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  • 型号: RCV080510M0JNEA
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产品参数 图文手册 常见问题
参数 数值
产品目录

电阻器

描述

RES 10M OHM 5% 1/8W 0805厚膜电阻器 - SMD 0.125w 10Mohm 5% 200PPM

产品分类

芯片电阻 - 表面安装

品牌

Vishay BC ComponentsVishay / Draloric

产品手册

点击此处下载产品Datasheet

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

薄膜电阻器,厚膜电阻器 - SMD,Vishay / Draloric RCV080510M0JNEARCV

数据手册

点击此处下载产品Datasheet

产品型号

RCV080510M0JNEARCV080510M0JNEA

产品

Thick Film Resistors SMD

产品种类

厚膜电阻器 - SMD

供应商器件封装

0805(2012 公制)

其它名称

BC2827CT

功率(W)

0.125W,1/8W

功率额定值

125 mW (1/8 W)

包装

剪切带 (CT)

商标

Vishay / Draloric

外壳代码-in

0805

外壳代码-mm

2012

外壳宽度

1.25 mm

外壳长度

2 mm

外壳高度

0.45 mm

大小/尺寸

0.079" 长 x 0.049" 宽(2.00mm x 1.25mm)

容差

5 %±5%

封装

Reel

封装/外壳

0805(2012 公制)

封装/箱体

0805 (2012 metric)

工作温度范围

- 55 C to + 155 C

成分

厚膜

标准包装

1

温度系数

±200ppm/°C200 PPM / K

特性

-

电压额定值

400 V

电阻

10 MOhms

电阻(Ω)

10M

端子数

2

系列

RCV

高度

0.020"(0.50mm)

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PDF Datasheet 数据手册内容提取

RCV e3 www.vishay.com Vishay Draloric High Voltage (up to 0.5 kV) Thick Film Chip Resistors FEATURES • High operating voltage (up to 500 V) • Pure tin solder contacts on Ni barrier layer provides compatibility with lead (Pb)-free and lead containing soldering processes • Metal glaze on high quality ceramic • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 STANDARD ELECTRICAL SPECIFICATIONS POWER LIMITINGELEMENT CASE CASE TEMPERATURE RESISTANCE RATING VOLTAGE U TOLERANCE MODEL SIZE SIZE MAX. COEFFICIENT RANGE SERIES P AC /DC ± % INCH METRIC 70 RMS ± ppm/K  W V 100 1 E24; E96 RCV0805 e3 0805 RR 2012M 0.125 400 100K to 10M 200 5 E24 100 1 E24; E96 RCV1206 e3 1206 RR 3216M 0.25 500 100K to 10M 200 5 E24 Notes • These resistors do not feature a lifetime limitation when operated within the limits of rated dissipation, permissible operating voltage and permissible film temperature. However, the resistance typically increases due to the resistor’s film temperature over operating time, generally known as drift. The drift may exceed the stability requirements of an individual application circuit and thereby limits the functional lifetime • No marking • Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material TECHNICAL SPECIFICATIONS PARAMETER UNIT RCV0805 RCV1206 Rated dissipation P (1) W 0.125 0.25 70 Limiting element voltage U AC /DC V 400 500 max. RMS Insulation voltage U (1 min) V > 500 ins. Voltage coefficient of resistance chart ppm/V 25 Insulation resistance  > 109 Operating temperature range °C -55 to +155 Weight mg 5.5 10 Note (1) The power dissipation on the resistors generates a temperature rise against the local ambient, depending on the heat flow support of the printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceeded PART NUMBER AND PRODUCT DESCRIPTION Part Number: RCV1206100KFKEA R C V 1 2 0 6 1 0 0 K F K E A MODEL RESISTANCE TOLERANCE TCR PACKAGING RCV0805 K = thousand F = ± 1 % K = ± 100 ppm/K EA, EB, EC RCV1206 M = million J = ± 5 % N = ± 200 ppm/K Product Description: RCV1206 100 100K 1 % ET1 e3 RCV1206 100 100K 1 % ET1 e3 MODEL TCR RESISTANCE TOLERANCE PACKAGING LEAD (Pb)-FREE RCV0805 ± 100 ppm/K 100K = 100 k ± 1 % ET1, ET5, ET6 e3 = pure tin RCV1206 ± 200 ppm/K 10M = 10 M ± 5 % termination finish Revision: 31-Jan-17 1 Document Number: 20054 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

RCV e3 www.vishay.com Vishay Draloric PACKAGING MODEL CODE QUANTITY CARRIER TAPE WIDTH PITCH REEL DIAMETER EA = ET1 5000 180 mm/7" RCV0805 EB = ET5 10 000 285 mm/11.25" EC = ET6 20 000 Paper tape acc. to 330 mm/13" IEC 60068-3 8 mm 4 mm EA = ET1 5000 Type I 180 mm/7" RCV1206 EB = ET5 10 000 285 mm/11.25" EC = ET6 20 000 330 mm/13" DIMENSIONS SOLDER PAD DIMENSIONS in millimeters SIZE DIMENSIONS in millimeters REFLOW SOLDERING WAVE SOLDERING INCH METRIC L W H T1 T2 a b l a b l 0805 2012 2.0 + 0.20 1.25 ± 0.15 0.45 ± 0.05 0.3 + 0.20 0.3 ± 0.2 0.7 1.3 1.2 0.9 1.3 1.3 - 0.10 - 0.10 1206 3216 3.2 + 0.10 1.6 ± 0.15 0.55 ± 0.05 0.45 ± 0.2 0.4 ± 0.2 0.9 1.7 2.0 1.1 1.7 2.3 - 0.20 FUNCTIONAL PERFORMANCE P70 n atio 100 p ssi % Di d e at R of n 50 o cti a Fr 0 - 50 0 50 100 °C 150 70 Derating Ambient Temperature in amb Revision: 31-Jan-17 2 Document Number: 20054 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

