SN74ALVC16244A 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCAS250O–JANUARY1993–REVISEDOCTOBER2005 FEATURES DGG OR DL PACKAGE • MemberoftheTexasInstrumentsWidebus™ (TOP VIEW) Family • OperatesFrom1.65Vto3.6V 1OE 1 48 2OE • Maxt of3nsat3.3V 1Y1 2 47 1A1 pd • – 24-mAOutputDriveat3.3V 1Y2 3 46 1A2 GND 4 45 GND • Latch-UpPerformanceExceeds250mAPer 1Y3 5 44 1A3 JESD17 1Y4 6 43 1A4 • ESDProtectionExceedsJESD22 V 7 42 V CC CC – 2000-VHuman-BodyModel(A114-A) 2Y1 8 41 2A1 – 200-VMachineModel(A115-A) 2Y2 9 40 2A2 – 1000-VCharged-DeviceModel(C101) GND 10 39 GND 2Y3 11 38 2A3 DESCRIPTION/ORDERING INFORMATION 2Y4 12 37 2A4 3Y1 13 36 3A1 This 16-bit buffer/driver is designed for 1.65-V to 3Y2 14 35 3A2 3.6-VV operation. CC GND 15 34 GND The SN74ALVC16244A is designed specifically to 3Y3 16 33 3A3 improve the performance and density of 3-state 3Y4 17 32 3A4 memory-address drivers, clock drivers, and V 18 31 V CC CC bus-orientedreceiversandtransmitters. 4Y1 19 30 4A1 The device can be used as four 4-bit buffers, two 4Y2 20 29 4A2 8-bit buffers, or one 16-bit buffer. It provides true GND 21 28 GND outputs and symmetrical active-low output-enable 4Y3 22 27 4A3 (OE)inputs. 4Y4 23 26 4A4 To ensure the high-impedance state during power up 4OE 24 25 3OE or power down, OE should be tied to V through a CC pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. ORDERINGINFORMATION T PACKAGE(1) ORDERABLEPARTNUMBER TOP-SIDEMARKING A FBGA–GRD SN74ALVC16244AGRDR Tapeandreel VC244A FBGA–ZRD(Pb-free) SN74ALVC16244AZRDR Tube SN74ALVC16244ADL SSOP–DL ALVC16244A Tapeandreel SN74ALVC16244ADLR –40(cid:176) Cto85(cid:176) C SN74ALVC16244ADGGR TSSOP–DGG Tapeandreel ALVC16244A SN74ALVC16244ADGGRE4 VFBGA–GQL SN74ALVC16244AGQLR Tapeandreel VC244A VFBGA–ZQL(Pb-free) SN74ALVC16244AZQLR (1) Packagedrawings,standardpackingquantities,thermaldata,symbolization,andPCBdesignguidelinesareavailableat www.ti.com/sc/package. Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsofTexas Instrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet. WidebusisatrademarkofTexasInstruments. PRODUCTIONDATAinformationiscurrentasofpublicationdate. Copyright©1993–2005,TexasInstrumentsIncorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarilyincludetestingofallparameters.

