Reference Only Spec. No. JENF243E-0003Q-01 P 1 / 8 Chip EMIFIL ® LC Combined Type for Large Current NFE61PT□□□□1H9□ Reference Specification 1. Scope This reference specification applies to Chip EMIFIL ® LC Combined Type for Large Current NFE61P Series. 2. Part Numbering NF E 61 PT 101 Z 1H 9 L Product ID Structure Dimension Features Capacitance Characteristics Rated Electrode Packaging (L× W) Voltage Code (L: Taping / B: Bulk) 3. Rating Customer Murata Rated Withstanding Rated Insulation Capacitance Part Number Part Number Voltage Voltage Current Resistance NFE61PT330B1H9L 33pF ± 30% NFE61PT330B1H9B NFE61PT680B1H9L 68pF ± 30% NFE61PT680B1H9B NFE61PT101Z1H9L 100pF ± 30% NFE61PT101Z1H9B NFE61PT181B1H9L 180pF ± 30% NFE61PT181B1H9B 1000 MΩ 50 V(DC) 125 V(DC) 2 A(DC) NFE61PT361B1H9L min. 360pF ± 20% NFE61PT361B1H9B NFE61PT681B1H9L 680pF ± 30% NFE61PT681B1H9B NFE61PT102E1H9L 1000pF ± ８０ % NFE61PT102E1H9B ２０ NFE61PT472C1H9L 4700pF ± ８０ % NFE61PT472C1H9B ２０ • Operating Temperature : - 40 °C to + 85 °C • Storage Temperature : - 55 °C to + 125 °C 4. Standard Testing Condition <Unless otherwise specified> <In case of doubt> Temperature: Ordinary Temp. 15°C to 35°C Temperature: 20°C ± 2°C Humidity: Ordinary Humidity 25 %(RH) to 85 %(RH) Humidity: 60 %(RH) to 70 %(RH) Atmospheric pressure: 86kPa to 106kPa 5. Style and Dimensions Equivalent Circuit 0.7±0.2 2.6±0.3 0.7±0.2 Input Output (1) (2) (3) (1) (3) 3 3 6±0. 6±0. G(N2D) 1. 1. ∗(1),(3):NoPolarity 1.6±0.3 6.8±0.5 ■ Unit Mass (Typical value) (inmm) 0.062g Note : Gap and bend between ceramic capacitor(∗) and ferrite bead(∗1) may come out as illustrated below, however, these are not affect the performance, mounting and reliability of the products. 0.5max. ∗ ∗1 ∗ ∗1 0.1max. (inmm) MURATA MFG. CO., LTD.

Reference Only Spec. No. JENF243E-0003Q-01 P 2 / 8 ■ Insertion Loss Characteristics (I.L.) (Typ.) 6. Marking No marking. 7. Electrical Performance No. Item Specification Test Method 7.1 Capacitance Meet item 3. Table 1 Capacitance Voltage Frequency 33,68,100 (pF) 1 to 5 V(rms) 1MHz±10% 180,360,680 1±0.2 V(rms) 1kHz±10% 1000 (pF) 4700 (pF) 0.1 max.V(rms) 1kHz±10% 7.2 Insulation Meet item 3. Voltage : 50 V(DC) Resistance(I.R.) Time : 60 ± 5 seconds 7.3 Withstanding Products shall not be damaged. Test Voltage : 125 V(DC) Voltage Testing Time : 1 to 5 seconds Limit the charging current: 10mA max. 8. Mechanical Performance No. Item Specification Test Method 8.1 Appearance and Meet item 5. Visual Inspection and measured with Slide Dimensions Calipers 8.2 Solderability The electrodes shall be at least 75% Flux : Ethanol solution of rosin, 25(wt)% covered with new solder coating. Pre-heat : 150 ± 10 °C, 60 ~ 90 s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 240 ± 3 °C Immersion Time : 3 ± 1 s Immersion and emersion rates : 25mm / s 8.3 Resistance to Meet Table 2. Flux : Ethanol solution of rosin, 25(wt)% soldering heat Table 2 Pre-heat : 150 ± 10 °C, 60 ~ 90 s Solder : Sn-3.0Ag-0.5Cu Appearance No damaged Solder Temperature : 270 ± 5 °C 33,68,100 Immersion Time : 10 ± 1 s Within 180,360 Immersion and emersion rates : 25mm / s ±15% Cap. Change 680 (pF) Then measured after exposure the room 1000 Within condition for 4 to 48 hours. 4700(pF) ±30% I.R. 1000 MΩ min. Withstanding No damaged Voltage MURATA MFG. CO., LTD.

