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ICGOO电子元器件商城为您提供LM3880MF-1AD/NOPB由Texas Instruments设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 LM3880MF-1AD/NOPB价格参考。Texas InstrumentsLM3880MF-1AD/NOPB封装/规格:PMIC - 电源控制器,监视器, Power Supply Controller Power Supply Sequencer SOT-23-6。您可以下载LM3880MF-1AD/NOPB参考资料、Datasheet数据手册功能说明书,资料中有LM3880MF-1AD/NOPB 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

集成电路 (IC)半导体

描述

IC PWR SUPPLY SEQUENCER SOT23-6监控电路 Power Sequencer 6-SOT-23 -40 to 125

DevelopmentKit

LM3880EVAL

产品分类

PMIC - 电源控制器,监视器

品牌

Texas Instruments

产品手册

点击此处下载产品Datasheet

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

电源管理 IC,监控电路,Texas Instruments LM3880MF-1AD/NOPB-

NumberofInputsMonitored

1 Input

数据手册

点击此处下载产品Datasheet

产品型号

LM3880MF-1AD/NOPB

产品培训模块

http://www.digikey.cn/PTM/IndividualPTM.page?site=cn&lang=zhs&ptm=30141

产品目录页面

点击此处下载产品Datasheet

产品种类

监控电路

人工复位

No Manual Reset

供应商器件封装

SOT-23-6

其它名称

LM3880MF-1AD/NOPBDKR
LM3880MF-1ADDKR
LM3880MF-1ADDKR-ND

制造商产品页

http://www.ti.com/general/docs/suppproductinfo.tsp?distId=10&orderablePartNumber=LM3880MF-1AD/NOPB

包装

Digi-Reel®

商标

Texas Instruments

安装类型

表面贴装

封装

Reel

封装/外壳

SOT-23-6

封装/箱体

SOT-23-6

工作温度

-40°C ~ 125°C

工作电源电流

25 uA

工厂包装数量

1000

应用

电源序列发生器

最小工作温度

- 40 C

标准包装

1

电压-电源

2.7 V ~ 5.5 V

电压-输入

-

电池备用开关

No Backup

电流-电源

25µA

电源电压-最大

5.5 V

电源电压-最小

2.7 V

监视器

No Watchdog

类型

Voltage Sequencers

系列

LM3880

被监测输入数

3 Input

设计资源

http://www.digikey.com/product-highlights/cn/zh/texas-instruments-webench-design-center/3176

输出类型

Open Collector / Drain

配用

/product-detail/zh/LM3880EVAL/LM3880EVAL-ND/1640692

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PDF Datasheet 数据手册内容提取

Product Order Technical Tools & Support & Folder Now Documents Software Community LM3880 SNVS451L–AUGUST2006–REVISEDNOVEMBER2018 LM3880 Three-Rail Simple Power Sequencer 1 Features 3 Description • QualifiedforAutomotiveApplications The LM3880 simple power supply sequencer offers 1 the easiest method to control power up sequencing • SimpleSolutionforSequencing3VoltageRails and power down sequencing of multiple Independent fromaSingleInputSignal voltage rails. By staggering the startup sequence, it is • EasilyCascadeupto3DevicestoSequenceas possible to avoid latch conditions or large in-rush Manyas9VoltageRails currentsthatcanaffectthereliabilityofthesystem. • Power-UpandPower-DownControl Available in a 6-pin SOT-23-6 package, the Simple • Tiny2.9-mmx1.9-mmFootprint Sequencer contains a precision enable pin and three open-drain output flags. The open-drain output flags • LowQuiescentCurrentof25µA permit that they can be pulled up to distinct voltage • InputVoltageRangeof2.7Vto5.5V supplies separate from the sequencer V (so long DD • StandardTimingOptionsAvailable as they do not exceed the recommended maximum voltage of 0.3V greater than V ), so as to interface DD 2 Applications with ICs requiring a range of different enable signals. When the LM3880 is enabled, the three output flags • AdvancedDriverAssistanceSystems(ADAS) will sequentially release, after individual time delays, • AutomotiveCameraModules thus permitting the connected power supplies to start • SecurityCameras up. The output flags will follow a reverse sequence duringpowerdowntoavoidlatchconditions. • Servers • NetworkingElements EPROM capability allows every delay and sequence to be fully adjustable. Contact Texas Instruments if a • FPGAPowerSupplySequencing nonstandardconfigurationisrequired. • MicroprocessorandMicrocontrollerSequencing • MultipleSupplySequencing DeviceInformation(1) PARTNUMBER PACKAGE BODYSIZE(NOM) LM3880 DBVSOT(6) 2.90mm×1.60mm (1) For all available packages, see the orderable addendum at theendofthedatasheet. SimplePowerSupplySequencing Input Supply 1 VCC Power Enable Supply 1 FLAG1 6 Power FLAG2 5 Enable Enable 3 EN Supply 2 FLAG3 4 Enable Power GND Supply 3 2 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

