Effective November 2015 Technical Data 4149 Supersedes March 2007 SD53 Low profile shielded power inductors Applications • Desktop computers • Notebook and laptop regulators • LED and White LED drivers • Digital cameras, media devices • Battery power systems Environmental Data • Storage temperature range (component): -40 °C to +125 °C Product description • Operating temperature range: -40 °C to +125 °C (Ambient plus self temperature rise) • Octagonal shape utilizes board space • Solder reflow temperature: J-STD-020D • Shielded drum core compliant • Inductance range from 1.1 uH to 100 uH • Current range from 0.44 A to 4.8 A Pb HHALOFGEN FREE • 5.7 mm x 5.2 mm footprint surface mount package in a 3.0 mm height • Ferrite core material • Halogen free, lead free, RoHS compliant

Technical Data 4149 SD53 Effective November 2015 Low profile shielded power inductors Product Specifications I 2 I 3 DCR (Ω) typical DCR (Ω) maximum @ rms sat Part Number5 OCL1 (μH) ±20% Part marking (A) (A) @ 20 °C 20 °C K-factor4 SD53-1R1-R 1.10 A 3.25 4.80 0.017 0.020 48 SD53-2R0-R 2.00 B 2.64 3.30 0.023 0.027 35 SD53-3R3-R 3.30 C 2.26 2.60 0.029 0.034 28 SD53-4R7-R 4.70 D 2.01 2.10 0.039 0.045 21 SD53-6R8-R 6.80 E 1.65 1.85 0.059 0.068 20 SD53-100-R 10.0 F 1.41 1.40 0.077 0.090 15 SD53-150-R 15.0 G 1.10 1.10 0.122 0.142 12 SD53-220-R 22.0 H 0.81 0.94 0.179 0.208 10 SD53-330-R 33.0 I 0.75 0.76 0.221 0.257 8 SD53-470-R 47.0 J 0.64 0.64 0.303 0.352 7 SD53-680-R 68.0 K 0.52 0.58 0.452 0.525 6 SD53-101-R 100 L 0.44 0.45 0.689 0.801 5 1. 1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.1 Vrms, 0.0 Adc. 4. K-factor: Used to determine B p-p for core loss (see graph). B p-p = K*L*∆I, B p-p(mT), K: (K factor from table), 2. Irms: DC current for an approximate ∆T of 40 °C without core loss. Derating is necessary for AC currents. PCB layout, L: (Inductance in uH), ∆I (Peak to peak ripple current in Amps). trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature 5. Part Number Definition: SD53-xxx-R rise. It is recommended that the temperature of the part not exceed 125 °C under worst case operating conditions SD53 = Product code and size; -xxx = Inductance value in uH; R = decimal point; verified in the end application If no R is present then third character equals the number of zeros. 3. lsat: Peak current for approximately 30% rolloff @ 25 °C. -R suffix = RoHS compliant. Dimensions (mm) 3 5 Part Marking: Line 1: (1st digit= inductance value per Part Marking Designator); (2nd digit= Bi-weekly production date code); (3rd digit= Last digit of the year produced), (4th digit= Internal manufacturing code). Line 2: 53=product size code) Do not route traces or vias underneath the inductor Packaging information (mm) Parts packaged on 13” diameter reel, 2,600 parts per reel. 2 www.eaton.com/elx

SD53 Technical Data 4149 Low profile shielded power inductors Effective November 2015 Core loss vs. Bp-p 10 500kHz 1 300kHz 1MHz 200kHz 0.1 100kHz W) ( 0.01 s s o L e or 0.001 C 0.0001 0.00001 0.000001 1 10 100 1000 Bp-p (mT) Temperature rise vs. total loss Inductance characteristics www.eaton.com/elx 3

Technical Data 4149 SD53 Effective November 2015 Low profile shielded power inductors Solder reflow profile TP Table 1 - Standard SnPb Solder (Tc) TC -5°C Max. Ramp Up Rate = 3°C/s tP Volume Volume Package mm3 mm3 Max. Ramp Down Rate = 6°C/s Thickness <350 ≥350 TL <2.5mm) 235°C 220°C Preheat t ≥2.5mm 220°C 220°C A e Tsmax atur Table 2 - Lead (Pb) Free Solder (Tc) per Volume Volume Volume Tem Tsmin ts PThacickkangees s m<3m503 m35m03 - 2000 m>2m003 0 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C • Temperature max. (Tsmax) 150°C 200°C • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) 183°C 217°C Time at liquidous (tL) 60-150 Seconds 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp)** within 5 °C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/elx © 2015 Eaton All Rights Reserved Eaton is a registered trademark. Printed in USA Publication No. 4149 All other trademarks are property November 2015 of their respective owners.