SD05C through SD24C Single Line TVS Diode for ESD Protection in Portable Electronics PPRROOTTEECCTTIIOONN PPRROODDUUCCTTSS PRELIMINARY Description Features The SDxxC TVS diodes are designed to replace multi- (cid:139) 350 Watts peak pulse power (t = 8/20µs) p layer varistors (MLVs) in portable applications such as (cid:139) Transient protection for data lines to cell phones, notebook computers, and PDA’s. They IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) offer superior electrical characteristics such as lower IEC 61000-4-4 (EFT) 40A (5/50ns) clamping voltage and no device degradation when IEC 61000-4-5 (Lightning) 24A (8/20µs) compared to MLVs. The SDxxC series TVS diodes are (cid:139) Small package for use in portable electronics designed to protect sensitive semiconductor compo- (cid:139) Suitable replacement for MLV’s in ESD protection nents from damage or upset due to electrostatic applications discharge (ESD) and other voltage induced transient (cid:139) Protects one I/O or power line events. (cid:139) Low clamping voltage (cid:139) Working voltages: 5V, 12V, 15V, 24V The SDxxC is in a SOD-323 package and will protect (cid:139) Low leakage current one bidirectional line. They are available with working voltages of 5 - 24 volts. These devices will fit on the (cid:139) Solid-state silicon avalanche technology same PCB pad area as an 0805 MLV device. They give Mechanical Characteristics the designer the flexibility to protect one line in applica- tions where arrays are not practical. Additionally, it (cid:139) EIAJ SOD-323 package may be “sprinkled” around the board in applications (cid:139) Molding compound flammability rating: UL 94V-0 where board space is at a premium. (cid:139) Marking : Marking code (cid:139) Packaging : Tape and Reel per EIA 481 They may may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (±15kV air, Applications ±8kV contact discharge). (cid:139) Cell Phone Handsets and Accessories (cid:139) Microprocessor based equipment (cid:139) Personal Digital Assistants (PDA’s) (cid:139) Notebooks, Desktops, and Servers (cid:139) Portable Instrumentation (cid:139) Pagers (cid:139) Peripherals Schematic & PIN Configuration 1 2 SOD-323 (Top View) Revision 07/06/04 1 www.semtech.com

SD05C through SD24C PROTECTION PRODUCTS Absolute Maximum Rating Rating Symbol Value Units PeakPulsePower(t =8/20µs) P 350 Watts p pk ESDVoltage(HBM WaveformperIEC61000-4-2) V 30 kV ESD Lead Soldering Temperature T 260(10sec.) °C L Operating Temperature T -55to+125 °C J StorageTemperature T -55to+150 °C STG Electrical Characteristics SD05CTVS Parameter Symbol Conditions Minimum Typical Maximum Units ReverseStand-Off Voltage V 5 V RWM ReverseBreakdown Voltage V I =1mA 6 V BR t ReverseLeakageCurrent I V =5V, T=25°C 10 µA R RWM Clamping Voltage V I =5A, t =8/20µs 9.8 V C PP p Clamping Voltage V I =24A, t =8/20µs 14.5 V C PP p Peak PulseCurrent I t =8/20µs 24 A PP p Junction Capacitance C V =0V, f =1MHz 200 pF j R SD12CTVS Parameter Symbol Conditions Minimum Typical Maximum Units ReverseStand-Off Voltage V 12 V RWM ReverseBreakdown Voltage V I =1mA 13.3 V BR t ReverseLeakageCurrent I V =12V, T=25°C 1 µA R RWM Clamping Voltage V I =5A, t =8/20µs 19 V C PP p Clamping Voltage V I =15A, t =8/20µs 24 V C PP p Peak PulseCurrent I t =8/20µs 15 A PP p Junction Capacitance C V =0V, f =1MHz 100 pF j R  2004 Semtech Corp. 2 www.semtech.com

