Product Sample & Technical Tools & Support & Folder Buy Documents Software Community SN74LV4051A SCLS428I–MAY1999–REVISEDSEPTEMBER2015 SN74LV4051A 8-Channel Analog Multiplexers and Demultiplexers 1 Features 3 Description • 2-Vto5.5-VV Operation The SN74LV4051A 8-channel CMOS analog 1 CC multiplexers and demultiplexers are designed for 2-V • SupportMixed-ModeVoltageOperationon to5.5-VV operation. AllPorts CC The SN74LV4051A devices handle both analog and • HighOn-OffOutput-VoltageRatio digital signals. Each channel permits signals with • LowCrosstalkBetweenSwitches amplitudes up to 5.5-V (peak) to be transmitted in • IndividualSwitchControls eitherdirection. • ExtremelyLowInputCurrent Applications include: signal gating, chopping, • Latch-UpPerformanceExceeds100-mAPer modulation or demodulation (modem), and signal JESD78,ClassII multiplexing for analog-to-digital and digital-to-analog conversionsystems. • ESDProtectionExceedsJESD22 – 2000-VHuman-BodyModel(A114-A) DeviceInformation(1) – 200-VMachineModel(A115-A) PARTNUMBER PACKAGE BODYSIZE(NOM) – 1000-VCharged-DeviceModel(C101) TSSOP(16) 5.00mm×6.30mm SOIC(16) 9.90mm×6.00mm 2 Applications SSOP(16) 6.20mm×7.80mm • Telecommunications SN74LV4051A TVSOP(16) 3.60mm×6.40mm • eCall PDIP(16) 19.30mm×6.35mm • Infotainment SO(16) 3.60mm×6.40mm VQFN(16) 3.50mm×4.00mm (1) For all available packages, see the orderable addendum at theendofthedatasheet. LogicDiagram(PositiveLogic) 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.UNLESSOTHERWISENOTED,thisdocumentcontainsPRODUCTION DATA.

SN74LV4051A SCLS428I–MAY1999–REVISEDSEPTEMBER2015 www.ti.com Table of Contents 1 Features.................................................................. 1 8.1 Overview.................................................................12 2 Applications........................................................... 1 8.2 FunctionalBlockDiagram.......................................12 3 Description............................................................. 1 8.3 FeatureDescription.................................................12 8.4 DeviceFunctionalModes........................................12 4 RevisionHistory..................................................... 2 9 ApplicationandImplementation........................ 13 5 PinConfigurationandFunctions......................... 3 9.1 ApplicationInformation............................................13 6 Specifications......................................................... 4 9.2 TypicalApplication .................................................13 6.1 AbsoluteMaximumRatings......................................4 10 PowerSupplyRecommendations..................... 15 6.2 ESDRatings..............................................................4 11 Layout................................................................... 15 6.3 RecommendedOperatingConditions.......................4 6.4 ThermalInformation..................................................5 11.1 LayoutGuidelines.................................................15 6.5 ElectricalCharacteristics..........................................5 11.2 LayoutExample....................................................15 6.6 OperatingCharacteristics..........................................6 12 DeviceandDocumentationSupport................. 16 6.7 SwitchingCharacteristics:V =2.5V±0.2V .......6 12.1 DocumentationSupport........................................16 CC 6.8 SwitchingCharacteristics:V =3.3V±0.3V .......6 12.2 CommunityResources..........................................16 CC 6.9 SwitchingCharacteristics:V =5V±0.5V ..........7 12.3 Trademarks...........................................................16 CC 6.10 AnalogSwitchCharacteristics................................7 12.4 ElectrostaticDischargeCaution............................16 6.11 TypicalCharacteristics............................................8 12.5 Glossary................................................................16 7 ParameterMeasurementInformation..................9 13 Mechanical,Packaging,andOrderable Information........................................................... 16 8 DetailedDescription............................................ 12 4 Revision History NOTE:Pagenumbersforpreviousrevisionsmaydifferfrompagenumbersinthecurrentversion. ChangesfromRevisionH(April2005)toRevisionI Page • AddedDeviceInformationtable,PinFunctionstable,ESDRatingstable,ThermalInformationtable,Detailed Descriptionsection,ApplicationsandImplementationsection,PowerSupplyRecommendationssection,Layout section,DeviceandDocumentationSupportsection,andMechanical,Packaging,andOrderableInformationsection......1 • DeletedSN54LV4051Apartnumberfromthedatasheet..................................................................................................... 1 • RemovedOrderingInformationtable..................................................................................................................................... 1 • DeletedθJAfromtheAbsoluteMaximumRatingstable ....................................................................................................... 4 2 SubmitDocumentationFeedback Copyright©1999–2015,TexasInstrumentsIncorporated ProductFolderLinks:SN74LV4051A

