Data sheet acquired from Harris Semiconductor SCHS056D – Revised August 2003 CD4071B Quad 2-Input OR Gate CD4072B Dual 4-Input OR Gate CD4075B Triple 3-Input OR Gate (cid:0)CD4071B, CD4072B, and CD4075B OR gates provide the system designer with direct implementation of the positive-logic OR function and supplement the existing family of CMOS gates. The CD4071B, CD4072B, and CD4075B types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PW and PWR suffixes). Copyright  2003, Texas Instruments Incorporated

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PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 PACKAGING INFORMATION OrderableDevice Status(1) Package Package Pins Package EcoPlan(2) Lead/BallFinish MSLPeakTemp(3) Type Drawing Qty 7706002CA ACTIVE CDIP J 14 1 TBD A42 N/AforPkgType CD4071BE ACTIVE PDIP N 14 25 Pb-Free CUNIPDAU N/AforPkgType (RoHS) CD4071BEE4 ACTIVE PDIP N 14 25 Pb-Free CUNIPDAU N/AforPkgType (RoHS) CD4071BF ACTIVE CDIP J 14 1 TBD A42 N/AforPkgType CD4071BF3A ACTIVE CDIP J 14 1 TBD A42 N/AforPkgType CD4071BF3AS2534 OBSOLETE CDIP J 14 TBD CallTI CallTI CD4071BM ACTIVE SOIC D 14 50 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4071BM96 ACTIVE SOIC D 14 2500 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4071BM96E4 ACTIVE SOIC D 14 2500 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4071BM96G4 ACTIVE SOIC D 14 2500 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4071BME4 ACTIVE SOIC D 14 50 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4071BMG4 ACTIVE SOIC D 14 50 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4071BMT ACTIVE SOIC D 14 250 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4071BMTE4 ACTIVE SOIC D 14 250 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4071BMTG4 ACTIVE SOIC D 14 250 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4071BNSR ACTIVE SO NS 14 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4071BNSRE4 ACTIVE SO NS 14 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4071BNSRG4 ACTIVE SO NS 14 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4071BPW ACTIVE TSSOP PW 14 90 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4071BPWE4 ACTIVE TSSOP PW 14 90 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4071BPWG4 ACTIVE TSSOP PW 14 90 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4071BPWR ACTIVE TSSOP PW 14 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4071BPWRE4 ACTIVE TSSOP PW 14 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4071BPWRG4 ACTIVE TSSOP PW 14 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4072BE ACTIVE PDIP N 14 25 Pb-Free CUNIPDAU N/AforPkgType (RoHS) CD4072BEE4 ACTIVE PDIP N 14 25 Pb-Free CUNIPDAU N/AforPkgType (RoHS) CD4072BF ACTIVE CDIP J 14 1 TBD A42 N/AforPkgType Addendum-Page1

PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 OrderableDevice Status(1) Package Package Pins Package EcoPlan(2) Lead/BallFinish MSLPeakTemp(3) Type Drawing Qty CD4072BF3A ACTIVE CDIP J 14 1 TBD A42 N/AforPkgType CD4072BM ACTIVE SOIC D 14 50 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4072BM96 ACTIVE SOIC D 14 2500 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4072BM96E4 ACTIVE SOIC D 14 2500 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4072BM96G4 ACTIVE SOIC D 14 2500 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4072BME4 ACTIVE SOIC D 14 50 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4072BMG4 ACTIVE SOIC D 14 50 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4072BMT ACTIVE SOIC D 14 250 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4072BMTE4 ACTIVE SOIC D 14 250 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4072BMTG4 ACTIVE SOIC D 14 250 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4072BNSR ACTIVE SO NS 14 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4072BNSRE4 ACTIVE SO NS 14 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4072BNSRG4 ACTIVE SO NS 14 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4072BPW ACTIVE TSSOP PW 14 90 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4072BPWE4 ACTIVE TSSOP PW 14 90 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4072BPWG4 ACTIVE TSSOP PW 14 90 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4075BE ACTIVE PDIP N 14 25 Pb-Free CUNIPDAU N/AforPkgType (RoHS) CD4075BEE4 ACTIVE PDIP N 14 25 Pb-Free CUNIPDAU N/AforPkgType (RoHS) CD4075BF ACTIVE CDIP J 14 1 TBD A42 N/AforPkgType CD4075BF3A ACTIVE CDIP J 14 1 TBD A42 N/AforPkgType CD4075BM ACTIVE SOIC D 14 50 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4075BM96 ACTIVE SOIC D 14 2500 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4075BM96E4 ACTIVE SOIC D 14 2500 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4075BM96G4 ACTIVE SOIC D 14 2500 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4075BME4 ACTIVE SOIC D 14 50 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4075BMG4 ACTIVE SOIC D 14 50 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4075BMT ACTIVE SOIC D 14 250 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) Addendum-Page2

PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 OrderableDevice Status(1) Package Package Pins Package EcoPlan(2) Lead/BallFinish MSLPeakTemp(3) Type Drawing Qty CD4075BMTE4 ACTIVE SOIC D 14 250 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4075BMTG4 ACTIVE SOIC D 14 250 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4075BNSR ACTIVE SO NS 14 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4075BNSRE4 ACTIVE SO NS 14 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4075BNSRG4 ACTIVE SO NS 14 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4075BPW ACTIVE TSSOP PW 14 90 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4075BPWE4 ACTIVE TSSOP PW 14 90 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4075BPWG4 ACTIVE TSSOP PW 14 90 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4075BPWR ACTIVE TSSOP PW 14 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4075BPWRE4 ACTIVE TSSOP PW 14 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4075BPWRG4 ACTIVE TSSOP PW 14 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) JM38510/17101BCA ACTIVE CDIP J 14 1 TBD A42 N/AforPkgType JM38510/17103BCA ACTIVE CDIP J 14 1 TBD A42 N/AforPkgType (1)Themarketingstatusvaluesaredefinedasfollows: ACTIVE:Productdevicerecommendedfornewdesigns. LIFEBUY:TIhasannouncedthatthedevicewillbediscontinued,andalifetime-buyperiodisineffect. NRND:Notrecommendedfornewdesigns.Deviceisinproductiontosupportexistingcustomers,butTIdoesnotrecommendusingthispartin anewdesign. PREVIEW:Devicehasbeenannouncedbutisnotinproduction.Samplesmayormaynotbeavailable. OBSOLETE:TIhasdiscontinuedtheproductionofthedevice. (2)EcoPlan-Theplannedeco-friendlyclassification:Pb-Free(RoHS),Pb-Free(RoHSExempt),orGreen(RoHS&noSb/Br)-pleasecheck http://www.ti.com/productcontentforthelatestavailabilityinformationandadditionalproductcontentdetails. TBD:ThePb-Free/Greenconversionplanhasnotbeendefined. Pb-Free(RoHS):TI'sterms"Lead-Free"or"Pb-Free"meansemiconductorproductsthatarecompatiblewiththecurrentRoHSrequirements forall6substances,includingtherequirementthatleadnotexceed0.1%byweightinhomogeneousmaterials.Wheredesignedtobesoldered athightemperatures,TIPb-Freeproductsaresuitableforuseinspecifiedlead-freeprocesses. Pb-Free(RoHSExempt):ThiscomponenthasaRoHSexemptionforeither1)lead-basedflip-chipsolderbumpsusedbetweenthedieand package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible)asdefinedabove. Green(RoHS&noSb/Br):TIdefines"Green"tomeanPb-Free(RoHScompatible),andfreeofBromine(Br)andAntimony(Sb)basedflame retardants(BrorSbdonotexceed0.1%byweightinhomogeneousmaterial) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incomingmaterialsandchemicals.TIandTIsuppliersconsidercertaininformationtobeproprietary,andthusCASnumbersandotherlimited informationmaynotbeavailableforrelease. Addendum-Page3

PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 InnoeventshallTI'sliabilityarisingoutofsuchinformationexceedthetotalpurchasepriceoftheTIpart(s)atissueinthisdocumentsoldbyTI toCustomeronanannualbasis. Addendum-Page4

PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) CD4071BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD4071BNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 CD4071BPWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 CD4072BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD4072BNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 CD4075BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD4075BNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 CD4075BPWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) CD4071BM96 SOIC D 14 2500 346.0 346.0 33.0 CD4071BNSR SO NS 14 2000 346.0 346.0 33.0 CD4071BPWR TSSOP PW 14 2000 346.0 346.0 29.0 CD4072BM96 SOIC D 14 2500 346.0 346.0 33.0 CD4072BNSR SO NS 14 2000 346.0 346.0 33.0 CD4075BM96 SOIC D 14 2500 346.0 346.0 33.0 CD4075BNSR SO NS 14 2000 346.0 346.0 33.0 CD4075BPWR TSSOP PW 14 2000 346.0 346.0 29.0 PackMaterials-Page2

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MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,65 0,10 M 0,19 14 8 0,15 NOM 4,50 6,60 4,30 6,20 Gage Plane 0,25 1 7 0°–8° A 0,75 0,50 Seating Plane 0,15 1,20 MAX 0,10 0,05 PINS ** 8 14 16 20 24 28 DIM A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 4040064/F 01/97 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-153 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265

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PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) 7706002CA ACTIVE CDIP J 14 1 TBD Call TI N / A for Pkg Type -55 to 125 7706002CA CD4072BF3A CD4071BE ACTIVE PDIP N 14 25 Green (RoHS NIPDAU N / A for Pkg Type -55 to 125 CD4071BE & no Sb/Br) CD4071BEE4 ACTIVE PDIP N 14 25 Green (RoHS NIPDAU N / A for Pkg Type -55 to 125 CD4071BE & no Sb/Br) CD4071BF ACTIVE CDIP J 14 1 TBD Call TI N / A for Pkg Type -55 to 125 CD4071BF CD4071BF3A ACTIVE CDIP J 14 1 TBD Call TI N / A for Pkg Type -55 to 125 CD4071BF3A CD4071BM ACTIVE SOIC D 14 50 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4071BM & no Sb/Br) CD4071BM96 ACTIVE SOIC D 14 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4071BM & no Sb/Br) CD4071BMT ACTIVE SOIC D 14 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4071BM & no Sb/Br) CD4071BNSR ACTIVE SO NS 14 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4071B & no Sb/Br) CD4071BPW ACTIVE TSSOP PW 14 90 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CM071B & no Sb/Br) CD4071BPWE4 ACTIVE TSSOP PW 14 90 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CM071B & no Sb/Br) CD4071BPWR ACTIVE TSSOP PW 14 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CM071B & no Sb/Br) CD4072BE ACTIVE PDIP N 14 25 Green (RoHS NIPDAU N / A for Pkg Type -55 to 125 CD4072BE & no Sb/Br) CD4072BF ACTIVE CDIP J 14 1 TBD Call TI N / A for Pkg Type -55 to 125 CD4072BF CD4072BF3A ACTIVE CDIP J 14 1 TBD Call TI N / A for Pkg Type -55 to 125 7706002CA CD4072BF3A CD4072BM ACTIVE SOIC D 14 50 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4072BM & no Sb/Br) CD4072BM96 ACTIVE SOIC D 14 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4072BM & no Sb/Br) Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) CD4072BM96G4 ACTIVE SOIC D 14 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4072BM & no Sb/Br) CD4072BMT ACTIVE SOIC D 14 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4072BM & no Sb/Br) CD4072BNSR ACTIVE SO NS 14 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4072B & no Sb/Br) CD4072BPW ACTIVE TSSOP PW 14 90 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CM072B & no Sb/Br) CD4072BPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CM072B & no Sb/Br) CD4075BE ACTIVE PDIP N 14 25 Green (RoHS NIPDAU N / A for Pkg Type -55 to 125 CD4075BE & no Sb/Br) CD4075BEE4 ACTIVE PDIP N 14 25 Green (RoHS NIPDAU N / A for Pkg Type -55 to 125 CD4075BE & no Sb/Br) CD4075BF ACTIVE CDIP J 14 1 TBD Call TI N / A for Pkg Type -55 to 125 CD4075BF CD4075BF3A ACTIVE CDIP J 14 1 TBD Call TI N / A for Pkg Type -55 to 125 CD4075BF3A CD4075BM ACTIVE SOIC D 14 50 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4075BM & no Sb/Br) CD4075BM96 ACTIVE SOIC D 14 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4075BM & no Sb/Br) CD4075BM96G4 ACTIVE SOIC D 14 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4075BM & no Sb/Br) CD4075BNSR ACTIVE SO NS 14 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4075B & no Sb/Br) CD4075BPW ACTIVE TSSOP PW 14 90 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CM075B & no Sb/Br) CD4075BPWR ACTIVE TSSOP PW 14 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CM075B & no Sb/Br) CD4075BPWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CM075B & no Sb/Br) JM38510/17101BCA ACTIVE CDIP J 14 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/ 17101BCA JM38510/17103BCA ACTIVE CDIP J 14 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/ 17103BCA Addendum-Page 2