SN74ALVC16244A 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCAS250O–JANUARY1993–REVISEDOCTOBER2005 GQL OR ZQL PACKAGE TERMINALASSIGNMENTS(1) (TOP VIEW) (56-BallGQL/ZQLPackage) 1 2 3 4 5 6 1 2 3 4 5 6 A A 1OE NC NC NC NC 2OE B B 1Y2 1Y1 GND GND 1A1 1A2 C C 1Y4 1Y3 V V 1A3 1A4 D CC CC E D 2Y2 2Y1 GND GND 2A1 2A2 F E 2Y4 2Y3 2A3 2A4 G F 3Y1 3Y2 3A2 3A1 H J G 3Y3 3Y4 GND GND 3A4 3A3 K H 4Y1 4Y2 V V 4A2 4A1 CC CC J 4Y3 4Y4 GND GND 4A4 4A3 K 4OE NC NC NC NC 3OE ABC (1) NC–Nointernalconnection ABC GRD OR ZRD PACKAGE TERMINALASSIGNMENTS(1) (TOP VIEW) (54-BallGRD/ZRDPackage) 1 2 3 4 5 6 1 2 3 4 5 6 A A 1Y1 NC 1OE 2OE NC 1A1 B 1Y3 1Y2 NC NC 1A2 1A3 B C 2Y1 1Y4 V V 1A4 2A1 CC CC C D 2Y3 2Y2 GND GND 2A2 2A3 D E 3Y1 2Y4 GND GND 2A4 3A1 E F 3Y3 3Y2 GND GND 3A2 3A3 G 4Y1 3Y4 V V 3A4 4A1 F CC CC H 4Y3 4Y2 NC NC 4A2 4A3 G J 4Y4 NC 4OE 3OE NC 4A4 H J (1) NC–Nointernalconnection xxxxx FUNCTIONTABLE (EACH4-BITBUFFER) INPUTS OUTPUT Y OE A L H H L L L H X Z 2

SN74ALVC16244A 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCAS250O–JANUARY1993–REVISEDOCTOBER2005 LOGICDIAGRAM(POSITIVELOGIC) 1 25 1OE 3OE 47 2 36 13 1A1 1Y1 3A1 3Y1 46 3 35 14 1A2 1Y2 3A2 3Y2 44 5 33 16 1A3 1Y3 3A3 3Y3 43 6 32 17 1A4 1Y4 3A4 3Y4 48 24 2OE 4OE 41 8 30 19 2A1 2Y1 4A1 4Y1 40 9 29 20 2A2 2Y2 4A2 4Y2 38 11 27 22 2A3 2Y3 4A3 4Y3 37 12 26 23 2A4 2Y4 4A4 4Y4 Pin numbers shown are for the DGG and DL packages. Absolute Maximum Ratings(1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT V Supplyvoltagerange –0.5 4.6 V CC V Inputvoltagerange(2) ControlInputs(3) –0.5 V +0.5 V I CC DataInputs -0.5 4.6 V Outputvoltagerange(2)(3) –0.5 V +0.5 V O CC I Inputclampcurrent V <0 –50 mA IK I I Outputclampcurrent V <0 –50 mA OK O I Continuousoutputcurrent – 50 mA O ContinuouscurrentthrougheachV orGND – 100 mA CC DGGpackage 70 DLpackage 63 q Packagethermalimpedance(4) (cid:176) C/W JA GQL/ZQLpackage 42 GRD/ZRDpackage 36 T Storagetemperaturerange –65 150 (cid:176) C stg (1) Stressesbeyondthoselistedunder"absolutemaximumratings"maycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunder"recommendedoperating conditions"isnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) Theinputnegative-voltageandoutputvoltageratingsmaybeexceedediftheinputandoutputcurrentratingsareobserved. (3) Thisvalueislimitedto4.6Vmaximum. (4) ThepackagethermalimpedanceiscalculatedinaccordancewithJESD51-7. 3

