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  • 型号: GP1A50HRJ00F
  • 制造商: Sharp Microelectronics
  • 库位|库存: xxxx|xxxx
  • 要求:
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GP1A50HRJ00F产品简介:

ICGOO电子元器件商城为您提供GP1A50HRJ00F由Sharp Microelectronics设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 GP1A50HRJ00F价格参考。Sharp MicroelectronicsGP1A50HRJ00F封装/规格:光学传感器 - 光断续器 - 槽型 - 逻辑输出, Optical Sensor Transmissive 0.118" (3mm) PCB Mount。您可以下载GP1A50HRJ00F参考资料、Datasheet数据手册功能说明书,资料中有GP1A50HRJ00F 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

传感器,变送器

描述

PHOTOINTER OPIC SLOT 3.0MM PCB光学开关(透射型,光电IC输出) Case Type Photntrptr 3.0mm 0.5mm Screw

产品分类

光学传感器 - 光断续器 - 槽型 - 逻辑输出

品牌

Sharp Microelectronics

产品手册

点击此处下载产品Datasheet

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

光学开关(透射型,光电IC输出),Sharp Microelectronics GP1A50HRJ00FOPIC™

数据手册

http://www.sharpsma.com/webfm_send/1549

产品型号

GP1A50HRJ00F

PCN设计/规格

http://www.sharpsma.com/webfm_send/1525

上升时间

0.5 us

下降时间

0.5 us

产品目录页面

点击此处下载产品Datasheet

产品种类

光学开关(透射型,光电IC输出)

光圈宽度

0.5 mm

其它名称

425-1948-5

反向电压

6 V

响应时间

1µs, 0.05µs

商标

Sharp Microelectronics

安装类型

通孔

封装/外壳

PCB 安装

工厂包装数量

100

感应方式

Transmissive, Slotted

感应方法

可传导的

感应距离

0.118"(3mm)

最大工作温度

+ 85 C

最小工作温度

- 25 C

标准包装

100

槽宽

3 mm

正向电压

5 V

正向电流

50 mA

电压-电源

4.5 V ~ 17 V

电流-电源

1.7mA

输出设备

Pull Up, Buffer

输出配置

上拉电阻,缓冲器

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PDF Datasheet 数据手册内容提取

GP1A50HRJ00F GP1A50HRJ00F Gap : 3mm, Slit : 0.5mm *OPIC Output Case package Transmissive Photointerrupter ■Description ■Agency approvals/Compliance GP1A50HRJ00F is a standard, OPIC output, trans- 1. Compliant with RoHS directive missive photointerrupter with opposing emitter and de- tector in a case, providing non-contact sensing. For this ■Applications family of devices, the emitter and detector are inserted in 1. General purpose detection of object presence or mo- a case, resulting in a through-hole design. tion. The case is unique because it uses additional screw 2. Example : Printer, FAX, Optical storage unit fixing holes, on both sides 3.2mm diameter, and the shape prevents miss-orientation. ■Features 1. Transmissive with OPIC output 2. Highlights : • Verical Slit for alternate motion detection • Output Low Level at intercepting optical path • Includes additional screw fi xing holes 3. Key Parameters : • Gap Width : 3mm • Slit Width (detector side) : 0.5mm • Package : 25×10×6 mm 4. Lead free and RoHS directive compliant * "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal- processing Notice The content of data sheet is subject to change without prior notice. In the absence of confi rmation by device specifi cation sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specifi cation sheets before using any SHARP device. Sheet No.: D3-A03501EN 1 Date Oct. 3. 2005 © SHARP Corporation

GP1A50HRJ00F ■Internal Connection Diagram Top view Voltage regulator 3 2 (15kΩ) 1 Anode 2 Cathode 4 3 VCC 4 VO 5 GND Amp 5 1 ■Outline Dimensions (Unit : mm) Top view 25±0.3 19±0.2 12.2±0.3 3+−00..21 56 2−C2 2−φ3.2±0.2 A-Aʼ section enter) Date code B-Bʼ section c 0.5 or 0.5 3.5 2.5Detct A B Model No. 1.5 ( 7 1A50HR 7.510 5−0.45+−00..31 5−0.4+−00..31 AʼBʼ MIN.9 (1.27) (1.27) (1.5) (9.2) 5 4 1 3 2 • Unspecified tolerance shall be as follows ; Dimensions(d) Tolerance d≤6 ±0.1 6<d≤18 ±0.2 18<d≤25 ±0.025 • ( ) : Reference dimensions Product mass : approx. 0.5g Dip soldering material : Sn−3Ag−0.5Cu Sheet No.: D3-A03501EN 2

