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  • 制造商: Microchip
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TC1240AECHTR产品简介:

ICGOO电子元器件商城为您提供TC1240AECHTR由Microchip设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 TC1240AECHTR价格参考。MicrochipTC1240AECHTR封装/规格:PMIC - 稳压器 - DC DC 开关稳压器, 固定 充电泵 开关稳压器 IC 正 2Vin 1 输出 40mA SOT-23-6。您可以下载TC1240AECHTR参考资料、Datasheet数据手册功能说明书,资料中有TC1240AECHTR 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

集成电路 (IC)半导体

描述

IC REG SWITCHED CAP DBL SOT23A稳压器—开关式稳压器 Positive Doubling

产品分类

PMIC - 稳压器 - DC DC 开关稳压器

品牌

Microchip Technology

产品手册

点击此处下载产品Datasheet

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

电源管理 IC,稳压器—开关式稳压器,Microchip Technology TC1240AECHTR-

数据手册

点击此处下载产品Datasheethttp://www.microchip.com/mymicrochip/filehandler.aspx?ddocname=en013869http://www.microchip.com/mymicrochip/filehandler.aspx?ddocname=en023833

产品型号

TC1240AECHTR

PWM类型

-

产品目录页面

点击此处下载产品Datasheet

产品种类

稳压器—开关式稳压器

供应商器件封装

SOT-23-6

其它名称

TC1240AECHCT

包装

剪切带 (CT)

同步整流器

商标

Microchip Technology

安装类型

表面贴装

安装风格

SMD/SMT

宽度

1.8 mm

封装

Reel

封装/外壳

SOT-23-6

封装/箱体

SOT-23A-6

工作温度

-40°C ~ 85°C

工厂包装数量

3000

开关频率

160 kHz

最大工作温度

+ 85 C

最大输入电压

5.5 V

最小工作温度

- 40 C

标准包装

1

电压-输入

2.5 V ~ 5.5 V

电压-输出

5 V ~ 11 V

电流-输出

20mA

类型

Buck

输出数

1

输出电压

5 V to 11 V

输出电流

20 mA

输出类型

可调式

频率-开关

80kHz

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PDF Datasheet 数据手册内容提取

TC1240/TC1240A Positive Doubling Charge Pumps with Shutdown in a SOT-23 Package Features General Description • Charge Pumps in 6-Pin SOT-23A Package The TC1240/TC1240A is a doubling CMOS charge • >99% Typical Voltage Conversion Efficiency pump voltage converter in a small 6-Pin SOT-23A package. The TC1240 doubles an input voltage that • Voltage Doubling can range from +2.5V to +4.0V, while the TC1240A • Input Voltage Range, TC1240: +2.5V to +4.0V, doubles an input voltage that can range from +2.5V to TC1240A: +2.5V to +5.5V +5.5V. Conversion efficiency is typically >99%. Internal • Low Output Resistance, TC1240: 17 (Typical) oscillator frequency is 160kHz for both devices. The TC1240A: 12 (Typical) TC1240 and TC1240A have an active-high shutdown • Only Two External Capacitors Required that limits the current consumption of the devices to • Low Supply Current, TC1240: 180µA (Typical) less than 1µA. TC1240A: 550µA (Typical) External component requirement is only two capacitors • Power-Saving Shutdown Mode (1µA Maximum) for standard voltage doubler applications. All other • Shutdown Input Fully Compatible with 1.8V Logic circuitry (including control, oscillator and power Systems MOSFETs) are integrated on-chip. Typical supply cur- rent is 180µA for the TC1240 and 550µA for the Applications TC1240A. Both devices are available in a 6-Pin SOT- 23A surface mount package. • Cellular Phones • Pagers Typical Application Circuit • PDAs, Portable Data Loggers • Battery Powered Devices Positive Voltage Doubler • Handheld Instruments C+ VIN INPUT + Package Type TC1240 C 1 TC1240A 6-Pin SOT-23A C- OFF SHDN C+ VOUT SHDN ON 6 5 4 V OUT 2 x INPUT GND + C 2 TC1240ECH TC1240AECH 1 2 3 V GND C- IN NOTE: 6-Pin SOT-23A is equivalent to the EIAJ (SC-74A)  2001-2012 Microchip Technology Inc. DS21516D-page 1

