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  • 型号: TC4404CPA
  • 制造商: Microchip
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TC4404CPA产品简介:

ICGOO电子元器件商城为您提供TC4404CPA由Microchip设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 提供TC4404CPA价格参考以及MicrochipTC4404CPA封装/规格参数等产品信息。 你可以下载TC4404CPA参考资料、Datasheet数据手册功能说明书, 资料中有TC4404CPA详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

集成电路 (IC)半导体

描述

IC MOSFET DVR 1.5A DUAL OD 8-DIP门驱动器 1.5A Dual Open-Drain

产品分类

PMIC - MOSFET,电桥驱动器 - 外部开关集成电路 - IC

品牌

Microchip Technology

产品手册

点击此处下载产品Datasheet

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

电源管理 IC,门驱动器,Microchip Technology TC4404CPA-

数据手册

http://www.microchip.com/mymicrochip/filehandler.aspx?ddocname=en011467

产品型号

TC4404CPA

PCN组件/产地

http://www.microchip.com/mymicrochip/NotificationDetails.aspx?id=5776&print=view

上升时间

30 ns

下降时间

30 ns

产品目录页面

点击此处下载产品Datasheet

产品种类

门驱动器

供应商器件封装

8-PDIP

包装

管件

商标

Microchip Technology

安装类型

通孔

安装风格

Through Hole

封装

Tube

封装/外壳

8-DIP(0.300",7.62mm)

封装/箱体

PDIP-8

工作温度

0°C ~ 70°C

工厂包装数量

60

延迟时间

15ns

最大功率耗散

730 mW

最大工作温度

+ 70 C

最小工作温度

0 C

标准包装

60

激励器数量

2 Driver

电压-电源

4.5 V ~ 18 V

电流-峰值

1.5A

电源电压-最小

4.5 V

电源电流

4.5 mA

类型

Amplifier

输入类型

反相

输出数

2

输出端数量

2

配置

Inverting

配置数

2

高压侧电压-最大值(自举)

-

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PDF Datasheet 数据手册内容提取

M TC4404/TC4405 1.5A Dual Open-Drain MOSFET Drivers Features General Description • Independently Programmable Rise and Fall The TC4404/TC4405 are CMOS buffer-drivers Times constructed with complementary MOS outputs, where (cid:127) Low Output Impedance – 7 Ω Typ. the drains of the totem-pole output have been left separated so that individual connections can be made (cid:127) High Speed t , t –<30nsec with 1000pF Load R F to the pull-up and pull-down sections of the output. This (cid:127) Short Delay Times – <30nsec allows the insertion of drain-current-limiting resistors in (cid:127) Wide Operating Range the pull-up and/or pull-down sections, allowing the user - 4.5V to 18V to define the rates of rise and fall for a capacitive load; (cid:127) Latch-Up Protected: Will Withstand > 500mA or a reduced output swing, if driving a resistive load, or Reverse Current (Either Polarity) to limit base current, when driving a bipolar transistor. (cid:127) Input Withstands Negative Swings Up to -5V Minimum rise and fall times, with no resistors, will be less than 30nsec for a 1000pF load. Applications For driving MOSFETs in motor-control applications, where slow-ON/fast-OFF operation is desired, these (cid:127) Motor Controls devices are superior to the previously used technique (cid:127) Driving Bipolar Transistors of adding a diode-resistor combination between the (cid:127) Driver for Non-overlapping Totem Poles driver output and the MOSFET, because they allow (cid:127) Reach-Up/Reach-Down Driver accurate control of turn-ON, while maintaining fast turn- OFF and maximum noise immunity for an OFF device. Device Selection Table When used to drive bipolar transistors, these drivers maintain the high speeds common to other Microchip Part Number Package Temp. Range drivers. They allow insertion of a base current-limiting TC4404COA 8-Pin SOIC 0°C to +70°C resistor, while providing a separate half-output for fast TC4404CPA 8-Pin PDIP 0°C to +70°C turn-OFF. By proper positioning of the resistor, either npn or pnp transistors can be driven. TC4404EOA 8-Pin SOIC -40°C to +85°C For driving many loads in low-power regimes, these TC4404EPA 8-Pin PDIP -40°C to +85°C drivers, because they eliminate shoot-through currents TC4404MJA 8-Pin CERDIP -55°C to +125°C in the output stage, require significantly less power at TC4405COA 8-Pin SOIC 0°C to +70°C higher frequencies, and can be helpful in meeting TC4405CPA 8-Pin PDIP 0°C to +70°C low-power budgets. TC4405EOA 8-Pin SOIC -40°C to +85°C TC4405EPA 8-Pin PDIP -40°C to +85°C TC4405MJA 8-Pin CERDIP -55°C to +125°C Package Type 8-Pin PDIP/SOIC/CERDIP VDD 1 8 A TOP VDD 1 8 A TOP IN A 2 7 A BOTTOM IN A 2 7 A BOTTOM TC4404 TC4404 IN B 3 6 B TOP IN B 3 6 B TOP GND 4 5 B BOTTOM GND 4 5 B BOTTOM VDD 1 8 A TOP VDD 1 8 A TOP IN A 2 7 A BOTTOM IN A 2 7 A BOTTOM TC4405 TC4405 IN B 3 6 B TOP IN B 3 6 B TOP GND 4 5 B BOTTOM GND 4 5 B BOTTOM  2002 Microchip Technology Inc. DS21418B-page 1

