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  • 型号: UPG2214TK-E2-A
  • 制造商: CEL
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UPG2214TK-E2-A产品简介:

ICGOO电子元器件商城为您提供UPG2214TK-E2-A由CEL设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 UPG2214TK-E2-A价格参考。CELUPG2214TK-E2-A封装/规格:RF 开关, 射频开关 IC 802.11a/b/g/WiFi,802.16/WiMax,WLAN SPDT 3GHz 50 欧姆 6-迷你型模塑。您可以下载UPG2214TK-E2-A参考资料、Datasheet数据手册功能说明书,资料中有UPG2214TK-E2-A 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

射频/IF 和 RFID

描述

IC SWITCH SPDT 6-MINIMOLDRF 开关 IC 3.0V L S Band SPDT

产品分类

RF 开关

IIP3

58dBm (标准)

品牌

CEL

产品手册

点击此处下载产品Datasheet

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

RF集成电路,RF 开关 IC,CEL UPG2214TK-E2-A-

数据手册

点击此处下载产品Datasheet点击此处下载产品Datasheet

P1dB

27dBm (标准) IP1dB

产品型号

UPG2214TK-E2-A

RF类型

802.11a/b/g/WiFi, 802.16/WiMax, WLAN

产品种类

RF 开关 IC

介入损耗

0.60 dB

供应商器件封装

6-迷你型模塑

关闭隔离—典型值

32 dB

其它名称

UPG2214TK-E2-A-ND
UPG2214TK-E2-ATR
UPG2214TKE2A

包装

带卷 (TR)

商标

CEL

安装风格

SMD/SMT

封装

Reel

封装/外壳

6-SMD,扁平引线

封装/箱体

S06

工作温度

-45°C ~ 85°C

工厂包装数量

5000

带宽

500 MHz to 3000 MHz

开关数量

Single

开关配置

SPDT

拓扑

反射

插损@频率

0.35dB @ 3GHz

最大工作温度

+ 85 C

最小工作温度

- 45 C

标准包装

5,000

特性

-

电压-电源

-

电源电压-最大

5.3 V

电源电压-最小

1.8 V

电路

SPDT

阻抗

50 欧姆

隔离@频率

24dB @ 3GHz (标准)

频率

0.05 GHz to 3 GHz

频率 -上

3GHz

频率 -下

50MHz

高控制电压

5.3 V

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PDF Datasheet 数据手册内容提取

GaAs INTEGRATED CIRCUIT PG2214TK 6 T L, S-BAND SPDT SWITCH M U 4 DESCRIPTION The PG2214TK is a GaAs MMIC for L, S-band SPDT (Single Pole Double Throw) switch w1hich was developed for mobile phone and another L, S-band application. This device can operate 2 control switching by control voltage 1.8 to 5.3 V. This devic2e can operate frequency from 0.05 to 3.0 GHz, having the low insertion loss and high isolatOion. 2 This device is housed in a 6-pin lead-less minimold (1511) package. And this package is able to high-density surface mounting. G FEATURES C • Switch control voltage : Vcont (H) = 1.8 to 5.3 -V (3.0 V TYP.) : Vcont (L) = 0.2 to +0.2 V (0 V TYP.) • Low insertion loss : Lins1 = 0.25 dB ETYP. @ f = 0.05 to 0.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : : Lins2 = 0.25 dB TYP. @ f = 0.5 to 1.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V t : Lins3 = 0.30 dB TYP. @ f = 1.0 to 2.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V n : Lins4 = 0.35 dB TYP. @ f = 2.0 to 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Lins5 =S 0.35 dB TYP. @ f = 2e.5 to 3.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V • High isolation : ISL1 = 32 dB TYP. @ f = 0.05 to 0.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : ISL2 = 28 dB TYP. @ f =m 0.5 to 1.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : ISL3 = 27 dB TYP. @ f = 1.0 to 2.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : ISL4 = 26 dB TYP. @ f = 2.0 to 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V e A: ISL5 = 24 dB TYP. @ f = 2.5 to 3.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V • Handling power : Pin (1 dB) = +27.0c dBm TYP. @ f = 0.5 to 3.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Pin (1 dB) = +20.0 dBm TYP. @ f = 0.5 to 3.0 GHz, Vcont (H) = 1.8 V, Vcont (L) = 0 V a • High-density surface mounting : 6-pin lead-less minimold package (1.5  1.1  0.55 mm) l H APPLICATIONS p • L, S-band digital cellular or cordless telephone • W-LAN, WLL and BluetoothTM etc.e R ORDERING INFORMATION P n Part Number Package Marking Supplying Form PG2214TK-E2 6-pin leIad-less minimold (1511) G4K Embossed tape 8 mm wide - Pin 1, 6 face the perforation side of the tape p Qty 5 kpcs/reel Remark To oorder evaluation samples, contact your nearby sales office. Part number for sample order: PG2214TK-A r D Caution: Observe precautions when handling because these devices are sensitive to electrostatic discharge Document No. PG10475EJ04V0DS (4th edition) The mark  shows major revised points. Date Published October 2004 CP(K)