LM3880 SNVS451L–AUGUST2006–REVISEDNOVEMBER2018 www.ti.com Table of Contents 1 Features.................................................................. 1 7.4 DeviceFunctionalModes........................................12 2 Applications........................................................... 1 8 ApplicationandImplementation........................ 13 3 Description............................................................. 1 8.1 ApplicationInformation............................................13 4 RevisionHistory..................................................... 2 8.2 TypicalApplication..................................................13 8.3 Do'sandDon'ts ......................................................15 5 PinConfigurationandFunctions......................... 3 9 PowerSupplyRecommendations...................... 17 6 Specifications......................................................... 4 10 Layout................................................................... 17 6.1 AbsoluteMaximumRatings......................................4 6.2 ESDRatings..............................................................4 10.1 LayoutGuidelines.................................................17 6.3 RecommendedOperatingConditions.......................4 10.2 LayoutExample....................................................17 6.4 ThermalInformation..................................................4 11 DeviceandDocumentationSupport................. 19 6.5 ElectricalCharacteristics...........................................5 11.1 DeviceSupport......................................................19 6.6 TypicalCharacteristics..............................................7 11.2 CommunityResources..........................................20 7 DetailedDescription.............................................. 9 11.3 Trademarks...........................................................20 7.1 Overview...................................................................9 11.4 ElectrostaticDischargeCaution............................20 7.2 FunctionalBlockDiagram.........................................9 11.5 Glossary................................................................20 7.3 FeatureDescription...................................................9 12 Mechanical,Packaging,andOrderable Information........................................................... 20 4 Revision History NOTE:Pagenumbersforpreviousrevisionsmaydifferfrompagenumbersinthecurrentversion. ChangesfromRevisionK(February2016)toRevisionL Page • UpdatedFeaturestospecifyhowmanyrailscanbesequencedbyasingledevice ............................................................ 1 • Addedfeaturethatdevicescanbecascaded ....................................................................................................................... 1 • SpecifieddevicedimensionsinFeatures............................................................................................................................... 1 • SpecifiedFPGAPowerSupplySequencinginApplications.................................................................................................. 1 • AddednoteindescriptionaboutopendrainFLAGpins......................................................................................................... 1 • AddedI/OcolumntoPinFunctionstable............................................................................................................................... 3 • ChangedPartNomenclaturesectiontoDeviceNomenclaturesection................................................................................ 19 ChangesfromRevisionJ(December2014)toRevisionK Page • ChangedHandlingRatingstoESDRatingsandmovedstoragetemperaturetoAbsoluteMaximumRatings.....................4 • Removed“CustomizedTimingandSequence”section ...................................................................................................... 12 • Addedcrossreferencestotimingdiagrams......................................................................................................................... 19 ChangesfromRevisionI(March2013)toRevisionJ Page • AddedHandlingRatingtable,FeatureDescriptionsection,DeviceFunctionalModes,Applicationand Implementationsection,PowerSupplyRecommendationssection,Layoutsection,DeviceandDocumentation Supportsection,andMechanical,Packaging,andOrderableInformationsection ............................................................... 4 ChangesfromRevisionH(March2013)toRevisionI Page • ChangedlayoutofNationalDataSheettoTIformat........................................................................................................... 19 2 SubmitDocumentationFeedback Copyright©2006–2018,TexasInstrumentsIncorporated ProductFolderLinks:LM3880

LM3880 www.ti.com SNVS451L–AUGUST2006–REVISEDNOVEMBER2018 5 Pin Configuration and Functions DBVPackage 6-PinSOT-23 TopView VCC 1 6 FLAG1 GND 2 5 FLAG2 EN 3 4 FLAG3 PinFunctions PIN I/O(1) DESCRIPTION NAME NO. EN 3 I Precisionenablepin FLAG1 6 O Open-drainoutput1 FLAG2 5 O Open-drainoutput2 FLAG3 4 O Open-drainoutput3 GND 2 G Ground VCC 1 I Inputsupply (1) I=input,O=output,G=ground Copyright©2006–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM3880