TC4404/TC4405 Because neither drain in an output is dependent on the These devices are built to operate in the most demand- other, these devices can also be used as open-drain ing electrical environments. They will not latch up under buffer/drivers where both drains are available in one any conditions within their power and voltage ratings; device, thus minimizing chip count. Unused open they are not subject to damage when up to 5V of noise drains should be returned to the supply rail that their spiking of either polarity occurs on their ground pin; and device sources are connected to (pull-downs to they can accept, without damage or logic upset, up to ground, pull-ups to V ), to prevent static damage. In 1/2 amp of reverse current (of either polarity) being DD addition, in situations where timing resistors or other forced back into their outputs. All terminals are fully means of limiting crossover currents are used, like protected against up to 2kV of electrostatic discharge. drains may be paralleled for greater current carrying capacity. Functional Block Diagram 1 VDD TC4404 Inverting 8 (6) 300 mV Pull Up 7 (5) Pull Down 2 (3) Input TC4405 4.7V Noninverting 4 GND Effective A (B) Input C ≤ 12 pF DS21418B-page 2  2002 Microchip Technology Inc.

TC4404/TC4405 1.0 ELECTRICAL *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These CHARACTERISTICS are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the Absolute Maximum Ratings* operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for Supply Voltage.....................................................+22V extended periods may affect device reliability. Power Dissipation (T ≤ 70°C) A PDIP........................................................730mW CERDIP...................................................800mW SOIC........................................................470mW Package Thermal Resistance PDIP RθJ-A.............................................125°C/W PDIP RθJ-C...............................................45°C/W CERDIP RθJ-A.........................................150°C/W CERDIP RθJ-C.........................................55°C/W SOIC RθJ-A............................................155°C/W SOIC RθJ-C..............................................45°C/W Operating Temperature Range C Version.........................................0°C to +70°C E Version.....................................-40°C to +85°C M Version...................................-55°C to +125°C Storage Temperature Range.............-65°C to +150°C TC4404/TC4405 ELECTRICAL SPECIFICATIONS Electrical Characteristics: T = +25°C, with 4.5V ≤ V ≤ 18V, unless otherwise noted. A DD Symbol Parameter Min Typ Max Units Test Conditions Input V Logic 1, High Input Voltage 2.4 — — V IH V Logic 0, Low Input Voltage — — 0.8 V IL I Input Current -1 — 1 µA 0V ≤ V ≤ V IN IN DD Output V High Output Voltage V – 0.025 — — V OH DD V Low Output Voltage — — 0.025 V OL R Output Resistance — 7 10 Ω I = 10mA, V = 18V; Any Drain O OUT DD I Peak Output Current (Any Drain) — 1.5 — A Duty cycle ≤ 2%, t ≤ 300µsec PK I Continuous Output Current (Any Drain) — — 100 mA DC I Latch-Up Protection (Any Drain) — >500 — mA Duty cycle ≤ 2%, t ≤ 300µsec R Withstand Reverse Current Switching Time (Note 1) t Rise Time — 25 30 nsec Figure3-1, C = 1000pF R L t Fall Time — 25 30 nsec Figure3-1, C = 1000pF F L t Delay Time — 15 30 nsec Figure3-1, C = 1000pF D1 L t Delay Time — 32 50 nsec Figure3-1, C = 1000pF D2 L Power Supply I Power Supply Current — — 4.5 mA V = 3V (Both Inputs) S IN — — 0.4 V = 0V (Both Inputs) IN Note 1: Switching times ensured by design.  2002 Microchip Technology Inc. DS21418B-page 3