SN74LV4051A www.ti.com SCLS428I–MAY1999–REVISEDSEPTEMBER2015 5 Pin Configuration and Functions D,DB,DGB,N,NS,PWPackage 16-PinSOIC,SSOP,TVSOP,PDIP,SO,TSSOP RGYPackage TopView 16-PinVQFNWithExposedThermalPad TopView Y4 1 16 VCC 4 CC Y V Y6 2 15 Y2 1 16 COM 3 14 Y1 Y6 2 15 Y2 Y7 4 13 Y0 COM 3 14 Y1 Y5 5 12 Y3 Y7 4 13 Y0 INH 6 11 A Y5 5 12 Y3 GND 7 10 B INH 6 11 A GND 8 9 GND 7 10 B 8 9 D C N G PinFunctions PIN I/O DESCRIPTION NAME NO. A 11 I SelectorlineAforoutputs(seeDeviceFunctionalModesforspecificinformation) B 10 I SelectorlineBforoutputs(seeDeviceFunctionalModesforspecificinformation) C 9 I SelectorlineCforoutputs(seeDeviceFunctionalModesforspecificinformation) COM 3 O/I(1) Output/Inputofmux GND 7,8 — Ground INH 6 I(1) Enablestheoutputsofthedevice.Logiclowlevelwithturntheoutputson,highlevelwillturn themoff. Y0 13 I/O(1) Input/Outputtomux Y1 14 I/O(1) Input/Outputtomux Y2 15 I/O(1) Input/Outputtomux Y3 12 I/O(1) Input/Outputtomux Y4 1 I/O(1) Input/Outputofmux Y5 5 I/O(1) Input/Outputtomux Y6 2 I/O(1) Input/Outputtomux Y7 4 I/O(1) Input/Outputtomux V 16 — Devicepower CC (1) TheseI/Odescriptionsrepresentthedevicewhenusedasamultiplexer,whenthisdeviceisoperatedasademultiplexerpinsY0-Y7 maybeconsideredoutputs(O)andtheCOMpinmaybeconsideredinputs(I). Copyright©1999–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:SN74LV4051A