Reference Only Spec. No. JENF243E-0003Q-01 P 3 / 8 No. Item Specification Test Method 8.4 Bending Meet Table 2. It shall be soldered on the paper-phenol Strength Table 2 substrate. (t=1.6mm) Appearance No damaged Pressurejig 33,68,100 Within R340 F 180,360 ±15% Cap. Change 680 (pF) Deflection 1000 Within 45 45 4700(pF) ±30% Product (inmm) Deflection : 3 mm Keeping Time : 30 seconds 9. Environment Performance (It shall be soldered on the substrate.) No. Item Specification Test Method 9.1 Humidity Meet Table 4. Temperature : 40 ± 2 °C Humidity : 90 to 95 %(RH) Table 4 Time : 500 h (+ 24 h , - 0 h) Appearance No damaged Then measured after exposure in the room 33,68,100 condition for 4 to 48 hours. Within 180,360 9.2 Heat Life ±15% Temperature : 85 ± 2 °C Cap. Change 680 (pF) Test Voltage : 1000 Within 33,68,100,180,360,680 (pF) : 4700 (pF) ±30% Rated Voltage × 200% I.R. 100 MΩ min. 1000,4700 (pF) : Rated Voltage × 150% Withstanding Time : 1000 h (+ 48h , - 0h) No damaged Voltage Then measured after exposure in the room condition for 4 to 48 hours. 9.3 Temperature Meet Table 2. 1 Cycle Cycling 1step : - 55°C (+ 0°C, - 3°C) / 30±3 min 2step : Room Temperature / within 5 min 3step : +125°C (+ 3°C, - 0°C) / 30±3 min 4step : Room Temperature / within 5 min Total of 10 cycles Then measured after exposure in the room condition for 4 to 48 hours. 10. Specification of Packaging 10.1. Appearance and Dimensions (12mm-wide plastic tape) SprocketHole φ1.5+-00.1 EmbossedCavity1 0.3±0.1 1.75±0. 5 0.0 3 2±0.1 5.5± 2.0±0. Dmiemaesnusreiodn a ot ft hthee b Coattvoimty sisid e. 7. 1 4.0±0.1 4.0±0.1 1.9±0.1 2.0±0.05 1.75±0.1 Directionoffeed (inmm) MURATA MFG. CO., LTD.

Reference Only Spec. No. JENF243E-0003Q-01 P 4 / 8 10.2. Specification of Taping (1) Packing quantity (standard quantity) 2500 pcs. / reel (2) Packing Method Products shall be packaged in the cavity of the plastic tape and sealed with cover tape. (3) Sprocket Hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point The cover tape have no spliced point. (5) Missing components number Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 10.3. Pull Strength of Plastic Tape and Cover Tape Plastic tape 5N min. Cover tape 10N min. 10.4. Peeling off force of cover tape 165° ~180° F CoverTape 0.2N to 0.7N (minimum value is typical) ∗ Speed of Peeling off : 300 mm / min PlasticTape 10.5. Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape (cover tape only and empty tape) and trailer-tape (empty tape) as follows. Trailer Leader 2.0±0.5 160min. Label 190min. 210min. Emptytape Covertape φ13.0±0.2 φ60±10 φ21.0±0.8 Directionoffeed 13±1 0 17±1.4 φ180±0 (in: mm) 3 10.6. Marking for reel Customer part number , MURATA part number , Inspection number(∗1) , RoHS marking(∗2) , Quantity , etc ∗1) « Expression of Inspection No. » □□ OOOO ××× (1) (2) (3) (1) Factory Code (2) Date First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D Third, Fourth digit : Day (3) Serial No. ∗2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number 10.7. Marking for Outside package (corrugated paper box) Customer name , Purchasing Order Number , Customer Part Number , MURATA part number , RoHS marking (∗2) , Quantity , etc MURATA MFG. CO., LTD.

Reference Only Spec. No. JENF243E-0003Q-01 P 5 / 8 10.8. Specification of Outer Case Outer Case Dimensions Label Standard Reel Quantity in Outer Case (mm) (Reel) H W D H 186 186 93 4 D ∗ Above Outer Case size is typical. It depends on a quantity of an order. W 11. Standard Land Dimensions The chip EMI filter suppresses noise by conducting the high-frequency noise element to ground. Therefore, to get enough noise reduction, feed through holes which is connected to ground-plane should be arranged according to the figure to reinforce the ground-pattern. (a) Standard land dimensions for reflow (b) Standard land dimensions for flow ･Side on which chips are mounted ･Side on which chips are mounted Smalldiameterthruholeφ0.4 Smalldiameterthruholeφ0.4 6 6 0 62 26 1. 2. 3. 0.1. 3.3. 2.0 Resist 1.5 3.8 Resist 4.8 Copperfoilpattern 4.8 Copperfoilpattern 8.8 Nopattern 9.0 Nopattern (inmm) 12. ! Caution Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party’s life, body or property. (1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment (5)Medical equipment (6)Transportation equipment(automobiles, trains, ships, etc.) (7)Traffic signal equipment (8)Disaster prevention / crime prevention equipment (9)Data-processing equipment (10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above 13. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 13.1. Flux and Solder Flux Use rosin-based flux, Do not use highly acidic flux (with chlorine content exceeding 0.2(wt)%). Do not use water-soluble flux. Solder Use Sn-3.0Ag-0.5Cu solder 13.2. Note for Assembling < Thermal Shock > Pre-heating should be in such a way that the temperature difference between solder and products surface is limited to 100°C max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100°C max. <Consideration for mounting of 2.5mm pitch> The mounting of 2.5mm pitch should be prevented on flow soldering to avoid an excess of solder volume. MURATA MFG. CO., LTD.