TC4404/TC4405 TC4404/TC4405 ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics: Over operating temperature range with 4.5V ≤ V ≤ 18V, unless otherwise noted. DD Symbol Parameter Min Typ Max Units Test Conditions V Logic 1, High Input Voltage 2.4 — — V IH V Logic 0, Low Input Voltage — — 0.8 V IL I Input Current -10 — 10 µA 0V ≤ V ≤ V IN IN DD Output V High Output Voltage V – 0.025 — — V OH DD V Low Output Voltage — — 0.025 V OL R Output Resistance — 9 12 Ω I = 10mA, V = 18V; Any Drain O OUT DD I Peak Output Current (Any Drain) — 1.5 — A Duty cycle ≤ 2%, t ≤ 300µsec PK I Continuous Output Current (Any Drain) — — 100 mA DC I Latch-Up Protection (Any Drain) — >500 — mA Duty cycle ≤ 2%, t ≤ 300µsec R Withstand Reverse Current Switching Time (Note 1) t Rise Time — — 40 nsec Figure3-1, C = 1000pF R L t Fall Time — — 40 nsec Figure3-1, C = 1000pF F L t Delay Time — — 40 nsec Figure3-1, C = 1000pF D1 L t Delay Time — — 60 nsec Figure3-1, C = 1000pF D2 L Power Supply I Power Supply Current — — 8 mA V = 3V (Both Inputs) S IN — — 0.6 V = 0V (Both Inputs) IN Note 1: Switching times ensured by design. DS21418B-page 4  2002 Microchip Technology Inc.

TC4404/TC4405 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table2-1. TABLE 2-1: PIN FUNCTION TABLE Pin No. (8-Pin PDIP, Symbol Description SOIC, CERDIP) 1 V Supply input, 4.5V to 18V. DD 2 IN A Control input A, TTL/CMOS compatible input. 3 IN B Control input A, TTL/CMOS compatible input. 4 GND Ground. 5 B BOTTOM Output B, pull down. 6 B TOP Output B, pull up. 7 A BOTTOM Output A, pull down. 8 A TOP Output A, pull up.  2002 Microchip Technology Inc. DS21418B-page 5

TC4404/TC4405 3.0 APPLICATIONS INFORMATION addition, it is advisable that low ESR bypass capacitors (4.7µF or 10µF tantalum) be placed as close to the 3.1 Circuit Layout Guidelines driver as possible. The driver should be physically located as close to the device it is driving as possible to Avoid long power supply and ground traces (added minimize the length of the output trace. inductance causes unwanted voltage transients). Use power and ground planes wherever possible. In FIGURE 3-1: SWITCHING TIME TEST CIRCUITS +5V 90% Input VDD = 18V 0V 10% tD1 tD2 tF tR 18V 4.7µF 0.1µF 90% 90% Output 1 10% 10% 2 8,7 0V Input 1 Output Inverting Driver CL = 1000pF 2 +5V 90% Input 10% 0V 4 18V 90% 90% tD1 tD2 Input: 100kHz, Output tR tF square wave, tRISE = tFALL ≤ 10nsec 10% 10% 0V Noninverting Driver 3.2 Typical Applications FIGURE 3-2: ZERO CROSSOVER CURRENT TOTEM-POLE FIGURE 3-3: DRIVING BIPOLAR SWITCH TRANSISTORS VDD VDD (4.5V - 18V) (4.5V - 18V) From TTL TC4404 RRTT VOUT From TTL TC4405 RRIIBB GND GND DS21418B-page 6  2002 Microchip Technology Inc.