SN74LV4051A SCLS428I–MAY1999–REVISEDSEPTEMBER2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1) MIN MAX UNIT V Supplyvoltagerange –0.5 7.0 V CC V Inputvoltagerange(2) –0.5 7.0 V I V SwitchI/Ovoltagerange(2)(3) –0.5 V +0.5 V IO CC I Inputclampcurrent V <0 −20 mA IK I I I/Odiodecurrent V <0 −50 mA IOK IO I Switchthroughcurrent V =0toV ±25 mA T IO CC ContinuouscurrentthroughV orGND ±50 mA CC T MaxJunctiontemperature 150 °C J T Storagetemperature –65 150 °C stg (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommendedOperating Conditionsisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) Theinputandoutputnegative-voltageratingsmaybeexceedediftheinputandoutputcurrentratingsareobserved. (3) Thisvalueislimitedto5.5-Vmaximum. 6.2 ESD Ratings VALUE UNIT Humanbodymodel(HBM),perANSI/ESDA/JEDECJS-001(1) ±2000 V(ESD) Electrostaticdischarge Charged-devicemodel(CDM),perJEDECspecificationJESD22- V C101(2) ±1000 (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess. (2) JEDECdocumentJEP157statesthat250-VCDMallowssafemanufacturingwithastandardESDcontrolprocess. 6.3 Recommended Operating Conditions overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1) MIN NOM MAX UNIT V Supplyvoltage 2(2) 5.5 V CC V =2V 1.5 CC High-levelinputvoltage, VCC=2.3Vto2.7V VCC×0.7 V V IH controlinputs V =3Vto3.6V V ×0.7 CC CC V =4.5Vto5.5V V ×0.7 CC CC V =2V 0.5 CC Low-levelinputvoltage, VCC=2.3Vto2.7V VCC×0.3 V V IL controlinputs V =3Vto3.6V V ×0.3 CC CC V =4.5Vto5.5V V ×0.3 CC CC V Controlinputvoltage 0 5.5 V I V Inputoroutputvoltage 0 V V IO CC V =2.3Vto2.7V 200 CC Δt/Δv Inputtransitionriseorfallrate V =3Vto3.6V 100 ns/V CC V =4.5Vto5.5V 20 CC T Operatingfree-airtemperature –40 85 °C A (1) AllunusedinputsofthedevicemustbeheldatV orGNDtoensureproperdeviceoperation.RefertoTIapplicationreport CC ImplicationsofSloworFloatingCMOSInputs,SCBA004. (2) Withsupplyvoltagesatornear2V,theanalogswitchON-stateresistancebecomesverynonlinear.Itisrecommendedthatonlydigital signalsbetransmittedattheselowsupplyvoltages. 4 SubmitDocumentationFeedback Copyright©1999–2015,TexasInstrumentsIncorporated ProductFolderLinks:SN74LV4051A

SN74LV4051A www.ti.com SCLS428I–MAY1999–REVISEDSEPTEMBER2015 6.4 Thermal Information SN74LV4051A THERMALMETRIC(1) N(PDIP) PW(TSSOP) UNIT 16PINS 16PINS R Junction-to-ambientthermalresistance 54.8 111.3 °C/W θJA R Junction-to-case(top)thermalresistance 42.1 45.3 °C/W θJC(top) R Junction-to-boardthermalresistance 34.8 56.9 °C/W θJB ψ Junction-to-topcharacterizationparameter 26.9 5.4 °C/W JT ψ Junction-to-boardcharacterizationparameter 34.7 56.3 °C/W JB (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheSemiconductorandICPackageThermalMetricsapplication report,SPRA953. 6.5 Electrical Characteristics overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted) PARAMETER TESTCONDITIONS V MIN TYP MAX UNIT CC T =25°C 38 180 A 2.3V T =–40°Cto85°C 225 A I =2mA, T r ON-state VI=VCCorGND, TA=25°C 3V 30 150 Ω on switchresistance VINH=VIL TA=–40°Cto85°C 190 (seeFigure2) T =25°C 22 75 A 4.5V T =–40°Cto85°C 100 A T =25°C 113 500 A 2.3V T =–40°Cto85°C 600 A PeakON-state IT=2mA, TA=25°C 54 180 r V =V toGND, 3V Ω on(p) resistance VIINH=CVCIL TA=–40°Cto85°C 225 T =25°C 31 100 A 4.5V T =–40°Cto85°C 125 A T =25°C 2.1 30 A 2.3V T =–40°Cto85°C 40 A Differencein IT=2mA, TA=25°C 1.4 20 Δr ON-stateresistance V =V toGND, 3V Ω on I CC betweenswitches VINH=VIL TA=–40°Cto85°C 30 T =25°C 1.3 15 A 4.5V T =–40°Cto85°C 20 A TA=25°C 0to ±0.1 I Controlinputcurrent V =5.5VorGND μA I I T =–40°Cto85°C 5.5V ±1 A V =V and T =25°C ±0.1 I CC A V =GND,or O OFF-stateswitch V =GNDand I I 5.5V μA S(off) leakagecurrent VO=VCC, TA=–40°Cto85°C ±1 V =V INH IH (seeFigure3) V =V orGND, T =25°C ±0.1 ON-stateswitchleakage I CC A I V =V 5.5V μA S(on) current (sIeNeHFiguILre4) TA=–40°Cto85°C ±1 I Supplycurrent V =V orGND T =–40°Cto85°C 5.5V 20 μA CC I CC A Controlinput C f=10MHz T =25°C 3.3V 2 pF IC capacitance A Commonterminal C T =25°C 3.3V 23.4 pF IS capacitance A Switchterminal C T =25°C 3.3V 5.7 pF OS capacitance A Feedthrough C T =25°C 3.3V 0.5 pF F capacitance A Copyright©1999–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:SN74LV4051A