LM3880 SNVS451L–AUGUST2006–REVISEDNOVEMBER2018 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings overoperatingfree-airtemperature(unlessotherwisenoted) (1)(2) MIN MAX UNIT VCC –0.3 6 V EN,FLAG1,FLAG2,FLAG3 –0.3 6 V MaximumFlagONcurrent 50 mA MaximumJunctiontemperature 150 °C Leadtemperature(Soldering,5s) 260 °C StoragetemperatureT –65 150 °C stg (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,whichdonotimplyfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommended OperatingConditions.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexasInstrumentsSalesOffice/Distributorsforavailabilityand specifications. 6.2 ESD Ratings VALUE UNIT V Electrostaticdischarge Humanbodymodel(HBM),perANSI/ESDA/JEDECJS-001,allpins (1) ±2 kV (ESD) (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess. 6.3 Recommended Operating Conditions overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT VCCtoGND 2.7 5.5 V EN,FLAG1,FLAG2,FLAG3 –0.3 V +0.3 V CC Junctiontemperature –40 125 °C 6.4 Thermal Information LM3880 THERMALMETRIC(1) DBV(SOT-23) UNIT 6PINS R Junction-to-ambientthermalresistance 187.6 °C/W θJA R Junction-to-case(top)thermalresistance 127.4 °C/W θJC(top) R Junction-to-boardthermalresistance 31.5 °C/W θJB ψ Junction-to-topcharacterizationparameter 23.3 °C/W JT ψ Junction-to-boardcharacterizationparameter 31.0 °C/W JB (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheICPackageThermalMetricsapplicationreport,SPRA953. 4 SubmitDocumentationFeedback Copyright©2006–2018,TexasInstrumentsIncorporated ProductFolderLinks:LM3880

LM3880 www.ti.com SNVS451L–AUGUST2006–REVISEDNOVEMBER2018 6.5 Electrical Characteristics LimitsapplytoalltimingoptionsandV =3.3V,unlessotherwisespecified.MinimumandMaximumlimitsapplyoverthefull CC OperatingTemperatureRange(T =-40°Cto+125°C)andarespecifiedthroughtest,designorstatisticalcorrelation.Typical J valuesrepresentthemostlikelyparametricnormatT =25°Candareprovidedforreferencepurposesonly. J PARAMETER TESTCONDITIONS MIN(1) TYP(2) MAX(1) UNIT I OperatingQuiescentcurrent 25 80 µA Q OPEN-DRAINFLAGS I FLAGxLeakageCurrent V =3.3V 1 20 nA FLAG FLAGx V FLAGxOutputVoltageLow I =1.2mA 0.4 V OL FLAGx POWER-UPSEQUENCE t Timerdelay1accuracy AllOtherTimingOptions –15% 15% d1 2msTimingOption –20% 20% t Timerdelay2accuracy AllOtherTimingOptions –15% 15% d2 2msTimingOption –20% 20% t Timerdelay3accuracy AllOtherTimingOptions –15% 15% d3 2msTimingOption –20% 20% POWER-DOWNSEQUENCE t Timerdelay4accuracy AllOtherTimingOptions –15% 15% d4 2msTimingOption –20% 20% t Timerdelay5accuracy AllOtherTimingOptions –15% 15% d5 2msTimingOption –20% 20% t Timerdelay6accuracy AllOtherTimingOptions –15% 15% d6 2msTimingOption –20% 20% TIMINGDELAYERROR (t –400 Ratiooftimingdelays Forx=1or4 95% 105% d(x) µs)/t d(x+1) Forx=1or4,2msoption 90% 110% t /t Ratiooftimingdelays Forx=2or5 95% 105% d(x) d(x+1) Forx=2or5,2msoption 90% 110% ENABLEPIN V ENpinthreshold 1.0 1.25 1.4 V EN I ENpinpullupcurrent V =0V 7 µA EN EN (1) Limitsare100%productiontestedat25°.LimitsovertheoperatingtemperaturerangeareensuredthroughcorrelationusingStatistical QualityControl(SQC)methods.ThelimitsareusedtocalculateTI'sAverageOutgoingQualityLevel(AOQL). (2) Typicalnumbersareat25°Candrepresentthemostlikelyparametricnorm. TimingRequirements EN FLAG1 FLAG2 FLAG3 td1 td2 td3 AllstandardoptionsuseSequence1foroutputflagsriseandfallorder.Refertosection11.1.2fordetailsofdifferent sequencespossible. Figure1. Power-UpSequence Copyright©2006–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM3880

LM3880 SNVS451L–AUGUST2006–REVISEDNOVEMBER2018 www.ti.com EN FLAG1 FLAG2 FLAG3 td4 td5 td6 AllstandardoptionsuseSequence1foroutputflagsriseandfallorder.Refertosection11.1.2fordetailsofdifferent sequencespossible. Figure2. Power-DownSequence 6 SubmitDocumentationFeedback Copyright©2006–2018,TexasInstrumentsIncorporated ProductFolderLinks:LM3880

