TVS Diode Array General Purpose ESD Protection - SP1002 Series SP1002 Series 5pF 8kV Bidirectional TVS Array RoHS Pb GREEN Description Back-to-Back Zener diodes fabricated in a proprietary silicon avalanche technology protect each I/O pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level specified in the IEC 61000-4- 2 international standard (Level 4, ±8kV contact discharge) without performance degradation. Their very low loading capacitance also makes them ideal for protecting high- speed signal pins. Pinout Features SP1002-01JTG SP1002-02JTG • Low capacitance of 5pF • Small package saves (TYP) I/O to I/O board space (SC70-3) (SC70-5) • ESD protection of ±8kV • Lightning Protection, IEC 1 1 5 contact discharge, ±15kV 61000-4-5, 2nd edition 2A air discharge, (Level 4, (8/20µs) NC NC IEC 61000-4-2) • RoHS compliant and lead • EFT protection, IEC free 2 3 4 61000-4-4, 40A • AEC-Q101 qualified (5/50ns) • Low leakage current of 0.5μA (MAX) at 5V Functional Block Diagram Applications SP1002-01JTG SP1002-02JTG • Computer Peripherals • LCD/PDP TVs • Mobile Phones • Set Top Boxes 1 1 3 • Digital Cameras • DVD Players • Desktops/Notebooks • MP3/PMP Application Example 2 5 4 MultiMedia MultiMedia Device Device Audio Out L Audio In L Additional Information Audio Out R Audio In R 2 x SP1002-01 Datasheet Resources Samples SCART MultiMedia Application of SP1002-01 Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/06/19

TVS Diode Array General Purpose ESD Protection - SP1002 Series Absolute Maximum Ratings Thermal Information Symbol Parameter Value Units Parameter Rating Units I Peak Current (t=8/20μs) 2 A Storage Temperature Range –55 to 150 °C PP p T Operating Temperature –40 to 125 °C Maximum Junction Temperature 150 °C OP T Storage Temperature –55 to 150 °C Maximum Lead Temperature 260 °C STOR (Soldering 20-40s) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (T = 25°C) OP Parameter Symbol Test Conditions Min Typ Max Units Voltage Drop V I=1mA 6.0 9.5 V D R Reverse Standoff Voltage V I≤1µA with 1 I/O at GND 6.0 V RWM R Leakage Current I V=5V with I/O at GND 0.5 µA LEAK R I =1A, t=8/20µs, Fwd 9.2 13.0 V Clamp Voltage1 V PP p C I =2A, t=8/20µs, Fwd 11.2 16.0 V PP p Dynamic Resistance R (V - V ) / (I - I ) 2.0 Ω DYN C2 C1 PP2 PP1 IEC61000-4-2 (Contact) ±8 kV ESD Withstand Voltage1,2 V ESD IEC61000-4-2 (Air) ±15 kV Reverse Bias=0V 6 pF Diode Capacitance1 C Reverse Bias=2.5V 5 pF D Reverse Bias=5V 5 pF Notes: 1 Parameter is guaranteed by device characterization 2 A minimum of 1,000 ESD pulses are applied at 1s intervals Soldering Parameters Reflow Condition Pb – Free assembly - Temperature Min (T ) 150°C tP s(min) TP CCrriittiiccaall ZZoonnee Pre Heat - Temperature Max (Ts(max)) 200°C e RRaammpp--uupp TTLL ttoo TTPP Average ram-p T uimp er a(tme i(nL itqou midauxs)) T(tes)mp (TL) to peak 36°0C –/ s1e8c0o nsde cmsax rutare TS(mTaxL) tL T to T - Ramp-up Rate 3°C/second max pm RRaammpp--ddoown S(max) L e PPrreehheeaatt - Temperature (T) (Liquidus) 217°C T Reflow L TS(min) - Temperature (tL) 60 – 150 seconds tS Peak Temperature (T) 260+0/-5 °C P 25 Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds time to peak temperature Time Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (T) 8 minutes max. P Do not exceed 260°C © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/06/19

TVS Diode Array General Purpose ESD Protection - SP1002 Series Package Dimensions — SC70-3 B Solder Pad Layout Package SC70-3 3 1.30 Pins 3 [0.0512] 0.65 JEDEC MO-203 E HE [0.0256] Millimeters Inches 0.70 Symbol [0.0276] Min Max Min Max 1 2 A 0.80 1.10 0.031 0.043 e e A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 D B 0.15 0.30 0.006 0.012 8] 9074 c 0.08 0.25 0.003 0.010 A2 A 1.0.0 [ D 1.85 2.25 0.073 0.089 E 1.15 1.35 0.045 0.053 A1 e 0.66 BSC 0.026 BSC HE 2.00 2.40 0.079 0.094 4] C 0.900.035 L 0.26 0.46 0.010 0.018 [ L Package Dimensions — SC70-5 e e Package SC70-5 6 5 4 Pins 5 not used Solder Pad Layout JEDEC MO-203 E HE Millimeters Inches Symbol Min Max Min Max 1 2 3 A 0.80 1.10 0.031 0.043 B A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 D B 0.15 0.30 0.006 0.012 A2 A c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 A1 E 1.15 1.35 0.045 0.053 e 0.65 BSC 0.026 BSC C HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 L Product Characteristics Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/06/19

TVS Diode Array General Purpose ESD Protection - SP1002 Series Part Numbering System Part Marking System SP 1002 – ** J T G B* * B** Product Series Number of Channels TVS Diode Arrays G= Green B = SP1002 Series (varies) (SPA® Diodes) T= Tape & Reel Assembly Site (varies) Series Ordering Information Number of Channels Package -01 = 1 Channel J = SC70-3 Part Number Package Marking Min. Order Qty. -02 = 2 Channel SC70-5 SP1002-01JTG SC70-3 B*1 3000 SP1002-02JTG SC70-5 B*2 3000 Embossed Carrier Tape & Reel Specification — SC70-3 PO Millimetres Inches Symbol P2 ØD t Min Max Min Max E 1.65 1.85 0.065 0.073 E F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.077 0.081 W D 1.40 1.60 0.055 0.063 D1 1.00 1.25 0.039 0.049 F P0 3.90 4.10 0.154 0.161 ØD1 BOB1 K1 10P0 40.0 ± 0.20 1.574 ± 0.008 W 7.70 8.10 0.303 0.318 AO P P 3.90 4.10 0.153 0.161 A1 A0 2.30 2.50 0.090 0.098 A1 1.00 Ref 0.039 Ref B0 2.30 2.50 0.090 0.098 O B1 1.90 Ref 0.074 K K0 1.10 1.30 0.043 0.051 K1 0.60 Ref 0.023 Ref t 0.27 max 0.010 Embossed Carrier Tape & Reel Specification — SC70-5 and SC70-6 Millimetres Inches Symbol Min Max Min Max E 1.65 1.85 0.065 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.077 0.081 D 1.40 1.60 0.055 0.063 D1 1.00 1.25 0.039 0.049 P0 3.90 4.10 0.154 0.161 10P0 40.0 ± 0.20 1.574 ± 0.008 W 7.70 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 2.14 2.34 0.084 0.092 B0 2.24 2.44 0.088 0.096 K0 1.12 1.32 0.044 0.052 t 0.27 max 0.010 max Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/06/19