SN74LV4051A SCLS428I–MAY1999–REVISEDSEPTEMBER2015 www.ti.com 6.6 Operating Characteristics V =3.3V,T =25°C CC A PARAMETER TESTCONDITIONS TYP UNIT C Powerdissipationcapacitance C =50pF, f=10MHz 5.9 pF pd L 6.7 Switching Characteristics: V = 2.5 V ± 0.2 V CC overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted) FROM TO TEST PARAMETER MIN TYP MAX UNIT (INPUT) (OUTPUT) CONDITIONS tPLH Propagation COMorYn YnorCOM CL=15pF TA=25°C 1.9 10 ns tPHL delaytime (seeFigure5) TA=–40°Cto85°C 16 tPZH Enable INH COMorYn CL=15pF TA=25°C 6.6 18 ns tPZL delaytime (seeFigure6) TA=–40°Cto85°C 23 tPHZ Disable INH COMorYn CL=15pF TA=25°C 7.4 18 ns tPLZ delaytime (seeFigure6) TA=–40°Cto85°C 23 tPLH Propagation COMorYn YnorCOM CL=50pF TA=25°C 3.8 12 ns tPHL delaytime (seeFigure6) TA=–40°Cto85°C 18 tPZH Enable INH COMorYn CL=50pF TA=25°C 7.8 28 ns tPZL delaytime (seeFigure6) TA=–40°Cto85°C 35 tPHZ Disable INH COMorYn CL=50pF TA=25°C 11.5 28 ns tPLZ delaytime (seeFigure6) TA=–40°Cto85°C 35 6.8 Switching Characteristics: V = 3.3 V ± 0.3 V CC overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted) FROM TO TEST PARAMETER MIN TYP MAX UNIT (INPUT) (OUTPUT) CONDITIONS tPLH Propagation COMorYn YnorCOM CL=15pF TA=25°C 1.2 6 ns tPHL delaytime (seeFigure5) TA=–40°Cto85°C 10 tPZH Enable INH COMorYn CL=15pF TA=25°C 4.7 12 ns tPZL delaytime (seeFigure6) TA=–40°Cto85°C 15 tPHZ Disable INH COMorYn CL=15pF TA=25°C 5.7 12 ns tPLZ delaytime (seeFigure6) TA=–40°Cto85°C 15 tPLH Propagation COMorYn YnorCOM CL=50pF TA=25°C 2.5 9 ns tPHL delaytime (seeFigure5) TA=–40°Cto85°C 12 tPZH Enable INH COMorYn CL=50pF TA=25°C 5.5 20 ns tPZL delaytime (seeFigure6) TA=–40°Cto85°C 25 tPHZ Disable INH COMorYn CL=50pF TA=25°C 8.8 20 ns tPLZ delaytime (seeFigure6) TA=–40°Cto85°C 25 6 SubmitDocumentationFeedback Copyright©1999–2015,TexasInstrumentsIncorporated ProductFolderLinks:SN74LV4051A