TC4404/TC4405 FIGURE 3-4: SERVO MOTOR CONTROL +24V 47kΩ 47kΩ +12V 15V 15V 0.1µF 0.1µF Direction (TTL Level) RT Motor Speed (PWM) RT ISENSE TC4469 TC4404 GND FIGURE 3-5: REACH-UP AND REACH-DOWN DRIVING +12V +12V Switched +12V +5V +5V From TTL TC4404 GND GND Switched -12V -12V -12V  2002 Microchip Technology Inc. DS21418B-page 7

TC4404/TC4405 4.0 TYPICAL CHARACTERISTICS Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Rise Time vs. Supply Voltage Fall Time vs. Supply Voltage Rise TIme vs. Capacitive Load 100 100 100 2200 pF TA= +25°C 2200 pF TTA= +25°C TA °C VDD 80 80 80 1500 pF 11550000 ppFF (nsec)tRISE 6400 11400700000 ppppFFF (nsec)tFALL 6400 111400070000000 ppppppFFFF t(nsec)RISE6400 1105VV 20 20 20 100 pF 100 pFF 0 0 0 4 6 8 10 12 14 16 18 4 6 8 10 12 14 16 18 100 1000 10,000 VDD (V) VDD (V) CLOAD (pF) Rise and Fall Times Propagation Delay Fall Time vs. Capacitive Load vs. Temperature vs. Supply Voltage 100 60 60 TA °C VDD = 5V CVDD = 1 =7 .150V00pF C = °1C000pF 80 50 50 ec) tD2 (nsec)ALL6400 1105VV ME (nsec)4300 Y TIME (ns4300 tF TI tFALL LA DE tD1 20 20 20 tRISE 0 10 10 100 1000 10,000 -55 -35 -15 5 25 45 65 85 105125 4 6 8 10 12 14 16 18 CLOAD (pF) °C) VDD (V) Effect of Input Amplitude Propagation Delay Time Quiescent Supply Current on Delay Time vs. Temperature vs. Voltage 60 60 10 CLOAD = 1000pF VVDD = 1 =7 .150V00pF TA= +25°C 50 T °C 50 tD2 nsec) nsec) mA) BOTH INPUTS = 1 E (40 E ( 40 (T TIM tD2 TIM CEN 1 ELAY 30 ELAY 30 QUIES D D I 20 tD1 20 tD1 BOTH INPUTS = 0 10 10 0.1 0 2 4 6 8 10 -55 -35 -15 5 25 45 65 85 105125 4 6 8 10 12 14 16 18 VDRIVE (V) °C) VDD (V) DS21418B-page 8  2002 Microchip Technology Inc.

TC4404/TC4405 TYPICAL CHARACTERISTICS (CONTINUED) Quiescent Supply Current vs. Temperature Pull-Up Output Resistance Pull-Down Output Resistance 4.0 25 25 VDD = 18V BOTH INPUTS = 1 3.5 20 20 WORST CASE A) WORST CASE @ TJ = +150°C (mSCENT3.0 Ω ()S(ON)15 @ TJ = +150°C Ω ()S(ON)15 E D D UI R R Q I 2.5 10 TYP @ +25°C 10 TYP @ +25°C 8 8 2.0 5 5 -55 -35 -15 5 25 45 65 85 105125 4 6 8 10 12 14 16 18 4 6 8 10 12 14 16 18 TEMPERATURE (°C) VDD (V) VDD (V)  2002 Microchip Technology Inc. DS21418B-page 9

TC4404/TC4405 5.0 PACKAGING INFORMATION 5.1 Package Marking Information Package marking data not available at this time. 5.2 Package Dimensions 8-Pin Plastic DIP PIN1 .260 (6.60) .240 (6.10) .045 (1.14) .070 (1.78) .030 (0.76) .040 (1.02) .310 (7.87) .400 (10.16) .290 (7.37) .348 (8.84) .200 (5.08) .140 (3.56) .040 (1.02) .020 (0.51) .015 (0.38) 3°MIN. .150 (3.81) .008 (0.20) .115 (2.92) .400 (10.16) .310 (7.87) .110 (2.79) .022 (0.56) .090 (2.29) .015 (0.38) Dimensions: inches (mm) DS21418B-page 10  2002 Microchip Technology Inc.