LM3880 www.ti.com SNVS451L–AUGUST2006–REVISEDNOVEMBER2018 6.6 Typical Characteristics 30 26 29 25 28 27 24 26 )A )A ( PQ 25 ( PQ 23 I 24 I 23 22 22 21 21 20 20 2.5 3 3.5 4 4.5 5 5.5 -40-25-10 5 20 35 50 65 80 95110125 TEMPERATURE (oC) VCC (V) Figure3.QuiescentCurrentvsVCC Figure4.QuiescentCurrentvsTemperature(VCC=3.3V) 1.232 1.230 1.228 1.226 RISING )V 1.224 ( N FALLING VE 1.222 1.220 1.218 1.216 1.214 -40-25-10 5 20 35 50 65 80 95 110125 TEMPERATURE (°C) Figure5.EnableThresholdvsTemperature Figure6.TimeDelay(30ms)vsVcc Figure7.TimeDelayRatiovsTemperature Figure8.TimeDelay(30ms)vsTemperature Copyright©2006–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM3880

LM3880 SNVS451L–AUGUST2006–REVISEDNOVEMBER2018 www.ti.com Typical Characteristics (continued) Figure9.FlagV vsVcc(R =100kΩ) Figure10.FlagVoltagevsCurrent OL FLAG 8 SubmitDocumentationFeedback Copyright©2006–2018,TexasInstrumentsIncorporated ProductFolderLinks:LM3880

LM3880 www.ti.com SNVS451L–AUGUST2006–REVISEDNOVEMBER2018 7 Detailed Description 7.1 Overview The LM3880 simple power supply sequencer provides a simple solution for sequencing multiple rails in a controlled manner. Six independent timers are integrated to control the timing sequence (power up and power down)ofthreeopen-drainoutputflags.Theseflagspermitconnectiontoeitherashutdownorenablepinoflinear regulators and switchers to control the operation of the power supplies. This allows design of a complete power systemwithoutconcernforlargeinrushcurrentsorlatch-upconditionsthatcanoccur. The timing sequence of the device is controlled entirely by the enable (EN) pin. Upon power up, all the flags are held low until this precision enable is pulled high. When the EN pin is asserted, the power-up sequence starts. An internal counter delays the first flag (FLAG1) from rising until a fixed time period has expired. When the first flag is released, another timer will begin to delay the release of the second flag (FLAG2). This process repeats untilallthreeflagshavesequentiallybeenreleased. The power-down sequence is the same as power-up sequence, but in reverse. When the EN pin is deasserted a timer will begin that delays the third flag (FLAG3) from pulling low. The second and first flag will then follow in a sequential manner after their appropriate delays. The three timers that are used to control the power-down schemecanalsobeindividuallyprogrammedandarecompletelyindependentofthepower-uptimers. 7.2 Functional Block Diagram VCC FLAG1 7 µA tD1 tD2 EN + tD3 FLAG2 Timing Sequence Delay 1.25 V Generation tD4 Control Master tD5 Clock FLAG3 tD6 EEPROM (Factory Set) GND 7.3 Feature Description 7.3.1 EnablePinOperation The timing sequence of the LM3880 is controlled by the assertion of the enable signal. The enable pin is designedwithaninternalcomparator,referencedtoabandgapvoltage(1.25V),toprovideaprecisionthreshold. This allows a delayed timing to be externally set using a capacitor or to start the sequencing based on a certain event, such as a line voltage reaching 90% of nominal. For an additional delayed sequence from the rail poweringVCC,simplyattachacapacitortotheENpinasshowninFigure11. Copyright©2006–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:LM3880

LM3880 SNVS451L–AUGUST2006–REVISEDNOVEMBER2018 www.ti.com Feature Description (continued) 7 µA EN + Enable CEN 1.25 V Figure11. CapacitorTiming Using the internal pullup current source to charge the external capacitor (C ) the enable pin delay can be EN calculatedbyEquation1: 1.25V x CEN tenable_delay = 7 PA (1) A resistor divider can also be used to enable the device based on a certain voltage threshold. Take care when sizingtheresistordividertoincludetheeffectsoftheinternalcurrentsource. One of the features of the EN pin is that it provides glitch free operation. The first timer will start counting at a rising threshold, but will always reset if the EN pin is deasserted before the first output flag is released. This can beshowninFigure12: EN FLAG1 td1 Figure12. ENGlitch 7.3.2 IncompleteSequenceOperation If the enable signal remains high for the entire power-up sequence, then the part will operate as shown in the standard timing diagrams. However, if the enable signal is de-asserted before the power-up sequence is completed the part will enter a controlled shutdown. This allows the system to walk through a controlled power cycling, preventing any latch conditions from occurring. This state only occurs if the enable pin is deasserted afterthecompletionoftimer1,butbeforetheentirepower-upsequenceiscompleted. When this event occurs, the falling edge of EN pin resets the current timer and will allow the remaining power-up cycle to complete before beginning the power-down sequence. The power down sequence starts approximately 120 ms after the final power-up flag. This allows output voltages in the system to stabilize before everything is shutdown.AnexampleofthisoperationcanbeseeninFigure13: 10 SubmitDocumentationFeedback Copyright©2006–2018,TexasInstrumentsIncorporated ProductFolderLinks:LM3880

