DT1240-04LP 4 CHANNELS LOW CAPACITANCE TVS DIODE ARRAY Features & Applications Mechan ical Data  Clamping Voltage: 9V at 10A 100ns, TLP  Case: U-DFN2510-10 9.4V at 5.5A 8μs/20μs  Case Material: Molded Plastic, “Green” Molding Compound.  IEC 61000-4-2 (ESD): Air — ±16kV, Contact — ±14kV UL Flammability Classification Rating 94V-0  IEC 61000-4-4 (EFT): Level 4  Moisture Sensitivity: Level 1 per J-STD-020 N  IEC 61000-4-5 (Lightning): ±5.5A (8/20µs)  Terminals: NiPdAu over Copper Leadframe (Lead Free Plating). O O  4 Channels of ESD Protection Solderable per MIL-STD-202, Method 208 e4  Low Channel Input Capacitance of 0.55pF Typical II  Weight: 0.038 grams (Approximate) TT  TLP Dynamic Resistance: 0.25Ω AA  Typically Used for High Speed Ports such as USB 2.0, USB 3.0 ® MM DVI™, HDMI2.0, Ethernet Port, IEEE, MDDI, PCI Express , RR SATA/ eSATA OO  Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  Halogen, Antimony and Beryllium Free. “Green” Device FF NN (Note 3)  An Automotive-Compliant Part is Available Under Separate II Datasheet (DT1240-04LPQ) ED U-DFN2510-10 and U-DFN2510-10 (Type CJ) CE NC AN P i n # Description 10 9 8 7 6 VA 1 , 2 , 4 , 5 I / O Pin 1 Pin 2 Pin 4 Pin 5 DV 6, 7, 9, 10 No Connection AD 3, 8 Vss 1 2 3 4 5 A 3,8 Pin Description (Top View) Device Schematic Ordering Information (Note 4) Part Number Compliance Marking Reel Size (inches) Tape Width (mm) Quantity per Reel DT1240-04LP-7 Standard BC7 7 8 3,000/Tape & Reel Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. 2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/. Marking Information BC7 = Product Type Marking Code BC7 = Product Type Marking Code YWX = Date Code Marking YM = Date Code Marking Y = Year (ex: 9 = 2019) BTCF27 YM Y = Year (ex: G = 2019) BTCF72 YWYMX W = Week M = Month (ex: 9 = September) (ex: a=Week 27; z Represents Week 52 and 53) X = Internal Code (ex: U=Monday) Date Code Key for YM Year 2019 2020 2021 2022 2023 2024 Code G H I J K L Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec Code 1 2 3 4 5 6 7 8 9 O N D Date Code Key for YWX Year 2019 2020 2021 2022 2023 2024 2025 Code 9 0 1 2 3 4 5 Week 1-26 27-52 53 Code A-Z a-z z Internal Code Sun Mon Tue Wed Thu Fri Sat Code T U V W X Y Z PCI Express is a trademark or registered trademark of PCI-SIG. DT1240-04LP 1 of 7 May 2019 Document number: DS36312 Rev. 3 - 2 www.diodes.com © Diodes Incorporated

DT1240-04LP Maximum Ratings (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit Conditions Peak Pulse Current, per IEC 61000-4-5 IPP 5.5 A I/O to VSS, 8/20µs Peak Pulse Power, per IEC 61000-4-5 PPP 60 W I/O to VSS, 8/20µs Operating Voltage (DC) VDC 6 V I/O to VSS ESD Protection – Contact Discharge, per IEC 61000-4-2 VESD_CONTACT ±14 kV I/O to VSS N O O ESD Protection – Air Discharge, per IEC 61000-4-2 VESD_AIR ±16 kV I/O to VSS II Operating Temperature TOP -55 to +85 °C — TT Storage Temperature TSTG -55 to +150 °C — AA MM RR OO Thermal Characteristics FF NN Characteristic Symbol Value Unit I I Power Dissipation Typical (Note 5) PD 350 mW ED CE Thermal Resistance, Junction to Ambient Typical (Note 5) RJA 360 °C/W NC AN VA Electrical Characteristics DV (@TA = +25°C, unless otherwise specified.) AD Characteristic Symbol Min Typ Max Unit Test Conditions A Reverse Working Voltage VRWM — — 5.5 V IR=1mA, I/O to VSS Reverse Current IR — — 0.5 μA VR = 5V, I/O to VSS Reverse Breakdown Voltage VBR 6 — — V IR = 1mA, I/O to VSS Forward Clamping Voltage VF -1.0 -0.85 — V IF = -15mA, I/O to VSS Holding Voltage VH 5.5 — — V — Reverse Clamping Voltage (Note 6) VC — 9.4 11 V IPP = 5.5A, I/O to VSS, 8/20µs Trigger Voltage VTRIG — — 9.5 V — ESD Clamping Voltage VESD — 9 — V TLP, 10A, tP = 100ns, I/O to VSS Dynamic Reverse Resistance RDIF-R — 0.25 — Ω TLP, 10A, tP = 100ns, I/O to VSS Dynamic Forward Resistance RDIF-F — 0.25 — Ω TLP, 10A, tP = 100ns, VSS to I/O Channel Input Capacitance (Note 7) CI/O — 0.55 0.65 pF VI/O = 2.5V, VSS = 0V, f = 1MHz Delta CI/O CI/OMAX-CI/OMIN — 05.054 — pF CI/OMAX-CI/OMIN Notes: 5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on Diodes Incorporated’s suggested pad layout, which can be found on our website at http://www.diodes.com/package-outlines.html. 6. Clamping voltage value is based on an 8x20µs peak pulse current (Ipp) waveform. 7. CI/O1=CPIN1+CPIN10, CI/O2=CPIN2+CPIN9, CI/O3=CPIN4+CPIN7, CI/O4=CPIN5+CPIN6 DT1240-04LP 2 of 7 May 2019 Document number: DS36312 Rev. 3 - 2 www.diodes.com © Diodes Incorporated

