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ICGOO电子元器件商城为您提供TUSB2551ARGTR由Texas Instruments设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 TUSB2551ARGTR价格参考¥4.97-¥11.18。Texas InstrumentsTUSB2551ARGTR封装/规格:接口 - 驱动器,接收器,收发器, 半 收发器 1/3 USB 2.0 16-QFN(3x3)。您可以下载TUSB2551ARGTR参考资料、Datasheet数据手册功能说明书,资料中有TUSB2551ARGTR 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

集成电路 (IC)半导体

描述

IC TXRX ADVANCED USB 2.0 16QFNUSB 接口集成电路 Advanced Universal Serial Bus Xcvr

产品分类

接口 - 驱动器,接收器,收发器

品牌

Texas Instruments

产品手册

点击此处下载产品Datasheet

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

接口 IC,USB 接口集成电路,Texas Instruments TUSB2551ARGTR-

数据手册

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产品型号

TUSB2551ARGTR

PCN设计/规格

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产品目录页面

点击此处下载产品Datasheet

产品种类

USB 接口集成电路

供应商器件封装

16-QFN(3x3)

其它名称

296-24834-1

包装

剪切带 (CT)

协议

USB 2.0

单位重量

24.100 mg

双工

商标

Texas Instruments

安装类型

表面贴装

安装风格

SMD/SMT

封装

Reel

封装/外壳

16-VFQFN 裸露焊盘

封装/箱体

VQFN-16

工作温度

-40°C ~ 85°C

工作电源电压

1.65 V to 3.6 V, 3.3 V, 5 V

工作电源电流

700 uA, 5 uA

工厂包装数量

3000

接收器滞后

200mV

数据速率

1.5Mbps

最大工作温度

+ 85 C

最小工作温度

- 40 C

标准

USB 2.0

标准包装

1

电压-电源

3.3V,5V

类型

收发器

系列

TUSB2551A

速度

High-Speed

驱动器/接收器数

1/3

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PDF Datasheet 数据手册内容提取

TUSB2551A www.ti.com...................................................................................................................................................................................................... SCES790–JUNE2009 ADVANCED UNIVERSAL SERIAL BUS TRANSCEIVER FEATURES 1 • CompliesWithUniversalSerialBus PW PACKAGE SpecificationRev.2.0(USB2.0) (TOPVIEW) • TransmitsandReceivesSerialDataatBoth Full-Speed(12-Mbit/s)andLow-Speed VCC(I/O) 1 14 VCC(5.0) (1.5-Mbit/s)DataRates SPEED 2 13 VPU(3.3) • IntegratedBypassable5-Vto3.3-VVoltage RCV 3 12 Vreg(3.3) VP 4 11 D+ RegulatorforPoweringViaUSBV BUS VM 5 10 D– • Low-PowerOperationisIdealforPortable SOFTCON 6 9 OE Equipment GND 7 8 SUSPEND • MeetstheIEC-61000-4-2ContactDischarge (±9kV)andAir-GapDischarge(±9kV)ESD RGT PACKAGE Ratings (BOTTOMVIEW) • SeparateI/OSupplyWithOperationDownto 1.65V N D O N • Very-LowPowerConsumptiontoMeetUSB TC PE F D S SuspendCurrentRequirements O N U C S G S N • NoPower-SupplySequencingRequirements 5 6 7 8 APPLICATIONS VM 4 9 OE • CellularPhones VP 3 10 D– • PersonalDigitalAssistants(PDAs) GND RCV 2 11 D+ • HandheldComputers (Exposed die pad) SPEED 1 12 Vreg(3.3) 16 15 14 13 C O) 0) 3) N C(I/ C(5. U(3. C C P V V V NC – No internal connection DESCRIPTION/ORDERING INFORMATION The TUSB2551A is a single-chip transceiver that complies with the physical-layer specifications of universal serial bus (USB) 2.0. The device supports both full-speed (12-Mbit/s) and low-speed (1.5-Mbit/s) operation. The TUSB2551A delivers superior edge-rate control, producing crisper eye diagrams, which ease the task of passing USBcompliancetesting. A dual supply-voltage operation allows the TUSB2551A to reference the system interface I/O signals to a supply voltage down to 1.6 V, while independently powered by the USB V . This allows the system interface to CC(5.0) operateatitscorevoltagewithouttheadditionofbufferinglogic,andalsoreducesystemoperatingcurrent. 1 Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsofTexas Instrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet. UNLESS OTHERWISE NOTED this document contains Copyright©2009,TexasInstrumentsIncorporated PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarilyincludetestingofallparameters.

