LM70 www.ti.com SNIS112G–JUNE2000–REVISEDMARCH2013 LM70 SPI/MICROWIRE 10-Bit plus Sign Digital Temperature Sensor CheckforSamples:LM70 FEATURES 1 DESCRIPTION • 0.25°CTemperatureResolution. 2 The LM70 is a temperature sensor, Delta-Sigma • ShutdownModeConservesPowerBetween analog-to-digital converter with an SPI and TemperatureReading MICROWIRE compatible interface available in WSON • SPIandMICROWIREBusInterface and VSSOP 8-pin packages. The host can query the • VSSOP-8andWSON-8PackagesSaveSpace LM70 at any time to read temperature. A shutdown mode decreases power consumption to less than 10 • ULRecognizedComponent µA. This mode is useful in systems where low averagepowerconsumptioniscritical. APPLICATIONS The LM70 has 10-bit plus sign temperature resolution • SystemThermalManagement (0.25°C per LSB) while operating over a temperature • PersonalComputers rangeof−55°Cto+150°C. • DiskDrives The LM70's 2.65V to 5.5V supply voltage range, low • OfficeElectronics supply current and simple SPI interface make it ideal for a wide range of applications. These include • ElectronicTestEquipment thermal management and protection applications in hard disk drives, printers, electronic test equipment, KEY SPECIFICATIONS andofficeelectronics. • SupplyVoltage2.65Vto5.5V • SupplyCurrent – Operating – 260 μA(typ) – 490 μA(max) – Shutdown – 12μA(typ) • TemperatureAccuracy – −40°Cto85°C,±2°C(max) – −10°Cto65°C,+1.5/−2°C(max) – −55°Cto125°C,+3/−2°C(max) – −55°Cto150°C,+3.5/−2°C(max) 1 Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsof TexasInstrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet. Alltrademarksarethepropertyoftheirrespectiveowners. 2 PRODUCTIONDATAinformationiscurrentasofpublicationdate. Copyright©2000–2013,TexasInstrumentsIncorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarilyincludetestingofallparameters.

LM70 SNIS112G–JUNE2000–REVISEDMARCH2013 www.ti.com Simplified Block Diagram Connection Diagram TopView TopView Figure1. VSSOP-8Package Figure2. WSON-8Package SeePackageNumberDGK0008A SeePackageNumberNGK0008A PINDESCRIPTIONS VSSOP-8 WSON-8 PinName Description TypicalConnection PinNo. PinNo. SI/O 1 1 Input/Output-Serialbusbi-directionaldataline. FromandtoController Schmitttriggerinput. SC 2 3 Clock-SerialbusclockSchmitttriggerinputline. FromController GND 4 7 PowerSupplyGround Ground V+ 5 5 PositiveSupplyVoltageInput DCVoltagefrom2.65Vto5.5V.Bypasswitha 0.1μFceramiccapacitor. CS 7 8 ChipSelectinput. FromController NC 3,6,8 2,4,6 NoConnect ThesepinsarenotconnectedtotheLM70die inanyway. 2 SubmitDocumentationFeedback Copyright©2000–2013,TexasInstrumentsIncorporated ProductFolderLinks:LM70

LM70 www.ti.com SNIS112G–JUNE2000–REVISEDMARCH2013 Typical Application Figure3. COPMicrocontrollerInterface Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. Copyright©2000–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM70

