Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/, use http://www.nexperia.com Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: - © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights reserved Should be replaced with: - © Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e-mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia

PESD3V3U1UA; PESD3V3U1UB; PESD3V3U1UL Ultra low capacitance unidirectional ESD protection diodes Rev. 01 — 30 October 2008 Product data sheet 1. Product profile 1.1 General description Ultra low capacitance unidirectional ElectroStatic Discharge (ESD) protection diodes in small Surface-Mounted Device (SMD) plastic packages designed to protect one signal line from the damage caused by ESD and other transients. Table 1. Product overview Type number Package Package configuration NXP JEITA PESD3V3U1UA SOD323 SC-76 very small PESD3V3U1UB SOD523 SC-79 ultra small and flatlead PESD3V3U1UL SOD882 - leadless ultra small 1.2 Features n UnidirectionalESDprotectionofoneline n ESD protection up to9kV n Ultralowdiodecapacitance:C =2.6pF n IEC61000-4-2; level4 (ESD) d n Very low leakage current: I =1nA n AEC-Q101 qualified RM 1.3 Applications n USB interfaces n Cellular handsets and accessories n 10/100/1000Mbit/sEthernet n Portable electronics n FireWire n Communication systems n High-speed data lines n Computers and peripherals n Subscriber Identity Module (SIM) card n Audio and video equipment protection 1.4 Quick reference data Table 2. Quick reference data T =25(cid:176) C unless otherwise specified. amb Symbol Parameter Conditions Min Typ Max Unit V reverse standoff voltage - - 3.3 V RWM C diode capacitance f=1MHz; V =0V - 2.6 3.1 pF d R

PESD3V3U1UA/UB/UL NXP Semiconductors Ultra low capacitance unidirectional ESD protection diodes 2. Pinning information Table 3. Pinning Pin Description Simplified outline Graphic symbol PESD3V3U1UA; PESD3V3U1UB 1 cathode [1] 2 anode 1 2 1 2 006aaa152 001aab540 PESD3V3U1UL 1 cathode [1] 2 anode 1 2 1 2 006aaa152 Transparent top view [1] The marking bar indicates the cathode. 3. Ordering information Table 4. Ordering information Type number Package Name Description Version PESD3V3U1UA SC-76 plastic surface-mounted package; 2leads SOD323 PESD3V3U1UB SC-79 plastic surface-mounted package; 2leads SOD523 PESD3V3U1UL - leadless ultra small plastic package; 2terminals; SOD882 body1.0· 0.6· 0.5mm 4. Marking Table 5. Marking codes Type number Marking code PESD3V3U1UA QT PESD3V3U1UB T8 PESD3V3U1UL XZ PESD3V3U1UA_UB_UL_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 30 October 2008 2 of 12

PESD3V3U1UA/UB/UL NXP Semiconductors Ultra low capacitance unidirectional ESD protection diodes 5. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit T junction temperature - 150 (cid:176) C j T ambient temperature - 55 +150 (cid:176) C amb T storage temperature - 65 +150 (cid:176) C stg Table 7. ESD maximum ratings T =25(cid:176) C unless otherwise specified. amb Symbol Parameter Conditions Min Max Unit V electrostatic discharge voltage IEC61000-4-2 [1] - 9 kV ESD (contact discharge) MIL-STD-883(human - 10 kV body model) [1] Device stressed with ten non-repetitive ESDpulses. Table 8. ESD standards compliance Standard Conditions IEC61000-4-2; level4 (ESD) >8kV(contact) MIL-STD-883; class3 (human body model) >4kV 001aaa631 IPP 100 % 90 % 10 % tr = 0.7 ns to 1 ns t 30 ns 60 ns Fig 1. ESD pulse waveform according to IEC61000-4-2 PESD3V3U1UA_UB_UL_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 30 October 2008 3 of 12

PESD3V3U1UA/UB/UL NXP Semiconductors Ultra low capacitance unidirectional ESD protection diodes 6. Characteristics Table 9. Characteristics T =25(cid:176) C unless otherwise specified. amb Symbol Parameter Conditions Min Typ Max Unit V reverse standoff voltage - - 3.3 V RWM I reverse leakage current V =3V - 1 100 nA RM RWM V breakdown voltage I =5mA 4.5 5.6 6.8 V BR R C diode capacitance f=1MHz; V =0V - 2.6 3.1 pF d R r differential resistance I =5mA - - 100 W dif R I 006aab356 2.6 Cd (pF) 2.5 - VCL- VBR - VRWM V 2.4 -- IIRRM - + 2.3 P-N 2.2 - IPP 0 1 2 3 4 5 VR (V) 006aaa407 f=1MHz; T =25(cid:176) C amb Fig 2. Diode capacitance as a function of reverse Fig 3. V-Icharacteristics for a unidirectional voltage; typical values ESDprotection diode PESD3V3U1UA_UB_UL_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 30 October 2008 4 of 12

