STPS340 Datasheet 40 V, 3 A power Schottky rectifier Features • Very small conduction losses • Negligible switching losses • Low forward voltage drop • Low thermal resistance • Extremely fast switching • Surface mount package • Avalanche rated • ECOPACK2 component Applications • Telecom power supply • Set-top box power supply • TV power supply • Battery charger Description Single chip Schottky rectifier suited for switch mode power supplies and high frequency DC to DC converters. Packaged in SMA Flat Notch, SMB, SMB Flat, SMC and DPAK, the STPS340 is ideal Product status for surface mounting and used in low voltage, high frequency inverters, free wheeling and polarity protection applications. STPS340 Product summary Symbol Value IF(AV) 3 A VRRM 40 V T j(max.) 150 °C VF(typ.) 0.52 V DS0792 - Rev 13 - October 2019 www.st.com For further information contact your local STMicroelectronics sales office.

STPS340 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 40 V IF(RMS) Forward rms current DPAK 6 A SMA Flat Notch TL = 105 °C SMB TL = 95 °C IF(AV) Average forward current, δ = 0.5, square wave SMB Flat TL = 115 °C 3 A SMC TL = 105 °C DPAK TC = 135°C SMA Flat Notch 105 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal All others 75 A PARM Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C 90 W Tstg Storage temperature range -65 to +150 °C Tj Maximum operating junction temperature(1) +150 °C 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameter Symbol Parameter Max. value Unit SMA Flat Notch 20 SMB 25 Rth(j-l) Junction to lead SMB Flat 15 °C/W SMC 20 Rth(j-c) Junction to case DPAK 5.5 For more information, please refer to the following application note : • AN5088 : Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit Tj = 25 °C - 20 µA IR(1) Reverse leakage current VR = VRRM Tj = 125 °C - 2 10 mA Tj = 25 °C - 0.63 IF = 3 A Tj = 125 °C - 0.52 0.57 VF(1) Forward voltage drop V Tj = 25 °C - 0.84 IF = 6 A Tj = 125 °C - 0.63 0.72 1. Pulse test: tp = 380 µs, δ < 2% DS0792 - Rev 13 page 2/19

STPS340 Characteristics To evaluate the conduction losses, use the following equation: P = 0.42 x I + 0.050 x I 2 F(AV) F (RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode DS0792 - Rev 13 page 3/19

STPS340 Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus Figure 2. Average forward current versus ambient average forward current temperature (δ = 0.5) (SMB, SMC, DPAK) 2.5PF(AV)(W) 3.5 IF(AV()A) DPAK δ= 0.1 δ= 0.2 δ= 0.5 Rth(j-a) = Rth(j-c) δ= 0.05 3.0 2.0 SMB δ= 1 2.5 Rth(j-a) = Rth(j-l) 1.5 2.0 SMC Rth(j-a) = Rth(j-l) 1.0 1.5 0.5 T 1.0 Rth(j-a) = 65 °C/W T 0.5 δ=tp/T tp 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0.0 δ = tP/T tP Tamb(°C) IF(AV)(A) 0 25 50 75 100 125 150 Figure 3. Average forward current versus ambient Figure 4. Normalized avalanche power derating versus temperature (δ = 0.5, SMB Flat) pulse duration (Tj = 125 °C) P (tp) ARM P (10 µs) IF(AV)(A) ARM 3.5 1 Rth(j-a) = Rth(j-l) 3.0 2.5 0.1 2.0 1.5 1.0 0.01 T 0.5 0.0 δ = tP/T tP tp(µs) 0.001 0 25 50 75 100 125 150 Tamb(°C) 1 10 100 1000 Figure 5. Relative variation of thermal impedance junction Figure 6. Relative variation of thermal impedance junction to ambient versus pulse duration (SMB) to lead versus pulse duration (SMB flat) Zth(j-a)/Rth(j-a) Zth(j-l)/Rth(j-l) 1.0 1.0 0.9 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 Single pulse Single pulse 0.1 0.1 0.0 0.0 1.E-02 1.E-01 1.E+00 tp(s) 1.E+01 1.E+02 1.E+03 1.E-04 1.E-03 1.E-02 tp(s) 1.E-01 1.E+00 1.E+01 DS0792 - Rev 13 page 4/19

