STPS15L45C Datasheet 2 x 7.5 A - 45 V low drop power Schottky rectifier Features A1 • Very small conduction losses K • Negligible switching losses A2 • Extremely fast switching K K • Low forward voltage drop • Low capacitance • Avalanche capability specified A2 • ECOPACK2 compliant component A2 A1 A1 DPAK Applications • SMPS • Freewheeling diodes • Switching diodes Description Dual center tab Schottky rectifier suited for SMPS and high frequency DC to DC converters. Packaged in DPAK, the STPS15L45C is intended for use in low voltage, high frequency inverters, freewheeling and polarity protection applications. Product status link STPS15L45C Product summary Symbol Value IF(AV) 2 x 7.5 A VRRM 45 V T j(max.) 150 °C VF(typ.) 0.40 V DS2653 - Rev 5 - August 2019 www.st.com For further information contact your local STMicroelectronics sales office.

STPS15L45C Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values, per diode, at 25 °C unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 45 V IF(RMS) Forward rms current 10 A Per diode 7.5 IF(AV) Average forward current Tc = 140 °C, δ = 0.5 square wave A Per device 15 IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 75 A PARM Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C 265 W Tstg Storage temperature range -65 to +175 °C Tj Maximum operating junction temperature(1) 150 °C 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameters Symbol Parameter Max. value Unit Per diode 4 Rth(j-c) Junction to case Total 2.4 °C/W Rth(c) Coupling 0.7 When the diodes 1 and 2 are used simultaneously : Δ T(diode 1) = P(diode1) x R (per diode) + P(diode 2) x R j th(j-c) th(c) For more information, please refer to the following application note : • AN5088 : Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics (per diode) Symbol Parameter Test conditions Min. Typ. Max. Unit Tj = 25 °C - 500 µA IR(1) Reverse leakage current VR = VRRM Tj = 125 °C - 60 120 mA Tj = 25 °C - 0.52 IF = 7.5 A Tj = 125 °C - 0.40 0.46 Tj = 25 °C - 0.60 VF(2) Forward voltage drop IF = 12 A V Tj = 125 °C - 0.49 0.57 Tj = 25 °C - 0.64 IF = 15 A Tj = 125 °C - 0.53 0.63 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 μs, δ < 2% To evaluate the conduction losses, use the following equation: DS2653 - Rev 5 page 2/10

STPS15L45C Characteristics P = 0.29 x I + 0.023 x I 2 F(AV) F (RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode DS2653 - Rev 5 page 3/10

STPS15L45C Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus Figure 2. Average forward current versus ambient average forward current (per diode) temperature (δ = 0.5, per diode) PF(AV)(W) IF(AV)(A) 5.5 δ = 0.5 5.0 δ = 0.2 Rth(j-a) = Rth(j-c) 4.5 δ = 0.1 4.0 δ = 0.05 3.5 δ = 1 3.0 2.5 2.0 Rth(j-a) = 70 °C/W 1.5 T 1.0 0.5 IF(AV)(A) δ = tp/T tp δ = tp/T tp Tamb(°C) 0.0 0 1 2 3 4 5 6 7 8 9 10 0 25 50 75 100 125 150 Figure 3. Normalized avalanche power derating versus Figure 4. Relative variation of thermal impedance junction pulse duration (Tj = 125 °C) to case versus pulse duration P (tp) ARM Zth(j-c)/Rth(j-c) P (10 µs) ARM 1.0 1 0.9 0.8 0.7 0.1 0.6 0.5 0.4 0.01 0.3 0.2 0.1 Single pulse tp(s) tp(µs) 0.0 0.001 1.E-03 1.E-02 1.E-01 1.E+00 1 10 100 1000 DS2653 - Rev 5 page 4/10

STPS15L45C Characteristics (curves) Figure 6. Junction capacitance versus reverse voltage applied (typical values, per diode) Figure 5. Reverse leakage current versus reverse voltage applied (typical values, per diode) C(nF) 1.E+02 IR(mA) 10.0 Tj = 150 °C F = 1 MHz VOSC = 30 mV Tj = 125 °C Tj = 25 °C 1.E+01 Tj = 100 °C 1.E+00 Tj = 75 °C 1.0 Tj = 50 °C 1.E-01 Tj = 25 °C 1.E-02 VR(V) VR(V) 0 5 10 15 20 25 30 35 40 45 0.1 1 10 100 Figure 7. Forward voltage drop versus forward current Figure 8. Thermal resistance junction to ambient versus (per diode) copper surface under tab IFM(A) Rth(j-a)(°C/W) 100 100 DPAK Tj = 125 °C 90 Epoxy printed circuit board, copper thickness: 35 µm (Maximum values) 80 70 60 Tj = 125 °C (Typical values) 50 10 40 Tj = 25 °C 30 (Maximum values) 20 10 VFM(V) SCu(cm²) 0 1 0 5 10 15 20 25 30 35 40 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 DS2653 - Rev 5 page 5/10

STPS15L45C Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 DPAK package information • Epoxy meets UL 94,V0 • Cooling method: by conduction (C) Figure 9. DPAK package outline E A b4 c2 Thermal pad E1 L2 D1 D H R L4 A1 b R e e1 c A2 L1 L V2 Gauge 0.25 plane Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. DS2653 - Rev 5 page 6/10

STPS15L45C DPAK package information Table 4. DPAK package mechanical data Dimensions Ref. Millimeters Inches (for reference only) Min. Max. Min. Max. A 2.18 2.40 0.085 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b4 4.95 5.46 0.194 0.215 c 0.46 0.61 0.018 0.024 c2 0.46 0.60 0.018 0.023 D 5.97 6.22 0.235 0.244 D1 4.95 5.60 0.194 0.220 E 6.35 6.73 0.250 0.265 E1 4.32 5.50 0.170 0.216 e 2.286 typ. 0.090 typ. e1 4.40 4.70 0.173 0.185 H 9.35 10.40 0.368 0.409 L 1.0 1.78 0.039 0.070 L2 1.27 0.050 L4 0.60 1.02 0.023 0.040 V2 -8° +8° -8° +8° Figure 10. DPAK recommended footprint (dimensions in mm) 12.7 6.7 3.0 3.0 A 4.572 6.7 B 1.6 The device must be positioned within 0.05 AB DS2653 - Rev 5 page 7/10

STPS15L45C Ordering Information 3 Ordering Information Table 5. Ordering information Order code Marking Package Weight Base qty. Delivery mode STPS15L45CB 75 Tube S15L45C DPAK 0.35 g STPS15L45CB-TR 2500 Tape and reel DS2653 - Rev 5 page 8/10

STPS15L45C Revision history Table 6. Document revision history Date Version Changes 10-Mar-2011 2 Automatic revalidation date workflow started. Updated DPAK package information and reformatted to current standard. 07-Jul-2015 3 Removed IPAK. 29-Nov-2018 4 Updated DPAK package information and reformatted to current standard. 09-Aug-2019 5 Added Section Applications. Updated Table 3, Figure 4 and Table 5. DS2653 - Rev 5 page 9/10

STPS15L45C IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2019 STMicroelectronics – All rights reserved DS2653 - Rev 5 page 10/10

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