LM3880 www.ti.com SNVS451L–AUGUST2006–REVISEDNOVEMBER2018 Feature Description (continued) EN FLAG1 FLAG2 FLAG3 td1 td2 td3 120 ms td4 td5 td6 Figure13. IncompletePower-UpSequence When the enable signal is deasserted, the part will commence its power-down sequence. If the enable signal is pulled high before the power-down sequence is completed, the part will ensure completion of the power-down sequence before starting power-up. This ensures that the system does not partially power down and power up and helps prevent latch-up events, such as in FPGAs and microprocessors. This state only occurs if the enable pinispulledhighafterthecompletionoftimer1,butbeforetheentirepower-downsequenceiscompleted. Whenthiseventoccurs,therisingedgeofenablepinresetsthecurrenttimerandwillallowtheremainingpower- down cycle to complete before beginning the power-up sequence. The power-up sequence starts approximately 120 ms after the final power-down flag. This allows the system to fully shut down before it is powered up. An exampleofthisoperationcanbeseeninFigure14: EN FLAG1 FLAG2 FLAG3 ttd1t ttd2t ttd3t t120 mst ttd4t ttd5t ttd6t Figure14. IncompletePower-DownSequence All the internal timers are generated by a master clock that has an extremely low tempco. This allows for tight accuracy across temperature and a consistent ratio between the individual timers. There is a slight additional delay of approximately 400 µs to timers 1 and 4, which is a result of the EPROM refresh. This refresh time is in additiontotheprogrammeddelaytimeandwillbealmostinsignificanttoallbuttheshortestoftimerdelays. Copyright©2006–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:LM3880

LM3880 SNVS451L–AUGUST2006–REVISEDNOVEMBER2018 www.ti.com 7.4 Device Functional Modes 7.4.1 PowerUpWithENPin The timing sequence of the Simple Power Supply Sequencer is controlled entirely by the enable (EN) pin. Upon power up, all the flags are held low until this precision enable is pulled high. After the EN pin is asserted, the power-upsequencewillcommence. 7.4.2 PowerDownWithENPin When EN pin is deasserted, the power down sequence will commence. A timer will begin that delays the third flag (FLAG3) from pulling low. The second and first flag will then follow in a sequential manner after their appropriatedelays. 12 SubmitDocumentationFeedback Copyright©2006–2018,TexasInstrumentsIncorporated ProductFolderLinks:LM3880

LM3880 www.ti.com SNVS451L–AUGUST2006–REVISEDNOVEMBER2018 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validateandtesttheirdesignimplementationtoconfirmsystemfunctionality. 8.1 Application Information 8.1.1 OpenDrainFlagsPullup The Simple Power Supply Sequencer contains three open-drain output flags which need to be pulled up for properoperation.100-kΩ resistorscanbeusedaspullupresistors. 8.1.2 EnabletheDevice SeeEnablePinOperation. 8.2 Typical Application 8.2.1 SimpleSequencingofThreePowerSupplies The Simple Power Supply Sequencer is used to implement a power-up and power-down sequence of three powersupplies. Sequence 1 for the LM3880, e.g. orderable part number LM3880MF-1AA has a power-up sequence (1 – 2 – 3) and power-down sequence (3 – 2 –1). See Table 3 and Table 4 for other sequence options or contact TI if other sequenceoptionsaredesired. Figure15. TypicalApplicationCircuit Copyright©2006–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:LM3880