RCV e3 www.vishay.com Vishay Draloric TEST PROCEDURES AND REQUIREMENTS REQUIREMENTS PROCEDURE PERMISSIBLE CHANGE (R) EN 60115-1 IEC 60068-2 TEST CLAUSE TEST METHOD Stability for product types: 100 k to 10 M RCV e3 4.5 - Resistance - ± 1 % ± 5 % U = 2.5 x P x R 70  2 x Umax.; Short time 4.13 - Style Duration ± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 ) overload RR2012M 1 s RR3216M 2 s Solder bath method; Sn60Pb40 Good tinning non-activated flux; ( 95 % covered); (235 ± 5) °C no visible damage (2 ± 0.2) s 4.17.2 58 (Td) Solderability Solder bath method; Sn96.5Ag3Cu0.5 Good tinning non-activated flux; ( 95 % covered); (245 ± 5) °C no visible damage (3 ± 0.3) s Temperature (20 / -55 / 20) °C and 4.8.4.2 - ± 100 ppm/K ± 200 ppm/K coefficient (20 / 155 / 20) °C 4.32 21 (Uu ) Shear (adhesion) 17.7 N No visible damage 3 Depth 2 mm; No visible damage, no open circuit in bent position 4.33 21 (Uu ) Substrate bending 1 3 times ± (0.25 % R + 0.05 ) 30 min. at -55 °C; 30 min. at 125 °C Rapid change of 4.19 14 (Na) temperature 5 cycles ± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 ) 1000 cycles ± (1 % R + 0.05 ) ± (1 % R + 0.05 ) 4.23 - Climatic sequence: - 4.23.2 2 (Ba) Dry heat 125 °C; 16 h 55 °C;  90 % RH 4.23.3 30 (Db) Damp heat, cyclic 24 h; 1 cycle 4.23.4 1 (Aa) Cold -55 °C; 2 h ± (1 % R + 0.05 ) ± (2 % R + 0.1 ) 4.23.5 13 (M) Low air pressure 1 kPa; (25 ± 10) °C; 1 h 55 °C; . 90 % RH 4.23.6 30 (Db) Damp heat, cyclic 24 h; 5 cycle 4.23.7 - DC load U = P x R 70 U = P70 x R Umax.; 1.5 h on; 0.5 h off; Endurance 4.25.1 - at 70 °C 70 °C; 1000 h ± (1 % R + 0.05 ) ± (2 % R + 0.1 ) 70 °C; 8000 h ± (2 % R + 0.1 ) ± (4 % R + 0.1 ) Solder bath method Resistance to 4.18.2 58 (Td) (260 ± 5) °C; ± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 ) soldering heat (10 ± 1) s (40 ± 2) °C; Damp heat, 4.24 78 (Cab) (93 ± 3) % RH; ± (1 % R + 0.05 ) ± (2 % R + 0.05 ) steady state 56 days Revision: 31-Jan-17 3 Document Number: 20054 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

RCV e3 www.vishay.com Vishay Draloric TEST PROCEDURES AND REQUIREMENTS REQUIREMENTS PROCEDURE PERMISSIBLE CHANGE (R) EN 60115-1 IEC 60068-2 TEST CLAUSE TEST METHOD Stability for product types: 100 k to 10 M RCV e3 Endurance at upper 4.25.3 - 155 °C; 1000 h ± (1 % R + 0.05 ) ± (2 % R + 0.05 ) category temperature Electrostatic IEC 61340-3-1; 4.40 - discharge 3 pos. + 3 neg. discharges; ± (1 % R + 0.05 ) (human body model) ESD voltage acc. to style Component solvent Isopropyl alcohol; 4.29 45 (XA) No visible damage resistance 50 °C; method 2 Solvent resistance Isopropyl alcohol; 4.30 45 (XA) Marking legible, no visible damage of marking 50 °C; method 1, toothbrush f = 10 Hz to 2000 Hz; Vibration, endurance x, y, z  1.5 mm; 4.22 6 (Fc) ± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 ) by sweeping A  200 m/s2; 10 sweeps per axis U = 15 x P x R 70 4.37 - Periodic electric  2 x Umax.; ± (1 % R + 0.05 ) overload 0.1 s on; 2.5 s off; 1000 cycles Single pulse high Û = 10 x P x R 70 4.27 - voltage overload,  2 x Umax.; ± (1 % R + 0.05 ) 10 μs/700 μs 10 pulses All tests are carried out in accordance with the following specifications: • EN 60115-1, generic specification • EN 140400, sectional specification • EN 140401-802, detail specification • IEC 60068-2-x, environmental test procedures Revision: 31-Jan-17 4 Document Number: 20054 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Legal Disclaimer Notice www.vishay.com Vishay Disclaimer  ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. © 2017 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED Revision: 08-Feb-17 1 Document Number: 91000

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