M74HC04 Hex inverter Datasheet - production data Description The M74HC04 is a high-speed CMOS hex inverter manufactured using silicon gate C2MOS technology. DIP14 SO14 TSSOP14 The internal circuit is composed of 3 stages including a buffer output which enables high noise immunity and stable output. Features All inputs are equipped with protection circuits to  High speed: guard against static discharge and transient t = 8 ns (typ.) at V = 6 V excess voltage. PD CC  Low power dissipation: I = 1 μA (max.) at T = 25 °C CC A  High noise immunity: V = V = 28% V (min.) NIH NIL CC  Symmetrical output impedance: |I | = I = 4 mA (min) at V = 4.5 V OH OL CC  Balanced propagation delays: t @ t PLH PHL  Wide operating voltage range: V (OPR) = 2 V to 6 V CC  Pin and function compatible with 74 series 04  ESD performance – CDM: 1 kV – HBM: 2 kV – MM: 200 V Table 1. Device summary Order code Temperature range Package Packaging Marking M74HC04B1R -55 °C to +125 °C DIP14 Tube M74HC04B1 M74HC04YRM13TR(1) -40 °C to +125 °C SO14 (automotive grade) Tape and reel 74HC04Y M74HC04RM13TR -55 °C to +125 °C SO14 Tape and reel 74HC04 M74HC04TTR -55 °C to +125 °C TSSOP14 Tape and reel HC04 M74HC04YTTR(1) -40 °C to +125 °C TSSOP14 (automotive grade) Tape and reel HC04Y 1. Qualification and characterization according to AEC Q100 and Q003 or equivalent, advanced screening according to AEC Q001 and Q002 or equivalent. September 2013 DocID001882 Rev 3 1/13 This is information on a product in full production. www.st.com

Contents M74HC04 Contents 1 Pin information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4.1 DIP14 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4.2 SO14 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4.3 TSSOP14 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2/13 DocID001882 Rev 3

M74HC04 Pin information 1 Pin information Figure 1. Pin connections and IEC logic symbols Table 2. Pin description Pin number Symbol Name and function 1, 3, 5, 9, 11, 13 1A to 6A Data inputs 2, 4, 6, 8, 10, 12 1Y to 6Y Data outputs 7 GND Ground (0 V) 14 V Positive supply voltage CC DocID001882 Rev 3 3/13 13

Functional description M74HC04 2 Functional description Table 3. Truth table A Y L H H L Figure 2. Input and output equivalent circuit 4/13 DocID001882 Rev 3

M74HC04 Electrical characteristics 3 Electrical characteristics Stressing the device above the ratings listed in the “Absolute maximum ratings” table may cause permanent damage to the device. These are stress ratings only, and operation of the device at these or any other conditions above those indicated in the operating sections of this specification are not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 4. Absolute maximum ratings Symbol Parameter Value Unit V Supply voltage -0.5 to +7 V CC V DC input voltage -0.5 to V +0.5 V I CC V DC output voltage -0.5 to V +0.5 V O CC I DC input diode current ±20 mA IK I DC output diode current ±20 mA OK I DC output current ±25 mA O I I DC V or ground current ±50 mA CC or GND CC P Power dissipation 500(1) mW D T Storage temperature -65 to +150 °C stg T Lead temperature (10 sec) 300 °C L 1. 500 mW at 65 °C; derate to 300 mW by 10 mW/°C from 65 °C to 85 °C Table 5. Recommended operating conditions Symbol Parameter Value Unit V Supply voltage 2 to 6 V CC V Input voltage 0 to V V I CC V Output voltage 0 to V V O CC T Operating temperature -55 to 125 °C op VCC = 2.0 V 0 to 1000 ns tr, tf Input rise and fall time VCC = 4.5 V 0 to 500 ns VCC = 6.0 V 0 to 400 ns DocID001882 Rev 3 5/13 13

Electrical characteristics M74HC04 Table 6. DC specifications Test condition Value TA = 25°C -40 to 85°C -55 to 125°C Symbol Parameter V (V) Unit CC Min. Typ. Max. Min. Max. Min. Max. 2.0 1.5 1.5 1.5 High-level input voltage 4.5 3.15 3.15 3.15 V V IH 6.0 4.2 4.2 4.2 2.0 0.5 0.5 0.5 Low-level V 4.5 1.35 1.35 1.35 V IL input voltage 6.0 1.8 1.8 1.8 2.0 I = -20 μA 1.9 2.0 1.9 1.9 O 4.5 I = -20 μA 4.4 4.5 4.4 4.4 O High-level V 6.0 I = -20 μA 5.9 6.0 5.9 5.9 OH output voltage O V 4.5 I = -4.0 mA 4.18 4.31 4.13 4.10 O 6.0 I = -5.2 mA 5.68 5.8 5.63 5.60 O 2.0 IO = 20 μA 0.0 0.1 0.1 0.1 4.5 IO = 20 μA 0.0 0.1 0.1 0.1 Low-level VOL output voltage 6.0 IO = 20 μA 0.0 0.1 0.1 0.1 V 4.5 IO = 4.0 mA 0.17 0.26 0.33 0.40 6.0 IO = 5.2 mA 0.18 0.26 0.33 0.40 I Input leakage 6.0 VI = VCC or 0.1 1 1 μA I current GND I Quiescent 6.0 VI = VCC or 1 10 20 μA CC supply current GND 6/13 DocID001882 Rev 3

