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  • 型号: NC7SZ19FHX
  • 制造商: Fairchild Semiconductor
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NC7SZ19FHX产品简介:

ICGOO电子元器件商城为您提供NC7SZ19FHX由Fairchild Semiconductor设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 NC7SZ19FHX价格参考¥1.31-¥1.31。Fairchild SemiconductorNC7SZ19FHX封装/规格:逻辑 - 信号开关,多路复用器,解码器, 解码器/多路分解器 1 x 1:2 6-MicroPak2™。您可以下载NC7SZ19FHX参考资料、Datasheet数据手册功能说明书,资料中有NC7SZ19FHX 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

集成电路 (IC)半导体

描述

IC DECODER/DEMUX UHS 6-MICROPAK2编码器、解码器、复用器和解复用器 TinyLogic UHS 1-of-2 Decoder/Demultiplexr

产品分类

逻辑 - 信号开关,多路复用器,解码器

品牌

Fairchild Semiconductor

产品手册

点击此处下载产品Datasheet

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

逻辑集成电路,编码器、解码器、复用器和解复用器,Fairchild Semiconductor NC7SZ19FHX7SZ

数据手册

点击此处下载产品Datasheet

产品型号

NC7SZ19FHX

产品

Decoders / Demultiplexers

产品种类

编码器、解码器、复用器和解复用器

供应商器件封装

*

其它名称

NC7SZ19FHX-ND
NC7SZ19FHXTR

功率耗散

120 mW

包装

带卷 (TR)

单位重量

20 mg

商标

Fairchild Semiconductor

安装类型

表面贴装

安装风格

SMD/SMT

封装

Reel

封装/外壳

6-UFDFN

封装/箱体

MicroPak-6

工作温度

-40°C ~ 85°C

工厂包装数量

5000

最大工作温度

+ 85 C

最小工作温度

- 40 C

标准包装

5,000

独立电路

1

电压-电源

1.65 V ~ 5.5 V

电压源

单电源

电流-输出高,低

32mA,32mA

电源电压-最大

5.55 V

电源电压-最小

1.65 V

电路

1 x 1:2

类型

解码器/多路分解器

系列

NC7SZ19

输入/输出线数量

2 / 2

输入线路数量

2

输出线路数量

2

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PDF Datasheet 数据手册内容提取

Is Now Part of To learn more about ON Semiconductor, please visit our website at www.onsemi.com Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

N C 7 S Z February 2011 1 9 — T in y L NC7SZ19 o g TinyLogic® UHS 1-of-2 Decoder / Demultiplexer ic ® U H Features Description S 1  Ultra-High Speed: tPD 2.7ns Typical at 5V The NC7SZ19 is a 1-of-2 decoder with a common -o VCC oCuMtpOuSt etencahbnleo.l oTghye t od aecvhiciee vies ufaltbrari-chaigtehd s pweitehd awdivtha nhcigehd f-2  Broad VCC Operating Range: 1.65V to 5.55V output drive while maintaining low static power D e  Power Down High Impedance Inputs/Outputs dissipation over a broad VCC operating range. The c device is specified to operate over the 1.65V to 5.5V V o  Over-Voltage Tolerance Inputs Facilitate 5V to 3V range. The inputs and outputs are high impedance wheCnC d e Translation V is 0V. Inputs tolerate voltages up to 5.5V r CC /  Proprietary Noise/EMI Reduction Circuitry independent of VCC operating voltage. D e  Ultra-Small MicroPak™ Packages m u l ti p Ordering Information le x e Part Number Top Mark Package Packing Method r NC7SZ19P6X Z19 6-Lead SC70, EIAJ SC88 1.25mm Wide 3000 Units on Tape & Reel NC7SZ19L6X B4 6-Lead MicroPak™, 1.00mm Wide 5000 Units on Tape & Reel NC7SZ19FHX B4 6-Lead, MicroPak2™, 1x1mm Body, .35mm Pitch 5000 Units on Tape & Reel TinyLogic® is a registered trademark of Fairchild Semiconductor Corporation. MicroPak™ is a trademark of Fairchild Semiconductor Corporation. © 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SZ19 • Rev. 1.0.2

