SMF05C TVS Diode Array For ESD and Latch-Up Protection PROTECTION PRODUCTS PRELIMINARY Description Features The SMF series TVS arrays are designed to protect sen- (cid:139) ESD protection for data lines to sitive electronics from damage or latch-up due to ESD IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) and other voltage-induced transient events. They are IEC 61000-4-4 (EFT) 40A (5/50ns) designed for use in applications where board space is at (cid:139) Small package for use in portable electronics a premium. Each device will protect up to five lines. They (cid:139) Protects five I/O lines are unidirectional devices and may be used on lines where (cid:139) Working voltage: 5V the signal polarities are above ground. (cid:139) Low leakage current TVS diodes are solid-state devices designed specifically (cid:139) Low operating and clamping voltages for transient suppression. They feature large cross-sec- (cid:139) Solid-state silicon-avalanche technology tional area junctions for conducting high transient cur- rents. They offer desirable characteristics for board level Mechanical Characteristics protection including fast response time, low operating (cid:139) EIAJ SC70-6L package and clamping voltage, and no device degradation. (cid:139) Molding compound flammability rating: UL 94V-0 The SMF series devices may be used to meet the immu- (cid:139) Marking : Marking Code nity requirements of IEC 61000-4-2, level 4. The small (cid:139) Packaging : Tape and Reel per EIA 481 SC70 package makes them ideal for use in portable elec- tronics such as cell phones, PDA’s, notebook comput- Applications ers, and digital cameras. (cid:139) Cellular Handsets and Accessories (cid:139) Cordless Phones (cid:139) Personal Digital Assistants (PDA’s) (cid:139) Notebooks and Handhelds (cid:139) Portable Instrumentation (cid:139) Digital Cameras (cid:139) Peripherals (cid:139) MP3 Players Circuit Diagram Schematic & PIN Configuration 1 3 4 5 6 1 6 2 5 3 4 2 SC70-6L (Top View) Revision 08/04/04 1 www.semtech.com

SMF05C PROTECTION PRODUCTS PRELIMINARY Absolute Maximum Rating Rating Symbol Value Units PeakPulsePower(tp =8/20µs) P 100 Watts pk PeakPulseCurrent (tp =8/20µs) I 8 A PP ESDperIEC61000-4-2(Air) 20 V kV ESDperIEC61000-4-2(Contact) ESD 15 Lead Soldering Temperature T 260(10seconds) oC L Operating Temperature T -55to+125 oC J StorageTemperature T -55to+150 oC STG Electrical Characteristics SMF05C Parameter Symbol Conditions Minimum Typical Maximum Units ReverseStand-Off Voltage V 5 V RWM ReverseBreakdown Voltage V I = 1mA 6 V BR t ReverseLeakageCurrent I V =5V, T=25°C 5 µA R RWM Clamping Voltage V I =5A, t =8/20µs 9.8 V C PP p Clamping Voltage V I =8A, t =8/20µs 12.5 V C PP p Junction Capacitance C V =0V, f =1MHz 130 pF j R  2004 Semtech Corp. 2 www.semtech.com

SMF05C PPRROOTTEECCTTIIOONN PPRROODDUUCCTTSS PRELIMINARY Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 10 110 100 W) 90 wer - P (kpk 1 Power or IPP 678000 Po d 50 ak Pulse 0.1 % of Rate 3400 Pe 20 10 0.01 0 0.1 1 10 100 1000 0 25 50 75 100 125 150 Pulse Duration - tp (µs) Ambient Temperature - TA (oC) Pulse Waveform Clamping Voltage vs. Peak Pulse Current 110 9 Waveform 100 Parameters: 8 90 tr = 8µs 80 td = 20µs V) 7 of IPP 6700 e-t e - V (C 6 nt ag 5 Perce 4500 td = IPP/2 ng Volt 4 30 pi 3 Waveform 20 Clam 2 Patrr a=m 8eµtesrs: 10 td = 20µs 1 0 0 5 10 15 20 25 30 0 Time (µs) 0 2 4 6 8 10 Peak Pulse Current - I (A) PP Capacitance vs. Reverse Voltage ESD Clamping Characteristics (8kV Contact Discharge per IEC 61000-4-2) 140 120 F) 100 p C (j e - 80 c n cita 60 a p a 40 C 20 f = 1MHz 0 0 1 2 3 4 5 6 Reverse Voltage - V (V) R  2004 Semtech Corp. 3 www.semtech.com