SN74LV4051A www.ti.com SCLS428I–MAY1999–REVISEDSEPTEMBER2015 6.9 Switching Characteristics: V = 5 V ± 0.5 V CC overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted) FROM TO TEST PARAMETER MIN TYP MAX UNIT (INPUT) (OUTPUT) CONDITIONS tPLH Propagation COMorYn YnorCOM CL=15pF TA=25°C 0.6 4 ns tPHL delaytime (seeFigure5) TA=–40°Cto85°C 7 tPZH Enable INH COMorYn CL=15pF TA=25°C 3.5 8 ns tPZL delaytime (seeFigure6) TA=–40°Cto85°C 10 tPHZ Disable INH COMorYn CL=15pF TA=25°C 4.4 8 ns tPLZ delaytime (seeFigure6) TA=–40°Cto85°C 10 tPLH Propagation COMorYn YnorCOM CL=50pF TA=25°C 1.5 6 ns tPHL delaytime (seeFigure5) TA=–40°Cto85°C 8 tPZH Enable INH COMorYn CL=50pF TA=25°C 4 14 ns tPZL delaytime (seeFigure6) TA=–40°Cto85°C 18 tPHZ Disable INH COMorYn CL=50pF TA=25°C 6.2 14 ns tPLZ delaytime (seeFigure6) TA=–40°Cto85°C 18 6.10 Analog Switch Characteristics overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted),T =25°C A FROM TO TEST PARAMETER V MIN TYP MAX UNIT (INPUT) (OUTPUT) CONDITIONS CC C =50pF, 2.3V 20 L Frequencyresponse R =600Ω, COMorYn YnorCOM L 3V 25 MHz (switchon) f =1MHz(sinewave) in (see(1)andFigure7) 4.5V 35 C =50pF, 2.3V 20 L Crosstalk R =600Ω, INH COMorYn L 3V 35 mV (controlinputtosignaloutput) f =1MHz(squarewave) in (seeFigure8) 4.5V 60 C =50pF, 2.3V –45 L Feedthroughattenuation R =600Ω, COMorYn YnorCOM L 3V –45 dB (switchoff) f =1MHz in (see(2)andFigure9) 4.5V –45 C =50pF, V =2V 2.3V 0.1% L I p-p R =10kΩ, L V =2.5V 3V 0.1% Sine-wavedistortion COMorYn YnorCOM f =1kHz I p-p in (sinewave) V =4V 4.5V 0.1% (seeFigure10) I p-p (1) Adjustf voltagetoobtain0-dBmoutput.Increasef frequencyuntildBmeterreads–3dB. in in (2) Adjustf voltagetoobtain0-dBminput. in Copyright©1999–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:SN74LV4051A

SN74LV4051A SCLS428I–MAY1999–REVISEDSEPTEMBER2015 www.ti.com 6.11 Typical Characteristics 200 T =25o C A 160 R on 120 MAX (Ohm) 80 40 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 V (V) cc Figure1.Plotat25°CforV vsMaxR CC ON 8 SubmitDocumentationFeedback Copyright©1999–2015,TexasInstrumentsIncorporated ProductFolderLinks:SN74LV4051A

SN74LV4051A www.ti.com SCLS428I–MAY1999–REVISEDSEPTEMBER2015 7 Parameter Measurement Information VCC VINH=VIL VCC VI=VCCorGND (ON) VO GND V –V r = I O Ω on 2 ˣ 10–3 2 mA V VI−VO Figure2. On-StateResistanceTestCircuit VCC VINH=VIH VCC VI A (OFF) VO GND Condition 1: VI= 0, VO=VCC Condition 2: VI=VCC, VO= 0 Figure3. Off-StateSwitchLeakage-CurrentTestCircuit VCC VINH=VIL VCC VI A (ON) Open GND VI=VCCor GND Figure4. On-StateSwitchLeakage-CurrentTestCircuit VCC VINH=VIL VCC Input (ON) Output 50Ω GND CL Figure5. PropagationDelayTime,SignalInputtoSignalOutput Copyright©1999–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:SN74LV4051A