TUSB2551A SCES790–JUNE2009...................................................................................................................................................................................................... www.ti.com ORDERINGINFORMATION(1) T PACKAGE(2) ORDERABLEPARTNUMBER TOP-SIDEMARKING A QFN–RGT Reelof2000 TUSB2551ARGTR ZUH –40°Cto85°C Reelof3000 TUSB2551APWR TSSOP–PW PREVIEW Tubeof90 TUSB2551APW (1) Forthemostcurrentpackageandorderinginformation,seethePackageOptionAddendumattheendofthisdocument,orseetheTI websiteatwww.ti.com. (2) Packagedrawings,thermaldata,andsymbolizationareavailableatwww.ti.com/packaging. BLOCKDIAGRAM To Internal Circuitry LDO V Regulator CC(5.0) V CC(I/O) V reg(3.3) V PU(3.3) SOFTCON D+ SPEED OE D– RCV r o elat Levansl Tr VP VM SUSPEND GND 2 SubmitDocumentationFeedback Copyright©2009,TexasInstrumentsIncorporated ProductFolderLink(s):TUSB2551A

TUSB2551A www.ti.com...................................................................................................................................................................................................... SCES790–JUNE2009 TERMINALFUNCTIONS TERMINAL NO. I/O DESCRIPTION NAME RGT PW Systeminterfacesupplyvoltage.UsedtoprovidereferencesupplyvoltageforsystemI/Ointerface VCC(I/O) 15 1 I signaling. Speed.Edge-ratecontrol:AlogicHIGHoperatesatedgeratesforfull-speedoperation.AlogicLOW SPEED 1 2 I operatesatedgeratesforlow-speedoperation. RCV 2 3 O Receivedata.OutputforUSBdifferentialdata. IfOE=1,VP=Receiveroutput(+) VP 3 4 I/O IfOE=0,VP=Driverinput(+) IfOE=1,VM=Receiveroutput(–) VM 4 5 I/O IfOE=0,VM=Driverinput(–) SOFTCON 5 6 I Softconnect.ControlsstateofVPU(3.3).SeeVPU(3.3)pindescriptionfordetails. GND 6 7 Groundreference SUSPEND 7 8 I Suspend.Activehigh.Turnsoffinternalcircuitstoreducesupplycurrent. NC 8,16 Nointernalconnection Outputenable.Activelow.Enablesthetransceivertotransmitdataontothebus.Wheninactive,the OE 9 9 I transceiverisinthereceivemode. D–,D+ 10,11 10,11 I/O DifferentialdatalinesconformingtotheUSBstandard 3.3-Vreferencesupply.Requiresaminimum0.1-m Fdecouplingcapacitorforstability.A1-m Fcapacitoris Vreg(3.3) 12 12 O recommended. Pullupsupplyvoltage.Usedtoconnect1.5-kΩpullupspeeddetectresistor. VPU(3.3) 13 13 O IfSOFTCON=1,VPU(3.3)ishighimpedance.IfSOFTCON=0,VPU(3.3)=3.3V. VCC(5.0) 14 14 I USBbussupplyvoltage.UsedtopowerUSBtransceiverandinternalcircuitry. FUNCTIONAL DESCRIPTION FUNCTIONSELECTION SUSPEND OE D+,D– RCV VP,VM FUNCTION 0 0 Driving Active Active Normaltransmitmode 0 1 Receiving Active Active Normalreceivemode 1 0 Hi-Z 0 Notactive Lowpowerstate 1 1 Hi-Z 0 Active Receivingduringsuspend(lowpowerstate)(1) (1) Duringsuspend,VPandVMareactivetodetectout-of-bandsignalingconditions. TRUTHTABLEDURINGNORMALMODE OE=0 INPUT OUTPUT RESULT VP VM D+ D– RCV 0 0 0 0 X(1) SE0 0 1 0 1 0 Logic0 1 0 1 0 1 Logic1 1 1 1 1 X(1) Undefined OE=1 INPUT OUTPUT RESULT D+ D– VP VM RCV 0 0 0 0 X(1) SE0 0 1 0 1 0 Logic0 1 0 1 0 1 Logic1 1 1 1 1 X(1) Undefined (1) X=Undefined Copyright©2009,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLink(s):TUSB2551A

