Effective July 2017 Technical Data 4449 Supersedes June 2012 HCM1103 High current power inductors Applications • Voltage Regulator Module (VRM) • Multi-phase regulators • Point-of-load modules • Desktop and server VRMs and EVRDs • Base station equipment • Notebook and laptop regulators • Battery power systems • Graphics cards • Data networking and storage systems Product features Environmental Data • 11.5 x 10.3 x 3.0 mm maximum surface mount package • Storage temperature range (Component): -55 °C to +125 °C • Iron powder core material • Operating temperature range: -55 °C to +125 °C • Magnetically shielded, low EMI (ambient plus self-temperature rise) • High current carrying capacity, low core losses • Solder reflow temperature: • Inductance range from 0.12 µH to 22.0 µH J-STD-020 (latest revision) compliant • Current range from 3.0 A to 75 A • Halogen free, lead free, RoHS compliant Pb HHALOFGEN FREE

Technical Data 4449 HCM1103 Effective July 2017 High current power inductors Product Specifications Part OCL1 FLL min.2 Irms3 Isat4 @ +25 °C DCR (mΩ) @ DCR (mΩ) @ Number6 ±20% (µH) (µH) (A) (A) +20 °C Typical +20 °C Maximum K-Factor5 HCM1103-R12-R 0.12 0.07 30 75 0.55 0.61 1200 HCM1103-R36-R 0.36 0.26 23 28 1.10 1.30 711 HCM1103-R47-R 0.47 0.33 20 26 1.50 2.00 515 HCM1103-R68-R 0.68 0.38 21 23 2.90 3.40 510 HCM1103-1R0-R 1.0 0.56 15 21 5.50 6.00 377 HCM1103-2R2-R 2.2 1.2 13 16 8.40 9.00 264 HCM1103-3R3-R 3.3 1.9 9.0 14 14.5 16.0 230 HCM1103-4R7-R 4.7 2.6 7.0 13 20.5 22.5 205 HCM1103-8R2-R 8.2 4.6 5.0 8.5 35.0 38.5 153 HCM1103-100-R 10.0 5.6 5.0 7.5 40.0 44.0 141 HCM1103-150-R 15.0 8.4 4.0 6.0 59.0 65.0 114 HCM1103-220-R 22.0 12.3 3.0 5.0 90.0 99.0 91 1.Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.25 Vrms, 0.0 Adc @ 4.Isat: Peak current for approximately 30% rolloff at +25 °C +25 °C 5.K-factor: Used to determine Bp-p for core loss (see graph). Bp-p 2.Full Load Inductance (FLL) Test Parameters: 100 kHz, 0.25 Vrms, Isat @ +25 °C. = K * L * ∆I. Bp-p:(Gauss), K: (K-factor from table), 3.Irms: DC current for an approximate temperature rise of 40 °C without core L: (Inductance in µH), ∆I (peak-to-peak ripple current in Amps). loss. Derating is necessary for AC currents. PCB layout, trace thickness and 6.Part Number Definition: HCM1103-xxx-R width, air-flow and proximity of other heat generating components will affect HCM1103 = Product code and size the temperature rise. It is recommended that the temperature of the part not xxx= Inductance value in µH, R = decimal point, exceed +125 °C under worst case operating conditions verified in the end if no R is present then third character = number of zeros. application. -R suffix = RoHS compliant Dimensions (mm) Top View Top View Side View Bottom View Recommended Pad Layout Schematic HCM1103-R36-R & HCM1103-R12-R & HCM1103-R47-R HCM1103-R68-R to HCM1103-220R w ly y wlyy R R Part Marking: xxx = Inductance value in uH, R = decimal point, if no R is present then third character = # of zeros. wlyy = (Date code), R = Revision Level All soldering surfaces to be coplanar within 0.10 millimeters. Tolerances are ±0.3 millimeters unless stated otherwise. HCM1103-R36-R and HCM1103-R47-R Color: Top Grey HCM1103-R12-R and HCM1103-R68-R to HCM1103-220-R Color : Top Grey Do not route traces or vias underneath the inductor 2 www.eaton.com/electronics