TC1240/TC1240A 1.0 ELECTRICAL † Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These CHARACTERISTICS are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the Absolute Maximum Ratings † operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for Input Voltage (VIN to GND) extended periods may affect device reliability. TC1240.............................................+4.5V, -0.3V TC1240A...........................................+5.8V, -0.3V Output Voltage (V to GND) OUT TC1240.......................................+9.0V, V -0.3V IN TC1240A...................................+11.6V, V -0.3V IN Current at V Pin............................................50mA OUT Short-Circuit Duration: V to GND.............Indefinite OUT Thermal Resistance.......................................210°C/W Power Dissipation (T = +25°C)........................600mW A Operating Temperature Range.............-40°C to +85°C Storage Temperature (Unbiased).......-65°C to +150°C TC1240 ELECTRICAL SPECIFICATIONS Electrical Specifications: Unless otherwise noted, typical values apply at T = +25°C. Minimum and maximum val- A ues apply for T = -40° to +85°C, and V = +2.8V, C = C = 3.3µF, SHDN = GND. A IN 1 2 Parameters Sym Min Typ Max Units Conditions Supply Current I — 180 300 µA R =  DD LOAD Shutdown Supply Current I — 0.1 1.0 µA SHDN = V SHDN IN Minimum Supply Voltage V 2.5 — — V R = 1.0k MIN LOAD Maximum Supply Voltage V — — 4.0 V R = 1.0k MAX LOAD Oscillator Frequency F — 160 — kHz T = -40°C to +85°C OSC A Switching Frequency (Note1) F 40 80 125 kHz T = -40°C to +85°C SW A Shutdown Input Logic High V 1.4 — — V V = V to V IH IN MIN MAX Shutdown Input Logic Low V — — 0.4 V V = V to V IL IN MIN MAX Power Efficiency P 86 93 — % R = 1.0k EFF LOAD Voltage Conversion Efficiency V 97.5 99.96 — % R =  EFF LOAD Output Resistance (Note2) R — 17 —  R = 1.0k OUT LOAD — — 30 T = -40°C to +85°C A Note 1: Switching frequency is one-half internal oscillator frequency. 2: Capacitor contribution is approximately 26% of the output impedance [ESR = 1 / switching frequency x capacitance]. DS21516D-page 2  2001-2012 Microchip Technology Inc.

TC1240/TC1240A TC1240A ELECTRICAL SPECIFICATIONS Electrical Specifications: Unless otherwise noted, typical values apply at T = +25°C. Minimum and maximum A values apply for T = -40° to +85°C, and V = +5.0V, C = C = 3.3µF, SHDN = GND. A IN 1 2 Parameters Sym Min Typ Max Units Conditions Supply Current I — 550 900 µA R =  DD LOAD Shutdown Supply Current I — 0.01 1.0 µA SHDN = V SHDN IN Minimum Supply Voltage V 2.5 — — V MIN Maximum Supply Voltage V — — 5.5 V MAX Output Current I 20 — — mA LOAD Sum of the R of the R — 4 8  I = 20mA DS(ON) SW LOAD internal MOSFET Switches Oscillator Frequency F — 160 — kHz T = -40°C to +85°C OSC A Switching Frequency (Note1) F 40 80 125 kHz T = -40°C to +85°C SW A Shutdown Input Logic High V 1.4 — — V V = V to V IH IN MIN MAX Shutdown Input Logic Low V — — 0.4 V V = V to V IL IN MIN MAX Power Efficiency P 86 94 — % I = 5mA EFF LOAD Voltage Conversion Efficiency V 99 99.96 — % R =  EFF LOAD Output Resistance (Note2) R — 12 —  I = 20µA OUT LOAD — — 25 T = -40°C to +85°C A Note 1: Switching frequency is one-half internal oscillator frequency. 2: Capacitor contribution is approximately 26% of the output impedance [ESR = 1 / switching frequency x capacitance].  2001-2012 Microchip Technology Inc. DS21516D-page 3

TC1240/TC1240A 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, typical values apply at T = +25°C. A 700 450 400 A) 600 A) μNT ( 500 μNT ( 335000 VIN = 4.0V E E R 400 R 250 R R LY CU 300 LY CU 210500 VIN = 2.8V UPP 200 UPP 100 S 100 S 50 0 0 2.00 3.00 4.00 5.00 6.00 -50 -25 0 25 50 75 100 125 SUPPLY VOLTAGE (V) TEMPERATURE (°C) FIGURE 2-1: Supply Current vs. Supply FIGURE 2-4: Supply Current vs. Voltage (No Load). Temperature (No Load). Ω) 20 Ω) 25 E ( E ( C C N N 20 STA 15 STA VIN = 2.8V ESI ESI 15 R R RCE 10 RCE 10 VIN = 4.0V U U O O UT S 5 UT S 5 P P OUT 0 OUT 0 2.00 3.00 4.00 5.00 6.00 -50 -25 0 25 50 75 100 125 SUPPLY VOLTAGE (V) TEMPERATURE (°C) FIGURE 2-2: Output Source Resistance FIGURE 2-5: Output Source Resistance vs. Supply Voltage (with R = 1k) vs. Temperature (with R = 1k LOAD LOAD 1 100% 0.9 90% 0.8 %) 80% VIN = 2.5V V) 0.7 CY ( 70% VIN = 3.5V LT DROP ( 000...654 VIN = 2.8V VIN = 4.0V EFFICIEN 654000%%% VIN = 4.5V VO 0.3 ER 30% 0.2 W 20% O 0.1 P 10% 0 0% 0 5 10 15 20 25 30 35 40 45 50 0 5 10 15 20 25 30 35 40 45 50 LOAD CURRENT (mA) LOAD CURRENT (mA) FIGURE 2-3: Output Voltage Drop vs. FIGURE 2-6: Power Efficiency vs. Load Load Current. Current. DS21516D-page 4  2001-2012 Microchip Technology Inc.