STPS340 Characteristics (curves) Figure 7. Relative variation of thermal impedance junction Figure 8. Relative variation of thermal impedance junction to ambient versus pulse duration (SMC) to case versus pulse duration (DPAK) Zth(j-a)/Rth(j-a) Zth(j-c)/Rth(j-c) 1.0 1.0 0.9 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 Single pulse 0.2 0.2 Single pulse 0.1 0.1 0.0 0.0 1.E-02 1.E-01 1.E+00 tp(s)1.E+01 1.E+02 1.E+03 1.E-03 1.E-02 tp(s) 1.E-01 1.E+00 Figure 9. Reverse leakage current versus reverse voltage Figure 10. Junction capacitance versus reverse voltage applied (typical values) applied (typical values) IR(mA) C(pF) 1.E+01 1000 Tj=150°C F=1MHz VOSC=30mVRMS Tj=25°C 1.E+00 Tj=125°C Tj=100°C 1.E-01 Tj=75°C 100 1.E-02 Tj=25°C 1.E-03 10 1.E-04 0 5 10 15 20VR(V)25 30 35 40 1 V1R(0V) 100 Figure 12. Thermal resistance junction to ambient versus Figure 11. Forward voltage drop versus forward current copper surface under each lead (SMA Flat Notch) IF(A) Rth(j-a)(°C/W) 10.00 200 Epoxy printed circuit board FR4,copper thickness:35 µm SMA Flat Notch (MaxTimj=u1m25 v°aClues) 1.00 150 ((TTyyppTTiijjcc==aa11ll22vv55aa°°llCCuueess)) 100 0.10 (MaxiTmj=u2m5 °vCalues) 50 S(Cu)(cm²) 0.01 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 VF(V) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 DS0792 - Rev 13 page 5/19

STPS340 Characteristics (curves) Figure 13. Thermal resistance junction to ambient versus Figure 14. Thermal resistance junction to ambient versus copper surface under each lead (SMB) copper surface under each lead (SMB flat) Rth(j-a)(°C/W) R (°C/W) th(j-a) 200 200 EpoxyprintedcircuitboardFR4,copperthickness:35µm SMB Epoxy printed circuit board FR4, eCu= 35 µm SMB flat 150 150 100 100 50 50 S(Cu)(cm²) SCu(cm²) 0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 16. Thermal resistance junction to ambient versus Figure 15. Thermal resistance junction to ambient versus copper surface under tab (DPAK) copper surface under each lead (SMC) 160 Rth(j-a)(°C/W) 100 Rth(j-a)(°C/W) EpoxyprintedcircuitboardFR4,copperthickness:35µm DPAK 140 SMC 90 Epoxy printed circuit board, copper thickness: 35 µm 80 120 70 100 60 80 50 60 40 30 40 20 20 10 SCu(cm²) SCu(cm²) 0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 5 10 15 20 25 30 35 40 DS0792 - Rev 13 page 6/19

STPS340 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 SMA Flat Notch package information • Epoxy meets UL94, V0 • Cooling method: by conduction (C) • Band indicates cathode Figure 17. SMA Flat Notch package outline DS0792 - Rev 13 page 7/19

STPS340 SMA Flat Notch package information Table 4. SMA Flat Notch package mechanical data Dimensions Ref. Millimeters Inches (for reference only) Min. Typ. Max. Min. Typ. Max. A1 0.90 1.10 0.035 0.044 A1 0.05 0.002 b 1.25 1.65 0.049 0.065 C 0.15 0.40 0.005 0.016 D 2.25 2.90 0.088 0.115 E 5.00 5.35 0.196 0.211 E1 3.95 4.60 0.155 0.182 G 2.00 0.079 G1 0.85 0.033 L 0.75 1.20 0.029 L1 0.45 0.018 L2 0.45 0.018 L3 0.05 0.002 V 8° 8° V1 8° 8° Figure 18. SMA Flat Notch recommended footprint in mm (inches) 1.20 3.12 1.20 (0.047) (0.123) (0.047) 1.52 (0.060) 5.52 (0.217) DS0792 - Rev 13 page 8/19

STPS340 SMB package information 2.2 SMB package information • Epoxy meets UL94, V0 • Lead-free package Figure 19. SMB package outline E1 D E A1 C A2 L b Table 5. SMB package mechanical data Dimensions Ref. Millimeters Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.074 0.097 A2 0.05 0.20 0.001 0.008 b 1.95 2.20 0.076 0.087 c 0.15 0.40 0.005 0.016 D 3.30 3.95 0.129 0.156 E 5.10 5.60 0.200 0.221 E1 4.05 4.60 0.159 0.182 L 0.75 1.50 0.029 0.060 DS0792 - Rev 13 page 9/19

STPS340 SMB package information Figure 20. SMB recommended footprint 1.62 2.60 1.62 (0.064) (0.102) (0.064) 2.18 (0.086) 5.84 (0.230) DS0792 - Rev 13 page 10/19