LM3880 SNVS451L–AUGUST2006–REVISEDNOVEMBER2018 www.ti.com Typical Application (continued) 8.2.1.1 DesignRequirements For this design example, use the parameters listed in Table 1 as the input parameters. The circuit shown in Figure15canhavevariouspower-downsequencesdependingonthesequencethepartisprogrammedfor.See Table3fordifferentpower-downsequenceoptions. Table1.DesignParameters DESIGNPARAMETER EXAMPLEVALUE InputSupplyvoltagerange 2.7Vto5.5V FlagOutputvoltage,ENhigh InputSupply FlagOutputvoltage,ENlow 0V FlagTimingDelay 30ms Power-UpSequence 1-2-3 Power-DownSequence 3-2-1 8.2.1.2 DetailedDesignProcedure Table2.BillofMaterials DESIGNATOR DESCRIPTION DEVICE QUANTITY MANUFACTURER U1 LM3880,Sequence1,30mstiming LM3880 1 TexasInstruments R1 100-kΩResistor,0603 CRCW0603100KFKEA 1 Vishay R2 100-kΩResistor,0603 CRCW0603100KFKEA 1 Vishay R3 100-kΩResistor,0603 CRCW0603100KFKEA 1 Vishay This application uses the Sequence 1 and 30-ms timing options of the Simple Power Supply Sequencer. See ApplicationCurvesfordetailsonthesequenceandtimingoption. 8.2.1.3 ApplicationCurves Figure16.Power-UpSequencefor Figure17.Power-DownSequencefor LM3880MF-1AE LM3880MF-1AE 14 SubmitDocumentationFeedback Copyright©2006–2018,TexasInstrumentsIncorporated ProductFolderLinks:LM3880

LM3880 www.ti.com SNVS451L–AUGUST2006–REVISEDNOVEMBER2018 8.2.2 SequencingUsingIndependentFlagSupply For applications requiring a flag output voltage that is different from the VCC, a separate Flag Supply may be used to pullup the open-drain outputs of the simple power supply sequencer. This is useful when interfacing the flag outputs with inputs that require a different voltage than VCC. The designer must ensure the flag supply voltageisnottakenaboveVCC+0.3VasspecifiedintheRecommendedOperatingConditions. Figure18. SequencingUsingIndependentFlagSupply 8.3 Do's and Don'ts Connecting the EN pin to VCC is not recommended. During power up, the EN voltage should be kept below the EN threshold until VCC rises above the minimum operating voltage. This will be violated if EN is connected to VCC, and undefined operation at the flag outputs can occur, especially during slow VCC rising slew rates. For systems requiring only power-up sequencing, a capacitor at the EN pin can be used to create a delay or a resistor divider can be used to enable the device based on a certain voltage threshold. While these solutions will work for power-up, it will not power-down the flag outputs in sequential fashion since the flag outputs will simply follow the input supply. For systems requiring both power-up and power-down sequencing, an external enable signal should be used, such as a GPIO signal from a microcontroller, to properly control power-up and power- downoftheflagoutputs. Copyright©2006–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 15 ProductFolderLinks:LM3880

LM3880 SNVS451L–AUGUST2006–REVISEDNOVEMBER2018 www.ti.com Do's and Don'ts (continued) Figure19. RecommendedENConnection 16 SubmitDocumentationFeedback Copyright©2006–2018,TexasInstrumentsIncorporated ProductFolderLinks:LM3880

LM3880 www.ti.com SNVS451L–AUGUST2006–REVISEDNOVEMBER2018 9 Power Supply Recommendations The VCC pin should be located as close as possible to the input supply (2.7–5.5 V). An input capacitor is not required but is recommended when noise might be present on the VCC pin. A 0.1-μF ceramic capacitor may be usedtobypassthisnoise. 10 Layout 10.1 Layout Guidelines • Pullup resistors should be connected between the flag output pins and a positive input supply, usually VCC. An independent flag supply may also be used. These resistors should be placed as close as possible to the Simple Power Supply Sequencer and the flag supply. Minimal trace length is recommended to make the connections.Atypicalvalueforthepullupresistorsis100kΩ. • For very tight sequencing requirements, minimal and equal trace lengths should be used to connect the flag outputs to the desired inputs. This will reduce any propagation delay and timing errors between the flag outputsalongtheline. 10.2 Layout Example Figure20andFigure21arelayoutexamplesfortheLM3880.TheseexamplesaretakenfromtheLM3880EVAL. Figure20. LM3880Top Copyright©2006–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 17 ProductFolderLinks:LM3880

LM3880 SNVS451L–AUGUST2006–REVISEDNOVEMBER2018 www.ti.com Layout Example (continued) Figure21. LM3880Bottom 18 SubmitDocumentationFeedback Copyright©2006–2018,TexasInstrumentsIncorporated ProductFolderLinks:LM3880