TC1240/TC1240A Note: Unless otherwise indicated, typical values apply at T = +25°C. A 100 z) VIN = 4.0V H k Y ( 80 NC VIN = 2.8V E U 60 Q E R G F 40 N HI C 20 T WI S 0 -50 -25 0 25 50 75 100 125 TEMPERATURE (°C) FIGURE 2-7: Switching Frequency vs. Temperature.  2001-2012 Microchip Technology Inc. DS21516D-page 5

TC1240/TC1240A 3.0 PIN DESCRIPTION The description of the pins are listed in Table3-1. TABLE 3-1: PIN FUNCTION TABLE Pin No. Symbol Description 1 V Power supply input IN 2 GND Ground 3 C- Commutation capacitor negative terminal 4 SHDN Shutdown input (active high) 5 V Doubled output voltage OUT 6 C+ Commutation capacitor positive terminal DS21516D-page 6  2001-2012 Microchip Technology Inc.

TC1240/TC1240A 4.0 DETAILED DESCRIPTION 5.0 TYPICAL APPLICATIONS The TC1240/TC1240A charge pump converter dou- 5.1 Output Voltage Considerations bles the voltage applied to the V pin. Conversion con- IN sists of a two-phase operation (Figure4-1). During the The TC1240/TC1240A performs voltage doubling but first phase, switches S and S are open and S and S does not provide regulation. The output voltage will 2 4 1 3 are closed. During this time, C charges to the voltage droop in a linear manner with respect to load current. 1 on V and load current is supplied from C . During the The value of this equivalent output resistance is approx- IN 2 second phase, S and S are closed, while S and S imately 12 nominal at +25°C and V = +5.0V for the 2 4 1 3 IN are open. TC1240A and 17 nominal at +25°C and V = +2.8V IN for the TC1240. V is approximately +10.0V at light During this second phase, C is level-shifted upward by OUT 1 loads for the TC1240A and +5.6V for the TC1240, and V volts. This connects C to the reservoir capacitor IN 1 droops according to the equation below: C , allowing energy to be delivered to the output as 2 needed. The actual voltage is slightly lower than 2 x V EQUATION IN since the four switches (S -S ) have an on-resistance 1 4 V = I R and the load drains charge from reservoir capacitor C . DROOP OUT OUT 2 V = 2V –V OUT IN DROOP S1 S2 TC1240/TC1240A 5.2 Charge Pump Efficiency V IN The overall power efficiency of the charge pump is C1 affected by four factors: V = 2 x V 1. Losses from power consumed by the internal OUT IN oscillator, switch drive, etc. (which vary with C 2 input voltage, temperature and oscillator S S 3 4 frequency). 2. I2R losses due to the on-resistance of the V MOSFET switches on-board the charge pump. IN 3. Charge pump capacitor losses due to effective OSC series resistance (ESR). 4. Losses that occur during charge transfer (from FIGURE 4-1: Ideal Switched Capacitor commutation capacitor to the output capacitor) Charge Pump Doubler. when a voltage difference between the two capacitors exist. Most of the conversion losses are due to factors (2) and (3) above. These losses are given by Equation5-1. EQUATION 5-1: 2 a)PLOSS(2,3) = IOUTROUT 1 b)R = ---------------------- +8R +4ESR +ESR OUT F C  SWITCH C1 C2 SW 1  2001-2012 Microchip Technology Inc. DS21516D-page 7