N C Pin Configurations 7 S Z 1 9 — T i n y L o g i c ® U H S 1 - o f - 2 Figure 1. SC70 (Top View) Figure 2. MicroPak™ (Top Through View) D e c o d e r / D e m u l t i p l e x Figure 3. Pin 1 Orientation e r Notes: 1. AAA represents product code top mark (see Ordering Information). 2. Orientation of top mark determines pin one location. 3. Reading the top mark left to right, pin one is the lower left pin. Pin Definitions Pin # SC70 Pin # MicroPak™ Name Description 1 1 A Decoder Address / Demultiplexer Select 2 2 GND Ground 3 3 /E Decoder Output Enable / Demultiplexer Data 4 4 Y Output 1 5 5 V Supply Voltage CC 6 6 Y Output 0 Function Table Inputs Output A /E Y = A + /E Y = /A + /E 0 1 L L L H H L H L X H H H H = HIGH Logic Level L = LOW Logic Level X = Don’t Care © 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SZ19 • Rev. 1.0.2 2

N C Absolute Maximum Ratings 7 S Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be Z 1 operable above the recommended operating conditions and stressing the parts to these levels is not recommended. 9 In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. — The absolute maximum ratings are stress ratings only. T i Symbol Parameter Min. Max. Unit n y L VCC Supply Voltage -0.5 7.0 V o g VIN DC Input Voltage -0.5 7.0 V ic V DC Output Voltage -0.5 7.0 V ® OUT U I DC Input Diode Current V < -0.5V -50 mA H IK IN S IOK DC Output Diode Current VIN < -0.5V -50 mA 1 IOUT DC Output Current ±50 mA -o f ICC or IGND DC VCC or Ground Current ±100 mA -2 T Storage Temperature Range -65 +150 °C D STG e T Junction Temperature Under Bias +150 °C c J o T Junction Lead Temperature (Soldering, 10 Seconds) +260 °C d L e r SC70-6 180 / D P Power Dissipation at +85°C MicroPak™-6 130 mW D e m MicroPak2™-6 120 u Human Body Model, JEDEC:JESD22-A114 4000 l t ESD V i p Charge Device Model, JEDEC:JESD22-C101 2000 l e x e r Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Conditions Min. Max. Unit Supply Voltage Operating 1.65 5.50 V V CC Supply Voltage Data Retention 1.5 5.5 V Input Voltage 0 5.5 V IN V Output Voltage 0 V V OUT CC V at 1.8V, ±0.15V, CC 0 20 2.5V ± 0.2V t, t Input Rise and Fall Times ns/V r f V at 3.3V ± 0.3V 0 10 CC V at 5.0V ± 0.5V 0 5 CC T Operating Temperature -40 +85 °C A SC70-6 425  Thermal Resistance MicroPak™-6 500 °C/W JA MicroPak2™-6 560 © 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SZ19 • Rev. 1.0.2 3

N C DC Electrical Characteristics 7 S Z T =+25°C TA=-40 to 1 A +85°C 9 Symbol Parameter V Condition Unit CC — Min. Typ. Max. Min. Max. T V HIGH Level Input 1.65 0.75VCC 0.75VCC V iny IH Voltage 2.30 to 5.50 0.70V 0.70V L CC CC o VIL LVOolWtag Lee vel Input 2.301 .t6o5 5 .50 00..2350VVCC 00..2350VVCC V gic® CC CC U 1.65 1.55 1.65 1.55 H 2.30 VIN=VIH, 2.20 2.30 2.20 S or VOL, 1 3.00 IOH=-100µA 2.90 3.00 2.90 -o f 4.50 4.40 4.50 4.40 - 2 HIGH Level V 1.65 I =-4mA 1.29 1.52 1.29 V D OH Output Voltage OH e 2.30 I =-8mA 1.90 2.15 1.90 c OH o 3.00 I =-16mA 2.40 2.80 2.40 d OH e 3.00 I =-24mA 2.30 3.68 2.30 r OH / 4.50 I =-32mA 3.80 4.20 3.80 D OH e 1.65 0.00 0.10 0.10 m u 2.30 V =V or, V , 0.00 0.10 0.10 l IN IL , IH t 3.00 IOL=100µA 0.00 0.10 0.10 ip l e 4.50 0.00 0.10 0.10 x LOW Level e V 1.65 I =4mA 0.08 0.24 0.24 V r OL Output Voltage OL 2.30 I =8mA 0.10 0.30 0.30 OL 3.00 I =16mA 0.15 0.40 0.40 OL 3.00 I =24mA 0.22 0.55 0.55 OL 4.50 I =32mA 0.22 0.55 0.55 OL Input Leakage I 0 to 5.5 V =5.5V, GND ±0.1 ±1.0 µA IN Current IN Power Off I 0 V or V =5.5V 1 10 µA OFF Leakage Current IN OUT Quiescent I 1.65 to 5.50 V =5.5V, GND 1 10 µA CC Supply Current IN © 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SZ19 • Rev. 1.0.2 4