PG2214TK PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM Pin No. Pin Name 6 1 OUTPUT1 T 2 GMND 3 OUTPUT2 U 4 4Vcont2 5 INPUT 1 6 Vcont1 2 TRUTH TABLE O 2 Vcont1 Vcont2 INPUTOUTPUT1 INPUTOUTPUT2 G Low High ON OFF High Low OFF -ON C ABSOLUTE MAXIMUM RATINGS (TA = +2E5C, unless otherwise specified) : t Parameter Symbol Ratings Unit n Switch Control Voltage Vcont +6.0 Note V S e Input Power Pin +30 dBm m Operating Ambient Temperature TA 45 to +85 C Storage Temperature Tstg 55 to +150 C A e Note Vcont1  Vcont2  6.0 V c a RECOMMENDED OPERATING RANGE (TA = +25C, unless otherwise specified) l H Parameter Symbopl MIN. TYP. MAX. Unit Switch Control Voltage (H) Vecont (H) 1.8 3.0 5.3 V Switch Control Voltage (L) Vcont (L) 0.2 0 0.2 V R P n I - p o r D 2 Data Sheet PG10475EJ04V0DS

PG2214TK ELECTRICAL CHARACTERISTICS (TA = +25C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, DC cut capacitors = 100 pF, unless otherwise specified) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit 6 T Insertion Loss 1 Lins1 f = 0.05 to 0.5 GHz Note 1  0.25 0.45 dB M Insertion Loss 2 Lins2 f = 0.5 to 1.0 GHz  0.25 0.45 dB Insertion Loss 3 Lins3 f = 1.0 to 2.0 GHz  0.30 0.50 dB U 4 Insertion Loss 4 Lins4 f = 2.0 to 2.5 GHz  0.35 0.55 dB Insertion Loss 5 Lins5 f = 2.5 to 3.0 GHz  0.351 0.60 dB Isolation 1 ISL1 f = 0.05 to 0.5 GHz Note 1 29 32  dB 2 Isolation 2 ISL2 f = 0.5 to 1.0 GHz 25 28  dB O 2 Isolation 3 ISL3 f = 1.0 to 2.0 GHz 24 27  dB Isolation 4 ISL4 f = 2.0 to 2.5 GHz G23 26  dB Isolation 5 ISL5 f = 2.5 to 3.0 GHz 21 24  dB Input Return Loss 1 RLin1 f = 0.05 to 0-.5 GHz Note 1 C15 20  dB Input Return Loss 2 RLin2 f = 0.5 to 3.0 GHz 15 20  dB E Output Return Loss 1 RLout1 f = 0.05 to 0.5 GHz Note 1 : 15 20  dB t Output Return Loss 2 RLout2 f = 0.5 to 3.0 GHz 15 20  dB n 0.1 dB Loss Compression Pin (0.1 dB) f = 2.0/2.5 GHz +21.0 +23.0  dBm Input Power Note 2 Sf = 0.5 to 3.0 GHz e  +23.0  dBm 1 dB Loss Compression Pin (1 dB) f = 0.5 to 3.0 GHzm  +27.0  dBm Input Power Note 3 2nd Harmonics A2f0 f = 2.0 GHez, Pin = +15 dBm  55 47 dBc f = 2.5c GHz, Pin = +15 dBm  55 47 dBc 3rd Harmonics 3f0 f =a 2.0 GHz, Pin = +15 dBm  55 47 dBc f = 2.5 GHz, Pin = +15 dBm  55 47 dBc l H Intermodulation Intercept Point IIP3 pf = 0.5 to 3.0 GHz, 2 tone,  +58  dBm Pin = +16 dBm, 5 MHz spicing e Switch Control Current Icont  4 20 A Switch Control Speed RtSW 50% CTL to 90/10% RF  20 200 ns P Notes 1. DC cut capacitorns = 1 000 pF at f = 0.05 to 0.5 GHz 2. Pin (0.1 dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of I linear range. - 3. Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of p linear range. o r D 3 Data Sheet PG10475EJ04V0DS

