ESD5B5.0S, SZESD5B5.0S ESD Protection Diode Micro−Packaged Diodes for ESD Protection The ESD5B Series is designed to protect voltage sensitive components from ESD. Excellent clamping capability, low leakage, and fast response time provide best in class protection on designs that are exposed to ESD. Because of its small size and bi−directional wwwwww..oonnsseemmii..ccoomm design, it is ideal for use in cellular phones, MP3 players, and portable applications that require audio line protection. Specification Features • Low Capacitance 32 pF • Low Clamping Voltage • Small Body Outline Dimensions: nom 0.063″ x 0.032″(1.6x0.8 mm) 2 • Low Body Height: nom 0.024″ (0.6 mm) • Reverse Working (Stand−off) Voltage: 5.0 V 1 • Peak Power up to 50 W @ 8 x 20 (cid:2)s Pulse SOD−523 • CASE 502 Low Leakage • Response Time is Typically < 1 ns • ESD Rating of Class 3 (> 16 kV) per Human Body Model MARKING DIAGRAM • IEC61000−4−2 Level 4 ESD Protection • SZ Prefix for Automotive and Other Applications Requiring Unique B5 M(cid:2) Site and Control Change Requirements; AEC−Q101 Qualified and 1 (cid:2) 2 PPAP Capable • B5 = Specific Device Code This is a Pb−Free Device M Date Code Mechanical Characteristics (cid:2) = Pb−Free Package CASE: Void-free, transfer-molded, thermosetting plastic (Note: Microdot may be in either location) Epoxy Meets UL 94 V−0 *Date Code orientation and/or position may LEAD FINISH: 100% Matte Sn (Tin) vary depending upon manufacturing location. MOUNTING POSITION: Any QUALIFIED MAX REFLOW TEMPERATURE: 260°C Device Meets MSL 1 Requirements ORDERING INFORMATION MAXIMUM RATINGS Device Package Shipping† Rating Symbol Value Unit ESD5B5.0ST1G SOD−523 3000 / Tape & IEC 61000−4−2 (ESD) Contact ±30 kV (Pb−Free) Reel Air ±30 ESD5B5.0ST5G SOD−523 8000 / Tape & (Pb−Free) Reel ESD Voltage Per Human Body Model 16 kV Per Machine Model 400 V SZESD5B5.0ST1G SOD−523 3000 / Tape & Peak Power (Figure 1) Per 8 x 20 (cid:2)s Waveform PPK 50 W (Pb−Free) Reel Peak Power (Figure 2)Per 10 x 1000 (cid:2)s Waveform 10 SZESD5B5.0ST5G SOD−523 8000 / Tape & Total Power Dissipation on FR−5 Board (Note 1) °PD° 200 mW (Pb−Free) Reel @ TA = 25°C †For information on tape and reel specifications, Junction and Storage Temperature Range TJ, Tstg −55 to °C including part orientation and tape sizes, please +150 refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Lead Solder Temperature − Maximum TL 260 °C (10 Second Duration) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. FR−5 = 1.0 x 0.75 x 0.62 in. See Application Note AND8308/D for further description of survivability specs. © Semiconductor Components Industries, LLC, 2015 1 Publication Order Number: August, 2018 − Rev. 7 ESD5B5.0ST1/D

ESD5B5.0S, SZESD5B5.0S ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) IPP I Symbol Parameter IPP Reverse Peak Pulse Current IT VC Clamping Voltage @ IPP VC VBR VRWM IR V VRWM Working Peak Reverse Voltage IIRT VRWM VBR VC IR Reverse Leakage Current @ VRWM VBR Breakdown Voltage @ IT IT Test Current IPP *See Application Note AND8308/D for detailed explanations of Bi−Directional datasheet parameters. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA for all types) VRWM IR ((cid:2)A) VBR (V) @ IT C (pF) @ VR = 0 V, (V) @ VRWM (Note 2) IT f = 1 MHz VC Device* Max Max Min Max mA Typ Per IEC61000−4−2 (Note 3) ESD5B5.0ST1G/T5G, 5.0 1.0 5.8 7.8 1.0 32 Figures 1 and 2 SZESD5B5.0ST1G See Below *Other voltages available upon request. 2. VBR is measured with a pulse test current IT at an ambient temperature of 25°C. 3. For test procedure see Figures 3 and 4 and Application Note AND8307/D. Figure 1. ESD Clamping Voltage Screenshot Figure 2. ESD Clamping Voltage Screenshot Positive 8 kV Contact per IEC 61000−4−2 Negative 8 kV Contact per IEC 61000−4−2 www.onsemi.com 2

ESD5B5.0S, SZESD5B5.0S IEC61000−4−2 Waveform IEC 61000−4−2 Spec. Ipeak First Peak Test Volt- Current Current at Current at 100% Level age (kV) (A) 30 ns (A) 60 ns (A) 90% 1 2 7.5 4 2 2 4 15 8 4 I @ 30 ns 3 6 22.5 12 6 4 8 30 16 8 I @ 60 ns 10% tP = 0.7 ns to 1 ns Figure 3. IEC61000−4−2 Spec ESD Gun Oscilloscope 50 (cid:3) Cable 50 (cid:3) Figure 4. Diagram of ESD Test Setup The following is taken from Application Note systems such as cell phones or laptop computers it is not AND8308/D − Interpretation of Datasheet Parameters clearly defined in the spec how to specify a clamping voltage for ESD Devices. at the device level. ON Semiconductor has developed a way to examine the entire voltage waveform across the ESD ESD Voltage Clamping protection diode over the time domain of an ESD pulse in the For sensitive circuit elements it is important to limit the form of an oscilloscope screenshot, which can be found on voltage that an IC will be exposed to during an ESD event the datasheets for all ESD protection diodes. For more to as low a voltage as possible. The ESD clamping voltage information on how ON Semiconductor creates these is the voltage drop across the ESD protection diode during screenshots and how to interpret them please refer to an ESD event per the IEC61000−4−2 waveform. Since the AND8307/D. IEC61000−4−2 was written as a pass/fail spec for larger www.onsemi.com 3

ESD5B5.0S, SZESD5B5.0S PACKAGE DIMENSIONS SOD−523 CASE 502 ISSUE E −X− D NOTES: −Y− 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. E MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 1 2 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO- 2Xb TRUSIONS, OR GATE BURRS. 0.08 M X Y MILLIMETERS DIM MIN NOM MAX TOP VIEW A 0.50 0.60 0.70 b 0.25 0.30 0.35 c 0.07 0.14 0.20 D 1.10 1.20 1.30 E 0.70 0.80 0.90 A HE 1.50 1.60 1.70 L 0.30 REF L2 0.15 0.20 0.25 c H RECOMMENDED E SOLDERING FOOTPRINT* SIDE VIEW 1.80 2X 0.48 2X 2X L 0.40 PACKAGE OUTLINE DIMENSION: MILLIMETERS 2X L2 *For additional information on our Pb−Free strategy and soldering BOTTOM VIEW details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free ON Semiconductor Website: www.onsemi.com Literature Distribution Center for ON Semiconductor USA/Canada 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Europe, Middle East and Africa Technical Support: Order Literature: http://www.onsemi.com/orderlit Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada For additional information, please contact your local Email: orderlit@onsemi.com Sales Representative ◊ www.onsemi.com ESD5B5.OST1/D 4

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