DT1240-04LP 100 E, 9.5 G A V T TRIG F OL 9.0 O V N ATING IN % R CURRENT75 E, TRIGGER OLTAGE (V) 88..05 BV O O ERR O50 AGG V RMATIRMATI EAK PULSE DPEAK POWE25 KDOWN VOLTHOLDIN 77..05 VH OO P A 6.5 E FF R B NN 6.0 0 II -60 -40 -20 0 20 40 60 80 100 120 140 160 0 25 50 75 100 125 150 175 200 T , AMBIENT TEMPERATURE ((°癈C)) CEED TA, AMBIENT TEMPERATURE ((癈°C)) FigureA 2 BV, Trigger Voltage, Holding Voltage NC Figure 1 Pulse Derating Curve vs. Ambient Temperature AN VA 11.0 4.0 DV AD 3.5 A 10.0 V) V) GE ( 3.0 IEC(6L1ig0h0t0in g- )4- 5 (E9.0 IEC(6L1ig0h0t0in g- )4- 5 TA 2.5 G L A O T V OL8.0 RD 2.0 G V WA N R 1.5 PI7.0 O M F LA V, F 1.0 C , C6.0 V 0.5 5.0 0.0 2 3 4 5 6 7 1 2 3 4 5 6 7 CURRENT FROM V TO I/O (A) CURRENT FROM I/O TO V (A) SS SS Figure 4 Forward Voltage Characteristic Figure 3 Clamping Voltage Characteristic 12 1.0 A) 0.9 ENT (V, 10 Voltage (pF)E 0.8 R C 0.7 R 8 N U A f=1MHz C T 0.6 E CI TAG 6 APA 0.5 L C O T 0.4 V U G 4 P N N 0.3 PI Ampere IO M CI/0.2 A 2 L C 0.1 0 0.0 -40 -30-20 -10 0 10 20 30 40 50 60 70 80 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 t, TIME (s) V INPUT VOLTAGE (V) Figure 5 Waveform of Clamping Voltage, I/O Current vs.Time ((88//2200uµss,, II//OO ttoo VVsSsS)) Figure 6 Input Capacitance vs. Input Voltage DT1240-04LP 3 of 7 May 2019 Document number: DS36312 Rev. 3 - 2 www.diodes.com © Diodes Incorporated

DT1240-04LP 10 A)9 (SS8 V o O t7 M I/6 N O R OO F5 II T TT EN4 AA R R MM U3 C RR 2 OO FF 1 NN II 0 ED 0 2 4 6 8 10 CE VOLTAGE FROM I/O to V (V) SS NC Figure 7 Current vs. Voltage AN VA DV AD A DT1240-04LP 4 of 7 May 2019 Document number: DS36312 Rev. 3 - 2 www.diodes.com © Diodes Incorporated

DT1240-04LP Package Outline Dimensions Please see http://www.diodes.com/package-outlines.html for the latest version. U-DFN2510-10 A3 A1 A N U-DFN2510-10 OO Seating Plane Dim Min Max Typ II A 0.545 0.605 0.575 TT A1 0.00 0.05 0.03 AA D A3 - - 0.13 MM b1 b 0.15 0.25 0.20 RR b1 0.35 0.45 0.40 OO D 2.450 2.575 2.500 FF e - - 0.50 NN R0.075 E 0.950 1.075 1.000 II E L 0.325 0.425 0.375 ED z - - 0.150 CE L All Dimensions in mm NC AN z R b VA e 0.1 DV 25 AD A U-DFN2510-10 (Type CJ) D b1 U-DFN2510-10 (Type CJ) L Dim Min Max Typ E k A 0.545 0.605 -- A1 0.00 0.05 -- A3 0.152REF b 0.150 0.250 -- PIN1 CORNER e b b1 0.350 0.450 -- D 2.450 2.575 -- A3 A1 E 0.950 1.075 -- e -- -- 0.500 E 0.950 1.075 1.000 L 0.350 0.450 -- A k 0.200REF All Dimensions in mm DT1240-04LP 5 of 7 May 2019 Document number: DS36312 Rev. 3 - 2 www.diodes.com © Diodes Incorporated

DT1240-04LP Suggested Pad Layout Please see http://www.diodes.com/package-outlines.html for the latest version. U-DFN2510-10 X2 X1 X N O O Value Dimensions TITI Y1 Y C (i0n. 5m0m0 ) AA X 0.250 MM X1 0.450 Y3 RR X2 2.250 OO Y 0.625 Y2 Y1 0.575 FF NN Y2 0.700 Y3 1.400 II ED C CE NC AN VA DV U-DFN2510-10 (Type CJ) AD A X2 X1 X Value Dimensions (in mm) Y1 Y C 0.500 X 0.250 X1 0.450 Y3 X2 2.250 Y 0.625 Y2 Y1 0.575 Y2 0.700 Y3 1.400 C DT1240-04LP 6 of 7 May 2019 Document number: DS36312 Rev. 3 - 2 www.diodes.com © Diodes Incorporated

DT1240-04LP IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or N trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume OO all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated II website, harmless against all damages. TT AA Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. MM Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and RR hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or OO indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. FF Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings NN noted herein may also be covered by one or more United States, international or foreign trademarks. II ED This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the CE final and determinative format released by Diodes Incorporated. NC AN LIFE SUPPORT VA DV Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: AD A A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2019, Diodes Incorporated www.diodes.com DT1240-04LP 7 of 7 May 2019 Document number: DS36312 Rev. 3 - 2 www.diodes.com © Diodes Incorporated