TC1240/TC1240A The switching frequency in Equation5-1b is defined as 5.3 Capacitor Selection one-half the oscillator frequency (i.e., F = F /2). SW OSC The 1/(F )(C ) term in Equation5-1b is the effective In order to maintain the lowest output resistance and SW 1 output resistance of an ideal switched capacitor circuit output ripple voltage, it is recommended that low ESR (Figure5-1 and Figure5-2). capacitors be used. Additionally, larger values of C1 will lower the output resistance and larger values of C will 2 The output voltage ripple is given by Equation5-2. reduce output ripple (see Equation5-1b). EQUATION 5-2: Table5-1 shows various values of C and the 1 corresponding output resistance values @ +25°C. It I VRIPPLE = 2------F----S--O--W--U-----T---C----2----+2IOUTESRC2 ashsosuwms etsh e ao u0tp.1ut vEoSltRagCe1 riapnpdle 0fo.9r vaRriSoWu.s vTaalbulees5 -o2f C . The V values assume 5mA output load 2 RIPPLE current and 0.1ESR . C2 f TABLE 5-1: OUTPUT RESISTANCE V+ V OUT VS. C (ESR = 0.1) 1 TC1240 TC1240A C C R C (µF) 1 2 L 1 R () R () OUT OUT 0.47 47 35 1 28.5 20.5 FIGURE 5-1: Ideal Switched Capacitor 2.2 19.5 14 Model. 3.3 17 12 4.7 15.5 10.5 R EQUIV V+ V 10 13.6 9.3 OUT 1 47 12.5 8.3 R = EQUIV FSW x C1 C R 100 12.2 8.1 2 L TABLE 5-2: OUTPUT VOLTAGE RIPPLE VS. C (ESR = 0.1) 2 FIGURE 5-2: Equivalent Output I 5mA OUT Resistance. TC1240/TC1240A C (µF) 1 V (mV) RIPPLE 0.47 142 1 67 2.2 30 3.3 20 4.7 14 10 6.7 47 2.5 100 1.6 DS21516D-page 8  2001-2012 Microchip Technology Inc.

TC1240/TC1240A 5.4 Input Supply Bypassing 5.6 Voltage Doubler The V input should be capacitively bypassed to The most common application for charge pump IN reduce AC impedance and minimize noise effects due devices is the doubler (Figure5-3). This application to the switching internal to the device. The uses two external capacitors – C and C (plus a power 1 2 recommended capacitor should be a large value (at supply bypass capacitor, if necessary). The output is least equal to C ) connected from the input to GND. equal to 2 x V minus any voltage drops due to 1 IN loading. Refer to Table5-1 and Table5-2 for capacitor 5.5 Shutdown Input selection. The TC1240 and TC1240A are disabled when SHDN is high, and enabled when SHDN is low. This input cannot be allowed to float. V IN + C 3 V OUT 5 6 + OUT C+ C 2 TC1240 + TC1240A C 1 1 V R IN L 3 2 C- GND 4 SHDN Device C C C 1 2 3 TC1240 3.3µF 3.3µF 3.3µF TC1240A FIGURE 5-3: Test Circuit.  2001-2012 Microchip Technology Inc. DS21516D-page 9

TC1240/TC1240A 5.7 Cascading Devices 5.8 Paralleling Devices Two or more TC1240/TC1240As can be cascaded to To reduce the value of R , multiple TC1240/ OUT increase output voltage (Figure5-4). If the output is TC1240As can be connected in parallel (Figure5-5). lightly loaded, it will be close to ((n + 1) x V ), but will The output resistance will be reduced by a factor of N, IN droop at least by R of the first device multiplied by where N is the number of TC1240/TC1240As. Each OUT the I of the second. It can be seen that the output device will require its own pump capacitor (C1x), but all Q resistance rises rapidly for multiple cascaded devices. devices may share one reservoir capacitor (C2). For the case of the two-stage ‘tripler’, output resistance However, to preserve ripple performance, the value of can be approximated as R = 2 x R + R , C2 should be scaled according to the number of OUT OUT1 OUT2 where R is the output resistance of the first stage paralled TC1240/TC1240As, respectively. OUT1 and R is the output resistance of the second stage. OUT2 5.9 Layout Considerations As with any switching power supply circuit good layout practice is recommended. Mount components as close together as possible to minimize stray inductance and capacitance. Also use a large ground plane to minimize noise leakage into other circuitry. V IN 6 C+ VIN 1 6 C+ VIN 1 + C TC1240 1B TC1240 TC1240A TC1240A + 2 C GND 2 1A GND 34 C- "1" OUT 5 43 C- "n" OUT 5 VOUT SHDN SHDN + + C2A C2B VOUT = (n + 1)VIN FIGURE 5-4: Cascading Multiple Devices To Increase Output Voltage. R OF SINGLE DEVICE OUT R = OUT NUMBER OF DEVICES VIN . . . VIN 1 1 3 3 TC1240 TC1240 C1A 2 TC1240A C1B 2 TC1240A + + 64 "1" 5 64 "n" 5 VOUT SHDN SHDN . . . + C 2 Shutdown VOUT = 2 x VIN Control FIGURE 5-5: Paralleling Multiple Devices To Reduce Output Resistance. DS21516D-page 10  2001-2012 Microchip Technology Inc.