TUSB2551A SCES790–JUNE2009...................................................................................................................................................................................................... www.ti.com Power-Supply Configurations The TUSB2551A can be used with different power-supply configurations, which can be dynamically changed. An overviewisgiveninTable1. • Normal mode – Both V and V or V and V are connected. For 5-V operation, V is CC(I/O) CC(5.0) CC(5.0) reg(3.3) CC(5.0) connected to a 5-V source (4 V to 5.5 V). The internal voltage regulator then produces 3.3 V for the USB connections. For 3.3-V operation, both V and V are connected to a 3.3-V source (3 V to 3.6 V). CC(5.0) reg(3.3) V is independently connected to a voltage source (1.65 V to 3.6 V), depending on the supply voltage of CC(I/O) theexternalcircuit. • Disable mode – V is not connected; V or V and V are connected. In this mode, the CC(I/O) CC(5.0) CC(5.0) reg(3.3) internalcircuitsoftheTUSB2551Aensurethatthe D+ and D– pins are in 3-state, and the power consumption dropstothelow-power(suspended)statelevel.SomehysteresisisbuiltintothedetectionofV lost. CC(I/O) • Sharing mode – V is connected; V and V are not connected. In this mode, the D+ and D– CC(I/O) CC(5.0) reg(3.3) pins are made 3-state, and the TUSB2551A allows external signals of up to 3.6 V to share the D+ and D– lines. The internal circuits of the TUSB2551A ensure that virtually no current (maximum 10 mA) is drawn via the D+ and D– lines. The power consumption through V drops to the low-power (suspended) state level. CC(I/O) Both the VP and VM pins are driven HIGH to indicate this mode. Pin RCV is made LOW. Some hysteresis is builtintothedetectionofV lost. reg(3.3) Table1.Power-SupplyConfigurationOverview CONFIGURATION VBUS/VTRM VIF Notes MODE Normal Connected Connected Normalsupplyconfigurationandoperation VP/VMareHIGHoutputs,RCVisLOW. Disconnect WithOE=0andSUSPEND=1,datalinesmaybedriven Open Connected (D+/D–sharing) withexternaldevicesupto3.6V. WithD+,D–floating,I drawslessthan1m A. CC(I/O) VP/VMareHIGHoutputs,RCVisLOW. Disconnect Ground Connected WithD+,D–floating,I drawslessthan1m A. CC(I/O)F DisableMode Connected Open LogiccontrolledinputspinsareHi-Z. Prohibited Connected Ground Prohibitedcondition Table2.PinStatesinDisableorSharingMode PINS DISABLE-MODESTATE SHARING-MODESTATE V /V 5-Vinput/3.3-Voutput,3.3-Vinput/3.3-Vinput Notpresent CC(5.0) reg(3.3) V Notpresent 1.65-Vto3.6-Vinput CC(I/O) V Highimpedance(off) Highimpedance(off) PU(3.3) D+,D– Highimpedance Highimpedance VP,VM Invalid(1) H RCV Invalid(1) L Inputs(SPEED,SUSPEND,OE,SOFTCON) Highimpedance Highimpedance (1) HighimpedanceordrivenLOW 4 SubmitDocumentationFeedback Copyright©2009,TexasInstrumentsIncorporated ProductFolderLink(s):TUSB2551A

