TLP700A Photocouplers Infrared LED & Photo IC TTTTLLLLPPPP777700000000AAAA 1111.... AAAApppppppplllliiiiccccaaaattttiiiioooonnnnssss • Industrial Inverters • Air Conditioner Inverters • MOSFET Gate Drivers • IGBT Gate Drivers • Induction Cooktop and Home Appliances 2222.... GGGGeeeennnneeeerrrraaaallll The TLP700A is a photocoupler in a 6-pin SDIP package that consists of an infrared LED optically coupled to an integrated high-gain, high-speed photodetector IC chip. It provides guaranteed performance and specifications at temperatures up to 110 . The TLP700A is physically smaller than the one in an 8-pin DIP package and compliant with international safety standards for reinforced insulation. It thus provides a smaller footprint solution for applications that require safety standard certification. An internal noise shield provides a guaranteed commonmode transient immunity of ±20 kV/µs. It is ideal for IGBT and power MOSFET gate drive. 3333.... FFFFeeeeaaaattttuuuurrrreeeessss (1) Buffer logic type (totem pole output) (2) Output peak current: ±2.5 A (max) (3) Operating temperature: -40 to 110  (4) Supply current: 3 mA (max) (5) Supply voltage: 15 to 30 V (6) Threshold input current: 5 mA (max) (7) Propagation delay time: 200 ns (max) (8) Common-mode transient immunity: ±20 kV/µs (min) (9) Isolation voltage: 5000 Vrms (min) (10) Safety standards UL-recognized: UL 1577, File No.E67349 cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349 VDE-approved: EN 60747-5-5, EN 62368-1 ((((NNNNooootttteeee 1111)))) CQC-approved: GB4943.1, GB8898 Japan Factory Note 1:When a VDE approved type is needed, please designate the OOOOppppttttiiiioooonnnn ((((DDDD4444)))). Start of commercial production 2012-01 ©2015-2020 1 2020-02-05 Toshiba Electronic Devices & Storage Corporation Rev.5.0

TLP700A 4444.... PPPPaaaacccckkkkaaaaggggiiiinnnngggg aaaannnndddd PPPPiiiinnnn CCCCoooonnnnffffiiiigggguuuurrrraaaattttiiiioooonnnn 1: Anode 2: N.C. 3: Cathode 4: GND 5: V (Output) O 6: V CC 11-5J1S 5555.... IIIInnnntttteeeerrrrnnnnaaaallll CCCCiiiirrrrccccuuuuiiiitttt ((((NNNNooootttteeee)))) Note: A 0.1-µF bypass capacitor must be connected between pin 6 and pin 4. 6666.... PPPPrrrriiiinnnncccciiiipppplllleeee ooooffff OOOOppppeeeerrrraaaattttiiiioooonnnn 6666....1111.... TTTTrrrruuuutttthhhh TTTTaaaabbbblllleeee Input LED M1 M2 Output H ON ON OFF H L OFF OFF ON L 6666....2222.... MMMMeeeecccchhhhaaaannnniiiiccccaaaallll PPPPaaaarrrraaaammmmeeeetttteeeerrrrssss 7.62 mm Pitch 10.16 mm Pitch Characteristics Unit TLP700A TLP700AF Creepage distances 7.0 (min) 8.0 (min) mm Clearance distances 7.0 (min) 8.0 (min) Internal isolation thickness 0.4 (min) 0.4 (min) ©2015-2020 2 2020-02-05 Toshiba Electronic Devices & Storage Corporation Rev.5.0