TC1240/TC1240A 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 6-Pin SOT-23A 6 5 4 1 2 3 4 1 2 3 1 & 2 = part number code + temperature range (two-digit code) Device Code TC1240 DN TC1240A EN ex: 1240AECH = E N 3 represents year and 2-month code 4 represents production lot ID code  2001-2012 Microchip Technology Inc. DS21516D-page 11

TC1240/TC1240A 6-Lead Plastic Small Outline Transistor (CH) (SOT-23) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E E1 B p1 D n 1 α c A A2 φ A1 L β Units INCHES* MILLIMETERS Dimension Limits MIN NOM MAX MIN NOM MAX Number of Pins n 6 6 Pitch p .038 0.95 Outside lead pitch (basic) p1 .075 1.90 Overall Height A .035 .046 .057 0.90 1.18 1.45 Molded Package Thickness A2 .035 .043 .051 0.90 1.10 1.30 Standoff A1 .000 .003 .006 0.00 0.08 0.15 Overall Width E .102 .110 .118 2.60 2.80 3.00 Molded Package Width E1 .059 .064 .069 1.50 1.63 1.75 Overall Length D .110 .116 .122 2.80 2.95 3.10 Foot Length L .014 .018 .022 0.35 0.45 0.55 Foot Angle φ 0 5 10 0 5 10 Lead Thickness c .004 .006 .008 0.09 0.15 0.20 Lead Width B .014 .017 .020 0.35 0.43 0.50 Mold Draft Angle Top α 0 5 10 0 5 10 Mold Draft Angle Bottom β 0 5 10 0 5 10 *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. JEITA (formerly EIAJ) equivalent: SC-74A Drawing No. C04-120 DS21516D-page 12  2001-2012 Microchip Technology Inc.

TC1240/TC1240A 7.0 REVISION HISTORY Revision D (December 2012) Added a note to each package outline drawing.  2001-2012 Microchip Technology Inc. DS21516D-page 13

TC1240/TC1240A NOTES: DS21516D-page 14  2001-2012 Microchip Technology Inc.

TC1240/TC1240A PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X /XX Examples: Device Temperature Package a) TC1240ECHTR: Tape and Reel, 6L SOT-23 Range (EIAJ) b) TC1240AECHTR: Tape and Reel, 6L SOT-23 (EIAJ) Device TC1240: Positive Doubling Charge Pump with Shutdown TC1240A Positive Doubling Charge Pump with Shutdown Temperature Range I = -40C to +85°C (Industrial) Package CHTR: = 6L SOT-23, Tape and Reel Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. Your local Microchip sales office 2. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.  2001-2012 Microchip Technology Inc. DS21516D-page 15

TC1240/TC1240A NOTES: DS21516D-page 16  2001-2012 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device Trademarks applications and the like is provided only for your convenience The Microchip name and logo, the Microchip logo, dsPIC, and may be superseded by updates. It is your responsibility to FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, ensure that your application meets with your specifications. PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash MICROCHIP MAKES NO REPRESENTATIONS OR and UNI/O are registered trademarks of Microchip Technology WARRANTIES OF ANY KIND WHETHER EXPRESS OR Incorporated in the U.S.A. and other countries. IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, INCLUDING BUT NOT LIMITED TO ITS CONDITION, MTP, SEEVAL and The Embedded Control Solutions QUALITY, PERFORMANCE, MERCHANTABILITY OR Company are registered trademarks of Microchip Technology FITNESS FOR PURPOSE. Microchip disclaims all liability Incorporated in the U.S.A. arising from this information and its use. Use of Microchip Silicon Storage Technology is a registered trademark of devices in life support and/or safety applications is entirely at Microchip Technology Inc. in other countries. the buyer’s risk, and the buyer agrees to defend, indemnify and Analog-for-the-Digital Age, Application Maestro, BodyCom, hold harmless Microchip from any and all damages, claims, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, suits, or expenses resulting from such use. No licenses are dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, conveyed, implicitly or otherwise, under any Microchip ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial intellectual property rights. Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2001-2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620768846 QUALITY MANAGEMENT SYSTEM Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and CERTIFIED BY DNV Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures == ISO/TS 16949 == are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.  2001-2012 Microchip Technology Inc. DS21516D-page 17

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