LM70 SNIS112G–JUNE2000–REVISEDMARCH2013 www.ti.com Absolute Maximum Ratings(1) SupplyVoltage −0.3Vto6.0V VoltageatanyPin −0.3VtoV++0.3V InputCurrentatanyPin(2) 5mA PackageInputCurrent(2) 20mA StorageTemperature −65°Cto+150°C SolderingInformation,LeadTemperature VSSOP-8andWSON-8Packages(3) VaporPhase(60seconds) 215°C Infrared(15seconds) 220°C ESDSusceptibility(4) HumanBodyModel 3000V MachineModel 300V (1) AbsoluteMaximumRatingsindicatelimitsbeyondwhichdamagetothedevicemayoccur.DCandACelectricalspecificationsdonot applywhenoperatingthedevicebeyonditsratedoperatingconditions. (2) Whentheinputvoltage(V)atanypinexceedsthepowersupplies(V <GNDorV >+V )thecurrentatthatpinshouldbelimitedto5 I I I S mA.The20mAmaximumpackageinputcurrentratinglimitsthenumberofpinsthatcansafelyexceedthepowersupplieswithaninput currentof5mAtofour. (3) Seethesectiontitled“SurfaceMount”foundinacurrentLinearDataBookforothermethodsofsolderingsurfacemountdevices. (4) Humanbodymodel,100pFdischargedthrougha1.5kΩresistor.Machinemodel,200pFdischargeddirectlyintoeachpin. Operating Ratings SpecifiedTemperatureRange T toT MIN MAX See(1) −55°Cto+150°C SupplyVoltageRange(+V ) +2.65Vto+5.5V S (1) ThelifeexpectancyoftheLM70willbereducedwhenoperatingatelevatedtemperatures.LM70θ (thermalresistance,junction-to- JA ambient)whenattachedtoaprintedcircuitboardwith2oz.foilissummarizedinthetablebelow:DeviceNumberLM70CILDThermal Resistance(θJA),51.3°C/W,DeviceNumberLM70CIMMThermalResistance(θJA),200°C/W Temperature-to-Digital Converter Characteristics Unlessotherwisenoted,thesespecificationsapplyforV+=2.65Vto3.6VfortheLM70-3andV+=4.5Vto5.5VfortheLM70- 5(1).BoldfacelimitsapplyforT =T =T toT ;allotherlimitsT =T=+25°C,unlessotherwisenoted. A J MIN MAX A J Parameter TestConditions Typical(2) LLiMm7it0s-(53) LLiMm7it0s-(33) (ULinmitist) TemperatureError(1) T =−10°Cto+65°C +1.5/−2.0 +1.5/−2.0 °C(max) A T =−40°Cto+85°C ±2.0 ±2.0 °C(max) A T =−55°Cto+125°C +3.0/−2.0 +3.0/−2.0 °C(max) A T =−55°Cto+150°C +3.5/−2.0 +3.5/−2.0 °C(max) A Resolution 11 Bits 0.25 °C TemperatureConversionTime See(4) 140 210 210 ms(max) QuiescentCurrent SerialBusInactive 260 490 490 μA(max) SerialBusActive 260 μA ShutdownMode 12 μA (1) BothpartnumbersoftheLM70willoperateproperlyovertheV+supplyvoltagerangeof2.65Vto5.5V.Thetemperatureerrorfor temperaturerangesof−10°Cto+65°C,−40°Cto+85°C,−55°Cto+125°Cand−55°Cto+150°Cincludeerrorinducedbypowersupply variationof±5%fromthenominalvalue.Temperatureerrorwillincreaseby±0.3°Cforapowersupplyvoltage(V+)variationof±10% fromthenominalvalue. (2) TypicalsareatT =25°Candrepresentmostlikelyparametricnorm. A (3) LimitsareguaranteedtoAOQL(AverageOutgoingQualityLevel). (4) Thisspecificationisprovidedonlytoindicatehowoftentemperaturedataisupdated.TheLM70canbereadatanytimewithoutregard toconversionstate(andwillyieldlastconversionresult).Aconversioninprogresswillnotbeinterrupted.Theoutputshiftregisterwillbe updatedatthecompletionofthereadandanewconversionrestarted. 4 SubmitDocumentationFeedback Copyright©2000–2013,TexasInstrumentsIncorporated ProductFolderLinks:LM70

LM70 www.ti.com SNIS112G–JUNE2000–REVISEDMARCH2013 Logic Electrical Characteristics Digital DC Characteristics Unlessotherwisenoted,thesespecificationsapplyforV+=2.65Vto3.6VfortheLM70-3andV+=4.5Vto5.5VfortheLM70- 5.BoldfacelimitsapplyforT =T =T toT ;allotherlimitsT =T=+25°C,unlessotherwisenoted. A J MIN MAX A J Parameter TestConditions Typical(1) Limits(2) Units (Limit) V Logical“1”InputVoltage V+×0.7 V(min) IN(1) V++0.3 V(max) V Logical“0”InputVoltage −0.3 V(min) IN(0) V+×0.3 V(max) InputHysteresisVoltage V+=2.65Vto3.6V 0.8 0.27 V(min) V+=4.5Vto5.5V 0.8 0.35 V(min) I Logical“1”InputCurrent V =V+ 0.005 3.0 μA(max) IN(1) IN I Logical“0”InputCurrent V =0V −0.005 −3.0 μA(min) IN(0) IN C AllDigitalInputs 20 pF IN V HighLevelOutputVoltage I =−400μA 2.4 V(min) OH OH V LowLevelOutputVoltage I =+2mA 0.4 V(max) OL OL I TRI-STATEOutputLeakageCurrent V =GND −1 μA(min) O_TRI-STATE O V =V+ +1 μA(max) O (1) TypicalsareatT =25°Candrepresentmostlikelyparametricnorm. A (2) LimitsareguaranteedtoAOQL(AverageOutgoingQualityLevel). Logic Electrical Characteristics Serial Bus Digital Switching Characteristics Unlessotherwisenoted,thesespecificationsapplyforV+=2.65Vto3.6VfortheLM70-3andV+=4.5Vto5.5VfortheLM70- 5,C (loadcapacitance)onoutputlines=100pFunlessotherwisespecified.BoldfacelimitsapplyforT =T =T to L A J MIN T ;allotherlimitsT =T =+25°C,unlessotherwisenoted. MAX A J Parameter TestConditions Typical(1) Limits(2) Units (Limit) t SC(Clock)Period 0.16 μs(min) 1 DC (max) t CSLowtoSC(Clock)HighSet-UpTime 100 ns(min) 2 t CSLowtoDataOut(SO)Delay 70 ns(max) 3 t SC(Clock)LowtoDataOut(SO)Delay 70 ns(max) 4 t CSHightoDataOut(SO)TRI-STATE 200 ns(min) 5 t SC(Clock)HightoDataIn(SI)HoldTime 60 ns(min) 6 t DataIn(SI)Set-UpTimetoSC(Clock)High 30 ns(min) 7 (1) TypicalsareatT =25°Candrepresentmostlikelyparametricnorm. A (2) LimitsareguaranteedtoAOQL(AverageOutgoingQualityLevel). Copyright©2000–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM70