SN74LV4051A SCLS428I–MAY1999–REVISEDSEPTEMBER2015 www.ti.com Parameter Measurement Information (continued) VCC TEST S1 S2 50Ω VINH tPLZ/tPZL GND VCC tPHZ/tPZH VCC GND VCC 1 kΩ VI VO S1 S2 GND CL TESTCIRCUIT VCC VCC VINH 50% 50% 0 V 0 V tPZL tPZH ≈VCC VOH VO 50% 50% VOL ≈0 V (tPZL, tPZH) VCC VCC VINH 50% 50% 0 V 0 V tPLZ tPHZ VO ≈VVCOCL VOL+ 0.3 V V≈O0H V VOH–0.3 V (tPLZ, tPHZ) VOLTAGEWAVEFORMS Figure6. SwitchingTime(t ,t ,t ,t ),ControltoSignalOutput PZL PLZ PZH PHZ V CC V = GND INH 0.1µF V V CC fin(1) I (ON) VO GND 50Ω RL CL V CC (1) f isasinewave. in Figure7. FrequencyResponse(SwitchOn) 10 SubmitDocumentationFeedback Copyright©1999–2015,TexasInstrumentsIncorporated ProductFolderLinks:SN74LV4051A

SN74LV4051A www.ti.com SCLS428I–MAY1999–REVISEDSEPTEMBER2015 Parameter Measurement Information (continued) V CC V INH 50Ω V CC V O GND R C 600Ω L L V /2 V /2 CC CC Figure8. Crosstalk(ControlInput,SwitchOutput) V CC V =V INH CC 0.1µF V V CC fin I (OFF) VO GND 50Ω 600Ω RL CL V /2 V /2 CC CC Figure9. FeedthroughAttenuation(SwitchOff) V CC V = GND INH 10µF V 10µF CC fin (ON) VO GND 600Ω RL CL V /2 CC Figure10. Sine-WaveDistortion Copyright©1999–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:SN74LV4051A

SN74LV4051A SCLS428I–MAY1999–REVISEDSEPTEMBER2015 www.ti.com 8 Detailed Description 8.1 Overview The SN74LV4051A device is an 8-channel analog multiplexer. A multiplexer is used when several signals must share the same device or resource. This device allows for the selection of one of these signals at a time for analysisorpropagation. 8.2 Functional Block Diagram 8.3 Feature Description TheSN74LV4051Adevicecontainsone8-channelmultiplexerforuseinavarietyofapplicationsandcanalsobe configured as demultiplexer by using the COM pin as an input and the Yn pins as outputs. This device is qualifiedtooperateinthetemperaturerange –40°Cto+85°C(maximumdependsonpackagetype). 8.4 Device Functional Modes Table1.FunctionTable INPUTS ON INH C B A CHANNEL L L L L Y0 L L L H Y1 L L H L Y2 L L H H Y3 L H L L Y4 L H L H Y5 L H H L Y6 L H H H Y7 H X X X None 12 SubmitDocumentationFeedback Copyright©1999–2015,TexasInstrumentsIncorporated ProductFolderLinks:SN74LV4051A

SN74LV4051A www.ti.com SCLS428I–MAY1999–REVISEDSEPTEMBER2015 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validateandtesttheirdesignimplementationtoconfirmsystemfunctionality. 9.1 Application Information A multiplexer is used in applications where multiple signals share a resource. In Figure 11, several different sensorsareconnectedtotheanalog-to-digitalconverter(ADC)ofamicrocontrollerunit(MCU). 9.2 Typical Application Figure11. ExampleofMultiplexerUseWithAnalogSensorsandtheADCofanMCU 9.2.1 DesignRequirements Designing with the SN74LV4051A device requires a stable input voltage between 2 V (see Recommended Operating Conditions for details) and 5.5 V. Another important design consideration are the characteristics of the signalbeingmultiplexed—ensurenoimportantinformationislostduetotimingorincompatibilitywiththisdevice. 9.2.2 DetailedDesignProcedure Normally, processing eight different analog signals requires eight separate ADCs, but Figure 11 shows how to achievethisusingonlyoneADCandfourGPIOs(general-purposeinput/outputs). Copyright©1999–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:SN74LV4051A