STPS340 SMB Flat package information 2.3 SMB Flat package information • Epoxy meets UL94, V0 • Lead-free package Figure 21. SMB Flat package outline A c D L 2x L1 2x E E1 L2 2x b Table 6. SMB Flat mechanical data Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.90 1.10 0.035 0.044 b 1.95 2.20 0.076 0.087 c 0.15 0.40 0.005 0.016 D 3.30 3.95 0.129 0.156 E 5.10 5.60 0.200 0.221 E1 4.05 4.60 0.159 0.182 L 0.75 1.50 0.029 0.060 L1 0.40 0.016 L2 0.60 0.024 DS0792 - Rev 13 page 11/19

STPS340 SMB Flat package information Figure 22. Footprint recommendations, dimensions in mm (inches) 1.20 3.44 1.20 (0.047) (0.136) (0.047) 2.07 (0.082) 5.84 (0.230) millimeters (inches) DS0792 - Rev 13 page 12/19

STPS340 SMC package information 2.4 SMC package information • Epoxy meets UL94, V0 Figure 23. SMC package outline E1 D E A1 A2 b C L E2 Table 7. SMC package mechanical data Dimensions Ref. Millimeters Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.0748 0.0965 A2 0.05 0.20 0.0020 0.0079 b 2.90 3.20 0.1142 0.1260 c 0.15 0.40 0.0059 0.0157 D 5.55 6.25 0.2185 0.2461 E 7.75 8.15 0.3051 0.3209 E1 6.60 7.15 0.2598 0.2815 E2 4.40 4.70 0.1732 0.1850 L 0.75 1.50 0.0295 0.0591 DS0792 - Rev 13 page 13/19

STPS340 SMC package information Figure 24. SMC recommended footprint 1.54 5.11 1.54 (0.061) (0.201) (0.061) 3.14 (0.124) 8.19 (0.323) millimeters (inches) DS0792 - Rev 13 page 14/19

STPS340 DPAK package information 2.5 DPAK package information • Epoxy meets UL 94,V0 • Cooling method: by conduction (C) Figure 25. DPAK package outline E A b4 c2 Thermal pad E1 L2 D1 D H R L4 A1 b R e e1 c A2 L1 L V2 Gauge 0.25 plane Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. DS0792 - Rev 13 page 15/19

STPS340 DPAK package information Table 8. DPAK package mechanical data Dimensions Ref. Millimeters Inches (for reference only) Min. Max. Min. Max. A 2.18 2.40 0.085 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b4 4.95 5.46 0.194 0.215 c 0.46 0.61 0.018 0.024 c2 0.46 0.60 0.018 0.023 D 5.97 6.22 0.235 0.244 D1 4.95 5.60 0.194 0.220 E 6.35 6.73 0.250 0.265 E1 4.32 5.50 0.170 0.216 e 2.286 typ. 0.090 typ. e1 4.40 4.70 0.173 0.185 H 9.35 10.40 0.368 0.409 L 1.0 1.78 0.039 0.070 L2 1.27 0.050 L4 0.60 1.02 0.023 0.040 V2 -8° +8° -8° +8° Figure 26. DPAK recommended footprint (dimensions in mm) 12.7 6.7 3.0 3.0 A 4.572 6.7 B 1.6 The device must be positioned within 0.05 AB DS0792 - Rev 13 page 16/19

STPS340 Ordering Information 3 Ordering information Table 9. Ordering information Order code Marking Package Weight Base qty. Delivery mode STPS340AFN A340 SMA Flat Notch 0.039 g 10 000 Tape and reel STPS340U U34 SMB 0.107 g 2500 Tape and reel STPS340UF FU34 SMB Flat 0.050 g 5000 Tape and reel STPS340S S34 SMC 0.243 g 10 000 Tape and reel STPS340B-TR S3 40 DPAK 0.320 g 2500 Tape and reel DS0792 - Rev 13 page 17/19

STPS340 Revision history Table 10. Document revision history Date Version Changes Jul-2003 7 Last update. Feb-2005 8 Layout update. No content change. 08-Feb-2007 9 Reformatted to current standard. Added ECOPACK statement. Added SMBflat package. 10-Feb-2009 10 Updated ECOPACK statement. Corrected Y axis in Figure 10. 23-Apr-2015 11 Updated DPAK and reformatted to current standard. 22-Sep-2016 12 Updated DPAK package information and reformatted to current standard. 08-Oct-2019 13 Added Section 2.1 SMA Flat Notch package information. DS0792 - Rev 13 page 18/19

STPS340 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2019 STMicroelectronics – All rights reserved DS0792 - Rev 13 page 19/19