TLP700A 7777.... AAAAbbbbssssoooolllluuuutttteeee MMMMaaaaxxxxiiiimmmmuuuummmm RRRRaaaattttiiiinnnnggggssss ((((NNNNooootttteeee)))) ((((UUUUnnnnlllleeeessssssss ooootttthhhheeeerrrrwwwwiiiisssseeee ssssppppeeeecccciiiiffffiiiieeeedddd,,,, TTTTaaaa ==== 22225555 )))) Characteristics Symbol Note Rating Unit LED Input forward current I 20 mA F Input forward current derating (T ≥ 105 ) ∆I /∆T -1 mA/ a F a Peak transient input forward I (Note 1) 1 A FPT current Peak transient input forward (T ≥ 85 ) ∆I /∆T -25 mA/ a FPT a current derating Input reverse voltage V 5 V R Input power dissipation P 40 mW D Input power dissipation (T ≥ 85 ) ∆P /∆T -1.0 mW/ a D a derating Detector Peak high-level output current (T = -40 to 110 ) I (Note 2) -2.5 A a OPH Peak low-level output current (T = -40 to 110 ) I (Note 2) +2.5 a OPL Output voltage V 35 V O Supply voltage V 35 CC Output power dissipation P 160 mW O Output power dissipation (T ≥ 85 ) ∆P /∆T -4.0 mW/ a O a derating Common Operating temperature T -40 to 110  opr Storage temperature T -55 to 125 stg Lead soldering temperature (10 s) T (Note 3) 260 sol Isolation voltage AC, 60 s, BV (Note 4) 5000 Vrms S R.H. ≤ 60 % Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1:Pulse width (PW) ≤ 1 µs, 300 pps Note 2:Exponential waveform. Pulse width ≤ 0.3 µs, f ≤ 15 kHz Note 3:≥ 2 mm below seating plane. Note 4:This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6 are shorted together. 8888.... RRRReeeeccccoooommmmmmmmeeeennnnddddeeeedddd OOOOppppeeeerrrraaaattttiiiinnnngggg CCCCoooonnnnddddiiiittttiiiioooonnnnssss ((((NNNNooootttteeee)))) Characteristics Symbol Note Min Typ. Max Unit Input on-state current I (Note 1) 6.5  10 mA F(ON) Input off-state voltage V 0  0.8 V F(OFF) Supply voltage V (Note 2) 15  30 CC Peak high-level output current I   -2.0 A OPH Peak low-level output current I   +2.0 OPL Operating frequency f (Note 3)   50 kHz Note: The recommended operating conditions are given as a design guide necessary to obtain the intended performance of the device. Each parameter is an independent value. When creating a system design using this device, the electrical characteristics specified in this datasheet should also be considered. Note: A ceramic capacitor (0.1 µF) should be connected between pin 6 and pin 4 to stabilize the operation of a high- gain linear amplifier. Otherwise, this photocoupler may not switch properly. The bypass capacitor should be placed within 1 cm of each pin. Note 1:The rise and fall times of the input on-current should be less than 0.5 µs. Note 2:Denotes the operating range, not the recommended operating condition. Note 3:Exponential waveform. I ≥ -2.0 A (≤ 0.3 µs), I ≤ 2.0 A (≤ 0.3 µs), T = 110  OPH OPL a ©2015-2020 3 2020-02-05 Toshiba Electronic Devices & Storage Corporation Rev.5.0