SN74LV4051A SCLS428I–MAY1999–REVISEDSEPTEMBER2015 www.ti.com Typical Application (continued) 9.2.3 ApplicationCurve 500 T =25o C A 400 R on 300 Peak MAX (Ohm)200 100 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 V (V) cc Figure12.Plotat25°CforV vsMaxR CC ON(peak) 14 SubmitDocumentationFeedback Copyright©1999–2015,TexasInstrumentsIncorporated ProductFolderLinks:SN74LV4051A

SN74LV4051A www.ti.com SCLS428I–MAY1999–REVISEDSEPTEMBER2015 10 Power Supply Recommendations Most systems have a common 3.3-V or 5-V rail that can supply the V pin of this device. If this rail is not CC available, a switched-mode power supply (SMPS) or a low dropout regulator (LDO) can supply this device from a higher-voltagerail. 11 Layout 11.1 Layout Guidelines TI recommends keeping the signal lines as short and as straight as possible (see Figure 13). Incorporation of microstrip or stripline techniques are also recommended when signal lines are more than 1" long. These traces must be designed with a characteristic impedance of either 50-Ω or 75-Ω as required by the application. Do not placethisdevicetooclosetohigh-voltageswitchingcomponentsbecausetheymaycauseinterference. 11.2 Layout Example Figure13. LayoutSchematic Copyright©1999–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 15 ProductFolderLinks:SN74LV4051A

SN74LV4051A SCLS428I–MAY1999–REVISEDSEPTEMBER2015 www.ti.com 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 RelatedDocumentation Forrelateddocumentation,seethefollowing: ImplicationsofSloworFloatingCMOSInputs,SCBA004 12.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TIE2E™OnlineCommunity TI'sEngineer-to-Engineer(E2E)Community.Createdtofostercollaboration amongengineers.Ate2e.ti.com,youcanaskquestions,shareknowledge,exploreideasandhelp solveproblemswithfellowengineers. DesignSupport TI'sDesignSupport QuicklyfindhelpfulE2Eforumsalongwithdesignsupporttoolsand contactinformationfortechnicalsupport. 12.3 Trademarks E2EisatrademarkofTexasInstruments. Allothertrademarksarethepropertyoftheirrespectiveowners. 12.4 Electrostatic Discharge Caution Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. 12.5 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronyms,anddefinitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowser-basedversionsofthisdatasheet,refertotheleft-handnavigation. 16 SubmitDocumentationFeedback Copyright©1999–2015,TexasInstrumentsIncorporated ProductFolderLinks:SN74LV4051A