PG2214TK ELECTRICAL CHARACTERISTICS (TA = +25C, Vcont (H) = 1.8 V, Vcont (L) = 0 V, DC cut capacitors = 100 pF, unless otherwise specified) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit 6 T Insertion Loss 6 Lins6 f = 0.05 to 0.5 GHz Note 1  0.25 0.50 dB M Insertion Loss 7 Lins7 f = 0.5 to 1.0 GHz  0.25 0.50 dB Insertion Loss 8 Lins8 f = 1.0 to 2.0 GHz  0.30 0.55 dB U 4 Insertion Loss 9 Lins9 f = 2.0 to 2.5 GHz  0.35 0.60 dB Insertion Loss 10 Lins10 f = 2.5 to 3.0 GHz  0.351 0.65 dB Isolation 6 ISL6 f = 0.05 to 0.5 GHz Note 1 27 30  dB 2 Isolation 7 ISL7 f = 0.5 to 2.0 GHz 23 27  dB O 2 Isolation 8 ISL8 f = 2.0 to 2.5 GHz 21 25  dB Isolation 9 ISL9 f = 2.5 to 3.0 GHz G20 24  dB Input Return Loss 3 RLin3 f = 0.05 to 3.0 GHz Note 1 15 20  dB Output Return Loss 3 RLout3 f = 0.05 to 3-.0 GHz Note 1 C15 20  dB 0.1 dB Loss Compression Pin (0.1 dB) f = 2.0/2.5 GHz +14.0 +17.0  dBm Input Power Note 2 E f = 0.5 to 3.0 GHz :  +17.0  dBm t 1 dB Loss Compression Pin (1 dB) f = 0.5 to 3.0 GHz  +20.0  dBm n Input Power Note 3 Switch Control Current IconSt e  4 20 A Switch Control Speed tSW 50% CTL to 90/10m% RF  20 200 ns Notes 1. DC cut capacitors = 1 000 pF at f = 0.05 to 0.5 GHz 2. Pin (0.1 dB) is measuAred the input power leveel when the insertion loss increases more 0.1 dB than that of linear range. c 3. Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of a linear range. l H p Caution This device is used it is necessary to use DC cut capacitors. The value of DC cut capacitors should be chosen to accommodate the frequency of operation, e bandwidth, switching speed and the condition with actual board of your system. The range of R recommended DC cut capacitor value is less than 100 pF. P n I - p o r D 4 Data Sheet PG10475EJ04V0DS

PG2214TK EVALUATION CIRCUIT 6 T M U 4 1 2 O 2 G C - E : t n Note C0 : 0.05 to 0.5 GHz 1 000 pF : 0.5 to 3.0 GHz 100 pF S e m The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. e A c a l H p e R P n I - p o r D 5 Data Sheet PG10475EJ04V0DS

PG2214TK ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD 6 T M U 4 1 2 O 2 G C - E : t n S e m e A c a l H p USING THE EVALUATION BOAeRD R Symbol Values P C1, C2, C3 100 pF n C4, C5 1 000 pF I - p o r D 6 Data Sheet PG10475EJ04V0DS

PG2214TK TYPICAL CHARACTERISTICS (TA = +25C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, DC cut capacitors = 100 pF, unless otherwise specified) 6 T M U 4 1 2 O 2 G C - Remark The graphs indicate nominal characteEristics. : t Caution These characteristics values include the losses of tnhe evaluation board. S e m e A c a l H p e R P n I - p o r D 7 Data Sheet PG10475EJ04V0DS

