*RoHS CVEOARMVSPIAILOILNAASNBTLE MPLIANT *RoHS CO LEAD FREE LVEREAoRDH SIFS ORCNEOES MAPRLEI ANT* *RoH& S ACEOC MAPPLPIRAONVTED AE*CR-oQH20S 0 anCdO MPLIANT Fnne TiCOaneop tsAmeutur praQtoteluiianmsangloit fi ttweicvmaietth ipAo eAnprE pafCtloiuc-rrQ aePt2 iaor0san0sns igvReee vuC-poD mt oSp t1ore2ns5es n ° tCs nnA peoORqppveueeslirreipacctmttuiaanrbergtnelei ntto eftran mesuqsuplutre giprreear odtput rertooect teroioacpnnteig oroeanf*st Regoo HefaS nteC eOlherMicaPg&L tIl hAr A EoN CT ,n C*O*icHM APLLIOAGNETN FREE n Low thermal derating factor electronic equipment n Higher hold currents at elevated temperature n RoHS compliant* MF-PSHT Series - PTC Resettable Fuses Electrical Characteristics Tripped Max. Time Ihold Itrip Resistance To Trip Power V max. I max. Dissipation Model Volts Amps Amperes Ohms Amperes Seconds Watts at 23 °C at 23 °C at 23 °C at 23 °C at 23 °C Hold Trip RMin. R1Max.** Typ. MF-PSHT010X 16 40 0.10 0.60 1.0 7.5 2.5 1.5 1.0 **R1Max. measured 24 hours post reflow. Maximum resistance after two solder reflow cycles. Environmental Characteristics Operating Temperature .........................................-40 °C to +125 °C Recommended Storage........................................+40 °C max, 70 % R.H. max. Passive Aging .......................................................+125 °C, 1000 hours .............................................Rfinal <R1max Humidity Aging......................................................+85 °C, 85 % R.H. 1000 hours .............................Rfinal <R1max Thermal Shock .....................................................-40 °C to +125 °C, 20 times ..................................Rfinal <R1max Solvent Resistance ...............................................MIL-STD-202, Method 215 ...................................No change (marking still legible) Vibration ...............................................................MIL-STD-883C, Method 2007.1, ...........................No change (Rmin < R < R1max) Condition A Moisture Sensitivity Level (MSL) ..........................See Note ESD Classification - HBM .....................................6 Test Procedures And Requirements Test Test Conditions Accept/Reject Criteria Visual/Mech. .........................................................Verify dimensions and materials ...........................Per MF physical description Resistance ............................................................In still air @ 23 °C .................................................Rmin ≤ R ≤ R1max Time to Trip ...........................................................At specified current, Vmax, 23 °C .........................T ≤ max. time to trip (seconds) Hold Current .........................................................30 min. at Ihold .....................................................No trip Trip Cycle Life .......................................................Vmax, Imax, 100 cycles ........................................No arcing or burning Trip Endurance .....................................................Vmax, 48 hours .....................................................No arcing or burning Solderability ..........................................................245 °C ±5 °C, 5 seconds ......................................95 % min. coverage Thermal Derating Chart - Ihold (Amps) Ambient Operating Temperature Model -40 °C -20 °C 0 °C +23 °C +40 °C +50 °C +60 °C +70 °C +85 °C +125 °C MF-PSHT010X 0.14 0.13 0.11 0.10 0.09 0.08 0.07 0.07 0.06 0.04 WARNING Cancer and Reproductive Harm - www.P65Warnings.ca.gov * RoHS Directive 2015/863, Mar 31, 2015 and Annex. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.