TLP700A 9999.... EEEElllleeeeccccttttrrrriiiiccccaaaallll CCCChhhhaaaarrrraaaacccctttteeeerrrriiiissssttttiiiiccccssss ((((NNNNooootttteeee)))) ((((UUUUnnnnlllleeeessssssss ooootttthhhheeeerrrrwwwwiiiisssseeee ssssppppeeeecccciiiiffffiiiieeeedddd,,,, TTTTaaaa ==== ----44440000 ttttoooo 111111110000 )))) Test Characteristics Symbol Note Test Condition Min Typ. Max Unit Circuit Input forward voltage V I = 10 mA, T = 25  1.45 1.55 1.7 V F F a Input forward voltage ∆V /∆T I = 10 mA  -2.0  mV/ F a F temperature coefficient Input reverse current I V = 5 V, T = 25    10 µA R R a Input capacitance C V = 0 V, f = 1 MHz, T = 25   60  pF t a Peak high-level output current I (Note 1) Fig. I = 5 mA, V = 15 V,  -1.6 -1.0 A OPH F CC 12.1.1 V = -3.5 V 6-5 I = 5 mA, V = 15 V,   -2.0 F CC V = -7 V 6-5 Peak low-level output current I (Note 1) Fig. I = 0 mA, V = 15 V, 1.0 1.6  OPL F CC 12.1.2 V = 2.5 V 5-4 I = 0 mA, V = 15 V, 2.0   F CC V = 7 V 5-4 High-level output voltage V Fig. I = 5 mA, R = 200 Ω, 11.0 13.7  V OH F L 12.1.3 V = +15 V, V = -15 V CC1 EE1 Low-level output voltage V Fig. V = 0.8 V, R = 200 Ω,  -14.9 -12.5 OL F L 12.1.4 V = +15 V, V = -15 V CC1 EE1 High-level supply current I Fig. I = 10 mA, V = 30 V,  1.5 3.0 mA CCH F CC 12.1.5 V = Open O Low-level supply current I Fig. I = 0 mA, V = 30 V,  1.5 3.0 CCL F CC 12.1.6 V = Open O Threshold input current (L/H) I V = 15 V, V > 1 V  1.0 5 FLH CC O Threshold input voltage (H/L) V V = 15 V, V < 1 V 0.8   V FHL CC O Supply voltage V  15  30 CC UVLO threshold voltage V I = 5 mA, V > 2.5 V 11.0 12.5 13.5 UVLO+ F O V I = 5 mA, V < 2.5 V 9.5 11.0 12.0 UVLO- F O UVLO hysteresis UVLO   1.5  HYS Note: All typical values are at T = 25 . a Note: This device is designed for low power consumption, making it more sensitive to ESD than its predecessors. Extra care should be taken in the design of circuitry and pc board implementation to avoid ESD problems. Note 1:I application time ≤ 50 µs; single pulse. O 11110000.... IIIIssssoooollllaaaattttiiiioooonnnn CCCChhhhaaaarrrraaaacccctttteeeerrrriiiissssttttiiiiccccssss ((((UUUUnnnnlllleeeessssssss ooootttthhhheeeerrrrwwwwiiiisssseeee ssssppppeeeecccciiiiffffiiiieeeedddd,,,, TTTTaaaa ==== 22225555 )))) Characteristics Symbol Note Test Conditions Min Typ. Max Unit Total capacitance (input to C (Note 1) V = 0 V, f = 1 MHz  1.0  pF S S output) Isolation resistance RS (Note 1) VS = 500 V, R.H. ≤ 60 % 1012 1014  Ω Isolation voltage BV (Note 1) AC, 60 s 5000   Vrms S Note 1:This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6 are shorted together. ©2015-2020 4 2020-02-05 Toshiba Electronic Devices & Storage Corporation Rev.5.0

TLP700A 11111111.... SSSSwwwwiiiittttcccchhhhiiiinnnngggg CCCChhhhaaaarrrraaaacccctttteeeerrrriiiissssttttiiiiccccssss ((((NNNNooootttteeee)))) ((((UUUUnnnnlllleeeessssssss ooootttthhhheeeerrrrwwwwiiiisssseeee ssssppppeeeecccciiiiffffiiiieeeedddd,,,, TTTTaaaa ==== ----44440000 ttttoooo 111111110000 )))) Test Characteristics Symbol Note Test Condition Min Typ. Max Unit Circuit Propagation delay time t (Note 1) Fig. I = 0 → 5 mA, V = 30 V, 50  200 ns pLH F CC (L/H) 12.1.7 R = 20 Ω, C = 10 nF g g Propagation