TC4404/TC4405 Package Dimensions (Continued) 8-Pin CERDIP (Narrow) .110 (2.79) .090 (2.29) PIN1 .300 (7.62) .230 (5.84) .055 (1.40) MAX. .020 (0.51) MIN. .400 (10.16) .320 (8.13) .370 (9.40) .290 (7.37) .040 (1.02) .200 (5.08) .020 (0.51) .160 (4.06) ..210205 ((53..0188)) .150M (I3N..81) ..001058 ((00..3280)) 3°MIN. .400 (10.16) .320 (8.13) .065 (1.65) .020 (0.51) .045 (1.14) .016 (0.41) Dimensions: inches (mm) 8-Pin SOIC PIN1 .157 (3.99) .244 (6.20) .150 (3.81) .228 (5.79) .050 (1.27) TYP. .197 (5.00) .189 (4.80) .069 (1.75) .053 (1.35) 8°MAX.. .010 (0.25) .007 (0.18) .020 (0.51) .010 (0.25) .013 (0.33) .004 (0.10) .050 (1.27) .016 (0.40) Dimensions: inches (mm)  2002 Microchip Technology Inc. DS21418B-page 11

TC4404/TC4405 NOTES: DS21418B-page 12  2002 Microchip Technology Inc.

TC4404/TC4405 Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom- mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. Your local Microchip sales office 2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 3. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.  2002 Microchip Technology Inc. DS21418B-page13

TC4404/TC4405 NOTES: DS21418B-page14  2002 Microchip Technology Inc.

TC4404/TC4405 Information contained in this publication regarding device Trademarks applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to The Microchip name and logo, the Microchip logo, FilterLab, ensure that your application meets with your specifications. KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER, No representation or warranty is given and no liability is PICSTART, PRO MATE, SEEVAL and The Embedded Control assumed by Microchip Technology Incorporated with respect Solutions Company are registered trademarks of Microchip Tech- to the accuracy or use of such information, or infringement of nology Incorporated in the U.S.A. and other countries. patents or other intellectual property rights arising from such dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, use or otherwise. Use of Microchip’s products as critical com- In-Circuit Serial Programming, ICSP, ICEPIC, microPort, ponents in life support systems is not authorized except with Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, express written approval by Microchip. No licenses are con- MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode veyed, implicitly or otherwise, under any intellectual property and Total Endurance are trademarks of Microchip Technology rights. Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified.  2002 Microchip Technology Inc. DS21418B-page 15