LM3880 www.ti.com SNVS451L–AUGUST2006–REVISEDNOVEMBER2018 11 Device and Documentation Support 11.1 Device Support 11.1.1 Third-PartyProductsDisclaimer TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONEORINCOMBINATIONWITHANYTIPRODUCTORSERVICE. 11.1.2 DeviceNomenclature ThelistofpartsavailabletoorderappearinthePackageOptionAddendum. Figure22. DeviceNomenclature Table3.SequenceDesignatorTable (1) FLAGORDER SEQUENCENUMBER POWERUP POWERDOWN 1 1-2-3 3-2-1 2 1-2-3 3-1-2 3 1-2-3 2-3-1 4 1-2-3 2-1-3 5 1-2-3 1-3-2 6 1-2-3 1-2-3 (1) SeeFigure1andFigure2. Table4.TimingDesignatorTable(1) TIMING DELAYS(ms) DESIGNATOR t t t t t t d1 d2 d3 d4 d5 d6 AA 10 10 10 10 10 10 AB 30 30 30 30 30 30 AC 60 60 60 60 60 60 AD 120 120 120 120 120 120 AE 2 2 2 2 2 2 AF 16 16 16 16 16 16 (1) SeeFigure1andFigure2. Copyright©2006–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 19 ProductFolderLinks:LM3880

LM3880 SNVS451L–AUGUST2006–REVISEDNOVEMBER2018 www.ti.com 11.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TIE2E™OnlineCommunity TI'sEngineer-to-Engineer(E2E)Community.Createdtofostercollaboration amongengineers.Ate2e.ti.com,youcanaskquestions,shareknowledge,exploreideasandhelp solveproblemswithfellowengineers. DesignSupport TI'sDesignSupport QuicklyfindhelpfulE2Eforumsalongwithdesignsupporttoolsand contactinformationfortechnicalsupport. 11.3 Trademarks E2EisatrademarkofTexasInstruments. 11.4 Electrostatic Discharge Caution Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. 11.5 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronyms,anddefinitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowser-basedversionsofthisdatasheet,refertotheleft-handnavigation. 20 SubmitDocumentationFeedback Copyright©2006–2018,TexasInstrumentsIncorporated ProductFolderLinks:LM3880

PACKAGE OPTION ADDENDUM www.ti.com 28-Nov-2018 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) LM3880MF-1AA NRND SOT-23 DBV 6 1000 TBD Call TI Call TI -40 to 125 F20A LM3880MF-1AA/NOPB ACTIVE SOT-23 DBV 6 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 F20A & no Sb/Br) LM3880MF-1AB/NOPB ACTIVE SOT-23 DBV 6 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 F21A & no Sb/Br) LM3880MF-1AC/NOPB ACTIVE SOT-23 DBV 6 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 F22A & no Sb/Br) LM3880MF-1AD/NOPB ACTIVE SOT-23 DBV 6 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 F23A & no Sb/Br) LM3880MF-1AE/NOPB ACTIVE SOT-23 DBV 6 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 F25A & no Sb/Br) LM3880MF-1AF/NOPB ACTIVE SOT-23 DBV 6 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 F31A & no Sb/Br) LM3880MFE-1AA/NOPB ACTIVE SOT-23 DBV 6 250 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 F20A & no Sb/Br) LM3880MFE-1AB/NOPB ACTIVE SOT-23 DBV 6 250 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 F21A & no Sb/Br) LM3880MFE-1AC/NOPB ACTIVE SOT-23 DBV 6 250 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 F22A & no Sb/Br) LM3880MFE-1AD/NOPB ACTIVE SOT-23 DBV 6 250 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 F23A & no Sb/Br) LM3880MFE-1AE/NOPB ACTIVE SOT-23 DBV 6 250 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 F25A & no Sb/Br) LM3880MFE-1AF/NOPB ACTIVE SOT-23 DBV 6 250 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 F31A & no Sb/Br) LM3880MFX-1AA/NOPB ACTIVE SOT-23 DBV 6 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 F20A & no Sb/Br) LM3880MFX-1AB/NOPB ACTIVE SOT-23 DBV 6 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 F21A & no Sb/Br) LM3880MFX-1AC/NOPB ACTIVE SOT-23 DBV 6 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 F22A & no Sb/Br) LM3880MFX-1AD/NOPB ACTIVE SOT-23 DBV 6 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 F23A & no Sb/Br) Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 28-Nov-2018 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) LM3880MFX-1AE/NOPB ACTIVE SOT-23 DBV 6 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 F25A & no Sb/Br) LM3880MFX-1AF/NOPB ACTIVE SOT-23 DBV 6 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 F31A & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF LM3880 : Addendum-Page 2

PACKAGE OPTION ADDENDUM www.ti.com 28-Nov-2018 •Automotive: LM3880-Q1 NOTE: Qualified Version Definitions: •Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 3