delay time t (Note 1) I = 5 → 0 mA, V = 30 V, 50  200 pHL F CC (H/L) R = 20 Ω, C = 10 nF g g Rise time t (Note 1) I = 0 → 5 mA, V = 30 V,  15  r F CC R = 20 Ω, C = 10 nF g g Fall time t (Note 1) I = 5 → 0 mA, V = 30 V,  8  f F CC R = 20 Ω, C = 10 nF g g Pulse width distortion |t -t | (Note 1) I = 0 ←→ 5 mA, V = 30 V,   50 pHL pLH F CC R = 20 Ω, C = 10 nF g g Propagation delay skew t (Note 1) -80  80 psk (device to device) High-level common-mode CM (Note 2) Fig. V = 1000 V , I = 5 mA, ±20 ±25  kV/µs H CM p-p F transient immunity 12.1.8 V = 30 V, T = 25 , CC a V = 26 V O(min) Low-level common-mode CM (Note 3) V = 1000 V , I = 0 mA, ±20 ±25  L CM p-p F transient immunity V = 30 V, T = 25 , CC a V = 1 V O(max) Note: All typical values are at T = 25 . a Note 1:Input signal ( f = 25 kHz, duty = 50 %, t = t = 5 ns or less ). r f C is less than 15 pF which includes probe and stray wiring capacitance. L Note 2:CM is the maximum rate of rise of the common mode voltage that can be sustained with the output voltage H in the logic high state (V > 26 V). O Note 3:CM is the maximum rate of fall of the common mode voltage that can be sustained with the output voltage in L the logic low state (V < 1 V). O ©2015-2020 5 2020-02-05 Toshiba Electronic Devices & Storage Corporation Rev.5.0

TLP700A 11112222.... TTTTeeeesssstttt CCCCiiiirrrrccccuuuuiiiittttssss aaaannnndddd CCCChhhhaaaarrrraaaacccctttteeeerrrriiiissssttttiiiiccccssss CCCCuuuurrrrvvvveeeessss 11112222....1111.... TTTTeeeesssstttt CCCCiiiirrrrccccuuuuiiiittttssss FFFFiiiigggg.... 11112222....1111....1111 IIIIOOOOPPPPHHHH TTTTeeeesssstttt CCCCiiiirrrrccccuuuuiiiitttt FFFFiiiigggg.... 11112222....1111....2222 IIIIOOOOPPPPLLLL TTTTeeeesssstttt CCCCiiiirrrrccccuuuuiiiitttt FFFFiiiigggg.... 11112222....1111....3333 VVVVOOOOHHHH TTTTeeeesssstttt CCCCiiiirrrrccccuuuuiiiitttt FFFFiiiigggg.... 11112222....1111....4444 VVVVOOOOLLLL TTTTeeeesssstttt CCCCiiiirrrrccccuuuuiiiitttt FFFFiiiigggg.... 11112222....1111....5555 IIIICCCCCCCCHHHH TTTTeeeesssstttt CCCCiiiirrrrccccuuuuiiiitttt FFFFiiiigggg.... 11112222....1111....6666 IIIICCCCCCCCLLLL TTTTeeeesssstttt CCCCiiiirrrrccccuuuuiiiitttt FFFFiiiigggg.... 11112222....1111....7777 SSSSwwwwiiiittttcccchhhhiiiinnnngggg TTTTiiiimmmmeeee TTTTeeeesssstttt CCCCiiiirrrrccccuuuuiiiitttt aaaannnndddd WWWWaaaavvvveeeeffffoooorrrrmmmm FFFFiiiigggg.... 11112222....1111....8888 CCCCoooommmmmmmmoooonnnn----MMMMooooddddeeee TTTTrrrraaaannnnssssiiiieeeennnntttt IIIImmmmmmmmuuuunnnniiiittttyyyy TTTTeeeesssstttt CCCCiiiirrrrccccuuuuiiiitttt aaaannnndddd WWWWaaaavvvveeeeffffoooorrrrmmmm ©2015-2020 6 2020-02-05 Toshiba Electronic Devices & Storage Corporation Rev.5.0