HCM1103 Technical Data 4449 High current power inductors Effective July 2017 Packaging information (mm) Supplied in tape and reel packaging, 1000 parts per 13” diameter reel. R y wlyy R y wl Temperature rise vs. total loss 60.0 50.0 C) 40.0 °e ( HCM1103-R12-R s Ri HCM1103-R36-R e HCM1103-R47-R ur 30.0 at HCM1103-R68-R er HCM1103-1R0-R p m HCM1103-2R2-R Te 20.0 HCM1103-3R3-R HCM1103-4R7-R HCM1103-8R2-R HCM1103-100-R 10.0 HCM1103-150-R HCM1103-220-R 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 Total L oss (W) www.eaton.com/electronics 3

Technical Data 4449 HCM1103 Effective July 2017 High current power inductors Core loss vs. Bp-p HCM1103-; R36-R and R47-R 10000 300K 1000 200K 100K 50K W) 100 m 25K s ( s o L e r o 10 C 1 0.1 10 100 1000 10000 B (Gauss) p-p HCM1103-; R12-R, R68-R through 220-R 10000.0 500K 300K 200K 1000.0 100K 50K 25K W) 100.0 m s ( s o L e r o 10.0 C 1.0 0.1 10 100 1000 10000 B (Gauss) p-p 4 www.eaton.com/electronics

HCM1103 Technical Data 4449 High current power inductors Effective July 2017 Inductance characteristics HCM1103-R12-R HCM1103-; R36-R, R47-R 110% 110% 100% 100% 90% 90% 80% 80% L L C C % of O70% % of O70% 60% 60% 50% 50% HCM1103-R36-R 40% 40% HCM1103-R47-R 30% 30% 0 10 20 30 40 50 60 70 80 0 5 10 15 20 25 30 35 40 45 Idc (A) Idc (A) HCM1103-; R68-R, 1R0-R HCM1103-; 2R2-R, 3R3-R 110% 110% 100% 100% 90% 90% 80% 80% L C L O C % of 70% % of O70% 60% 60% 50% 50% 40% HCM1103-R68-R 40% HCM1103-2R2-R HCM1103-1R0-R HCM1103-3R3-R 30% 0 5 10 15 20 25 30 35 40 30% I (A) 0 2 4 6 8 10 12 14 16 18 20 22 24 26 dc I (A) dc HCM1103-4R7-R HCM1103-; 8R2-R, 100-R 110% 110% 100% 100% 90% 90% 80% 80% CL CL % of O70% % of O70% 60% 60% 50% 50% HCM1103-8R2-R 40% 40% HCM1103-100-R 30% 30%0000 2 4 6 8 10 12 14 0000 2 4 6 8 10 12 14 16 18 Idc (A) Idc (A) www.eaton.com/electronics 5

Technical Data 4449 HCM1103 Effective July 2017 High current power inductors Inductance characteristics 110% 100% 90% 80% L C O of 70% % 60% 50% HCM1103-150-R 40% HCM1103-220-R 30% 0 2 4 6 8 10 12 Idc (A) 6 www.eaton.com/electronics

HCM1103 Technical Data 4449 High current power inductors Effective July 2017 Solder reflow profile TP Table 1 - Standard SnPb Solder (Tc) TC -5°C Max. Ramp Up Rate = 3°C/s tP Volume Volume Package mm3 mm3 Max. Ramp Down Rate = 6°C/s Thickness <350 ≥350 TL <2.5mm) 235°C 220°C Preheat t ≥2.5mm 220°C 220°C A e Tsmax atur Table 2 - Lead (Pb) Free Solder (Tc) per Volume Volume Volume Tem Tsmin ts PThacickkangees s m<3m503 m35m03 - 2000 m>2m003 0 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C • Temperature max. (Tsmax) 150°C 200°C • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) 183°C 217°C Time at liquidous (tL) 60-150 Seconds 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp)** within 5 °C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Eaton is a registered trademark. Printed in USA Publication No. 4449 BU-SB12434 All other trademarks are property July 2017 of their respective owners.