GP1A50HRJ00F Date code (2 digit) 1st digit 2nd digit Year of production Month of production A.D. Mark Month Mark 2000 0 1 1 2001 1 2 2 2002 2 3 3 2003 3 4 4 2004 4 5 5 2005 5 6 6 2006 6 7 7 2007 7 8 8 2008 8 9 9 2009 9 10 X 2010 0 11 Y : : 12 Z repeats in a 10 year cycle Country of origin Japan, Indonesia or Philippines (Indicated on the packing case) Sheet No.: D3-A03501EN 3

GP1A50HRJ00F ■Absolute Maximum Ratings (Ta=25˚C) Parameter Symbol Rating Unit ∗1 Forward current I 50 mA F ∗1, 2Peak forward current I 1 A Input FM Reverse voltage V 6 V R Power dissipation P 75 mW Supply voltage VCC −0.5 to +17 V Output Output current I 50 mA O Power dissipation P 250 mW O Operating temperature Topr −25 to +85 ˚C Storage temperature Tstg −40 to +100 ˚C ∗3Soldering temperature T 260 ˚C sol ∗1 Refer to Fig. 1, 2, 3 ∗2 Pulse width ≤ 100μs, Duty ratio=0.01 ∗3 For 5s or less ■Electro-optical Characteristics (Ta=25˚C) Parameter Symbol Condition MIN. TYP. MAX. Unit Input Forward voltage VF IF=5mA − 1.1 1.4 V Reverse current IR VR=3V − − 10 μA Operating supply voltage VCC − 4.5 − 17 V Low level output voltage VOL VCC=5V, IOL=16mA, IF=0 − 0.15 0.4 V Output High level output voltage VOH VCC=5V, IF=5mA 4.9 − − V Low level supply current ICCL VCC=5V, IF=0 − 1.7 3.8 mA High level supply current ICCH VCC=5V, IF=5mA − 0.7 2.2 mA ∗4 "Low→High" threshold input current IFLH VCC=5V − 1 5 mA Transfer ∗5 Hysteresis IFHL/IFLH VCC=5V 0.55 0.75 0.95 − charac- ∗me 6 "Low→High" Propagation delay time tPLH − 3 9 teristics ponce ti "RHisigeh t→imLeow" Propagation delay time tPtHrL VCC=5V, IF=5mA, RL=280Ω −− 05.1 01.55 μs Res Fall time tf − 0.05 0.5 ∗4 I represents forward current when output goes from "Low" to "High". FLH ∗5 I represents forward current when output goes from "High" to "Low". FHL ∗6 Test circuit for response time is shown in Fig.12. Sheet No.: D3-A03501EN 4

GP1A50HRJ00F Fig.1 Forward Current vs. Fig.2 Output Power Dissipation vs. Ambient Temperature Ambient Temperature 60 300 50 W) 250 m A) (O nt I (mF 40 pation P 200 ard curre 30 wer dissi 150 Forw 20 ut po 100 p ut 10 O 50 0 0 −25 0 25 50 75 85 100 −25 0 25 50 75 85 100 Ambient temperature Ta (˚C) Ambient temperature T (C) a Fig.3 Low Level Output Current vs. Fig.4 Forward Current vs. Forward Voltage Ambient Temperature 60 Ta=75˚C 25˚C A) 50 50˚C 0˚C (mL A) 100 −25˚C ut current IO 4300 urrent I (mF p c ut d w level o 20 Forwar 10 o L 10 0 1 −20 0 25 50 75 85 100 0 0.5 1 1.5 2 2.5 3 3.5 Ambient temperature T (˚C) Foward voltage VF (V) a Fig.5 Relative Threshold Input Current vs. Fig.6 Relative Threshold Input Current vs. Supply Voltage Ambient Temperature 1.1 1.8 Ta=25˚C VCC=5V ,ILFLH 1 IFLH IaFtL VH=C1C=5V ,ILFLH 1.6 IaFt LTHa==125˚C H H F F ent I 0.9 ent I 1.4 urr urr IFLH ut c ut c 1.2 p 0.8 p n n d i I d i 1 I ol FHL ol FHL h h es 0.7 es hr hr 0.8 e t e t v v elati 0.6 elati 0.6 R R 0.5 0.4 0 5 10 15 20 25 −25 0 25 50 75 100 Supply voltage VCC (V) Ambient temperature Ta (˚C) Sheet No.: D3-A03501EN 5