TLP700A 11112222....2222.... CCCChhhhaaaarrrraaaacccctttteeeerrrriiiissssttttiiiiccccssss CCCCuuuurrrrvvvveeeessss ((((NNNNooootttteeee)))) FFFFiiiigggg.... 11112222....2222....1111 IIIIFFFF ---- VVVVFFFF FFFFiiiigggg.... 11112222....2222....2222 IIIIFFFF ---- TTTTaaaa FFFFiiiigggg.... 11112222....2222....3333 PPPPOOOO ---- TTTTaaaa FFFFiiiigggg.... 11112222....2222....4444 IIIIFFFFLLLLHHHH ---- TTTTaaaa FFFFiiiigggg.... 11112222....2222....5555 IIIICCCCCCCCLLLL ---- TTTTaaaa FFFFiiiigggg.... 11112222....2222....6666 IIIICCCCCCCCHHHH ---- TTTTaaaa ©2015-2020 7 2020-02-05 Toshiba Electronic Devices & Storage Corporation Rev.5.0

TLP700A FFFFiiiigggg.... 11112222....2222....7777 VVVVOOOOLLLL ---- TTTTaaaa FFFFiiiigggg.... 11112222....2222....8888 VVVVOOOOHHHH ---- TTTTaaaa FFFFiiiigggg.... 11112222....2222....9999 VVVVOOOOLLLL ---- IIIIOOOOPPPPLLLL FFFFiiiigggg.... 11112222....2222....11110000 ((((VVVVOOOOHHHH----VVVVCCCCCCCC)))) ---- IIIIOOOOPPPPHHHH FFFFiiiigggg.... 11112222....2222....11111111 VVVVOOOO((((VVVVUUUUVVVVLLLLOOOO)))) ---- VVVVCCCCCCCC FFFFiiiigggg.... 11112222....2222....11112222 ttttppppLLLLHHHH,,,,ttttppppHHHHLLLL,,,,||||ttttppppHHHHLLLL----ttttppppLLLLHHHH|||| ---- TTTTaaaa ©2015-2020 8 2020-02-05 Toshiba Electronic Devices & Storage Corporation Rev.5.0

TLP700A FFFFiiiigggg.... 11112222....2222....11113333 ttttppppLLLLHHHH,,,,ttttppppHHHHLLLL,,,,||||ttttppppHHHHLLLL----ttttppppLLLLHHHH|||| ---- IIIIFFFF FFFFiiiigggg.... 11112222....2222....11114444 ttttppppLLLLHHHH,,,,ttttppppHHHHLLLL,,,,||||ttttppppHHHHLLLL----ttttppppLLLLHHHH|||| ---- VVVVCCCCCCCC Note: The above characteristics curves are presented for reference only and not guaranteed by production test, unless otherwise noted. ©2015-2020 9 2020-02-05 Toshiba Electronic Devices & Storage Corporation Rev.5.0

TLP700A 11113333.... SSSSoooollllddddeeeerrrriiiinnnngggg aaaannnndddd SSSSttttoooorrrraaaaggggeeee 11113333....1111.... PPPPrrrreeeeccccaaaauuuuttttiiiioooonnnnssss ffffoooorrrr SSSSoooollllddddeeeerrrriiiinnnngggg The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective of whether a soldering iron or a reflow soldering method is used. • When using soldering reflow. The soldering temperature profile is based on the package surface temperature. (See the figure shown below, which is based on the package surface temperature.) Reflow soldering must be performed once or twice. The mounting should be completed with the interval from the first to the last mountings being 2 weeks. FFFFiiiigggg.... 11113333....1111....1111 AAAAnnnn eeeexxxxaaaammmmpppplllleeee ooooffff aaaa tttteeeemmmmppppeeeerrrraaaattttuuuurrrreeee pppprrrrooooffffiiiilllleeee wwwwhhhheeeennnn lllleeeeaaaadddd((((PPPPbbbb))))----ffffrrrreeeeeeee ssssoooollllddddeeeerrrr iiiissss uuuusssseeeedddd • When using soldering flow Preheat the device at a temperature of 150  (package surface temperature) for 60 to 120 seconds. Mounting condition of 260  within 10 seconds is recommended. Flow soldering must be performed once. • When using soldering Iron Complete soldering within 10 seconds for lead temperature not exceeding 260  or within 