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) SN74LV4051AD ACTIVE SOIC D 16 40 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 LV4051A & no Sb/Br) SN74LV4051ADBR ACTIVE SSOP DB 16 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 LW051A & no Sb/Br) SN74LV4051ADGVR ACTIVE TVSOP DGV 16 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 LW051A & no Sb/Br) SN74LV4051ADGVRG4 ACTIVE TVSOP DGV 16 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 LW051A & no Sb/Br) SN74LV4051ADR ACTIVE SOIC D 16 2500 Green (RoHS NIPDAU | SN Level-1-260C-UNLIM -40 to 85 LV4051A & no Sb/Br) SN74LV4051AN ACTIVE PDIP N 16 25 Green (RoHS NIPDAU N / A for Pkg Type -40 to 85 SN74LV4051AN & no Sb/Br) SN74LV4051ANSR ACTIVE SO NS 16 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 74LV4051A & no Sb/Br) SN74LV4051APW ACTIVE TSSOP PW 16 90 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 LW051A & no Sb/Br) SN74LV4051APWG4 ACTIVE TSSOP PW 16 90 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 LW051A & no Sb/Br) SN74LV4051APWR ACTIVE TSSOP PW 16 2000 Green (RoHS NIPDAU | SN Level-1-260C-UNLIM -40 to 85 LW051A & no Sb/Br) SN74LV4051APWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 LW051A & no Sb/Br) SN74LV4051APWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 LW051A & no Sb/Br) SN74LV4051APWT ACTIVE TSSOP PW 16 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 LW051A & no Sb/Br) SN74LV4051ARGYR ACTIVE VQFN RGY 16 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 LW051A & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN74LV4051A : •Automotive: SN74LV4051A-Q1 •Enhanced Product: SN74LV4051A-EP NOTE: Qualified Version Definitions: •Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects •Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 16-Oct-2019 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) SN74LV4051ADGVR TVSOP DGV 16 2000 330.0 12.4 6.8 4.0 1.6 8.0 12.0 Q1 SN74LV4051ADR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 SN74LV4051ADR SOIC D 16 2500 330.0 16.8 6.5 10.3 2.1 8.0 16.0 Q1 SN74LV4051ANSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74LV4051APWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74LV4051APWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74LV4051APWRG4 TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74LV4051APWT TSSOP PW 16 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74LV4051ARGYR VQFN RGY 16 3000 330.0 12.4 3.8 4.3 1.5 8.0 12.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 16-Oct-2019 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) SN74LV4051ADGVR TVSOP DGV 16 2000 367.0 367.0 35.0 SN74LV4051ADR SOIC D 16 2500 333.2 345.9 28.6 SN74LV4051ADR SOIC D 16 2500 364.0 364.0 27.0 SN74LV4051ANSR SO NS 16 2000 367.0 367.0 38.0 SN74LV4051APWR TSSOP PW 16 2000 367.0 367.0 35.0 SN74LV4051APWR TSSOP PW 16 2000 364.0 364.0 27.0 SN74LV4051APWRG4 TSSOP PW 16 2000 367.0 367.0 35.0 SN74LV4051APWT TSSOP PW 16 250 367.0 367.0 35.0 SN74LV4051ARGYR VQFN RGY 16 3000 367.0 367.0 35.0 PackMaterials-Page2

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MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,23 0,40 0,07 M 0,13 24 13 0,16 NOM 4,50 6,60 4,30 6,20 Gage Plane 0,25 0°–(cid:1)8° 0,75 1 12 0,50 A Seating Plane 0,15 1,20 MAX 0,08 0,05 PINS ** 14 16 20 24 38 48 56 DIM A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 4073251/E 08/00 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. D. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265

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PACKAGE OUTLINE PW0016A TSSOP - 1.2 mm max height SCALE 2.500 SMALL OUTLINE PACKAGE SEATING PLANE C 6.6 TYP 6.2 A 0.1 C PIN 1 INDEX AREA 14X 0.65 16 1 2X 5.1 4.55 4.9 NOTE 3 8 9 0.30 B 4.5 16X 0.19 1.2 MAX 4.3 0.1 C A B NOTE 4 (0.15) TYP SEE DETAIL A 0.25 GAGE PLANE 0.15 0.05 0.75 0.50 0 -8 DETA 20AIL A TYPICAL 4220204/A 02/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-153. www.ti.com

EXAMPLE BOARD LAYOUT PW0016A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE 16X (1.5) SYMM (R0.05) TYP 1 16X (0.45) 16 SYMM 14X (0.65) 8 9 (5.8) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SOLDER MASK METAL UNDER SOLDER MASK OPENING METAL SOLDER MASK OPENING EXPOSED METAL EXPOSED METAL 0.05 MAX 0.05 MIN ALL AROUND ALL AROUND NON-SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDE15.000R MASK DETAILS 4220204/A 02/2017 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN PW0016A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE 16X (1.5) SYMM (R0.05) TYP 1 16X (0.45) 16 SYMM 14X (0.65) 8 9 (5.8) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 10X 4220204/A 02/2017 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,65 0,15 M 0,22 28 15 0,25 0,09 5,60 8,20 5,00 7,40 Gage Plane 1 14 0,25 A 0°–(cid:1)8° 0,95 0,55 Seating Plane 2,00 MAX 0,05 MIN 0,10 PINS ** 14 16 20 24 28 30 38 DIM A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 4040065/E 12/01 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265

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