SD05C through SD24C PROTECTION PRODUCTS PRELIMINARY Electrical Characteristics (Continued) SD15CTVS Parameter Symbol Conditions Minimum Typical Maximum Units ReverseStand-Off Voltage V 15 V RWM ReverseBreakdown Voltage V I =1mA 16.7 V BR t ReverseLeakageCurrent I V =15V, T=25°C 1 µA R RWM Clamping Voltage V I =5A, t =8/20µs 24 V C PP p Clamping Voltage V I =12A, t =8/20µs 29 V C PP p Peak PulseCurrent I t =8/20µs 12 A PP p Junction Capacitance C V =0V, f =1MHz 75 pF j R SD24CTVS Parameter Symbol Conditions Minimum Typical Maximum Units ReverseStand-Off Voltage V 24 V RWM ReverseBreakdown Voltage V I =1mA 26.7 V BR t ReverseLeakageCurrent I V =24V, T=25°C 1 µA R RWM Clamping Voltage V I =5A, t =8/20µs 40 V C PP p Clamping Voltage V I =8A, t =8/20µs 44 V C PP p Peak PulseCurrent I t =8/20µs 8 A PP p Junction Capacitance C V =0V, f =1MHz 50 pF j R  2004 Semtech Corp. 3 www.semtech.com

SD05C through SD24C PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 10 110 W) 100 k wer - P (pk 1 wer or IPP 789000 o o 60 P P se ed 50 Pul 0.1 Rat 40 eak % of 30 P 20 10 0.01 0 0.1 1 10 100 1000 0 25 50 75 100 125 150 Pulse Duration - tp (µs) Ambient Temperature - TA (oC) Pulse Waveform Clamping Voltage vs. Peak Pulse Current 110 30 100 Waveform Waveform Parameters: Parameters: SD12C 90 tr = 8µs 25 80 td = 20µs (V)C tdtr == 280µµss cent of IPP 567000 e-t oltage - V 1250 SD05C Per 40 td = IPP/2 ng V 30 pi 10 m 20 a Cl 10 5 0 0 5 10 15 20 25 30 0 Time (µs) 0 5 10 15 20 25 30 Peak Pulse Current - I (A) PP  2004 Semtech Corp. 4 www.semtech.com

SD05C through SD24C PROTECTION PRODUCTS PRELIMINARY Applications Information Device Connection Options Device Schematic and Pin Configuration The SDxxC TVS diodes are designed to protect one data, I/O, or power supply line. The device is designed to replace multi-layer varistors (MLVs) in portable applications. It is easily implemented on existing 0805 MLV pads and is only slightly larger than 0603 MLV pads. The device is bidirectional and may be used on lines where the signal polarity is above and below ground. The device is symmetrical, so there is no cathode band. Size Comparison to 0805 MLV Circuit Board Layout Recommendations for Suppres- sion of ESD. Good circuit board layout is critical for the suppression of fast rise-time transients such as ESD. The following guidelines are recommended (Refer to application note SI99-01 for more detailed information): (cid:122) Place the TVS near the input terminals or connectors to restrict transient coupling. (cid:122) Minimize the path length between the TVS and the protected line. SOD-323 0805 MLV (cid:122) The ESD transient return path to ground should Note: Nominal dimensions in inches be kept as short as possible. (cid:122) Place a TVS and decoupling capacitor between power and ground of components that may be Component Placement Comparison vulnerable to electrostatic discharges to the ground plane. (cid:122) Minimize all conductive loops including power and ground loops. (cid:122) Use multilayer boards when possible. (cid:122) Minimize interconnecting line lengths (cid:122) Never run critical signals near board edges. (cid:122) Fill unused portions of the PCB with ground plane. 0805 MLV on SOD-323 on 0805 SOD-323 on Recommended Matte Tin Lead Finish 0805 Solder Pad MLV Pad (SOD-323) Solder Pad Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small com- pared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint.  2004 Semtech Corp. 5 www.semtech.com

SD05C through SD24C PROTECTION PRODUCTS Outline Drawing - SOD-323 Land Pattern - SOD-323  2004 Semtech Corp. 6 www.semtech.com

SD05C through SD24C PROTECTION PRODUCTS PRELIMINARY Marking Codes Marking Part Number Code SD05C 5/5 SD12C 6/6 SD15C 7/7 SD24C 8/8 Ordering Information Part Qtyper Lead Finish ReelSize Number Reel SD05C.TC SnPb 3,000 7” SD12C.TC SnPb 3,000 7” SD15C.TC SnPb 3,000 7” SD24C.TC SnPb 3,000 7” SD05C.TCT Pb free 3,000 7” SD12C.TCT Pb free 3,000 7” SD15C.TCT Pb free 3,000 7” SD24C.TCT Pb free 3,000 7” Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804  2004 Semtech Corp. 7 www.semtech.com