NL27WZ07 Dual Buffer with Open Drain Outputs The NL27WZ07 is a high performance dual buffer with open drain outputs operating from a 1.65 to 5.5 V supply. The internal circuit is composed of multiple stages, including an open drain output. The open drain output provides the capability to set http://onsemi.com the output switching level to a user selectable value with an external resistor and power supply. The logic high output value is set by the MARKING external power supply and can be less than, equal or greater than the DIAGRAMS V power supply, provided the voltage supply is less than 5.5 V. CC 6 Features SC−88 • 1 M M7 M(cid:2) Extremely High Speed: t 2.3 ns (typical) at V = 5 V DF SUFFIX PD CC (cid:2) • CASE 419B Designed for 1.65 V to 5.5 V V Operation, CMOS compatible CC • 1 Over Voltage Tolerant Inputs • LVTTL Compatible − Interface Capability with 5 V TTL Logic with VCC = 3 V TSOP−6 M7 M(cid:2) • LVCMOS Compatible DT SUFFIX (cid:2) • 1 CASE 318G 24 mA Output Sink Capability 1 • Near Zero Static Supply Current Substantially Reduces System M7 = Device Code Power Requirements M = Date Code* • Chip Complexity: FET = 72; Equivalent Gate = 18 (cid:2) = Pb−Free Package • These Devices are Pb−Free and are RoHS Compliant (Note: Microdot may be in either location) • NLV Prefix for Automotive and Other Applications Requiring *Date Code orientation and/or position may vary Unique Site and Control Change Requirements; AEC−Q100 depending upon manufacturing location. Qualified and PPAP Capable PIN ASSIGNMENT Pin Function 1 IN A1 IN A1 1 6 OUT Y1 2 GND 3 IN A2 4 OUT Y2 5 VCC GND 2 5 VCC 6 OUT Y1 FUNCTION TABLE A Input Y Output IN A2 3 4 OUT Y2 L L H Z Figure 1. Pinout (Top View) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. IN A1 1 OUT Y1 IN A2 1 OUT Y2 Figure 2. Logic Symbol © Semiconductor Components Industries, LLC, 2012 1 Publication Order Number: April, 2012 − Rev. 15 NL27WZ07/D

NL27WZ07 MAXIMUM RATINGS Symbol Characteristics Value Units VCC DC Supply Voltage −0.5 to +7.0 V VI DC Input Voltage −0.5 ≤ VI ≤ +7.0 V VO DC Output Voltage −0.5 ≤ VO ≤ +7.0 V Output in Z or LOW State (Note 1) IIK DC Input Diode Current −50 mA VI < GND IOK DC Output Diode Current −50 mA VO < GND IO DC Output Sink Current ±50 mA ICC DC Supply Current per Supply Pin ±100 mA IGND DC Ground Current per Ground Pin ±100 mA TSTG Storage Temperature Range −65 to +150 °C PD Power Dissipation in Still Air mW SC−88, TSOP−6 200 (cid:2)JA Thermal Resistance °C/W SC−88, TSOP−6 333 TL Lead Temperature, 1 mm from case for 10 s 260 °C TJ Junction Temperature under Bias +150 °C ILatchup Latchup Performance mA Above VCC and Below GND at 85°C (Note 5) ±500 MSL Moisture Sensitivity Level 1 FR Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in VESD ESD Classification V Human Body Model (Note 3) > 2000 Machine Model (Note 4) > 200 Charged Device Model (Note 5) N/A Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. IO absolute maximum rating must be observed. 2. Tested to EIA/JESD22−A114−A, rated to EIA/JESD22−A114−B. 3. Tested to EIA/JESD22−A115−A, rated to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A 5. Tested to EIA/JESD78 RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Units VCC Supply Voltage V Operating 1.65 5.5 Data Retention Only 1.5 5.5 VI Input Voltage 0 5.5 V VO Output Voltage (Z or LOW State) 0 5.5 V TA Operating Free−Air Temperature −55 +125 °C (cid:3)t/(cid:3)V Input Transition Rise or Fall Rate ns/V VCC = 2.5 V ±0.2 V 0 20 VCC = 3.0 V ±0.3 V 0 10 VCC = 5.0 V ±0.5 V 0 5 http://onsemi.com 2