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) M38510/17101BCA ACTIVE CDIP J 14 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/ 17101BCA M38510/17103BCA ACTIVE CDIP J 14 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/ 17103BCA (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF CD4071B, CD4071B-MIL, CD4072B, CD4072B-MIL, CD4075B, CD4075B-MIL : Addendum-Page 3

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 •Catalog: CD4071B, CD4072B, CD4075B •Military: CD4071B-MIL, CD4072B-MIL, CD4075B-MIL NOTE: Qualified Version Definitions: •Catalog - TI's standard catalog product •Military - QML certified for Military and Defense Applications Addendum-Page 4

PACKAGE MATERIALS INFORMATION www.ti.com 8-Nov-2018 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) CD4071BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD4071BMT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD4071BNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 CD4071BPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 CD4072BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD4072BMT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD4072BNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 CD4075BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD4075BNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 CD4075BPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 8-Nov-2018 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) CD4071BM96 SOIC D 14 2500 367.0 367.0 38.0 CD4071BMT SOIC D 14 250 210.0 185.0 35.0 CD4071BNSR SO NS 14 2000 367.0 367.0 38.0 CD4071BPWR TSSOP PW 14 2000 367.0 367.0 35.0 CD4072BM96 SOIC D 14 2500 367.0 367.0 38.0 CD4072BMT SOIC D 14 250 210.0 185.0 35.0 CD4072BNSR SO NS 14 2000 367.0 367.0 38.0 CD4075BM96 SOIC D 14 2500 367.0 367.0 38.0 CD4075BNSR SO NS 14 2000 367.0 367.0 38.0 CD4075BPWR TSSOP PW 14 2000 367.0 367.0 35.0 PackMaterials-Page2

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PACKAGE OUTLINE J0014A CDIP - 5.08 mm max height SCALE 0.900 CERAMIC DUAL IN LINE PACKAGE PIN 1 ID A 4X .005 MIN (OPTIONAL) [0.13] .015-.060 TYP [0.38-1.52] 1 14 12X .100 [2.54] 14X .014-.026 14X .045-.065 [0.36-0.66] [1.15-1.65] .010 [0.25] C A B .754-.785 [19.15-19.94] 7 8 B .245-.283 .2 MAX TYP .13 MIN TYP [6.22-7.19] [5.08] [3.3] SEATING PLANE C .308-.314 [7.83-7.97] AT GAGE PLANE .015 GAGE PLANE [0.38] 0 -15 14X .008-.014 TYP [0.2-0.36] 4214771/A 05/2017 NOTES: 1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This package is hermitically sealed with a ceramic lid using glass frit. 4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only. 5. Falls within MIL-STD-1835 and GDIP1-T14. www.ti.com

EXAMPLE BOARD LAYOUT J0014A CDIP - 5.08 mm max height CERAMIC DUAL IN LINE PACKAGE (.300 ) TYP [7.62] SEE DETAIL B SEE DETAIL A 1 14 12X (.100 ) [2.54] SYMM 14X ( .039) [1] 7 8 SYMM LAND PATTERN EXAMPLE NON-SOLDER MASK DEFINED SCALE: 5X .002 MAX (.063) [0.05] [1.6] METAL ALL AROUND ( .063) SOLDER MASK [1.6] OPENING METAL .002 MAX SOLDER MASK (R.002 ) TYP [0.05] OPENING [0.05] ALL AROUND DETAIL A DETAIL B SCALE: 15X 13X, SCALE: 15X 4214771/A 05/2017 www.ti.com

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