SN74ALVC16244A 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCAS250O–JANUARY1993–REVISEDOCTOBER2005 Recommended Operating Conditions(1) MIN MAX UNIT V Supplyvoltage 1.65 3.6 V CC V =1.65Vto1.95V 0.65· V CC CC V High-levelinputvoltage V =2.3Vto2.7V 1.7 V IH CC V =2.7Vto3.6V 2 CC V =1.65Vto1.95V 0.35· V CC CC V Low-levelinputvoltage V =2.3Vto2.7V 0.7 V IL CC V =2.7Vto3.6V 0.8 CC ControlInputs 0 V CC V Inputvoltage V I DataInputs 0 3.6 V Outputvoltage 0 V V O CC V =1.65V –4 CC V =2.3V –12 CC I High-leveloutputcurrent mA OH V =2.7V –12 CC V =3V –24 CC V =1.65V 4 CC V =2.3V 12 CC I Low-leveloutputcurrent mA OL V =2.7V 12 CC V =3V 24 CC D t/D v Inputtransitionriseorfallrate 10 ns/V T Operatingfree-airtemperature –40 85 (cid:176) C A (1) AllunusedinputsofthedevicemustbeheldatV orGNDtoensureproperdeviceoperation.RefertotheTIapplicationreport, CC ImplicationsofSloworFloatingCMOSInputs,literaturenumberSCBA004. Electrical Characteristics overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted) PARAMETER TESTCONDITIONS V MIN TYP(1) MAX UNIT CC I =–100m A 1.65Vto3.6V V –0.2 OH CC I =–4mA 1.65V 1.2 OH I =–6mA 2.3V 2 OH V 2.3V 1.7 V OH I =–12mA 2.7V 2.2 OH 3V 2.4 I =–24mA 3V 2 OH I =100m A 1.65Vto3.6V 0.2 OL I =4mA 1.65V 0.45 OL I =6mA 2.3V 0.4 OL V V OL 2.3V 0.7 I =12mA OL 2.7V 0.4 I =24mA 3V 0.55 OL I V =V orGND 3.6V – 5 m A I I CC I V =V orGND 3.6V – 10 m A OZ O CC I V =V orGND, I =0 3.6V 40 m A CC I CC O D I OneinputatV –0.6V, OtherinputsatVCCor 3Vto3.6V 750 m A CC CC GND Controlinputs 3 C V =V orGND 3.3V pF i I CC Datainputs 6 (1) AlltypicalvaluesareatV =3.3V,T =25°C. CC A 4

SN74ALVC16244A 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCAS250O–JANUARY1993–REVISEDOCTOBER2005 Electrical Characteristics (continued) overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted) PARAMETER TESTCONDITIONS V MIN TYP(1) MAX UNIT CC C Outputs V =V orGND 3.3V 7 pF o O CC Switching Characteristics overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted)(seeFigure1) V =2.5V V =3.3V PARAMETER FROM TO VCC=1.8V C–C0.2V VCC=2.7V C–C0.3V UNIT (INPUT) (OUTPUT) TYP MIN MAX MIN MAX MIN MAX t A Y (1) 1 3.7 3.6 1 3 ns pd t OE Y (1) 1 5.7 5.4 1 4.4 ns en t OE Y (1) 1 5.2 4.6 1 4.1 ns dis (1) Thisinformationwasnotavailableatthetimeofpublication. Operating Characteristics T =25(cid:176) C A TEST VCC=1.8V VCC=2.5V VCC=3.3V PARAMETER UNIT CONDITIONS TYP TYP TYP Powerdissipation Outputsenabled (1) 16 19 C C =50pF,f=10MHz pF pd capacitance Outputsdisabled L (1) 4 5 (1) Thisinformationwasnotavailableatthetimeofpublication. 5

SN74ALVC16244A 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCAS250O–JANUARY1993–REVISEDOCTOBER2005 PARAMETER MEASUREMENT INFORMATION VLOAD From Output RL S1 Open TEST S1 Under Test GND tpd Open (see Note CAL) RL ttPPHLZZ//ttPPZZLH VGLNOADD LOAD CIRCUIT INPUT VCC VM VLOAD CL RL VD VI tr/tf 1.8 V VCC ≤2 ns VCC/2 2 × VCC 30 pF 1 kW 0.15 V 2.5 V ± 0.2 V VCC ≤2 ns VCC/2 2 × VCC 30 pF 500 W 0.15 V 2.7 V 2.7 V ≤2.5 ns 1.5 V 6 V 50 pF 500 W 0.3 V 3.3 V ± 0.3 V 2.7 V ≤2.5 ns 1.5 V 6 V 50 pF 500 W 0.3 V tw VI Timing VI Input VM VM Input VM 0 V 0 V VOLTAGE WAVEFORMS PULSE DURATION tsu th IDnpautat VM VM VI COounttpruotl VI 0 V (low-level VM VM enabling) 0 V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES tPZL tPLZ Output VI Waveform 1 VLOAD/2 Input VM VM S1 at VLOAD VM VOL + VD 0 V (see Note B) VOL tPLH tPHL tPZH tPHZ Output VM VM VOH WSa1v eaOfto uGrtmpNu D2t VM VOH − VD VOH VOL (see Note B) 0 V VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 W . D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure1.LoadCircuitandVoltageWaveforms 6

PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2018 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) SN74ALVC16244ADGGR ACTIVE TSSOP DGG 48 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 ALVC16244A & no Sb/Br) SN74ALVC16244ADL ACTIVE SSOP DL 48 25 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 ALVC16244A & no Sb/Br) SN74ALVC16244ADLR ACTIVE SSOP DL 48 1000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 ALVC16244A & no Sb/Br) SN74ALVC16244AZQLR ACTIVE BGA ZQL 56 1000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 85 VC244A MICROSTAR & no Sb/Br) JUNIOR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2018 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 12-Feb-2019 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) SN74ALVC16244ADGGR TSSOP DGG 48 2000 330.0 24.4 8.6 13.0 1.8 12.0 24.0 Q1 SN74ALVC16244ADLR SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1 SN74ALVC16244AZQLR BGAMI ZQL 56 1000 330.0 16.4 4.8 7.3 1.5 8.0 16.0 Q1 CROSTA RJUNI OR PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 12-Feb-2019 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) SN74ALVC16244ADGGR TSSOP DGG 48 2000 367.0 367.0 45.0 SN74ALVC16244ADLR SSOP DL 48 1000 367.0 367.0 55.0 SN74ALVC16244AZQLR BGAMICROSTAR ZQL 56 1000 350.0 350.0 43.0 JUNIOR PackMaterials-Page2

MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,50 0,08 M 0,17 48 25 6,20 8,30 6,00 7,90 0,15 NOM Gage Plane 0,25 1 24 0°–8° A 0,75 0,50 Seating Plane 0,15 1,20 MAX 0,10 0,05 PINS ** 48 56 64 DIM A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 4040078/F 12/97 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold protrusion not to exceed 0,15. D. Falls within JEDEC MO-153 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265

PACKAGE OUTLINE ZQL0056A JRBGA - 1 mm max height SCALE 2.100 PLASTIC BALL GRID ARRAY 4.6 B A 4.4 BALL A1 CORNER 7.1 6.9 1 MAX C SEATING PLANE 0.35 0.15 TYP BALL TYP 0.1 C 3.25 TYP SYMM (0.625) TYP K J (0.575) TYP H G 5.85 F SYMM TYP E D C 0.45 56X NOTE 3 0.35 B 0.15 C B A 0.08 C A 0.65 TYP 1 2 3 4 5 6 BALL A1 CORNER 0.65 TYP 4219711/B 01/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. No metal in this area, indicates orientation. www.ti.com

EXAMPLE BOARD LAYOUT ZQL0056A JRBGA - 1 mm max height PLASTIC BALL GRID ARRAY (0.65) TYP 56X ( 0.33) 1 2 3 4 5 6 A (0.65) TYP B C D E SYMM F G H J K SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK 0.05 MAX 0.05 MIN METAL UNDER OPENING SOLDER MASK EXPOSED METAL ( 0.33) ( 0.33) METAL EXPOSED METAL SOLDER MASK OPENING NON-SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS NOT TO SCALE 4219711/B 01/2017 NOTES: (continued) 4. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For information, see Texas Instruments literature number SPRAA99 (www.ti.com/lit/spraa99). www.ti.com

EXAMPLE STENCIL DESIGN ZQL0056A JRBGA - 1 mm max height PLASTIC BALL GRID ARRAY 56X ( 0.33) (0.65) TYP 1 2 3 4 5 6 A (0.65) TYP B C D E SYMM F G H J K SYMM SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4219711/B 01/2017 NOTES: (continued) 5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. www.ti.com

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