N C AC Electrical Characteristics 7 S Z T =+25°C TA=-40 to 1 A +85°C 9 Symbol Parameter V Condition Unit Figure CC — Min. Typ. Max. Min. Max. T i 1.80 ± 0.15 2.5 5.9 10.5 2.5 11.0 n y 2.50 ± 0.20 C =15pF, 1.2 3.5 6.0 1.2 6.4 L L o tPLH, tPHL PAr oorp a/Eg atoti oOnu Dtpeulat y 35..3000 ±± 00..3500 RL=1M 00..85 22..71 43..12 00..85 43..55 ns FFiigguurree 56 gic® U 3.30 ± 0.30 CL=50pF, 1.2 3.2 5.1 1.2 5.4 H 5.00 ± 0.50 RL=500 0.8 2.7 4.0 0.8 4.3 S 1 C Input Capacitance 0 2.3 pF - IN o f C Power Dissipation 3.30 10.5 pF Figure 5 -2 PD Capacitance(4) 5.00 12.8 D e Note: c o 4. C is defined as the value of the internal equivalent capacitance which is derived from dynamic operating PD d current consumption (ICCD) at no output loading and operating at 50% duty cycle. CPD is related to ICCD dynamic e operating current by the expression: ICCD=(CPD)(VCC)(fIN)+(ICCstatic). r / D e m u l t i p l e x e r Notes: 5. C includes load and stray capacitance. L 6. Input PRR = 1.0MHz, t = 500ns. W Figure 4. AC Test Circuit Figure 5. I Test Circuit Figure 6. AC Waveforms CCD Note: 7. Input=AC Waveform; t=t=1.8ns. r f 8. PRR=10MHz; Duty Cycle=50%. 9. /E Input=GND. © 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SZ19 • Rev. 1.0.2 5

N C Physical Dimensions 7 S Z 1 SYMM 9 CL — 2.00±0.20 A 0.65 T 0.50 MIN i n 6 4 B y L o g PIN ONE i 1.25±0.10 1.90 c ® U H 1 3 S 1 (0.25) 00..3105 0.40 MIN -o 0.65 0.10 A B 1.30 f-2 LAND PATTERN RECOMMENDATION D 1.30 e c o 1.00 SEE DETAIL A d 0.80 e r / 1.10 D 0.80 e m 0.10 0.10 C u C 0.00 l 2.10±0.30 t i SEATING p PLANE le x e NOTES: UNLESS OTHERWISE SPECIFIED r GAGE A) THIS PACKAGE CONFORMS TO EIAJ PLANE (R0.10) SC-88, 1996. B) ALL DIMENSIONS ARE IN MILLIMETERS. C) DIMENSIONS DO NOT INCLUDE BURRS 0.25 0.10 OR MOLD FLASH. 0.20 D) DRAWING FILENAME: MKT-MAA06AREV6 0.46 30° 0.26 0° DETAIL A SCALE: 60X Figure 7. 6-Lead, SC70, EIAJ SC88, 1.25mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. Tape and Reel Specification Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications: http://www.fairchildsemi.com/products/analog/pdf/sc70-6_tr.pdf. Package Designator Tape Section Cavity Number Cavity Status Cover Type Status Leader (Start End) 125 (Typical) Empty Sealed P6X Carrier 3000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed © 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SZ19 • Rev. 1.0.2 6

