SPECIFICATION PA.22A Part No. : Product Name : Dielectric PIFA Antenna Description : Tri-band - 880~960 MHz, 1710~1990 MHz, 0dB Gain Size: 29.8mm*6mm*5mm RoHS Compliant SPE-11-8-060/G Page 1 of 24

1. Scope This specification is for a Tri-band GSM miniature PIFA (Dielectric Planar Inverted-F Type Antenna) (DPA™) Antenna for internal SMT mounting. Note: The antenna also shows a response at 850MHz which means the antenna can also be defined on quad-band, depending on the target specification for the device itself. 2. Electrical Specifications The antenna has the electrical characteristics given in Table 1 under the Taoglas standard installation conditions as shown in the Evaluation Board (Figure No. Parameter Specification 1 Frequency 880~960 MHz , 1710~1990 MHz 2 Dimensions 29.8*6.0*5.0 mm 3 Impedance 50 Ω 4 VSWR 2.5 max (depends on environment) 5 Polarization Linear 6 Operating Temperature -40~85°C Ag (Environmentally Friendly Lead- 7 Termination Free) *Data is measured on Taoglas Evaluation Board (reference ground plane) pictured below SPE-11-8-060/G Page 2 of 24

2.1 S11 Response Curve SPE-11-8-060/G Page 3 of 24

Radiation patterns also available (measured in free space and on evaluation board) SPE-11-8-060/G Page 4 of 24

2.2 Gain and Efficiency SPE-11-8-060/G Page 5 of 24

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3. Mechanical Dimensions 3.1 PA.22 Antenna feed to module to ground solder pads (mechanical only) SPE-11-8-060/G Page 17 of 24

3.2Evaluation board dimensions SPE-11-8-060/G Page 18 of 24

3.3 Recommended layout (as per Taoglas evalution board) Non metal area 4.7nH inductor 6mm clearance ideally For EVB only to ground (minimum 4mm clearance) feed to mod ule View from underneath board – note solder pads either side – laid out on non metal area Layout dimensions - Allow 6mm clearance all around if possible (minimum 4mm) SPE-11-8-060/G Page 19 of 24

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3.4 Recommended Transmission Line and Matching Network Note: The PA.22 can be made “quad band” with appropriate matching circuit Guidelines for routing RF when designing a PCB; 1) Good 2) Bad SPE-11-8-060/G Page 21 of 24

4. Packaging SPE-11-8-060/G Page 22 of 24

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5. Recommended Reflow Temperature Profile (1) Time shown in the above figures is measured from the point when chip surface reaches temperature. (2) Temperature difference in high temperature part should be within 110°C. (3) After soldering, do not force cool, allow the parts to cool gradually. *General attention to soldering: ● High soldering temperatures and long soldering times can cause leaching of the termination, decrease in adherence strength, and the change of characteristic may occur. ● for soldering, please refer to the soldering curves above. However, please keep exposure to temperatures exceeding 200°C to under 50 seconds. ● please use a mild flux (containing less than 0.2wt% Cl). Also, if the flux is water soluble, be sure to wash thoroughly to remove any residue from the underside of components that could affect resistance. Cleaning: When using ultrasonic cleaning, the board may resonate if the output power is too high. Since this vibration can cause cracking or a decrease in the adherence of the termination, we recommend that you use the conditions below. Frequency: 40 kHz max. - Output power: 20W/Iiter -Cleaning time: 5minutes max. SPE-11-8-060/G Page 24 of 24