PG2214TK 6 T M U 4 1 2 O 2 G C - E : t n S e m e A c a l H p e R P n I - p o r D Remark The graphs indicate nominal characteristics. 8 Data Sheet PG10475EJ04V0DS

PG2214TK 6 T M U 4 1 2 O 2 G Remark The graph indicate nominal characteristics. C - E : t n S e m e A c a l H p e R P n I - p o r D 9 Data Sheet PG10475EJ04V0DS

PG2214TK PACKAGE DIMENSIONS 6-PIN LEAD-LESS MINIMOLD (1511) (UNIT: mm) 6 T M U 4 1 2 O 2 G C - E : t n S e m e A c a l H p e R P n I - p o r D 10 Data Sheet PG10475EJ04V0DS

PG2214TK RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. 6 Soldering Method Soldering Conditions T Condition Symbol M Infrared Reflow Peak temperature (package surface temperature) : 260C or below IR260 Time at peak temperature : 10 seconds or less Time at temperature of 220C or higher : 60 seconds or less U 4 Preheating time at 120 to 180C : 12030 seconds Maximum number of reflow processes : 3 times 1 Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below VPS Peak temperature (package surface temperature) : 215C or below 2 VP215 Time at temperature of 200C or higher O: 25 to 40 seconds Preheating time at 120 to 150C : 30 to 60 seco2nds Maximum number of reflow processes : 3 times G Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Wave Soldering Peak temperature (molten solder temperature) : 260C or below WS260 C Time at peak temperature - : 10 seconds or less Preheating temperature (package surface temperature) : 120C or below Maximum number of flow proEcesses : 1 time : Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below t Partial Heating Peak temperature (pin temperature) n : 350C or below HS350 Soldering time (per side of device) : 3 seconds or less Maximum chlorineS content of rosin flux (% maess) : 0.2%(Wt.) or below m Caution Do not use different soldering methods together (except for partial heating). e A c a l H p e R P n I - p o r D 11 Data Sheet PG10475EJ04V0DS

PG2214TK This product uses gallium arsenide (GaAs). Caution GaAs Products GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws 6 and/or ordinances, dispose of the product as recommended below. T 1. Commission a disposal company able to (with a license to) collect, transport and dispose of M materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to spUecial control) up until final d4isposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. 1 • Do not lick the product or in any way allow it to enter the mouth. 2 O 2 G C - E : t n S e m e A c a l H p e R P n I - p o r D 12 Data Sheet PG10475EJ04V0DS

NOTICE 1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. California Eastern Laboratories and Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of 6these circuits, software, or information. T 2. California Eastern Laboratories has used reasonable care in preparing the information included in this document, but California Eastern Laboratories does M not warrant that such information is error free. California Eastern Laboratories and Renesas Electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. 3. California Eastern Laboratories and Renesas Electronics do not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical informUation described in this docum4ent. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of California Eastern Laboratories or Renesas Electronics or others. 1 4. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. California Eastern Laboratories and Renesas Electronics assume no responsibility for any losses incurred by you or third parties arising from such alteration, modification, copy or otherwise misappropriation of Renesas Electronics product. 2 5. Renesas Electronics products are classified according to the following two quality grades: “Standard” and “High Quality”. The recommended applications O for each Renesas Electronics product depends on the product’s quality grade, as indicated below. “Standard”: Computers; office equipment; communications 2 equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots etc. “High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-crime systems; and safety equipment etc. Renesas Electronics products are neither intended nor authorized for useG in products or systems that may pose a direct threat to human life or bodily injury (artificial life support devices or systems, surgical implantations etc.), or may cause serious property damages (nuclear reactor control systems, military equipment etc.). You must check the quality grade of each Renesas Electronics product before using it in a particular application. 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Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safetyS measures to guard them againest the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, m fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or systems manufactured by you. 8. 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Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. aYou should not use Renesas Electronics products or technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. When exporting the Renesas Electronics products or technologyl described in this document, you should comply with the applicable export control laws and H regulations and follow the procedures required by suchp laws and regulations. 10. 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