NL27WZ07 DC ELECTRICAL CHARACTERISTICS VCC TA = 25°C −55°C (cid:2)TA (cid:2) 125°C Symbol Parameter Condition (V) Min Typ Max Min Max Units VIH High−Level Input Voltage 1.65 to 1.95 0.75 VCC 0.75 VCC V 2.3 to 5.5 0.7 VCC 0.7 VCC VIL Low−Level Input Voltage 1.65 to 1.95 0.25 VCC 0.25 VCC V 2.3 to 5.5 0.3 VCC 0.3 VCC ILKG Z−State Output Leakage VIN = VIL 2.3 to 5.5 ±5.0 ±10.0 (cid:4)A Current VOUT = VCC or GND VOL Low−Level Output IOL = 100 (cid:4)A 1.65 to 5.5 0.0 0.1 0.1 V Voltage VIN = VIL IOL = 4 mA 1.65 0.08 0.24 0.24 IOL = 8 mA 2.3 0.20 0.3 0.3 IOL = 12 mA 2.7 0.22 0.4 0.4 IOL = 16 mA 3.0 0.28 0.4 0.4 IOL = 24 mA 3.0 0.38 0.55 0.55 IOL = 32 mA 4.5 0.42 0.55 0.55 IIN Input Leakage Current VIN = 5.5 V or GND 0 to 5.5 ±0.1 ±1.0 (cid:4)A IOFF Power Off VIN = 5.5 V or 0 1 10 (cid:4)A Leakage Current VOUT = 5.5 V ICC Quiescent Supply Cur- VIN = 5.5 V or GND 5.5 1 10 (cid:4)A rent AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 (cid:5) TA = 25°C −55°C (cid:2) TA (cid:2) 125°C Symbol Parameter Condition VCC (V) Min Typ Max Min Max Units tPZL Propagation Delay RL = R1 = 5000 (cid:5)(cid:6) CL = 15 pF 1.8 ±0.15 1.8 5.3 11.5 1.8 12.0 ns (Figure 3 and 4) 2.5 ±0.2 1.2 3.7 5.8 1.2 6.4 RL = R1 = 500 (cid:5)(cid:6) CL = 50 pF 3.3 ±0.3 0.8 2.9 4.4 0.8 4.8 5.0 ±0.5 0.5 2.3 3.5 0.5 3.9 tPLZ Propagation Delay RL = R1 = 5000 (cid:5)(cid:6) CL = 15 pF 1.8 ±0.15 1.8 5.3 11.5 1.8 12.0 ns (Figure 3 and 4) 2.5 ±0.2 1.2 2.8 5.8 1.2 6.4 RL = R1 = 500 (cid:5)(cid:6) CL = 50 pF 3.3 ±0.3 0.8 2.1 4.4 0.8 4.8 5.0 ±0.5 0.5 1.4 3.5 0.5 3.9 CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Units CIN Input Capacitance VCC = 5.5 V, VI = 0 V or VCC 2.5 pF COUT Output Capacitance VCC = 5.5 V, VI = 0 V or VCC 4.0 pF CPD Power Dissipation Capacitance (Note 6) 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 4.0 pF 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD (cid:2) VCC (cid:2) fin (cid:2) ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD (cid:2) VCC2 (cid:2) fin (cid:2) ICC (cid:2) VCC. http://onsemi.com 3

NL27WZ07 VCC A 50% GND tPZL tPLZ HIGH IMPEDANCE Y 50% VCC VOL (cid:2)0.3 V Figure 3. Switching Waveforms VCC PULSE R1 VCC (cid:3) 2 DUT GENERATOR RT CL RL RT = ZOUT of pulse generator (typically 50 (cid:5)) Figure 4. Test Circuit ORDERING INFORMATION Device Package Shipping† NL27WZ07DFT2G SC−88 / SOT−363 / SC−70−6 3000 / Tape & Reel (Pb−Free) NLV27WZ07DFT2G* SC−88 / SOT−363 / SC−70−6 3000 / Tape & Reel (Pb−Free) NL27WZ07DTT1G TSOP−6 3000 / Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. http://onsemi.com 4

NL27WZ07 PACKAGE DIMENSIONS SC−88/SC70−6/SOT−363 CASE 419B−02 ISSUE W D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. e 2. CONTROLLING DIMENSION: INCH. 3. 419B−01 OBSOLETE, NEW STANDARD 419B−02. MILLIMETERS INCHES 6 5 4 DIM MIN NOM MAX MIN NOM MAX A 0.80 0.95 1.10 0.031 0.037 0.043 HE −E− A1 0.00 0.05 0.10 0.000 0.002 0.004 A3 0.20 REF 0.008 REF 1 2 3 b 0.10 0.21 0.30 0.004 0.008 0.012 C 0.10 0.14 0.25 0.004 0.005 0.010 D 1.80 2.00 2.20 0.070 0.078 0.086 E 1.15 1.25 1.35 0.045 0.049 0.053 e 0.65 BSC 0.026 BSC b6 PL L 0.10 0.20 0.30 0.004 0.008 0.012 0.2 (0.008) M E M HE 2.00 2.10 2.20 0.078 0.082 0.086 A3 C A A1 L SOLDERING FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 (cid:4) mm (cid:5) SCALE 20:1 inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5

NL27WZ07 PACKAGE DIMENSIONS TSOP−6 CASE 318G−02 ISSUE U D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. H 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 6 5 4 L2 4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH, GAUGE PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR E1 ÉÉ E PLANE GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D AND E1 ARE DETERMINED AT DATUM H. 1 2 3 5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE. L NOTE 5 b M C PSLEAANTIENG DIM MIN MILLNIMOEMTERSMAX DETAIL Z A 0.90 1.00 1.10 e A1 0.01 0.06 0.10 b 0.25 0.38 0.50 c 0.10 0.18 0.26 c D 2.90 3.00 3.10 0.05 A EE1 21..5300 21..7550 31..0700 e 0.85 0.95 1.05 A1 L 0.20 0.40 0.60 DETAIL Z LM2 0° 0.25− BSC 10° RECOMMENDED SOLDERING FOOTPRINT* 6X 0.60 3.20 6X 0.95 0.95 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free ON Semiconductor Website: www.onsemi.com Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 5163, Denver, Colorado 80217 USA Europe, Middle East and Africa Technical Support: Order Literature: http://www.onsemi.com/orderlit Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Japan Customer Focus Center For additional information, please contact your local Email: orderlit@onsemi.com Phone: 81−3−5817−1050 Sales Representative http://onsemi.com NL27WZ07/D 6

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