GP1A50HRJ00F Fig.7 Low Level Output Voltage vs. Fig.8 Low Level Output Voltage vs. Low Level Output Current Ambient Temperature 1 0.6 VCC=5V Ta=25˚C VCC=5V 0.5 V) V) (OL (OL V V e e 0.4 g g a a olt olt v v ut 0.1 ut 0.3 IOL=30mA p p ut ut o o el el 0.2 ev ev 16mA w l w l o o L L 0.1 5mA 0.01 0 1 10 100 −25 0 25 50 75 100 Low level output current IOL (mA) Ambient temperature Ta (˚C) Fig.9 Supply Current vs. Fig.10 Propagation Delay Time vs. Ambient Temperature (H Gain Mode) Forward Current 3 12 VCC=5V RL=280Ω s) 10 Ta=25˚C tPHL μ (L mA) 2 VCC=17V , tHPH 8 Supply current I (CC 1 VCC=171V50VV ICCL gation delay time tPL 46 ICCH Propa 2 tPLH 10V 5V 0 0 −25 0 25 50 75 100 0 10 20 30 40 50 60 Ambient temperature T (˚C) Forward current I (mA) a F Fig.11 Rise Time,Fall Time vs. Fig.12 Test Circuit for Response Time Load Resistance 0.8 IF=5mA Voltage regulator Ta=25˚C Input +5V 0.7 VCC=5V 280Ω IF=5mA (15kΩ) e t, t(s)μrf 00..65 tZr=Ot=f=500.0Ω1μs47Ω Amp. 0.01OμuFtput m me, fall ti 00..43 tr GND se ti Input 50% Ri 0.2 0.1 tPLH tPHL t f V 90% OH 0 0.1 1 10 Output 10% 1.5V V OL Load resistance RL (kΩ) tr tf Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. Sheet No.: D3-A03501EN 6

GP1A50HRJ00F ■Design Considerations ●Recommended operating conditions Parameter Symbol MIN. TYP. MAX. Unit Output current IO − − 16 mA Forward current IF 10 − 20 mA Operating terperature Topr 0 − 70 ˚C ●Notes about static electricity Transisiter of detector side in bipolar confi guration may be damaged by static electricity due to its minute design. When handing these devices, general countermeasure against static electricity should be taken to avoid breakdown of devices or degradation of characteristics. ●Design guide 1) Prevention of detection error To prevent photointerrupter from faulty operation caused by external light, do not set the detecting face to the external light. 2) In order to stabilize power supply line, connect a by-pass capacitor of more than 0.01μF between V and CC GND near the device. 3) Position of opaque board Opaque board shall be installed at place 4mm or more from the top of elements. (Example) 4mm or more This product is not designed against irradiation and incorporates non-coherent IRED. ●Degradation In general, the emission of the IRED used in photocouplers will degrade over time. In the case of long term operation, please take the general IRED degradation (50% degradation over 5 years) into the design consideration. Sheet No.: D3-A03501EN 7

GP1A50HRJ00F ●Parts This product is assembled using the below parts. • Photodetector (qty. : 1) [Using a silicon photodiode as light detecting portion, and a bipolar IC as signal processing circuit] Maximum Sensitivity Sensitivity Category Response time (μs) wavelength (nm) wavelength (nm) Photodiode 900 400 to 1 200 3 • Photo emitter (qty. : 1) Maximum light emitting Category Material I/O Frequency (MHz) wavelength (nm) Infrared emitting diode Gallium arsenide (GaAs) 950 0.3 (non-coherent) • Material Case Connector terminal fl ame fi nish Black NORYL resin Solder dip. (Sn−3Ag−0.5Cu) • Others Laser generator is not used. Sheet No.: D3-A03501EN 8

