STPSC10H065 650 V power Schottky silicon carbide diode Datasheet - production data Description The SiC diode is an ultra high performance power Schottky diode. It is manufactured using a silicon carbide substrate. The wide band gap material allows the design of a Schottky diode structure with a 650 V rating. Due to the Schottky construction, no recovery is shown at turn-off and ringing patterns are negligible. The minimal capacitive turn-off behavior is independent of temperature. Especially suited for use in PFC applications, this ST SiC diode will boost performance in hard switching conditions. Its high forward surge capability ensures good robustness during Features transient phases.  No or negligible reverse recovery Table 1: Device summary  Switching behavior independent of Symbol Value temperature  Dedicated to PFC applications IF(AV) 10 A  High forward surge capability VRRM 650 V  Insulated package: TO-220AC Ins Tj (max.) 175 °C  Insulated voltage: 2500 V sine RMS  Typical package capacitance: 7 pF February 2017 DocID023604 Rev 7 1/14 This is information on a product in full production. www.st.com

Characteristics STPSC10H065 1 Characteristics Table 2: Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 650 V IF(RMS) Forward rms current 22 A TO-220AC, DPAK, D²PAK, IF(AV) Average forward current TC = 135 °C(1), DC 10 A TO-220AC Ins, TC = 85 °C(1), DC TO-220AC, DPAK, D²PAK, Repetitive peak forward Tc = 135 °C(1), Tj = 175 °C, δ = 0.1 IFRM current TO-220AC Ins, Tc = 85 °C(1), 41 A Tj = 175 °C, δ = 0.1 tp = 10 ms sinusoidal, Tc = 25 °C 90 Surge non repetitive forward IFSM current tp = 10 ms sinusoidal, Tc = 125 °C 80 A tp = 10 µs square, Tc = 25 °C 470 Tstg Storage temperature range -55 to +175 °C Tj Operating junction temperature(2) -40 to +175 °C Notes: (1)Value based on Rth(j-c) max. (2)(dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 3: Thermal parameters Value Symbol Parameter Unit Typ. Max. TO-220AC, DPAK, D²PAK 1.25 1.5 Rth(j-c) Junction to case °C/W TO-220AC Ins 2.1 3.5 Table 4: Static electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit Tj = 25 °C - 9 100 IR(1) Reverse leakage current VR = VRRM µA Tj = 150 °C - 85 425 Tj = 25 °C - 1.56 1.75 VF(2) Forward voltage drop IF = 10 A V Tj = 150 °C - 1.98 2.5 Notes: (1)Pulse test: tp = 10 ms, δ < 2% (2)Pulse test: tp = 500 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 1.35 x I + 0.115 x I 2 F(AV) F (RMS) 2/14 DocID023604 Rev 7

STPSC10H065 Characteristics Table 5: Dynamic electrical characteristics Symbol Parameter Test conditions Typ. Unit QCj(1) Total capacitive charge VR = 400 V 28.5 nC VR = 0 V, Tc = 25 °C, F = 1 MHz 480 Cj Total capacitance pF VR = 400 V, Tc = 25 °C, F = 1 MHz 48 Notes: (1)Most accurate value for the capacitive charge: 𝑄 =∫𝑉𝑂𝑈𝑇𝐶(𝑉 )•𝑑𝑉 𝑐𝑗 0 𝐽 𝑅 𝑅 DocID023604 Rev 7 3/14

Characteristics STPSC10H065 1.1 Characteristics (curves) Figure 1: Forward voltage drop versus forward Figure 2: Forward voltage drop versus forward current (typical values, low level) current (typical values, high level) IF(A) IF(A) 20 100 18 Pulsetest:tp=500µs 90 Pulsetest:tp=500µs 16 80 Ta=25°C 14 70 12 Ta=100°C Ta=150°C 60 Ta=25°C 10 Ta=175°C 50 Ta=100°C 8 40 6 30 Ta=150°C 4 20 2 10 VF(V) Ta=175°C VF(V) 0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 1 2 3 4 5 6 7 8 Figure 3: Reverse leakage current versus reverse Figure 4: Peak forward current versus case voltage applied (typical values) temperature (TO-220AC, DPAK, D²PAK) IR(µA) 1.E+03 1.E+02 Tj=175°C 1.E+01 Tj=150°C 1.E+00 1.E-01 Tj=25°C VR(V) 1.E-02 0 50 100 150 200 250 300 350 400 450 500 550 600 650 Figure 6: Junction capacitance versus reverse Figure 5: Peak forward current versus case voltage applied (typical values) temperature (TO-220AC Ins) Cj(pF) 500 450 F=1MHz VOSC=30mVRMS 400 Tj=25°C 350 300 250 200 150 100 50 VR(V) 0 0.1 1.0 10.0 100.0 1000.0 4/14 DocID023604 Rev 7

STPSC10H065 Characteristics Figure 7: Relative variation of thermal impedance Figure 8: Relative variation of thermal impedance junction to case versus pulse duration junction to case versus pulse duration (TO-220AC, DPAK and D²PAK) (TO-220AC Ins) Zth(j-c)/Rth(j-c) Zth(j-c)/Rth(j-c) 1.0 1.0 0.9 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 Singlepulse 0.1 Singlepulse tp(s) 0.1 tp(s) 0.0 0.0 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 Figure 9: Non-repetitive peak surge forward current versus pulse duration Figure 10: Total capacitive charges versus reverse (sinusoidal waveform) voltage applied (typical values) 1.E+03 IFSM(A) 32 Qcj(nC) 28 Ta=25°C 24 20 Ta=125°C 16 1.E+02 12 8 4 VR(V) tp(s) 0 1.E+01 0 50 100 150 200 250 300 350 400 1.E-05 1.E-04 1.E-03 1.E-02 Figure 11: Thermal resistance junction to ambient versus copper surface under tab for D²PAK package (typical values) Rth(j-a)(°C/W) 80 70 60 50 40 30 20 EpoxyprintedboardFR4,eCU=35µm 10 SCu(cm²) 0 0 5 10 15 20 25 30 35 40 DocID023604 Rev 7 5/14