Reference Only Spec. No. JENF243E-0003Q-01 P 6 / 8 13.3. Attention Regarding P.C.B. Bending The following shall be considered when designing P.C.B.'s and laying out products. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage. 〔Products direction〕 a b Products shall be located in the sideways < direction (Length:a b) to the mechanical stress. 〈Poorexample〉 〈Goodexample〉 (2) Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures Stress Level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1 (2) Add slits in the board separation part. A > B (3) Keep the mounting position of the component away from the board separation surface. A > C *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. 13.4. Standard Soldering Conditions On flow soldering (e.g. double wave soldering), use the product in consideration of the conditions of solder, solder temperature and immersion time (melting time) because longer soldering time may cause the corrosion of the electrode. On dipping soldering, use the product in consideration of the conditions of solder, solder temperature, flux, preheat and so on because de-wetting may be caused. Standard soldering profile and the limit soldering profile is as follows. The excessive soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product quality. MURATA MFG. CO., LTD.

Reference Only Spec. No. JENF243E-0003Q-01 P 7 / 8 < Flow Soldering Profile > Temp. (°C) 265°C±3°C 250°C Limit Profile 150 HeatingTime StandardProfile 60smin. Time.(s) Standard Profile Limit Profile Pre-heating 150°C , 60s min. Heating 250°C , 4s ~ 6s 265°C ± 3°C , 5s max. Cycle of flow 2 times 2 times < Reflow Soldering Profile > Temp. 260°C (°C) 245°C±3°C 230°C 220°C Limit Profile 180 150 30s～60s StandardProfile 60smax. 90s±30s Time.(s) Standard Profile Limit Profile Pre-heating 150°C ~ 180°C , 90s ± 30s Heating above 220°C , 30s ~ 60s above 230°C , 60s max. Peak temperature 245°C ± 3°C 260°C , 10s Cycle of reflow 2 times 2 times 13.5. Printing of Adhesive (Flow Soldering) Adhesive amount shall be about 0.5mg for one position to obtain enough adhesive strength. The adhesive position is as follows. 0.6 1.2 3.2 1.5 Adhesive 4.8 9.0 Positionofadhesive (inmm) 13.6. Solder paste printing for reflow • Standard printing pattern of solder paste. · Standard thickness of the solder paste should be 150μm to 200µm. 6 6 · Use the solder paste printing pattern of the right pattern. 1. 2. · For the resist and copper foil pattern, use standard land dimensions. 1.5 4.8 8.8 (inmm) MURATA MFG. CO., LTD.

Reference Only Spec. No. JENF243E-0003Q-01 P 8 / 8 13.7. Reworking with Soldering iron The following conditions shall be strictly followed when using a soldering iron. • Pre-heating : 150°C, 1 min • Soldering iron output : 30W max. • Tip temperature : 350°C max. • Tip diameter : φ3mm max. • Soldering time : 3(+1,-0) s • Times : 2times max. Note: Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ceramic material due to the thermal shock. 13.8. Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.) (2) Ultrasonic cleaning shall comply with the following conditions, with avoiding the resonance phenomenon at the mounted products and P.C.B. Power: 20W / l max. Frequency: 28kHz to 40kHz Time: 5 minutes max. (3) Cleaner 1. Cleaner · Isopropyl alcohol (IPA) 2. Aqueous agent · PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 13.9. Operating Environment Do not use this product under the following environmental conditions, on deterioration of the performance, such as insulation resistance may result from the use. (1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. 13.10. Resin coating It may affect on the product's performance when using resin for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 13.11. Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 13.12. Storage condition (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage environment condition · Products should be stored in the warehouse on the following conditions. Temperature : - 10 °C to + 40 °C Humidity : 15 % to 85% relative humidity No rapid change on temperature and humidity · Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. · Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. · Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. · Products should be stored under the airtight packaged condition. (3) Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. MURATA MFG. CO., LTD.

Reference Only Spec. No. JENF243E-0003Q-01 P 9 / 8 14. ! Notes (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG. CO., LTD.