MF-PSHT Series - PTC Resettable Fuses Product Dimensions A B C D Model Min. Max. Min. Max. Min. Max. Min. 2.00 2.30 1.20 1.50 0.40 0.80 0.25 MF-PSHT010X (0.079) (0.091) (0.047) (0.059) (0.016) (0.031) (0.010) MM DIMENSIONS: (INCHES) Top View Bottom View Side View Recommended Pad Layout A C Terminal material: 1.50 ± 0.10 Nickel/gold plated. F B (.059 ± .004) D 1.00 ± 0.05 1.20 ± 0.10 (.039 ± .002) (.047 ± .004) Packaging Quantity 3000 pcs. per reel Typical Time to Trip at 23 ˚C How to Order 100 MF - PSHT 010 X - 2 Multifuse® Product Designator 10 Series PSHT = 0805 High Temperature s) Surface Mount d n Component o ec Hold Current, Ihold S 1 010 (0.10 Amps) p ( Multifuse® freeXpansion™ Design Tri Packaging me to 0.1 MF-PSHT010X -2 = TPaapcek aagnedd R peeer lEIA 481 Ti 0.01 Typical Part Marking 0.001 Represents total content. Layout may vary. 0.1 1 10 PART IDENTIFICATION: MF-PSHT010X = F Current (Amps) F The Time to Trip curves represent typical performance of a device in a simulated application BIWEEKLY DATE CODE WILL APPEAR ON THE PACKAGING LABEL: environment. Actual performance in specific customer applications may differ from these values WEEK 1 AND 2 = A WEEK 51 AND 52 = Z due to the influence of other variables. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.

MF-PSHT Series - PTC Resettable Fuses Solder Reflow Recommendations tp Notes: TP CRITICAL ZONE • MF-PSHT models are intended for reflow soldering (including, but not RAMP-UP TLTO TP limited to heating plate, hot air, IR, nitrogen, and vapor phase). TL • Wave soldering is permissible only if the device is on the top of the DIMENSIONS: MM tL PCB, opposite the heat source. (INCHES) e Ts max • Hand soldering is not recommended for these devices. atur RAMP-DOWN • All temperatures refer to the topside of the device, measured on the er device body surface. Temp Ts min PREtHsEAT • Inf orte mfloewe tt ethmep peurabtliusrheesd e sxpceeceidfi cthaetio rnesc.ommended profile, devices may • Compatible with Pb and Pb-free solder reflow profiles. 25 • Excess solder may cause a short circuit. t 25 °C TO PEAK • Please refer to the Multifuse® Polymer PTC Resettable Fuse Soldering Recommendations for more details. Time Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Tsmax to Tp) 3 °C / second max. PREHEAT: Temperature Min. (Tsmin) 150 °C Temperature Max. (Tsmax) 200 °C TimDePesr co(rcTiepsstimsonin to Tsmax) (ts) Materials Temperature InTtiemr6vea0l~180 seIanccscopenepcdtats bsloel d(ie.er .j oeixnhti btoit sd ewteertmtininge o iff jsooinldt’esr sjouirnfat cise). Use the following criteria (ref. acceptability of printed 1.TApIMplyE s oMldAerI NpaTsAte ItNoED ABO•SVnE 9:6 .5 / Ag 3.0 / Cu 0.5 Room temperature board assemblies, IPC-A-610): te s t Tbeoamrdp (e8r -a 1tu0 rmei l( tThiLc)k ) cAlleloayn wsoaltdeer rs poalusbtele or no 217 °C A) Acceptable (see Figure 1) Time (tL) (see note 1) 60~150 seco(n1d)sThe solder connection wetting angle (solder to Peak Temperature (Tp)•s(Gin1g0le) (sUidLe dap epprooxvye dg)lass 260 °C cdoomesp noonte next caenedd s9o0ld °e.r to PCB termination) Time within 5 °C of Actu•aPl CP beoaakrd Taeppmropxe. 4rax4tux.r0e6 i(nt.p) 20~40 secon(d2s)Solder balls that do not violate minimum 2.Place test units onto board 6 units/board electrical clearances and are attached 3.RRaammp pu-pDown Rate Convection oven (see note 2) 2.5 °C ± 06.5 ° °C/s e/c s.econd m(asoxl.dered) to a metal surface. 4.TPrimeheea t2 (5T S°)C to Peak Temperature 150 °C to 190 °C 90 ± 30 s8ec .minutes Bm)aUxn.acceptable (see Figure 2) 5.Time above liquidus (TL) 220 °C 60-90 sec. (1)Solder connection wetting angle exceeding 90 °. 6.Peak temperature (TP) 250 °C +0 °/-5 ° 10-20 sec. within (2)Incomplete reflow of solder paste. 5 °C of peak (3)Dewetting. 7.Ramp down Room temperature 3 °C ± 0.5 °C/sec. If unacceptable, determine cause and correct prior to (see note 2) next run. 8.Cleaning water clean profile High pressure deionized 72 °F to 160 °F As required NOTES: water 65 PSI max. (22 °C to 71 °C) 1. Water soluble solder paste only above 100K. 2. Refer to ref. temperature profile. Temperature at lead/pad junction with “K” type thermocouple. Temperature of Lead/Pad Junction 3. Units that are board mounted for environmental (Derived using 6-zone Convection Oven) testing must see a peak temperature in the reflow zone, as specified. This is to ensure that all test units will see “worst case conditions”. 4. Ramp down rate to be measured from 245 °C to 150 °C. 5. Process Description 8 does not apply to open frame trimmers. MF-PSHT SERIES, REV. F 04/19 “freeXpansion Design” is a trademark of Bourns, Inc. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.

