STPS2200 Power Schottky diode Datasheet  production data Features K A  Low forward voltage drop  Very small conduction losses A  Negligible switching losses  Extremely fast switching K  Low thermal resistance SMB  -40°C minimum operating Tj STPS2200U  ECOPACK®2 compliant component A Description This device is a 200 V Schottky rectifier suited for K switch mode power supplies and high frequency DC to DC converters. SMBflat STPS2200UF Packaged in SMB, SMBflat, this device is especially intended for use in low voltage, high frequency inverters, freewheeling and polarity Table 1. Device summary protection. Also ideal for all LED lighting Symbol Value applications. I 2 A F(AV) VRRM 200 V T 175 °C j(max) V 0.58 V F(typ) April 2013 DocID024381 Rev 1 1/9 This is information on a product in full production. www.st.com 9

Characteristics STPS2200 1 Characteristics T a ble 2. Absolute ratings (limiting values, at 25 °C unless otherwise stated) Symbol Parameter Value Unit V Repetitive peak reverse voltage 200 V RRM I Forward rms current 10 A F(RMS) SMB T = 145 °C l I Average forward current  = 0.5, square wave 2 A F(AV) SMBflat T = 150 °C l I Surge non repetitive forward current t = 10 ms sinusoidal, T = 25 °C 100 A FSM p l T Storage temperature range -65 to +175 °C stg T Operating junction temperature range -40 to +175 °C j Table 3. Thermal parameters Symbol Parameter Value Unit SMB 20 R Junction to lead °C/W th(j-l) SMBflat 15 Table 4. Static electrical characteristics Symbol Test conditions Min. Typ. Max. Unit T = 25 °C 5 µA I (1) Reverse leakage current j V = V R R RRM T = 125 °C 0.7 2.5 mA j T = 25 °C 0.73 0.80 V V (1) Forward voltage drop j I = 2 A F F T = 125 °C 0.58 0.64 V j 1. Pulse test: t = 380 µs,  < 2% p To evaluate the maximum conduction losses use the following equation: P = 0.58 x I + 0.03 I 2 F(AV) F (RMS) Note: More information is available in the application notes: AN604 Calculation of conduction losses in a power rectifier AN4021 Calculation of reverse losses in a power diode 2/9 DocID024381 Rev 1

STPS2200 Characteristics Figure 1. Average forward power dissipation Figure 2. Forward voltage drop versus forward versus average forward current current PF(AV)(W) IF(A) 1.6 1.E+01 1.4 δ= 0.05 δ= 0.1 δ= 0.2 δ= 0.5 δ= 1 Tj= 125°C 1.2 (Maximum values) 1.0 1.E+00 Tj=125°C (Typical values) 0.8 Tj=25°C (Maximum values) 0.6 1.E-01 Tj=25°C 0.4 T (Typical values) 0.2 IF(AV)(A) δ=tp/T tp VF(V) 0.0 1.E-02 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 Figure 3. Reverse leakage current versus Figure 4. Junction capacitance versus reverse reverse voltage applied (typical values) voltage applied (typical values) IR(mA) C(pF) 1.E+01 1000 1.E+00 Tj= 150 °C VOSTFCj === 132 05M °mHCVzRMS Tj= 125 °C 1.E-01 Tj= 100 °C 1.E-02 Tj= 75 °C 100 1.E-03 Tj= 50 °C Tj= 25 °C 1.E-04 VR(V) VR(V) 1.E-05 10 0 20 40 60 80 100 120 140 160 180 200 1 10 100 1000 Figure 5. Relative variation of thermal Figure 6. Relative variation of thermal impedance junction to lead versus pulse impedance junction to lead versus pulse duration (SMB) duration (SMBflat) Zth(j-l)/Rth(j-l) 1.0 Zth(j-l)/Rth(j-l) 1.0 0.9 SMB 0.9 SMBflat 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 0.1 Single pulse tp(s) 0.1 Single pulse tp(s) 0.0 0.0 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 DocID024381 Rev 1 3/9

Characteristics STPS2200 Figure 7. Thermal resistance junction to Figure 8. Thermal resistance junction to ambient versus copper surface under each lead ambient versus copper surface under each lead (SMB) (SMBflat) Rth(j-a)(°C/W) Rth(j-a)(°C/W) 200 200 SMB SMBflat Epoxy printed circuit board FR4 Epoxy printed circuit board FR4 copper thickness = 35 µm copper thickness = 35 µm 150 150 100 100 50 50 SCu(cm²) SCu(cm²) 0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 4/9 DocID024381 Rev 1

STPS2200 Package information 2 Package information  Epoxy meets UL94, V0  Lead-free package  Cooling method: by conduction (C)  Recommended torque value: 0.4 to 0.6 N·m In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 9. SMB dimension definitions E1 D E A1 C A2 L b Table 5. SMB dimension values Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 L 0.75 1.50 0.030 0.059 DocID024381 Rev 1 5/9

Package information STPS2200 Figure 10. SMB footprint, dimensions in mm (inches) 1.62 2.60 1.62 (0.064) (0.102) (0.064) 2.18 (0.086) 5.84 (0.23) Figure 11. SMBflat (non exposed pad) dimension definitions A c D L2x L2 2x E E1 L L1 2x b Table 6. SMBflat (non exposed pad) dimension values Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.90 1.10 0.035 0.043 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 D 3.30 3.95 1.30 0.156 E 5.10 5.60 0.200 0.220 E1 4.05 4.60 0.189 0.181 L 0.75 1.50 0.029 0.059 L1 0.40 0.016 L2 0.60 0.024 6/9 DocID024381 Rev 1

STPS2200 Package information Figure 12. SMBflat (non exposed pad) footprint dimensions 5.84 (0.230) 2.07 (0.082) 1.20 3.44 1.20 (0.047) (0.136) (0.047) millimeters (inches) DocID024381 Rev 1 7/9

Ordering information STPS2200 3 Ordering information Table 7. Ordering information Ordering type Marking Package Weight Base qty Delivery mode STPS2200U G22 SMB g 2500 Tape and reel STPS2200UF FG22 SMBflat g 5000 Tape and reel 4 Revision history Table 8. Document revision history Date Revision Changes 11-Apr-2013 1 First issue 8/9 DocID024381 Rev 1

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