M WORLDWIDE SALES AND SERVICE AMERICAS ASIA/PACIFIC Japan Corporate Office Australia Microchip Technology Japan K.K. Benex S-1 6F 2355 West Chandler Blvd. Microchip Technology Australia Pty Ltd 3-18-20, Shinyokohama Chandler, AZ 85224-6199 Suite 22, 41 Rawson Street Kohoku-Ku, Yokohama-shi Tel: 480-792-7200 Fax: 480-792-7277 Epping 2121, NSW Kanagawa, 222-0033, Japan Technical Support: 480-792-7627 Australia Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Web Address: http://www.microchip.com Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 Rocky Mountain China - Beijing Korea 2355 West Chandler Blvd. Microchip Technology Consulting (Shanghai) Microchip Technology Korea Chandler, AZ 85224-6199 Co., Ltd., Beijing Liaison Office 168-1, Youngbo Bldg. 3 Floor Tel: 480-792-7966 Fax: 480-792-7456 Unit 915 Samsung-Dong, Kangnam-Ku Bei Hai Wan Tai Bldg. Seoul, Korea 135-882 Atlanta No. 6 Chaoyangmen Beidajie Tel: 82-2-554-7200 Fax: 82-2-558-5934 500 Sugar Mill Road, Suite 200B Beijing, 100027, No. China Singapore Atlanta, GA 30350 Tel: 86-10-85282100 Fax: 86-10-85282104 Microchip Technology Singapore Pte Ltd. Tel: 770-640-0034 Fax: 770-640-0307 China - Chengdu 200 Middle Road Boston #07-02 Prime Centre Microchip Technology Consulting (Shanghai) 2 Lan Drive, Suite 120 Singapore, 188980 Co., Ltd., Chengdu Liaison Office Westford, MA 01886 Tel: 65-6334-8870 Fax: 65-6334-8850 Rm. 2401, 24th Floor, Tel: 978-692-3848 Fax: 978-692-3821 Taiwan Ming Xing Financial Tower Chicago No. 88 TIDU Street Microchip Technology Taiwan 333 Pierce Road, Suite 180 Chengdu 610016, China 11F-3, No. 207 Itasca, IL 60143 Tel: 86-28-6766200 Fax: 86-28-6766599 Tung Hua North Road Tel: 630-285-0071 Fax: 630-285-0075 China - Fuzhou Taipei, 105, Taiwan Dallas Tel: 886-2-2717-7175 Fax: 886-2-2545-0139 Microchip Technology Consulting (Shanghai) 4570 Westgrove Drive, Suite 160 Co., Ltd., Fuzhou Liaison Office Addison, TX 75001 Unit 28F, World Trade Plaza EUROPE Tel: 972-818-7423 Fax: 972-818-2924 No. 71 Wusi Road Detroit Fuzhou 350001, China Denmark Tri-Atria Office Building Tel: 86-591-7503506 Fax: 86-591-7503521 Microchip Technology Nordic ApS 32255 Northwestern Highway, Suite 190 China - Shanghai Regus Business Centre Farmington Hills, MI 48334 Microchip Technology Consulting (Shanghai) Lautrup hoj 1-3 Tel: 248-538-2250 Fax: 248-538-2260 Co., Ltd. Ballerup DK-2750 Denmark Kokomo Room 701, Bldg. B Tel: 45 4420 9895 Fax: 45 4420 9910 2767 S. Albright Road Far East International Plaza France Kokomo, Indiana 46902 No. 317 Xian Xia Road Microchip Technology SARL Tel: 765-864-8360 Fax: 765-864-8387 Shanghai, 200051 Parc d’Activite du Moulin de Massy Los Angeles Tel: 86-21-6275-5700 Fax: 86-21-6275-5060 43 Rue du Saule Trapu 18201 Von Karman, Suite 1090 China - Shenzhen Batiment A - ler Etage Irvine, CA 92612 Microchip Technology Consulting (Shanghai) 91300 Massy, France Tel: 949-263-1888 Fax: 949-263-1338 Co., Ltd., Shenzhen Liaison Office Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 New York Rm. 1315, 13/F, Shenzhen Kerry Centre, Germany 150 Motor Parkway, Suite 202 Renminnan Lu Microchip Technology GmbH Hauppauge, NY 11788 Shenzhen 518001, China Gustav-Heinemann Ring 125 Tel: 631-273-5305 Fax: 631-273-5335 Tel: 86-755-2350361 Fax: 86-755-2366086 D-81739 Munich, Germany San Jose Hong Kong Tel: 49-89-627-144 0 Fax: 49-89-627-144-44 Italy Microchip Technology Inc. Microchip Technology Hongkong Ltd. 2107 North First Street, Suite 590 Unit 901-6, Tower 2, Metroplaza Microchip Technology SRL San Jose, CA 95131 223 Hing Fong Road Centro Direzionale Colleoni Tel: 408-436-7950 Fax: 408-436-7955 Kwai Fong, N.T., Hong Kong Palazzo Taurus 1 V. Le Colleoni 1 Toronto Tel: 852-2401-1200 Fax: 852-2401-3431 20041 Agrate Brianza Milan, Italy 6285 Northam Drive, Suite 108 India Tel: 39-039-65791-1 Fax: 39-039-6899883 Mississauga, Ontario L4V 1X5, Canada Microchip Technology Inc. United Kingdom Tel: 905-673-0699 Fax: 905-673-6509 India Liaison Office Divyasree Chambers Arizona Microchip Technology Ltd. 505 Eskdale Road 1 Floor, Wing A (A3/A4) No. 11, O’Shaugnessey Road Winnersh Triangle Bangalore, 560 025, India Wokingham Tel: 91-80-2290061 Fax: 91-80-2290062 Berkshire, England RG41 5TU Tel: 44 118 921 5869 Fax: 44-118 921-5820 03/01/02 (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:5)(cid:7)(cid:8)(cid:1) DS21418B-page 16  2002 Microchip Technology Inc.

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