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焊接，拆焊，返修产品 > 焊接 共133条产品
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直径
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保质期
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存储/冷藏温度：x
保质期起始日期：x
直径：x
形式：x
熔点：x
线规：x
发货信息：x
工艺：x
保质期：x
零件状态：x
焊剂类型：x
成分：x
重量：x
类型：x
| 序号 | 图片 | 型号 | 制造商 | 环保 | 描述 |
|---|---|---|---|---|---|
| 1 |  |
SMDSWLTLFP32 | Chip Quik Inc. | Y | Lead Free Wire Solder Bi57Sn42Ag1 (57/42/1) 21 AWG, 22 SWG |
| 2 | 暂无 | 92-7068-9030 | Kester Solder | Y | Lead Free No-Clean Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 22 AWG, 23 SWG Spool, 17.64 oz (500g) |
| 3 | 暂无 | 24-0595-9713 | Kester Solder | Leaded Rosin Mildly Activated (RMA) Wire Solder Pb95Sn5 (95/5) 20 AWG, 22 SWG Spool, 1 lb (454 g) | |
| 4 | 暂无 | 24-6337-8846 | Kester Solder | Leaded No-Clean Wire Solder Sn63Pb37 (63/37) 18 AWG, 19 SWG Spool, 1 lb (454 g) | |
| 5 |  |
386824 | Multicore | Leaded Rosin Activated (RA) Wire Solder Sn60Pb40 (60/40) 22 AWG, 23 SWG Spool, 17.64 oz (500g) | |
| 6 |  |
SMDLTLFPT5 | Chip Quik Inc. | Y | Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Syringe, 0.53 oz (15g), 5cc |
| 7 |  |
SMDLTLFP15T4 | Chip Quik Inc. | Y | Lead Free No-Clean Solder Paste, Two Part Mix Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 0.53 oz (15g) |
| 8 |  |
SMDLTLFP50T3 | Chip Quik Inc. | Y | Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 1.76 oz (50g) |
| 9 |  |
SMDLTLFP500T3C | Chip Quik Inc. | Y | Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Cartridge, 17.64 oz (500g) |
| 10 |  |
SMDLTLFP250T4 | Chip Quik Inc. | Y | Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 8.8 oz (250g) |
| 11 |  |
SMDLTLFP10T4 | Chip Quik Inc. | Y | Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Syringe, 1.23 oz (35g), 10cc |
| 12 |  |
SMDLTLFPT4 | Chip Quik Inc. | Y | Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Syringe, 0.53 oz (15g), 5cc |
| 13 |  |
SMDLTLFP60T4 | Chip Quik Inc. | Y | Lead Free No-Clean Solder Paste, Two Part Mix Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 2.12 oz (60g) |
| 14 |  |
SMDLTLFP500T4C | Chip Quik Inc. | Y | Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Cartridge, 17.64 oz (500g) |
| 15 |  |
SMDLTLFP250T5 | Chip Quik Inc. | Y | Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 8.8 oz (250g) |
| 16 |  |
SMDLTLFP | Chip Quik Inc. | Y | Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Syringe, 0.53 oz (15g), 5cc |
| 17 |  |
SMDLTLFP500T3 | Chip Quik Inc. | Y | Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 17.64 oz (500g) |
| 18 |  |
14-6337-0031 | Kester Solder | Leaded Wire Solder Sn63Pb37 (63/37) 20 AWG, 22 SWG Spool, 1 lb (454 g) | |
| 19 |  |
24-6337-0039 | Kester Solder | Leaded Rosin Activated (RA) Wire Solder Sn63Pb37 (63/37) 18 AWG, 19 SWG Spool, 1 lb (454 g) | |
| 20 | 暂无 | 26-6337-0038 | Kester Solder | Leaded Rosin Activated (RA) Wire Solder Sn63Pb37 (63/37) 18 AWG, 19 SWG Spool, 5 lbs (2.27kg) |