M74HC04 Electrical characteristics Table 7. AC electrical characteristics (C = 50 pF, input t = t = 6 ns) L r f Test condition Value TA = 25°C -40 to 85°C -55 to 125°C Symbol Parameter V (V) Unit CC Min. Typ. Max. Min. Max. Min. Max. 2.0 38 75 95 110 Output t t transition time 4.5 8 15 19 22 ns fLH fHL 6.0 6 13 16 19 2.0 45 95 120 145 Propagation t t 4.5 9 19 24 29 ns PLH PHL delay time 6.0 8 16 20 25 Table 8. Capacitive characteristics Test condition Value TA = 25°C -40 to 85°C -55 to 125°C Symbol Parameter V (V) Unit CC Min. Typ. Max. Min. Max. Min. Max. C Input capacitance 5.0 5 10 10 10 pF IN Power dissipation C 5.0 22 pF PD capacitance(1) 1. CPD is defined as the value of the IC’s internal equivalent capacitance which is calculated from the operating current consumption without load. (Refer to the test circuit). Average operating current can be obtained by the following equation: I = C x V x f + I /6 (per gate) CC(opr) PD CC IN CC DocID001882 Rev 3 7/13 13

Electrical characteristics M74HC04 Figure 3. Test circuit Figure 4. Waveforms: propagation delay times (f = 1 MHz; 50% duty cycle) 8/13 DocID001882 Rev 3

M74HC04 Package information 4 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 4.1 DIP14 package information Figure 5. Plastic DIP14 package mechanical outline Table 9. Plastic DIP14 package mechanical data mm. inches Dimension Min. Typ Max. Min. Typ. Max. a1 0.51 0.020 B 1.39 1.65 0.055 0.065 b 0.5 0.020 b1 0.25 0.010 D 20 0.787 E 8.5 0.335 e 2.54 0.100 e3 15.24 0.600 F 7.1 0.280 I 5.1 0.201 L 3.3 0.130 Z 1.27 2.54 0.050 0.100 DocID001882 Rev 3 9/13 13

Package information M74HC04 4.2 SO14 package information Figure 6. Plastic SO14 package mechanical outline Table 10. SO14 package mechanical data mm. inches Ref. Min. Typ Max. Min. Typ. Max. A 1.75 0.068 a1 0.1 0.2 0.003 0.007 a2 1.65 0.064 b 0.35 0.46 0.013 0.018 b1 0.19 0.25 0.007 0.010 C 0.5 0.019 c1 45° (typ.) D 8.55 8.75 0.336 0.344 E 5.8 6.2 0.228 0.244 e 1.27 0.050 e3 7.62 0.300 F 3.8 4.0 0.149 0.157 G 4.6 5.3 0.181 0.208 L 0.5 1.27 0.019 0.050 M 0.68 0.026 S 8° (max.) 10/13 DocID001882 Rev 3

M74HC04 Package information 4.3 TSSOP14 package information Figure 7. TSSOP14 package mechanical outline Table 11. TSSOP14 package mechanical data Ref. mm. inches Min. Typ Max. Min. Typ. Max. A 1.2 0.047 A1 0.05 0.15 0.002 0.004 0.006 A2 0.8 1 1.05 0.031 0.039 0.041 b 0.19 0.30 0.007 0.012 c 0.09 0.20 0.004 0.0089 D 4.9 5 5.1 0.193 0.197 0.201 E 6.2 6.4 6.6 0.244 0.252 0.260 E1 4.3 4.4 4.48 0.169 0.173 0.176 e 0.65 BSC 0.0256 BSC K 0° 8° 0° 8° L 0.45 0.60 0.75 0.018 0.024 0.030 DocID001882 Rev 3 11/13 13

Revision history M74HC04 5 Revision history Table 12. Document revision history Date Revision Changes Added ESD information to Features Added automotive grade order codes, temperature ranges, and 11-Sep-2013 3 marking information to Table 1: Device summary Revised document presentation Minor textual updates 12/13 DocID001882 Rev 3

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