MC74LCX08 Low-Voltage CMOS Quad 2-Input AND Gate With 5 V−Tolerant Inputs The MC74LCX08 is a high performance, quad 2−input AND gate http://onsemi.com operating from a 2.3 to 3.6 V supply. High impedance TTL compatible inputs significantly reduce current loading to input drivers while TTL MARKING compatible outputs offer improved switching noise performance. A V I DIAGRAMS specification of 5.5 V allows MC74LCX08 inputs to be safely driven from 5.0 V devices. 14 Current drive capability is 24 mA at the outputs. SOIC−14 LCX08G 14 D SUFFIX AWLYWW Features CASE 751A • 1 Designed for 2.3 V to 3.6 V V Operation 1 CC • 5.0 V Tolerant Inputs − Interface Capability With 5.0 V TTL Logic • LVTTL Compatible 14 • LVCMOS Compatible TSSOP−14 LCX 08 • 24 mA Balanced Output Sink and Source Capability 14 DT SUFFIX ALYW(cid:2) CASE 948G (cid:2) • Near Zero Static Supply Current (10 (cid:2)A) Substantially Reduces 1 1 System Power Requirements • A = Assembly Location Latchup Performance Exceeds 500 mA L, WL = Wafer Lot • ESD Performance: Human Body Model >2000 V Y = Year W, WW = Work Week Machine Model >200 V • G or (cid:2) = Pb−Free Package NLV Prefix for Automotive and Other Applications Requiring (Note: Microdot may be in either location) Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS ORDERING INFORMATION Compliant See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. © Semiconductor Components Industries, LLC, 2014 1 Publication Order Number: September, 2014 − Rev. 10 MC74LCX08/D

MC74LCX08 1 A0 3 VCC A2 B2 O2 A3 B3 O3 2 O0 B0 14 13 12 11 10 9 8 4 A1 6 5 O1 B1 13 A2 11 12 O2 B2 10 1 2 3 4 5 6 7 A3 8 9 O3 A0 B0 O0 A1 B1 O1 GND B3 Figure 1. Pinout: 14−Lead (Top View) Figure 2. Logic Diagram PIN NAMES TRUTH TABLE Pins Function Inputs Outputs An, Bn Data Inputs An Bn On On Outputs L L L L H L H L L H H H H = High Voltage Level L = Low Voltage Level For ICC reasons, DO NOT FLOAT Inputs MAXIMUM RATINGS Symbol Parameter Value Condition Unit VCC DC Supply Voltage −0.5 to +7.0 V VI DC Input Voltage −0.5 ≤ VI ≤ +7.0 V VO DC Output Voltage −0.5 ≤ VO ≤ VCC + 0.5 Output in HIGH or LOW State (Note 1) V IIK DC Input Diode Current −50 VI < GND mA IOK DC Output Diode Current −50 VO < GND mA +50 VO > VCC mA IO DC Output Source/Sink Current ±50 mA ICC DC Supply Current Per Supply Pin ±100 mA IGND DC Ground Current Per Ground Pin ±100 mA TSTG Storage Temperature Range −65 to +150 °C MSL Moisture Sensitivity Level 1 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. IO absolute maximum rating must be observed. http://onsemi.com 2