LM70 SNIS112G–JUNE2000–REVISEDMARCH2013 www.ti.com Timing Diagrams Figure4. DataOutputTimingDiagram Figure5. TRI-STATEDataOutputTimingDiagram Figure6. DataInputTimingDiagram 6 SubmitDocumentationFeedback Copyright©2000–2013,TexasInstrumentsIncorporated ProductFolderLinks:LM70

LM70 www.ti.com SNIS112G–JUNE2000–REVISEDMARCH2013 Figure7. Temperature-to-DigitalTransferFunction(Non-linearscaleforclarity) Figure8. TRI-STATETestCircuit Copyright©2000–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM70

LM70 SNIS112G–JUNE2000–REVISEDMARCH2013 www.ti.com Typical Performance Characteristics AveragePower-OnResetVoltagevsTemperature StaticSupplyCurrentvsTemperature Figure9. Figure10. TemperatureError Figure11. 8 SubmitDocumentationFeedback Copyright©2000–2013,TexasInstrumentsIncorporated ProductFolderLinks:LM70

LM70 www.ti.com SNIS112G–JUNE2000–REVISEDMARCH2013 FUNCTIONAL DESCRIPTION The LM70 temperature sensor incorporates a band-gap type temperature sensor and 10-bit plus sign ΔΣ ADC (Delta-Sigma Analog-to-Digital Converter). Compatibility of the LM70's three wire serial interface with SPI and MICROWIRE allows simple communications with common microcontrollers and processors. Shutdown mode can be used to optimize current drain for different applications. A manufacture's ID register identifies the LM70 as a TIproduct. POWER UP AND POWER DOWN The LM70 always powers up in a known state. The power up default condition is continuous conversion mode. Immediatly after power up the LM70 will output an erroneous code until the first temperature conversion has completed. When the supply voltage is less than about 1.6V (typical), the LM70 is considered powered down. As the supply voltage rises above the nominal 1.6V power up threshold, the internal registers are reset to the power up default statedescribedabove. SERIAL BUS INTERFACE The LM70 operates as a slave and is compatible with SPI or MICROWIRE bus specifications. Data is clocked out on the falling edge of the serial clock (SC), while data is clocked in on the rising edge of SC. A complete transmit/receivecommunicationwillconsistof32serialclocks.Thefirst16clockscomprisethetransmitphaseof communication,whilethesecond16clocksarethereceivephase. When CS is high SI/O will be in TRISTATE. Communication should be initiated by taking chip select (CS) low. This should not be done when SC is changing from a low to high state. Once CS is low the serial I/O pin (SI/O) will transmit the first bit of data. The master can then read this bit with the rising edge of SC. The remainder of the data will be clocked out by the falling edge of SC. Once the 14 bits of data (one sign bit, ten temperature bits and 3 high bits) are transmitted the SI/O line will go into TRI-STATE. CS can be taken high at any time during the transmit phase. If CS is brought low in the middle of a conversion the LM70 will complete the conversion and theoutputshiftregisterwillbeupdatedafterCSisbroughtbackhigh. The receive phase of a communication starts after 16 SC periods. CS can remain low for 32 SC cycles. The LM70 will read the data available on the SI/O line on the rising edge of the serial clock. Input data is to an 8-bit shift register. The part will detect the last eight bits shifted into the register. The receive phase can last up to 16 SC periods. All ones must be shifted in order to place the part into shutdown. A zero in any location will take the LM70outofshutdown.ThefollowingcodesonlyshouldbetransmittedtotheLM70: • 00hex(normaloperation) • 01hex(normaloperation) • 03hex(normaloperation) • 07hex(normaloperation) • 0Fhex(normaloperation) • 1Fhex(normaloperation) • 3Fhex(normaloperation) • 7Fhex(normaloperation) • FFhex(Shutdown,transmitmanufacturer'sID) any others may place the part into a Test Mode. Test Modes are used by TI to thoroughly test the function of the LM70 during production testing. Only eight bits have been defined above since only the last eight transmitted, beforeCSistakenHIGH,aredetectedbytheLM70 ThefollowingcommunicationcanbeusedtodeterminetheManufacturer's/DeviceIDandthenimmediatelyplace thepartintocontinuousconversionmode.WithCScontinuouslylow: • Read16bitsoftemperaturedata • Write16bitsofdatacommandingshutdown • Read16bitsofManufacture's/DeviceIDdata • Write8to16bitsofdatacommandingConversionMode • TakeCSHIGH. Copyright©2000–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:LM70