PESD3V3U1UA/UB/UL NXP Semiconductors Ultra low capacitance unidirectional ESD protection diodes ESD TESTER 4 GHz DIGITAL RG 223/U OSCILLOSCOPE RZ 450 W 50 W coax 10· ATTENUATOR CZ 50 W DUT (DEVICE IEC 61000-4-2 network UNDER CZ = 150 pF; RZ = 330 W TEST) vertical scale = 2 kV/div vertical scale = 20 V/div horizontal scale = 15 ns/div horizontal scale = 100 ns/div GND GND unclamped +8 kV ESD pulse waveform clamped +8 kV ESD pulse waveform (IEC 61000-4-2 network) (IEC 61000-4-2 network) pin 1 to 2 vertical scale = 2 kV/div vertical scale = 20 V/div horizontal scale = 15 ns/div horizontal scale = 100 ns/div GND GND unclamped - 8 kV ESD pulse waveform clamped - 8 kV ESD pulse waveform (IEC 61000-4-2 network) (IEC 61000-4-2 network) pin 1 to 2 006aab357 Fig 4. ESD clamping test setup and waveforms PESD3V3U1UA_UB_UL_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 30 October 2008 5 of 12

PESD3V3U1UA/UB/UL NXP Semiconductors Ultra low capacitance unidirectional ESD protection diodes 7. Application information The PESD3V3U1Uxseries is designed for the protection of one unidirectional data or signallinefromthedamagecausedbyESD.Thedevicesmaybeusedonlineswherethe signal polarities are either positive or negative with respect to ground. line to be protected line to be protected (positive signal polarity) (negative signal polarity) DUT DUT GND GND unidirectional protection of one line 006aab251 Fig 5. Application diagram Circuit board layout and protection device placement Circuit board layout is critical for the suppression of ESD and Electrical Fast Transient(EFT). The following guidelines are recommended: 1. Place the device as close to the input terminal or connector as possible. 2. The path length between the device and the protected line should be minimized. 3. Keep parallel signal paths to a minimum. 4. Avoid running protected conductors in parallel with unprotected conductors. 5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and ground loops. 6. Minimize the length of the transient return path to ground. 7. Avoid using shared transient return paths to a common ground point. 8. Ground planes should be used whenever possible. For multilayer PCBs, use ground vias. 8. Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standardQ101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. PESD3V3U1UA_UB_UL_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 30 October 2008 6 of 12

PESD3V3U1UA/UB/UL NXP Semiconductors Ultra low capacitance unidirectional ESD protection diodes 9. Package outline 1.35 1.1 0.85 0.65 1.15 0.8 0.75 0.58 1 0.45 1 0.15 2.7 1.8 1.65 1.25 2.3 1.6 1.55 1.15 2 2 0.40 0.25 0.34 0.17 0.25 0.10 0.26 0.11 Dimensions in mm 03-12-17 Dimensions in mm 02-12-13 Fig 6. Package outline Fig 7. Package outline PESD3V3U1UA(SOD323/SC-76) PESD3V3U1UB(SOD523/SC-79) 0.62 0.50 0.55 0.46 0.30 2 0.22 1.02 0.65 0.95 0.30 0.22 1 0.55 cathode marking on top side 0.47 Dimensions in mm 03-04-17 Fig 8. Package outline PESD3V3U1UL(SOD882) 10. Packing information Table 10. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 3000 8000 10000 PESD3V3U1UA SOD323 4mm pitch, 8mm tape and reel -115 - -135 PESD3V3U1UB SOD523 2mm pitch, 8mm tape and reel - -315 - 4mm pitch, 8mm tape and reel -115 - -135 PESD3V3U1UL SOD882 2mm pitch, 8mm tape and reel - - -315 [1] For further information and the availability of packing methods, seeSection14. PESD3V3U1UA_UB_UL_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 30 October 2008 7 of 12

PESD3V3U1UA/UB/UL NXP Semiconductors Ultra low capacitance unidirectional ESD protection diodes 11. Soldering 3.05 2.1 solder lands solder resist 1.65 0.95 0.5 (2· ) 0.6 (2· ) solder paste occupied area 2.2 Dimensions in mm 0.5 (2· ) 0.6 (2· ) sod323_fr Fig 9. Reflow soldering footprint PESD3V3U1UA(SOD323/SC-76) 5 2.9 1.5 (2· ) solder lands solder resist occupied area 1.2 2.75 (2· ) Dimensions in mm preferred transport direction during soldering sod323_fw Fig 10. Wave soldering footprint PESD3V3U1UA(SOD323/SC-76) PESD3V3U1UA_UB_UL_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 30 October 2008 8 of 12

