STPS140 Datasheet 40 V power Schottky rectifier Features • Very small conduction losses • Negligible switching losses • Low forward voltage drop • Surface mount miniature packages • Avalanche rated • ECOPACK®2 compliant Applications • Reverse polarity protection • Set-top box power supply • TV power supply • Battery charger Description Single chip Schottky rectifiers suited to switched mode power supplies and high frequency DC to DC converters. Packaged in SMA and SMB, the STPS140 is ideal for use in surface mounting and used in low voltage, high frequency inverters, free-wheeling and polarity protection applications. Product status STPS140 Product summary Symbol Value IF(AV) 1 A VRRM 40 V T j(max.) 150 °C VF(typ.) 0.43 V DS1044 - Rev 8 - November 2018 www.st.com For further information contact your local STMicroelectronics sales office.

STPS140 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 40 V IF(RMS) Forward rms current 7 A SMA TL = 130 °C IF(AV) Average forward current δ = 0.5, square wave 1 A SMB TL = 135 °C IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 60 A PARM Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C 65 W Tstg Storage temperature range -65 to +150 °C Tj Operating junction temperature(1) +150 °C 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameter Symbol Parameter Max. value Unit SMA 30 Rth(j-l) Junction to lead °C/W SMB 25 For more information, please refer to the following application note : • AN5088 : Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit Tj = 25 °C - 12 µA IR(1) Reverse leakage current VR = VRRM Tj = 100 °C - 0.25 2 mA Tj = 25 °C - 0.55 IF = 1 A Tj = 125 °C - 0.43 VF(2) Forward voltage drop V Tj = 25 °C - 0.65 IF = 2 A Tj = 125 °C - 0.53 0.60 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.40 x I + 0.10 x I 2 F(AV) F (RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode DS1044 - Rev 8 page 2/11

STPS140 Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus Figure 2. Average forward current versus ambient average forward current temperature (SMA, δ = 0.5) PF(AV)(W) IF(AV)(A) 0.7 1.2 δ= 0.1 δ= 0.2 δ= 0.5 Rth(j-a)=Rth(j-l) 0.6 δ= 0.05 1.0 0.5 0.8 0.4 δ= 1 0.6 0.3 Rth(j-a)=100°C/W 0.2 T 0.4 T 0.1 0.2 IF(AV)(A) δ=tp/T tp 0.0 0.0 δ=tp/T tp Tamb (°C) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 25 50 75 100 125 150 Figure 3. Average forward current versus ambient Figure 4. Normalized avalanche power derating versus temperature (SMB, δ = 0.5) pulse duration (T = 125 °C) j IF(AV)(A) PARM(tp) 1.2 P (10 µs) Rth(j-a)=Rth(j-l) 1 ARM 1.0 0.8 0.1 0.6 Rth(j-a)=80°C/W 0.4 0.01 T 0.2 δ=tp/T tp Tamb (°C) 0.0 tp(µs) 0 25 50 75 100 125 150 0.001 1 10 100 1000 Figure 5. Relative variation of thermal impedance junction Figure 6. Relative variation of thermal impedance junction to ambient versus pulse duration (SMA) to ambient versus pulse duration (SMB) Zth(j-a)/Rth(j-a) Zth(j-a)/Rth(j-a) 1.0 1.0 0.9 SMA 0.9 SMB 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 Single pulse 0.1 Single pulse tp(s) 0.1 tp(s) 0.0 0.0 1E-2 1E-1 1E+0 1E+1 1E+2 1E-2 1E-1 1E+0 1E+1 1E+2 1E+3 DS1044 - Rev 8 page 3/11

STPS140 Characteristics (curves) Figure 7. Reverse leakage current versus reverse voltage Figure 8. Junction capacitance versus reverse voltage applied (typical values) applied (typical values) IR(µA) C(pF) 1E+3 200 Tj = 125 °C F=1MHz VOSC=30mVRMS 1E+2 Tj=25°C 100 Tj = 75 °C 1E+1 50 1E+0 Tj = 25 °C 20 1E-1 VR(V) VR(V) 1E-2 10 0 5 10 15 20 25 30 35 40 1 2 5 10 20 50 Figure 10. Thermal resistance junction to ambient versus Figure 9. Forward voltage drop versus forward current copper surface under each lead (typical values) (maximum values) IF(A) Rth(j-a)(°C/W) 200 1E+1 SMA 150 1E+0 TTjj== 112255° C°C 100 1E-1 Epoxy printed board FR4, eCu = 35 µm 50 VF(V) SCu(cm²) 1E-2 0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 11. Thermal resistance junction to ambient versus copper surface under each lead (typical values) Rth(j-a)(°C/W) 200 SMB 150 100 Epoxy printed board FR4, eCu = 35 µm 50 SCu(cm²) 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 DS1044 - Rev 8 page 4/11

STPS140 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 SMB package information • Epoxy meets UL94, V0 • Lead-free package Figure 12. SMB package outline E1 D E A1 C A2 L b DS1044 - Rev 8 page 5/11

STPS140 SMB package information Table 4. SMB package mechanical data Dimensions Ref. Millimeters Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.074 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.076 0.087 c 0.15 0.40 0.005 0.016 D 3.30 3.95 0.129 0.156 E 5.10 5.60 0.200 0.220 E1 4.05 4.60 0.159 0.181 L 0.75 1.50 0.029 0.059 Figure 13. SMB recommended footprint 1.62 2.60 1.62 (0.064) (0.102) (0.064) 2.18 (0.086) 5.84 (0.230) DS1044 - Rev 8 page 6/11

STPS140 SMA package information 2.2 SMA package information • Epoxy meets UL94, V0 • Cooling method : by conduction (C) Figure 14. SMA package outline E1 D E A1 C A2 L b Table 5. SMA package mechanical data Dimensions Ref. Millimeters Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.075 0.097 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.90 0.089 0.114 E 4.80 5.35 0.189 0.211 E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 DS1044 - Rev 8 page 7/11

STPS140 SMA package information Figure 15. SMA recommended footprint in mm (inches) 1.4 2.63 1.4 (0.055) (0.104) (0.055) 1.64 (0.065) 5.43 (0.214) DS1044 - Rev 8 page 8/11

STPS140 Ordering information 3 Ordering information Table 6. Ordering information Order code Marking Package Weight Base qty. Delivery mode STPS140A S140 SMA 68 mg 5000 Tape and reel STPS140U G14 SMB 107 mg 2500 Tape and reel DS1044 - Rev 8 page 9/11

STPS140 Revision history Table 7. Document revision history Date Revision Changes Jul-2003 7.2 Last update. SMA package dimensions update. Reference A1 max. changed from 2.70 mm (0.106 inch.) to 2.03 Aug-2004 7.3 mm (0.080). Updated Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified), 21-Nov-2018 8 Figure 4. Normalized avalanche power derating versus pulse duration (Tj = 125 °C), Section 2.1 and Section 2.2 . DS1044 - Rev 8 page 10/11

STPS140 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2018 STMicroelectronics – All rights reserved DS1044 - Rev 8 page 11/11