GP1A50HRJ00F ■Manufacturing Guidelines ●Soldering Method Flow Soldering: Soldering should be completed below 260˚C and within 5 s. Please take care not to let any external force exert on lead pins. Please don't do soldering with preheating, and please don't do soldering by refl ow. Hand soldering Hand soldering should be completed within 3 s when the point of solder iron is below 350̊C. Please solder within one time. Please don't touch the terminals directly by soldering iron. Soldered product shall treat at normal temperature. Other notice Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the cooling and soldering conditions. Flux Some fl ux, which is used in soldering, may crack the package due to synergistic effect of alcohol in fl ux and the rise in temperature by heat in soldering. Therefore, in using fl ux, please make sure that it does not have any infl uence on appearance and reliability of the photointerrupter. Sheet No.: D3-A03501EN 9

GP1A50HRJ00F ●Cleaning instructions Solvent cleaning : Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less. Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs by cleaning bath size, ultrasonic power output, cleaning time, PCB size or device mounting condition etc. Please test it in actual using condition and confi rm that doesn't occur any defect before starting the ultrasonic cleaning. Recommended solvent materials : Ethyl alcohol, Methyl alcohol and Isopropyl alcohol. ●Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specifi c brominated fl ame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). •Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). Sheet No.: D3-A03501EN 10

GP1A50HRJ00F ■Package specifi cation ●Case package Package materials Anti-static plastic bag : Polyethtylene Moltopren : Urethane Partition : Corrugated fi berboard Packing case : Corrugated fi berboard Package method 100 pcs of products shall be packaged in a plastic bag, Ends shall be fi xed by stoppers. The bottom ot the packing case is covered with moltopren, and the partition is set in the packing case. Each partition should have 1 plastic bag. The 10 plastic bags containing a product are put in the packing case. Moltopren should be located after all product are settled (1 packing contains 1 000 pcs). Packing composition Moltopren Partition Anti-static plastic bag Packing case Sheet No.: D3-A03501EN 11

GP1A50HRJ00F ■Important Notices · The circuit application examples in this publication with equipment that requires higher reliability such as: are provided to explain representative applications of --- Transportation control and safety equipment (i.e., SHARP devices and are not intended to guarantee any aircraft, trains, automobiles, etc.) circuit design or license any intellectual property rights. --- Traffi c signals SHARP takes no responsibility for any problems related --- Gas leakage sensor breakers to any intellectual property right of a third party resulting --- Alarm equipment from the use of SHARP's devices. --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in · Contact SHARP in order to obtain the latest device connection with equipment that requires an extremely specification sheets before using any SHARP device. high level of reliability and safety such as: SHARP reserves the right to make changes in the --- Space applications specifi cations, characteristics, data, materials, structure, --- Telecommunication equipment [trunk lines] and other contents described herein at any time --- Nuclear power control equipment without notice in order to improve design or reliability. --- Medical and other life support equipment (e.g., Manufacturing locations are also subject to change scuba). without notice. · If the SHARP devices listed in this publication fall · Observe the following points when using any devices within the scope of strategic products described in the in this publication. SHARP takes no responsibility for Foreign Exchange and Foreign Trade Law of Japan, it damage caused by improper use of the devices which is necessary to obtain approval to export such SHARP does not meet the conditions and absolute maximum devices. ratings to be used specifi ed in the relevant specifi cation sheet nor meet the following conditions: · This publication is the proprietary product of SHARP (i) The devices in this publication are designed for use and is copyrighted, with all rights reserved. Under in general electronic equipment designs such as: the copyright laws, no part of this publication may be --- Personal computers reproduced or transmitted in any form or by any means, --- Offi ce automation equipment electronic or mechanical, for any purpose, in whole or in --- Telecommunication equipment [terminal] part, without the express written permission of SHARP. --- Test and measurement equipment Express written permission is also required before any --- Industrial control use of this publication may be made by a third party. --- Audio visual equipment --- Consumer electronics · Contact and consult with a SHARP representative (ii) Measures such as fail-safe function and redundant if there are any questions about the contents of this design should be taken to ensure reliability and safety publication. when SHARP devices are used for or in connection [H160] Sheet No.: D3-A03501EN 12