3 seconds not exceeding 350  Heating by soldering iron must be done only once per lead. 11113333....2222.... PPPPrrrreeeeccccaaaauuuuttttiiiioooonnnnssss ffffoooorrrr GGGGeeeennnneeeerrrraaaallll SSSSttttoooorrrraaaaggggeeee • Avoid storage locations where devices may be exposed to moisture or direct sunlight. • Follow the precautions printed on the packing label of the device for transportation and storage. • Keep the storage location temperature and humidity within a range of 5  to 35  and 45 % to 75 %, respectively. • Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions. • Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads. • When restoring devices after removal from their packing, use anti-static containers. • Do not allow loads to be applied directly to devices while they are in storage. • If devices have been stored for more than two years under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use. ©2015-2020 10 2020-02-05 Toshiba Electronic Devices & Storage Corporation Rev.5.0

TLP700A 11114444.... LLLLaaaannnndddd PPPPaaaatttttttteeeerrrrnnnn DDDDiiiimmmmeeeennnnssssiiiioooonnnnssss ffffoooorrrr RRRReeeeffffeeeerrrreeeennnncccceeee OOOOnnnnllllyyyy UUUUnnnniiiitttt:::: mmmmmmmm 11115555.... MMMMaaaarrrrkkkkiiiinnnngggg ©2015-2020 11 2020-02-05 Toshiba Electronic Devices & Storage Corporation Rev.5.0

TLP700A PPPPaaaacccckkkkaaaaggggeeee DDDDiiiimmmmeeeennnnssssiiiioooonnnnssss Unit: mm Weight: 0.26 g (typ.) Package Name(s) TOSHIBA: 11-5J1S ©2015-2020 12 2020-02-05 Toshiba Electronic Devices & Storage Corporation Rev.5.0

TLP700A RRRREEEESSSSTTTTRRRRIIIICCCCTTTTIIIIOOOONNNNSSSS OOOONNNN PPPPRRRROOOODDDDUUUUCCCCTTTT UUUUSSSSEEEE Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as "TOSHIBA". Hardware, software and systems described in this document are collectively referred to as "Product". • TOSHIBA reserves the right to make changes to the information in this document and related Product without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TTTTOOOOSSSSHHHHIIIIBBBBAAAA AAAASSSSSSSSUUUUMMMMEEEESSSS NNNNOOOO LLLLIIIIAAAABBBBIIIILLLLIIIITTTTYYYY FFFFOOOORRRR CCCCUUUUSSSSTTTTOOOOMMMMEEEERRRRSSSS'''' PPPPRRRROOOODDDDUUUUCCCCTTTT DDDDEEEESSSSIIIIGGGGNNNN OOOORRRR AAAAPPPPPPPPLLLLIIIICCCCAAAATTTTIIIIOOOONNNNSSSS.... • PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, lifesaving and/or life supporting medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, and devices related to power plant. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales representative or contact us via our website. • Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. • Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. • The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. • AAAABBBBSSSSEEEENNNNTTTT AAAA WWWWRRRRIIIITTTTTTTTEEEENNNN SSSSIIIIGGGGNNNNEEEEDDDD AAAAGGGGRRRREEEEEEEEMMMMEEEENNNNTTTT,,,, EEEEXXXXCCCCEEEEPPPPTTTT AAAASSSS