LM70 SNIS112G–JUNE2000–REVISEDMARCH2013 www.ti.com Note that 210 ms will have to pass for a conversion to complete before the LM70 actually transmits temperature data. TEMPERATURE DATA FORMAT Temperature data is represented by a 11-bit, two's complement word with an LSB (Least Significant Bit) equal to 0.25°C: DigitalOutput Temperature Binary Hex +150°C 0100101100011111 4B1Fh +125°C 0011111010011111 3E9Fh +25°C 0000110010011111 0B9Fh +0.25°C 0000000000111111 003Fh 0°C 0000000000011111 001Fh −0.25°C 1111111111111111 FFFFh −25°C 1111001110011111 F39Fh −55°C 1110010010011111 E49Fh Note:ThelasttwobitsareTRI-STATEanddepictedasoneinthetable. The first data byte is the most significant byte with most significant bit first, permitting only as much data as necessary to be read to determine temperature condition. For instance, if the first four bits of the temperature data indicate an overtemperature condition, the host processor could immediately take action to remedy the excessivetemperatures. SHUTDOWN MODE/MANUFACTURER'S ID Shutdown mode is enabled by writing XX FF to the LM70 as shown in Figure 14c. and discussed in Section 1.2. TheserialbusisstillactivewhentheLM70isinshutdown.Currentdrawdropstolessthan10µAbetweenserial communications. When in shutdown mode the LM70 always will output 1000 0001 0000 00XX. This is the manufacturer's ID/Device ID information. The first 5-bits of the field (1000 0XXX) are reserved for manufacturer's ID. INTERNAL REGISTER STRUCTURE The LM70 has three registers, the temperature register, the configuration register and the manufacturer's/device identification register. The temperature and manufacturer's/device identification registers are read only. The configurationregisteriswriteonly. CONFIGURATIONREGISTER (Selectsshutdownorcontinuousconversionmodes): Table1.(WriteOnly): D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 X X X X X X X X Shutdown D0-D15settoXXFFhexenablesshutdownmode. D0-D15settoXX00hexenablescontinuousconversionmode. Note: setting D0-D15 to any other values may place the LM70 into a manufacturer's test mode, upon which the LM70 will stop responding as described. These test modes are to be used for production testing only. See Section1.2SerialBusInterfaceforacompletediscussion. 10 SubmitDocumentationFeedback Copyright©2000–2013,TexasInstrumentsIncorporated ProductFolderLinks:LM70

LM70 www.ti.com SNIS112G–JUNE2000–REVISEDMARCH2013 TEMPERATUREREGISTER Table2.(ReadOnly): D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 MSB Bit9 Bit8 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 LSB 1 1 1 X X D0–D1:Undefined.TRI-STATEwillbeoutputonSI/0. D2–D4:Alwayssethigh. D5–D15:TemperatureData.OneLSB=0.25°C.Two'scomplementformat. MANUFACTURER'S/DEVICEIDREGISTER Table3.(ReadOnly): D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 1 0 0 0 0 0 0 1 0 0 0 0 0 0 X X D0–D1:Undefined.TRI-STATEwillbeoutputonSI/0. D2-D4:AlwayssetLOW. D5–D15:Manufacturer'sIDData.ThisregisterisaccessedwhenevertheLM70isinshutdownmode. Serial Bus Timing Diagrams Figure12. a)ReadingContinuousConversion-SingleEight-BitFrame Figure13. b)ReadingContinuousConversion-TwoEight-BitFrames Figure14. c)WritingShutdownControl Copyright©2000–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:LM70