MF-PSHT Series Tape and Reel Specifications MF-PSHT010X Tape Dimensions per EIA 481 8.0 ± 0.30 W (0.315 ± 0.012) 4.0 ± 0.10 P 0 (0.157 ± 0.004) 4.0 ± 0.10 P 1 (0.157 ± 0.004) 2.0 ± 0.05 P 2 (0.079 ± 0.002) 1.65 ± 0.10 A 0 (0.065 ± 0.004) 2.40 ± 0.10 B 0 (0.094 ± 0.004) 4.35 B 1 max. (0.171) 1.5 + 0.10/-0.0 D 0 (0.059 + 0.004/-0) 3.5 ± 0.05 F (0.138 ± 0.002) 1.75 ± 0.10 E 1 (0.069 ± 0.004) MM DIMENSIONS: 6.25 (INCHES) E2 min. (0.246) 0.6 T max. (0.024) 0.1 T 1 max. (0.004) 0.95 ± 0.10 K 0 (0.037 ± 0.004) 390 Leader min. (15.35) 160 Trailer min. (6.30) Reel Dimensions 185 A max. (7.28) 50 N min. (1.97) 8.4 + 1.5/-0.0 W 1 (0.331 + 0.059/-0.0) 14.4 W 2 max. (0.567) MM DIMENSIONS: P0 (INCHES) T D0 P2 E1 W2(MEASURED AT HUB) COVER TAPE F A N(HUB DIA.) E2W B1 B0 K0 P1 W1(AMT EHAUSBU)RED T1 A0 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.

3B3o1u2rn -s ®2 Mmumlti fSuMseD® TPrPimTCm Rinegse Pttoatbelnet Fioumseester Application Notice • Users are responsible for independent and adequate evaluation of Bourns® Multifuse® Polymer PTC devices in the user’s application, including the PPTC device characteristics stated in the applicable data sheet. • Polymer PTC devices must not be allowed to operate beyond their stated maximum ratings. Operation in excess of such maximum ratings could result in damage to the PTC device and possibly lead to electrical arcing and/or fire. Circuits with inductance may generate a voltage above the rated voltage of the polymer PTC device and should be thoroughly evaluated within the user’s application during the PTC selection and qualification process. • Polymer PTC devices are intended to protect against adverse effects of temporary overcurrent or overtemperature conditions up to rated limits and are not intended to serve as protective devices where overcurrent or overvoltage conditions are expected to be repetitive or prolonged. • In normal operation, polymer PTC devices experience thermal expansion under fault conditions. Thus, a polymer PTC device must be protected against mechanical stress, and must be given adequate clearance within the user’s application to accommodate such thermal expansion. Rigid potting materials or fixed housings or coverings that do not provide adequate clearance should be thoroughly examined and tested by the user, as they may result in the malfunction of polymer PTC devices if the thermal expansion is inhibited. • Exposure to lubricants, silicon-based oils, solvents, gels, electrolytes, acids, and other related or similar materials may adversely affect the performance of polymer PTC devices. • Aggressive solvents may adversely affect the performance of polymer PTC devices. Conformal coating, encapsulating, potting, molding, and sealing materials may contain aggressive solvents including but not limited to xylene and toluene, which are known to cause adverse effects on the performance of polymer PTCs. Such aggressive solvents must be thoroughly cured or baked to ensure their complete removal from polymer PTCs to minimize the possible adverse effect on the device. • Recommended storage conditions should be followed at all times. Such conditions can be found on the applicable data sheet and on the Multifuse® Polymer PTC Moisture/Reflow Sensitivity Classification (MSL) note: https://www.bourns.com/docs/RoHS-MSL/msl_mf.pdf MFAN 12/18 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.

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