PACKAGE MATERIALS INFORMATION www.ti.com 28-Nov-2018 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) LM3880MF-1AA SOT-23 DBV 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM3880MF-1AA/NOPB SOT-23 DBV 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM3880MF-1AB/NOPB SOT-23 DBV 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM3880MF-1AC/NOPB SOT-23 DBV 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM3880MF-1AD/NOPB SOT-23 DBV 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM3880MF-1AE/NOPB SOT-23 DBV 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM3880MF-1AF/NOPB SOT-23 DBV 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM3880MFE-1AA/NOPB SOT-23 DBV 6 250 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM3880MFE-1AB/NOPB SOT-23 DBV 6 250 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM3880MFE-1AC/NOPB SOT-23 DBV 6 250 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM3880MFE-1AD/NOPB SOT-23 DBV 6 250 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM3880MFE-1AE/NOPB SOT-23 DBV 6 250 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM3880MFE-1AF/NOPB SOT-23 DBV 6 250 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM3880MFX-1AA/NOPB SOT-23 DBV 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM3880MFX-1AB/NOPB SOT-23 DBV 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM3880MFX-1AC/NOPB SOT-23 DBV 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM3880MFX-1AD/NOPB SOT-23 DBV 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM3880MFX-1AE/NOPB SOT-23 DBV 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 28-Nov-2018 Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) LM3880MFX-1AF/NOPB SOT-23 DBV 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) LM3880MF-1AA SOT-23 DBV 6 1000 210.0 185.0 35.0 LM3880MF-1AA/NOPB SOT-23 DBV 6 1000 210.0 185.0 35.0 LM3880MF-1AB/NOPB SOT-23 DBV 6 1000 210.0 185.0 35.0 LM3880MF-1AC/NOPB SOT-23 DBV 6 1000 210.0 185.0 35.0 LM3880MF-1AD/NOPB SOT-23 DBV 6 1000 210.0 185.0 35.0 LM3880MF-1AE/NOPB SOT-23 DBV 6 1000 210.0 185.0 35.0 LM3880MF-1AF/NOPB SOT-23 DBV 6 1000 210.0 185.0 35.0 LM3880MFE-1AA/NOPB SOT-23 DBV 6 250 210.0 185.0 35.0 LM3880MFE-1AB/NOPB SOT-23 DBV 6 250 210.0 185.0 35.0 LM3880MFE-1AC/NOPB SOT-23 DBV 6 250 210.0 185.0 35.0 LM3880MFE-1AD/NOPB SOT-23 DBV 6 250 210.0 185.0 35.0 LM3880MFE-1AE/NOPB SOT-23 DBV 6 250 210.0 185.0 35.0 LM3880MFE-1AF/NOPB SOT-23 DBV 6 250 210.0 185.0 35.0 LM3880MFX-1AA/NOPB SOT-23 DBV 6 3000 210.0 185.0 35.0 LM3880MFX-1AB/NOPB SOT-23 DBV 6 3000 210.0 185.0 35.0 LM3880MFX-1AC/NOPB SOT-23 DBV 6 3000 210.0 185.0 35.0 PackMaterials-Page2

PACKAGE MATERIALS INFORMATION www.ti.com 28-Nov-2018 Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) LM3880MFX-1AD/NOPB SOT-23 DBV 6 3000 210.0 185.0 35.0 LM3880MFX-1AE/NOPB SOT-23 DBV 6 3000 210.0 185.0 35.0 LM3880MFX-1AF/NOPB SOT-23 DBV 6 3000 210.0 185.0 35.0 PackMaterials-Page3

PACKAGE OUTLINE DBV0006A SOT-23 - 1.45 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 3.0 2.6 0.1 C 1.75 1.45 B A 1.45 MAX PIN 1 INDEX AREA 1 6 2X 0.95 3.05 2.75 1.9 5 2 4 3 0.50 6X 0.25 0.15 0.2 C A B (1.1) TYP 0.00 0.25 GAGE PLANE 0.22 TYP 0.08 8 TYP 0.6 0 0.3 TYP SEATING PLANE 4214840/B 03/2018 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side. 4. Leads 1,2,3 may be wider than leads 4,5,6 for package orientation. 5. Refernce JEDEC MO-178. www.ti.com

EXAMPLE BOARD LAYOUT DBV0006A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 6X (1.1) 1 6X (0.6) 6 SYMM 2 5 2X (0.95) 3 4 (R0.05) TYP (2.6) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK SOLDER MASK METAL UNDER METAL OPENING OPENING SOLDER MASK EXPOSED METAL EXPOSED METAL 0.07 MAX 0.07 MIN ARROUND ARROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS 4214840/B 03/2018 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DBV0006A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 6X (1.1) 1 6X (0.6) 6 SYMM 2 5 2X(0.95) 3 4 (R0.05) TYP (2.6) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4214840/B 03/2018 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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