LM70 SNIS112G–JUNE2000–REVISEDMARCH2013 www.ti.com Application Hints To get the expected results when measuring temperature with an integrated circuit temperature sensor like the LM70, it is important to understand that the sensor measures its own die temperature. For the LM70, the best thermal path between the die and the outside world is through the LM70's pins. In the VSSOP-8 package the ground pin is connected to the back side of the LM70 die and thus has the most effect on the die temperature. Although the other pins will also have some effect on the LM70die temperature and therefore should not be discounted. The LM70 will provide an accurate measurement of the temperature of the printed circuit board on which it is mounted, because the pins represent a good thermal path to the die. A less efficient thermal path exists between the plastic package and the LM70 die. If the ambient air temperature is significantly different from theprintedcircuitboardtemperature,itwillhaveasmalleffectonthemeasuredtemperature. In probe-type applications, the LM70 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or screwed into a threaded hole in a tank. As with any IC, the LM70 and accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such as Humiseal and epoxy paints or dips are often used to insure that moisture cannot corrode the LM70 or its connections. TypicalApplications Figure15. TemperatureMonitorUsingIntel196Processor 12 SubmitDocumentationFeedback Copyright©2000–2013,TexasInstrumentsIncorporated ProductFolderLinks:LM70

LM70 www.ti.com SNIS112G–JUNE2000–REVISEDMARCH2013 Figure16. LM70DigitalInputControlUsingMicro-Controller'sGeneralPurposeI/O Copyright©2000–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:LM70

LM70 SNIS112G–JUNE2000–REVISEDMARCH2013 www.ti.com REVISION HISTORY ChangesfromRevisionF(March2013)toRevisionG Page • ChangedlayoutofNationalDataSheettoTIformat.......................................................................................................... 13 14 SubmitDocumentationFeedback Copyright©2000–2013,TexasInstrumentsIncorporated ProductFolderLinks:LM70

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) LM70CILD-3/NOPB ACTIVE WSON NGK 8 1000 Green (RoHS SN Level-3-260C-168 HR -55 to 150 T33 & no Sb/Br) LM70CILD-5/NOPB ACTIVE WSON NGK 8 1000 Green (RoHS SN Level-3-260C-168 HR -55 to 150 T35 & no Sb/Br) LM70CILDX-3/NOPB ACTIVE WSON NGK 8 4500 Green (RoHS SN Level-3-260C-168 HR -55 to 150 T33 & no Sb/Br) LM70CIMM-3 NRND VSSOP DGK 8 1000 TBD Call TI Call TI -55 to 150 T04C LM70CIMM-3/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS SN Level-1-260C-UNLIM -55 to 150 T04C & no Sb/Br) LM70CIMM-5 NRND VSSOP DGK 8 1000 TBD Call TI Call TI -55 to 150 T03C LM70CIMM-5/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS SN Level-1-260C-UNLIM -55 to 150 T03C & no Sb/Br) LM70CIMMX-3/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS SN Level-1-260C-UNLIM -55 to 150 T04C & no Sb/Br) LM70CIMMX-5/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS SN Level-1-260C-UNLIM -55 to 150 T03C & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) LM70CILD-3/NOPB WSON NGK 8 1000 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1 LM70CILD-5/NOPB WSON NGK 8 1000 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1 LM70CILDX-3/NOPB WSON NGK 8 4500 330.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1 LM70CIMM-3 VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM70CIMM-3/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM70CIMM-5 VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM70CIMM-5/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM70CIMMX-3/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM70CIMMX-5/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) LM70CILD-3/NOPB WSON NGK 8 1000 210.0 185.0 35.0 LM70CILD-5/NOPB WSON NGK 8 1000 210.0 185.0 35.0 LM70CILDX-3/NOPB WSON NGK 8 4500 367.0 367.0 35.0 LM70CIMM-3 VSSOP DGK 8 1000 210.0 185.0 35.0 LM70CIMM-3/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LM70CIMM-5 VSSOP DGK 8 1000 210.0 185.0 35.0 LM70CIMM-5/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LM70CIMMX-3/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0 LM70CIMMX-5/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0 PackMaterials-Page2

MECHANICAL DATA NGK0008A LDA08A (Rev C) www.ti.com

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