PESD3V3U1UA/UB/UL NXP Semiconductors Ultra low capacitance unidirectional ESD protection diodes 2.15 1.1 solder lands solder resist 0.5 0.6 1.2 (2· ) (2· ) solder paste occupied area 0.7 Dimensions in mm (2· ) 0.8 (2· ) sod523_fr Reflow soldering is the only recommended soldering method. Fig 11. Reflow soldering footprint PESD3V3U1UB(SOD523/SC-79) 1.3 0.7 R0.05 (8· ) solder lands 0.6 0.7 solder resist 0.9 (2· ) (2· ) solder paste occupied area 0.3 (2· ) Dimensions in mm 0.4 (2· ) sod882_fr Reflow soldering is the only recommended soldering method. Fig 12. Reflow soldering footprint PESD3V3U1UL(SOD882) PESD3V3U1UA_UB_UL_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 30 October 2008 9 of 12

PESD3V3U1UA/UB/UL NXP Semiconductors Ultra low capacitance unidirectional ESD protection diodes 12. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes PESD3V3U1UA_UB_UL_1 20081030 Product data sheet - - PESD3V3U1UA_UB_UL_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 30 October 2008 10 of 12

PESD3V3U1UA/UB/UL NXP Semiconductors Ultra low capacitance unidirectional ESD protection diodes 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] Theproductstatusofdevice(s)describedinthisdocumentmayhavechangedsincethisdocumentwaspublishedandmaydifferincaseofmultipledevices.Thelatestproductstatus information is available on the Internet at URLhttp://www.nxp.com. 13.2 Definitions Applications —Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the Draft —The document is a draft version only. The content is still under specified use without further testing or modification. internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any Limiting values —Stress above one or more limiting values (as defined in representations or warranties as to the accuracy or completeness of theAbsoluteMaximumRatingsSystemofIEC60134)maycausepermanent informationincludedhereinandshallhavenoliabilityfortheconsequencesof damagetothedevice.Limitingvaluesarestressratingsonlyandoperationof use of such information. the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting Short data sheet —A short data sheet is an extract from a full data sheet values for extended periods may affect device reliability. withthesameproducttypenumber(s)andtitle.Ashortdatasheetisintended forquickreferenceonlyandshouldnotbereliedupontocontaindetailedand Terms and conditions of sale —NXP Semiconductors products are sold full information. For detailed and full information see the relevant full data subjecttothegeneraltermsandconditionsofcommercialsale,aspublished sheet, which is available on request via the local NXP Semiconductors sales athttp://www.nxp.com/profile/terms, including those pertaining to warranty, office. In case of any inconsistency or conflict with the short data sheet, the intellectual property rights infringement and limitation of liability, unless full data sheet shall prevail. explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. 13.3 Disclaimers No offer to sell or license —Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the General —Information in this document is believed to be accurate and grant,conveyanceorimplicationofanylicenseunderanycopyrights,patents reliable.However,NXPSemiconductorsdoesnotgiveanyrepresentationsor or other industrial or intellectual property rights. warranties,expressedorimplied,astotheaccuracyorcompletenessofsuch Quick reference data —The Quick reference data is an extract of the information and shall have no liability for the consequences of use of such product data given in the Limiting values and Characteristics sections of this information. document, and as such is not complete, exhaustive or legally binding. Right to make changes —NXPSemiconductorsreservestherighttomake ESD protection devices —These products are only intended for protection changes to information published in this document, including without against ElectroStatic Discharge (ESD) pulses and are not intended for any limitation specifications and product descriptions, at any time and without otherusageincluding,withoutlimitation,voltageregulationapplications.NXP notice.Thisdocumentsupersedesandreplacesallinformationsuppliedprior Semiconductorsacceptsnoliabilityforuseinsuchapplicationsandtherefore to the publication hereof. such use is at the customer’s own risk. Suitability for use —NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or 13.4 Trademarks malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental Notice:Allreferencedbrands,productnames,servicenamesandtrademarks damage. NXP Semiconductors accepts no liability for inclusion and/or use of are the property of their respective owners. NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. 14. Contact information For more information, please visit:http://www.nxp.com For sales office addresses, please send an email to:salesaddresses@nxp.com PESD3V3U1UA_UB_UL_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 30 October 2008 11 of 12

PESD3V3U1UA/UB/UL NXP Semiconductors Ultra low capacitance unidirectional ESD protection diodes 15. Contents 1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2 4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Application information. . . . . . . . . . . . . . . . . . . 6 8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 6 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 6 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 10 Packing information. . . . . . . . . . . . . . . . . . . . . . 7 11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10 13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 14 Contact information. . . . . . . . . . . . . . . . . . . . . 11 15 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Pleasebeawarethatimportantnoticesconcerningthisdocumentandtheproduct(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 30 October 2008 Document identifier: PESD3V3U1UA_UB_UL_1