TUSB2551A www.ti.com...................................................................................................................................................................................................... SCES790–JUNE2009 Power-Supply Input Options TheTUSB2551Ahastwopower-supplyinputoptions. • Internal regulator – V is connected to 4 V to 5.5 V. The internal regulator is used to supply the internal CC(5.0) circuitrywith3.3V(nominal).V becomesa3.3-Voutputreference. reg(3.3) • Regulatorbypass–V andV areconnectedtothesamesupply.Theinternalregulatoris bypassed, CC(5.0) reg(3.3) and the internal circuitry is supplied directly from the V power supply. The voltage range is reg(3.3) 3Vto3.6VtocomplywiththeUSBspecification. Thesupply-voltagerangeforeachinputoptionisspecifiedinTable3. Table3.Power-SupplyInputOptions INPUTOPTION V V V CC(5.0) reg(3.3) CC(I/O) Supplyinputforinternalregulator Voltage-referenceoutput SupplyinputfordigitalI/Opins Internalregualtor (4Vto5.5V) (3.3V,300m A) (1.4Vto3.6V) ConnectedtoV with reg(3.3) Supplyinput SupplyinputfordigitalI/Opins Regulatorbypass maximumvoltagedropof0.3V (3Vto3.6V) (1.4Vto3.6V) (2.7Vto3.6V) Electrostatic Discharge (ESD) PINNAME ESD TYP UNIT IEC61000-4-2,Air-GapDischarge ±9 D+,D–,V IEC61000-4-2,ContactDischarge ±9 kV CC(5.0) Human-BodyModel ±15 Allotherpins Human-BodyModel ±2 kV Copyright©2009,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLink(s):TUSB2551A

TUSB2551A SCES790–JUNE2009...................................................................................................................................................................................................... www.ti.com ABSOLUTE MAXIMUM RATINGS(1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT V Supplyvoltagerange –0.5 6 V CC(5.0) V I/Osupplyvoltagerange –0.5 4.6 V CC(I/O) V Regulatedvoltagerange –0.5 4.6 V reg(3.3) V DCinputvoltagerange –0.5 V +0.5 mA I CC(I/O) I Outputcurrent(D+,D–) ±50 mA O(D+,D-) I Outputcurrent(allothers) ±15 mA O I InputCurrent ±50 mA I T Storagetemperaturerange –65 150 °C stg (1) Stressesbeyondthoselistedunder"absolutemaximumratings"maycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunder"recommendedoperating conditions"isnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. RECOMMENDED OPERATING CONDITIONS MIN NOM MAX UNIT V Supplyvoltage,internalregulatoroption 5-Voperation 4 5 5.25 V CC(5.0) V Supplyvoltage,regulatorbypassoption 3.3-Voperation 3 3.3 3.6 V reg(3.3) V I/Osupplyvoltage 1.65 3.6 V CC(I/O) V Low-levelinputvoltage(1) V –0.3 0.15V V IL CC(I/O) CC(I/O) V High-levelinputvoltage(1) 0.85V V +0.3 V IH CC(I/O) CC(I/O) D+,D– InputvoltageonanalogI/Opins 0 3.6 V T Junctiontemperature –40 85 °C c (1) Specificationappliestothefollowingpins:SUSPEND,SPEED,RCV,SOFTCON,VP,VM,andOE. 6 SubmitDocumentationFeedback Copyright©2009,TexasInstrumentsIncorporated ProductFolderLink(s):TUSB2551A