Package information STPSC10H065 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.  Epoxy meets UL94, V0  Cooling method: by conduction (C)  Recommended torque value: 0.55 N·m  Maximum torque value: 0.7 N·m 2.1 TO-220AC package information Figure 12: TO-220AC package outline 6/14 DocID023604 Rev 7

STPSC10H065 Package information Table 6: TO-220AC package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 H2 10.00 10.40 0.393 0.409 L2 16.40 typ. 0.645 typ. L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M 2.6 typ. 0.102 typ. Diam 3.75 3.85 0.147 0.151 DocID023604 Rev 7 7/14

Package information STPSC10H065 2.2 TO-220AC Ins package information Figure 13: TO-220AC Ins package outline Table 7: TO-220AC Ins package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 15.20 15.90 0.598 0.625 a1 3.75 typ. 0.147 typ. a2 13.00 14.00 0.511 0.551 B 10.00 10.40 0.393 0.409 b1 0.61 0.88 0.024 0.034 b2 1.23 1.32 0.048 0.051 C 4.40 4.60 0.173 0.181 c1 0.49 0.70 0.019 0.027 c2 2.40 2.72 0.094 0.107 e 4.80 5.40 0.189 0.212 F 6.20 6.60 0.244 0.259 ØI 3.75 3.85 0.147 0.151 8/14 DocID023604 Rev 7

STPSC10H065 Package information 2.3 DPAK package information Figure 14: DPAK package outline 0068772_A_21 DocID023604 Rev 7 9/14

Package information STPSC10H065 Table 8: DPAK mechanical data Dimensions Dim. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 2.20 2.40 0.087 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b4 5.20 5.40 0.205 0.213 c 0.45 0.60 0.018 0.024 c2 0.48 0.60 0.019 0.024 D 6.00 6.20 0.236 0.244 D1 4.95 5.10 5.25 0.201 0.195 0.207 E 6.40 6.60 0.252 0.260 E1 4.60 4.70 4.80 0.181 0.185 0.189 e 2.16 2.28 2.40 0.085 0.090 0.094 e1 4.40 4.60 0.173 0.181 H 9.35 10.10 0.368 0.398 L 1.00 1.50 0.039 0.059 (L1) 2.60 2.80 3.00 0.102 0.110 0.118 L2 0.65 0.80 0.95 0.026 0.031 0.037 L4 0.60 1.00 0.024 0.039 R 0.20 0.008 V2 0° 8° 0° 8° Figure 15: DPAK recommended footprint (dimensions are in mm) 10/14 DocID023604 Rev 7

STPSC10H065 Package information 2.4 D²PAK package information Figure 16: D²PAK package outline DocID023604 Rev 7 11/14

Package information STPSC10H065 Table 9: D²PAK package mechanical data Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 4.40 4.60 0.173 0.181 A1 0.03 0.23 0.001 0.009 b 0.70 0.93 0.028 0.037 b2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.018 0.024 c2 1.23 1.36 0.048 0.053 D 8.95 9.35 0.352 0.368 D1 7.50 7.75 8.00 0.295 0.305 0.315 D2 1.10 1.30 1.50 0.043 0.051 0.060 E 10 10.40 0.394 0.409 E1 8.50 8.70 8.90 0.335 0.343 0.346 E2 6.85 7.05 7.25 0.266 0.278 0.282 e 2.54 0.100 e1 4.88 5.28 0.190 0.205 H 15 15.85 0.591 0.624 J1 2.49 2.69 0.097 0.106 L 2.29 2.79 0.090 0.110 L1 1.27 1.40 0.049 0.055 L2 1.30 1.75 0.050 0.069 R 0.4 0.015 V2 0° 8° 0° 8° Figure 17: D²PAK recommended footprint (dimensions are in mm) 12/14 DocID023604 Rev 7

STPSC10H065 Ordering information 3 Ordering information Table 10: Ordering information Order code Marking Package Weight Base qty. Delivery mode STPSC10H065G-TR STPSC10H065G D²PAK 1.48 g 1000 Tape and reel STPSC10H065D STPSC10H065D TO-220AC 1.86 g 50 Tube STPSC10H065DI STPSC 10H065DI TO-220AC Ins 2.12 g 50 Tube STPSC10H065B-TR PSC10 H065 DPAK 0.32 g 2500 Tape and reel 4 Revision history Table 11: Document revision history Date Revision Changes 31-Aug-2012 1 First issue. 10-Oct-2012 2 Added Max. value to Table 3. 07-Nov-2013 3 Updated Figure 1, Figure 2, Figure 13, Figure 14 and Table 8. 07-Jan-2014 4 Added TO-220AC Ins package. 22-Jul-2015 5 Updated Table 10 and reformatted to current standard. 10-Dec-2015 6 Inserted package name on cover page. 06-Feb-2017 7 Updated D²PAK package section. DocID023604 Rev 7 13/14

STPSC10H065 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2017 STMicroelectronics – All rights reserved 14/14 DocID023604 Rev 7

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