PPPPRRRROOOOVVVVIIIIDDDDEEEEDDDD IIIINNNN TTTTHHHHEEEE RRRREEEELLLLEEEEVVVVAAAANNNNTTTT TTTTEEEERRRRMMMMSSSS AAAANNNNDDDD CCCCOOOONNNNDDDDIIIITTTTIIIIOOOONNNNSSSS OOOOFFFF SSSSAAAALLLLEEEE FFFFOOOORRRR PPPPRRRROOOODDDDUUUUCCCCTTTT,,,, AAAANNNNDDDD TTTTOOOO TTTTHHHHEEEE MMMMAAAAXXXXIIIIMMMMUUUUMMMM EEEEXXXXTTTTEEEENNNNTTTT AAAALLLLLLLLOOOOWWWWAAAABBBBLLLLEEEE BBBBYYYY LLLLAAAAWWWW,,,, TTTTOOOOSSSSHHHHIIIIBBBBAAAA ((((1111)))) AAAASSSSSSSSUUUUMMMMEEEESSSS NNNNOOOO LLLLIIIIAAAABBBBIIIILLLLIIIITTTTYYYY WWWWHHHHAAAATTTTSSSSOOOOEEEEVVVVEEEERRRR,,,, IIIINNNNCCCCLLLLUUUUDDDDIIIINNNNGGGG WWWWIIIITTTTHHHHOOOOUUUUTTTT LLLLIIIIMMMMIIIITTTTAAAATTTTIIIIOOOONNNN,,,, IIIINNNNDDDDIIIIRRRREEEECCCCTTTT,,,, CCCCOOOONNNNSSSSEEEEQQQQUUUUEEEENNNNTTTTIIIIAAAALLLL,,,, SSSSPPPPEEEECCCCIIIIAAAALLLL,,,, OOOORRRR IIIINNNNCCCCIIIIDDDDEEEENNNNTTTTAAAALLLL DDDDAAAAMMMMAAAAGGGGEEEESSSS OOOORRRR LLLLOOOOSSSSSSSS,,,, IIIINNNNCCCCLLLLUUUUDDDDIIIINNNNGGGG WWWWIIIITTTTHHHHOOOOUUUUTTTT LLLLIIIIMMMMIIIITTTTAAAATTTTIIIIOOOONNNN,,,, LLLLOOOOSSSSSSSS OOOOFFFF PPPPRRRROOOOFFFFIIIITTTTSSSS,,,, LLLLOOOOSSSSSSSS OOOOFFFF OOOOPPPPPPPPOOOORRRRTTTTUUUUNNNNIIIITTTTIIIIEEEESSSS,,,, BBBBUUUUSSSSIIIINNNNEEEESSSSSSSS IIIINNNNTTTTEEEERRRRRRRRUUUUPPPPTTTTIIIIOOOONNNN AAAANNNNDDDD LLLLOOOOSSSSSSSS OOOOFFFF DDDDAAAATTTTAAAA,,,, AAAANNNNDDDD ((((2222)))) DDDDIIIISSSSCCCCLLLLAAAAIIIIMMMMSSSS AAAANNNNYYYY AAAANNNNDDDD AAAALLLLLLLL EEEEXXXXPPPPRRRREEEESSSSSSSS OOOORRRR IIIIMMMMPPPPLLLLIIIIEEEEDDDD WWWWAAAARRRRRRRRAAAANNNNTTTTIIIIEEEESSSS AAAANNNNDDDD CCCCOOOONNNNDDDDIIIITTTTIIIIOOOONNNNSSSS RRRREEEELLLLAAAATTTTEEEEDDDD TTTTOOOO SSSSAAAALLLLEEEE,,,, UUUUSSSSEEEE OOOOFFFF PPPPRRRROOOODDDDUUUUCCCCTTTT,,,, OOOORRRR IIIINNNNFFFFOOOORRRRMMMMAAAATTTTIIIIOOOONNNN,,,, IIIINNNNCCCCLLLLUUUUDDDDIIIINNNNGGGG WWWWAAAARRRRRRRRAAAANNNNTTTTIIIIEEEESSSS OOOORRRR CCCCOOOONNNNDDDDIIIITTTTIIIIOOOONNNNSSSS OOOOFFFF MMMMEEEERRRRCCCCHHHHAAAANNNNTTTTAAAABBBBIIIILLLLIIIITTTTYYYY,,,, FFFFIIIITTTTNNNNEEEESSSSSSSS FFFFOOOORRRR AAAA PPPPAAAARRRRTTTTIIIICCCCUUUULLLLAAAARRRR PPPPUUUURRRRPPPPOOOOSSSSEEEE,,,, AAAACCCCCCCCUUUURRRRAAAACCCCYYYY OOOOFFFF IIIINNNNFFFFOOOORRRRMMMMAAAATTTTIIIIOOOONNNN,,,, OOOORRRR NNNNOOOONNNNIIIINNNNFFFFRRRRIIIINNNNGGGGEEEEMMMMEEEENNNNTTTT.... • GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product. • Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TTTTOOOOSSSSHHHHIIIIBBBBAAAA AAAASSSSSSSSUUUUMMMMEEEESSSS NNNNOOOO LLLLIIIIAAAABBBBIIIILLLLIIIITTTTYYYY FFFFOOOORRRR DDDDAAAAMMMMAAAAGGGGEEEESSSS OOOORRRR LLLLOOOOSSSSSSSSEEEESSSS OOOOCCCCCCCCUUUURRRRRRRRIIIINNNNGGGG AAAASSSS AAAA RRRREEEESSSSUUUULLLLTTTT OOOOFFFF NNNNOOOONNNNCCCCOOOOMMMMPPPPLLLLIIIIAAAANNNNCCCCEEEE WWWWIIIITTTTHHHH AAAAPPPPPPPPLLLLIIIICCCCAAAABBBBLLLLEEEE LLLLAAAAWWWWSSSS AAAANNNNDDDD RRRREEEEGGGGUUUULLLLAAAATTTTIIIIOOOONNNNSSSS.... https://toshiba.semicon-storage.com/ ©2015-2020 13 2020-02-05 Toshiba Electronic Devices & Storage Corporation Rev.5.0