N C 7 Physical Dimensions S Z 1 2X 9 0.05 C 1.45 B — 2X (1) T 0.05 C in y L o (0.254) 1.00 (0.49) gi 5X c ® (0.75) U H (0.52) S PIN 1 IDENTIFIER TOP VIEW A 1X 1 5 -o 0.55MAX (0.30) f - PIN 1 6X 2 0.05 C D 0.05 RECOMMENED ec 0.00 LAND PATTERN o d 0.05 C e C 0.45 r 0.25 00..10006X 0.35 / D 0.15 6X e DETAIL A 1.0 m 0.10 C B A u 0.05 C 0.40 l 0.30 ti p l e 0.35 5X x 0.25 e r 00..4300 5X DETAIL A 0.075 X 45 PIN 1 TERMINAL (0.05) 0.5 CHAMFER (0.13) 6X 4X BOTTOM VIEW Notes: 1. CONFORMS TO JEDEC STANDARD M0-252 VARIATION UAAD 2. DIMENSIONS ARE IN MILLIMETERS 3. DRAWING CONFORMS TO ASME Y14.5M-1994 4. FILENAME AND REVISION: MAC06AREV4 5. PIN ONE IDENTIFIER IS 2X LENGTH OF ANY OTHER LINE IN THE MARK CODE LAYOUT. Figure 8. 6-Lead, MicroPak™, 1.0mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. Tape and Reel Specification Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications: http://www.fairchildsemi.com/products/logic/pdf/micropak_tr.pdf. Package Designator Tape Section Cavity Number Cavity Status Cover Type Status Leader (Start End) 125 (Typical) Empty Sealed L6X Carrier 5000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed © 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SZ19 • Rev. 1.0.2 7

N C 7 Physical Dimensions S Z 1 0.89 9 — 0.05 C 0.35 2X 1.00 B A T 5X 0.40 in y L PIN 1 o 0.66 MIN 250uM g 1.00 ic 1X 0.45 ® U H 6X 0.19 S 0.05 C TOP VIEW 2X RECOMMENDED LAND PATTERN 1 - FOR SPACE CONSTRAINED PCB o f 0.90 - 2 0.05 C 0.35 D e c C 0.55MAX 5X0.52 o d e r SIDE VIEW 0.73 / D (0.08) 4X 0.09 1X0.57 em DETAIL A 1 2 3 0.19 6X u l t 0.20 6X ip l e ALTERNATIVE LAND PATTERN x FOR UNIVERSAL APPLICATION e r (0.05) 6X 5X0.35 0.25 0.60 6 5 4 0.10 C B A 0.35 (0.08) .05 C 0.40 0.30 4X BOTTOM VIEW NOTES: A. COMPLIES TO JEDEC MO-252 STANDARD B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994 0.075X45° D. LANDPATTERN RECOMMENDATION IS BASED ON FSC CHAMFER DETAIL A DESIGN. PIN 1 LEAD SCALE: 2X E. DRAWING FILENAME AND REVISION: MGF06AREV3 Figure 9. 6-Lead, MicroPak2™, 1x1mm Body, .35mm Pitch Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. Tape and Reel Specification Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications: http://www.fairchildsemi.com/packaging/MicroPAK2_6L_tr.pdf. Package Designator Tape Section Cavity Number Cavity Status Cover Type Status Leader (Start End) 125 (Typical) Empty Sealed FHX Carrier 5000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed © 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SZ19 • Rev. 1.0.2 8

N C 7 S Z 1 9 — T i n y L o g i c ® U H S 1 - o f - 2 D e c o d e r / D e m u l t i p l e x e r © 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SZ19 • Rev. 1.0.2 9

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free ON Semiconductor Website: www.onsemi.com Literature Distribution Center for ON Semiconductor USA/Canada 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Europe, Middle East and Africa Technical Support: Order Literature: http://www.onsemi.com/orderlit Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Japan Customer Focus Center For additional information, please contact your local Email: orderlit@onsemi.com Phone: 81−3−5817−1050 Sales Representative © Semiconductor Components Industries, LLC www.onsemi.com www.onsemi.com 1

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: O N Semiconductor: NC7SZ19L6X NC7SZ19P6X NC7SZ19FHX NC7SZ19P6