MC74LCX08 RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Type Max Unit VCC Supply Voltage Operating 2.0 2.5, 3.3 3.6 V Data Retention Only 1.5 2.5, 3.3 3.6 VI Input Voltage 0 5.5 V VO Output Voltage (HIGH or LOW State) 0 VCC V (3−State) IOH HIGH Level Output Current VCC = 3.0 V − 3.6 V −24 mA VCC = 2.7 V − 3.0 V −12 VCC = 2.3 V − 2.7 V −8 IOL LOW Level Output Current VCC = 3.0 V − 3.6 V +24 mA VCC = 2.7 V − 3.0 V +12 VCC = 2.3 V − 2.7 V +8 TA Operating Free−Air Temperature −40 +85 °C (cid:3)t/(cid:3)V Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V 0 10 ns/V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. DC ELECTRICAL CHARACTERISTICS TA = −40°C to +85°C Symbol Characteristic Condition Min Max Unit VIH HIGH Level Input Voltage (Note 2) 2.3 V ≤ VCC ≤ 2.7 V 1.7 V 2.7 V ≤ VCC ≤ 3.6 V 2.0 VIL LOW Level Input Voltage (Note 2) 2.3 V ≤ VCC ≤ 2.7 V 0.7 V 2.7 V ≤ VCC ≤ 3.6 V 0.8 VOH HIGH Level Output Voltage 2.3 V ≤ VCC ≤ 3.6 V; IOH = −100 (cid:2)A VCC−0.2 V VCC = 2.3 V; IOH = −8 mA 1.8 VCC = 2.7 V; IOH = −12 mA 2.2 VCC = 3.0 V; IOH = −18 mA 2.4 VCC = 3.0 V; IOH = −24 mA 2.2 VOL LOW Level Output Voltage 2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 (cid:2)A 0.2 V VCC = 2.3 V; IOL = 8 mA 0.6 VCC = 2.7 V; IOL = 12 mA 0.4 VCC = 3.0 V; IOL = 16 mA 0.4 VCC = 3.0 V; IOL = 24 mA 0.55 IOFF Power Off Leakage Current VCC = 0, VIN = 5.5 V or VOUT = 5.5 V 10 (cid:2)A IIN Input Leakage Current VCC = 3.6 V, VIN = 5.5 V or GND ±5 (cid:2)A ICC Quiescent Supply Current VCC = 3.6 V, VIN = 5.5 V or GND 10 (cid:2)A (cid:3)ICC Increase in ICC per Input 2.3 ≤ VCC ≤ 3.6 V; VIH = VCC − 0.6 V 500 (cid:2)A Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 2. These values of VI are used to test DC electrical characteristics only. http://onsemi.com 3

MC74LCX08 AC CHARACTERISTICS (tR = tF = 2.5 ns; RL = 500 (cid:4)) Limits TA = −40°C to +85°C VCC = 3.3 V ± 0.3 V VCC = 2.7 V VCC = 2.5 V ± 0.2 V CL = 50 pF CL = 50 pF CL = 30 pF Symbol Parameter Waveform Min Max Min Max Min Max Unit tPLH Propagation Delay Time 1 1.5 5.5 1.5 6.2 1.5 6.6 ns tPHL Input to Output 1.5 5.5 1.5 6.2 1.5 6.6 tOSHL Output−to−Output Skew 1.0 ns tOSLH (Note 3) 1.0 3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter guaranteed by design. DYNAMIC SWITCHING CHARACTERISTICS TA = +25°C Symbol Characteristic Condition Min Typ Max Unit VOLP Dynamic LOW Peak Voltage VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V 0.8 V (Note 4) VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V 0.6 V VOLV Dynamic LOW Valley Voltage VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V −0.8 V (Note 4) VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V −0.6 V 4. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is measured in the LOW state. CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Unit CIN Input Capacitance VCC = 3.3 V, VI = 0 V or VCC 7 pF COUT Output Capacitance VCC = 3.3 V, VI = 0 V or VCC 8 pF CPD Power Dissipation Capacitance 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 25 pF ORDERING INFORMATION Device Package Shipping† MC74LCX08DG SOIC−14 55 Units / Rail (Pb−Free) MC74LCX08DR2G SOIC−14 2500 Tape & Reel (Pb−Free) MC74LCX08DTG TSSOP−14 96 Units / Rail (Pb−Free) MC74LCX08DTR2G TSSOP−14 2500 Tape & Reel (Pb−Free) NLVLCX08DTR2G* TSSOP−14 2500 Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable. http://onsemi.com 4

