical Dental Equipment Breathing Machines

SL Modular Connector System Specifications REFERENCE INFORMATION ELECTRICAL PHYSICAL Packaging: Tape-and-reel, tube Voltage (max.): 250V Housing: Glass-filled polyester UL File No.: E29179 Current (max.): 3.0A High-Temp Housings: Liquid Crystal Polymer (LCP) CSA File No.: LR19980 Contact Resistance (max.): 15 milliohms Contact: Brass Designed In: Millimeters Dielectric Withstanding Voltage (min.): 600V AC Plating: RoHS: Yes Insulation Resistance (min.): 10000 Megohms Contact Area — Matte tin or select gold Halogen Free: No Solder Tail Area — Matte tin Glow Wire Compliant: No MECHANICAL Underplating — Nickel Mating Force (min.): 45N Operating Temperature: -40 to +105°C Unmating Force (min.): 15N Durability (min.): 25 (Tin) 50 (Gold) Ordering Information Tape-and-Reel Packaging Versions Order No. Component Circuits Plating Poles 74099-06XX Tin 74099-06YY Wire-to-Board Headers, Vertical SMT 3 through 12 15µ” Gold 74099-06ZZ 30µ” Gold 5-Pole Power 15-91-6XX9 Tin 2 through 25 15-91-7XX0 Wire-to-Board Headers, Right Angle SMT 15µ” Gold 15-91-7XX1 2 through 12 30µ” Gold XX: Replace XX with desired circuit size YY: Replace YY with desired circuit size +20 (e.g.: 3 circuit = 74099-0623) ZZ: Replace ZZ with desired circuit size +40 (e.g.: 3 circuit = 74099-0643) Tube Packaging Versions Series No. Component Circuit Sizes Series No. Component Wire Gauge 70066, 70107 Crimp Housings 2 to 25 70021, 70058, 71851 Crimp Terminals 22 to 32 AWG 70021, 70058, 71851 Crimp Terminals 22 to 32 AWG 70541, 70543, 70545, 70551, 70553, PCB Headers 2 to 25 70555, 70634, 74095, 74099, 87898 73838 Female TPA Locks 2 to 8 70400, 70475 IDT Assemblies 2 to 25 70013, 70022 Clips and Modular Branches 2 to 50 High-Temperature Headers That Are Reflow Process Capable Series No. Type Orientation Circuit Sizes 171971 Through Hole Vertical 171972 Through Hole with Pegs 171974 Through Hole Right-Angle 171975 Through Hole with Pegs 2 to 25 171973 Vertical SMT 171976 Right-Angle 171977 SMT with Pegs Right-Angle www.molex.com/link/slmodular.html Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners. Order No. 987651-0406 Rev. 5 USA/0k/GF/2018.06 ©2018 Molex