TUSB2551A www.ti.com...................................................................................................................................................................................................... SCES790–JUNE2009 DC ELECTRICAL CHARACTERISTICS – SYSTEM AND USB INTERFACE(1) V =3.6V,V =5V(unlessotherwisenoted),T =25°C.Boldindicatesspecificationsovertemperature,–40°Cto CC(I/O) CC(5.0) A 85°C. PARAMETER TESTCONDITIONS MIN TYP MAX UNIT VOH Hvoigltha-gleev(2e)loutput IOH=20m A 0.9VCC(I/O) V VOL Lvoolwta-gleev(e2)loutput IOL=20m A 0.1 V I Inputleakagecurrent(2) –5 1.5 5 m A IL SPEED SUSPEND OE VOLTAGE LOAD 1 0 1 1 5 1 0 0 1 5 0 0 1 1 5 m A V = ICC(I/O) VCC(I/O)supplycurrent 0 0 0 5C.C2(55.0V), 1 5 0 1 0 V = 1 5 CC(I/O) 3.6V f=6MHz, 1 0 0 1 2 mA C =50pF L 0 0 0 f=750kHz, 260 280 m A C =600pF L 1 0 1 800 1100 1 0 0 3000 5000 0 0 1 230 350 m A V = 0 0 0 CC(5.0) 400 700 5.25V, I V supplycurrent CC(5.0) CC(5.0) 0 1 0 V = 130 200 CC(I/O) 3.6V f=6MHz, 1 0 0 6 10 C =50pF L mA f=750kHz, 0 0 0 4..3 5 C =600pF L I V leakagecurrent SOFTCON=1,V =0V –5 5 m A PU(3.3)LEAK PU(3.3) PU(3.3) I V leakagecurrent V =3.6V,V =0V –5 5 m A CC(I/O)LEAK CC(I/O) CC(I/O) CC(5.0) V Pullupoutputvoltage I =200m A,V =4Vto5.25V 3 3.3 3.6 V PU(3.3) reg(3.3) CC(5.0) V switch R PU(3.3) I =10mA,V =4Vto5.25V 10 Ω SW resistance reg(3.3) CC(5.0) ESDProtection IEC-61000-4-2 Air-GapDischarge 10pulses ±9 (D+,D–, kV V only) ContactDischarge 10pulses ±9 CC(5.0) (1) Specificationforpackagedproductonly (2) Specificationappliestothefollowingpins:RCV,VP,VM,OE. Copyright©2009,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLink(s):TUSB2551A

TUSB2551A SCES790–JUNE2009...................................................................................................................................................................................................... www.ti.com DC ELECTRICAL CHARACTERISTICS – TRANSCEIVER(1) PARAMETER TESTCONDITIONS MIN TYP MAX UNIT LeakageCurrent I Hi-Zstatedatalineleakage(suspendmode) 0V<V <3.3V,SUSPEND=1 –10 10 m A LO IN InputLevels V Differentialinputsensitivity |(D+)–(D–)| 0.2 V DI V Differentialcommonmoderange IncludesV range 0.8 2.5 V CM DI V Single-endedreceiverthreshold 0.8 2 V SE Receiverhysteresis 200 mV OutputLevels V Staticoutputlow R =1.5kΩto3.6V 0.3 V OL L V Staticoutputhigh R =15kΩtoGND 2.8 3.6 V OH L Capacitance C Transceivercapacitance PintoGND 10 pF IN Z Driveroutputresistance Steady-statedrive 1 6 11 Ω DRV (1) Specificationforpackagedproductonly 8 SubmitDocumentationFeedback Copyright©2009,TexasInstrumentsIncorporated ProductFolderLink(s):TUSB2551A

TUSB2551A www.ti.com...................................................................................................................................................................................................... SCES790–JUNE2009 AC ELECTRICAL CHARACTERISTICS(1) PARAMETER TESTCONDITIONS MIN MAX UNIT DriverCharacteristics(LowSpeed) T Transitionrisetime C =200pF(seeFigure2),C =600pF 75 300 ns R L L T Transitionfalltime C =200pF(seeFigure2),C =600pF 75 300 ns F L L LRFM Rise/falltimematching T ,T 80 125 % R F V Outputsignalcrossovervoltage 1.3 2 V CRS DriverCharacteristics(FullSpeed) T Transitionrisetime C =50pF(seeFigure2) 4 20 ns R L T Transitionfalltime C =50pF(seeFigure2) 4 20 ns F L FRFM Rise/falltimematching TR,TF 90 111.1 % V Outputsignalcrossovervoltage 1.3 2 V CRS TransceiverTiming(FullSpeed) t OEtoreceiver3-statedelay SeeFigure1 15 ns PVZ t Receiver3-statetotransmitdelay SeeFigure1 15 ns PZD t OEtodriver3-statedelay SeeFigure1 15 ns PDZ t Driver3-statetoreceivedelay SeeFigure1 15 ns PZV t PLH V ,V toD+,D–propagationdelay SeeFigure4 17 ns t P M PHL t PLH D+,D–toRCVpropagationdelay SeeFigure3 17 ns t PHL t PLH D+,D–toV ,V propagationdelay SeeFigure3 10 ns t P M PHL (1) Specificationforpackagedproductonly Copyright©2009,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLink(s):TUSB2551A