SMF05C PROTECTION PRODUCTS PRELIMINARY Applications Information Device Connection for Protection of Five Data Lines SMF05C Circuit Diagram The SMF05C is designed to protect up to five unidirec- tional data lines. The device is connected as follows: 1 3 4 5 6 1. Unidirectional protection of five I/O lines is achieved by connecting pins 1, 3, 4, 5 and 6 to the data lines. Pin 2 is connected to ground. The ground connection should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. Circuit Board Layout Recommendations for Suppres- sion of ESD. 2 Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are Protection of Five Unidirectional Lines recommended: (cid:122) Place the SMF05C near the input terminals or connectors to restrict transient coupling. (cid:122) Minimize the path length between the SMF05C and the protected line. (cid:122) Minimize all conductive loops including power and ground loops. (cid:122) The ESD transient return path to ground should be kept as short as possible. (cid:122) Never run critical signals near board edges. (cid:122) Use ground planes whenever possible. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small com- pared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint.  2004 Semtech Corp. 4 www.semtech.com

SMF05C PPRROOTTEECCTTIIOONN PPRROODDUUCCTTSS PRELIMINARY Typical Applications  2004 Semtech Corp. 5 www.semtech.com

SMF05C PROTECTION PRODUCTS PRELIMINARY Outline Drawing - SC70 6L A DIMENSIONS e1 D DIM INCHES MILLIMETERS MIN NOMMAX MIN NOMMAX N A - - .043 - - 1.10 A1 .000 - .004 0.00 - 0.10 2X E/2 SEE DETAIL A A2 .028 .035 .039 0.70 0.90 1.00 EI E SIDE VIEW b .006 - .012 0.15 - 0.30 c .003 - .009 0.08 - 0.22 D .075 .079 .083 1.90 2.00 2.10 ccc C 1 2 E1 .045 .049 .053 1.15 1.25 1.35 E .083 BSC 2.10 BSC 2X N/2 TIPS e H e .026 BSC 0.65 BSC e1 .051 1.30 BSC B L .010 .014 .018 0.26 0.36 0.46 GAGE c L1 (.017) (0.42) PLANE N 6 6 D 01 0° - 8° 0° - 8° 0.15 L aaa .004 0.10 aaa C 01 bbb .004 0.10 A2 A (L1) ccc .012 0.30 SEATING DETAIL A PLANE C A1 bxN bbb C A-B D NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS - A - AND - B - TO BE DETERMINED AT DATUM PLANE-H- 3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 4. REFERENCE JEDEC STD MO-203, VARIATION AB. Land Pattern - SC70 6L X DDIIMMEENNSSIIOONNSS DDIIMM IINNCCHHEESS MMIILLLLIIMMEETTEERRSS CC (.073) (1.85) GG .039 1.00 C G Z PP .026 0.65 XX .016 0.40 Y YY .033 0.85 ZZ .106 2.70 P NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET.  2004 Semtech Corp. 6 www.semtech.com

SMF05C PPRROOTTEECCTTIIOONN PPRROODDUUCCTTSS PRELIMINARY Marking Codes Marking Part Number Code SMF05C 5C Note: (1) Pin 1 Identified with a dot Ordering Information Qtyper Part Number Lead Finish ReelSize Reel SMF05C.TC SnPb 3,000 7Inch SMF05C.TCT MatteSn 3,000 7Inch Contact Information Semtech Corporation Protection Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804  2004 Semtech Corp. 7 www.semtech.com