MC74LCX08 Vcc An, Bn Vmi Vmi 0 V tPHL tPLH VOH On Vmo Vmo VOL WAVEFORM 1 − PROPAGATION DELAYS tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns Vcc Symbol 3.3 V + 0.3 V 2.7 V 2.5 V + 0.2 V Vmi 1.5 V 1.5 V Vcc/2 Vmo 1.5 V 1.5 V Vcc/2 Figure 3. AC Waveforms VCC PULSE DUT GENERATOR RT CL RL CL= 50 pF at VCC = 3.3 + 0.3 V or equivalent (includes jig and probe capacitance) CL= 30 pF at VCC = 2.5 + 0.2 V or equivalent (includes jig and probe capacitance) RL= R1 = 500 (cid:4) or equivalent RT= ZOUT of pulse generator (typically 50 (cid:4)) Figure 4. Test Circuit http://onsemi.com 5

MC74LCX08 PACKAGE DIMENSIONS TSSOP−14 CASE 948G ISSUE B 14X K REF NOTES: 1. DIMENSIONING AND TOLERANCING PER 0.10 (0.004) M T U S V S ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 0.15 (0.006) T U S 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. N MOLD FLASH OR GATE BURRS SHALL NOT 0.25 (0.010) EXCEED 0.15 (0.006) PER SIDE. 2XL/2 14 8 4I.NTDEIMRLEENASDIO FNL ABS DHO OERS PNROOT TINRCULSUIODNE. M INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. L B 5. DIMENSION K DOES NOT INCLUDE −U− N DAMBAR PROTRUSION. ALLOWABLE PIN 1 DAMBAR PROTRUSION SHALL BE 0.08 IDENT. F (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL 1 7 DETAIL E CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE 0.15 (0.006) T U S A K DETERMINED AT DATUM PLANE −W−. −V− K1 MILLIMETERS INCHES ÇÉÇÉÇÉ DIM MIN MAX MIN MAX J J1 A 4.90 5.10 0.193 0.200 ÇÉÇÉÇÉ B 4.30 4.50 0.169 0.177 C −−− 1.20 −−− 0.047 SECTION N−N D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC H 0.50 0.60 0.020 0.024 −W− C J 0.09 0.20 0.004 0.008 J1 0.09 0.16 0.004 0.006 0.10 (0.004) K 0.19 0.30 0.007 0.012 K1 0.19 0.25 0.007 0.010 −T− SPELAATNIENG D G H DETAIL E ML 06 .(cid:3) 4 0 BS8C (cid:3) 00. 2(cid:3) 52 BS8C (cid:3) SOLDERING FOOTPRINT* 7.06 1 0.65 PITCH 14X 14X 0.36 1.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6

MC74LCX08 PACKAGE DIMENSIONS SOIC−14 NB CASE 751A−03 ISSUE K D A NOTES: B 1.DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2.CONTROLLING DIMENSION: MILLIMETERS. 14 8 3.DIMENSION b DOES NOT INCLUDE DAMBAR A3 PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF AT MAXIMUM MATERIAL CONDITION. H E 4.DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSIONS. L 5.MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 1 7 DETAIL A MILLIMETERS INCHES 0.25 M B M 13Xb DIM MIN MAX MIN MAX A 1.35 1.75 0.054 0.068 0.25 M C A S B S A1 0.10 0.25 0.004 0.010 A3 0.19 0.25 0.008 0.010 DETAIL A b 0.35 0.49 0.014 0.019 h A D 8.55 8.75 0.337 0.344 X 45(cid:3) E 3.80 4.00 0.150 0.157 e 1.27 BSC 0.050 BSC H 5.80 6.20 0.228 0.244 h 0.25 0.50 0.010 0.019 e A1 C SEATING M ML 0.04 0(cid:3) 1.72 5(cid:3) 0.001 6(cid:3) 0.074 9(cid:3) PLANE SOLDERING FOOTPRINT* 6.50 14X 1.18 1 1.27 PITCH 14X 0.58 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free ON Semiconductor Website: www.onsemi.com Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 5163, Denver, Colorado 80217 USA Europe, Middle East and Africa Technical Support: Order Literature: http://www.onsemi.com/orderlit Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Japan Customer Focus Center For additional information, please contact your local Email: orderlit@onsemi.com Phone: 81−3−5817−1050 Sales Representative http://onsemi.com MC74LCX08/D 7