TUSB2551A SCES790–JUNE2009...................................................................................................................................................................................................... www.ti.com TIMINGDIAGRAMS TRANSMIT RECEIVE OE t t PVZ PZV V /V P M t t PZD PDZ D+/D– Figure1.EnableandDisableTimes RISE TIME FALL TIME Differential 90% 90% Data Lines 10% 10% t t R F Figure2.RiseandFallTimes D+ Differential V V CRS Data Lines CRS D– V tPLH tPHL OH V OL V SS Figure3.ReceiverPropagationDelay V OH V OL t t PLH PHL D+ V Differential V CRS Data Lines CRS D– Figure4.DriverPropagationDelay 10 SubmitDocumentationFeedback Copyright©2009,TexasInstrumentsIncorporated ProductFolderLink(s):TUSB2551A

TUSB2551A www.ti.com...................................................................................................................................................................................................... SCES790–JUNE2009 TESTCIRCUITS D.U.T. 25 pF Figure5.LoadforV ,V ,RCV P M VTRM 15k 20 D.U.T. 15k C L Figure6.LoadforD+,D– Copyright©2009,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLink(s):TUSB2551A

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TUSB2551ARGTR ACTIVE VQFN RGT 16 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 ZUH & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 11-Aug-2017 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) TUSB2551ARGTR VQFN RGT 16 3000 330.0 12.4 3.3 3.3 1.0 8.0 12.0 Q2 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 11-Aug-2017 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) TUSB2551ARGTR VQFN RGT 16 3000 346.0 346.0 35.0 PackMaterials-Page2

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PACKAGE OUTLINE RGT0016B VQFN - 1 mm max height SCALE 3.600 PLASTIC QUAD FLATPACK - NO LEAD A 3.1 B 2.9 PIN 1 INDEX AREA 3.1 2.9 1 MAX C SEATING PLANE 0.05 0.08 0.00 1.6 0.05 (0.2) TYP 5 8 EXPOSED THERMAL PAD 12X 0.5 4 9 4X 17 SYMM 1.5 1 12 0.3 16X 0.2 16 13 0.1 C A B PIN 1 ID SYMM (OPTIONAL) 0.05 0.5 16X 0.3 4219033/A 08/2016 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. www.ti.com

EXAMPLE BOARD LAYOUT RGT0016B VQFN - 1 mm max height PLASTIC QUAD FLATPACK - NO LEAD ( 1.6) SYMM 16 13 16X (0.6) 1 12 16X (0.25) 17 SYMM (2.8) (0.55) TYP 12X (0.5) 9 4 ( 0.2) TYP VIA 5 8 (R0.05) (0.55) TYP ALL PAD CORNERS (2.8) LAND PATTERN EXAMPLE SCALE:20X 0.07 MAX 0.07 MIN ALL AROUND ALL AROUND SOLDER MASK METAL OPENING SOLDER MASK METAL UNDER OPENING SOLDER MASK NON SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS 4219033/A 08/2016 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. www.ti.com

EXAMPLE STENCIL DESIGN RGT0016B VQFN - 1 mm max height PLASTIC QUAD FLATPACK - NO LEAD ( 1.47) 16 13 16X (0.6) 1 12 16X (0.25) 17 SYMM (2.8) 12X (0.5) 9 4 METAL ALL AROUND 5 8 SYMM (R0.05) TYP (2.8) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 17: 84% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:25X 4219033/A 08/2016 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com

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