Product Sample & Technical Tools & Support & Folder Buy Documents Software Community CC1121 SWRS111F–JUNE2011–REVISEDOCTOBER2014 CC1121 High-Performance Low-Power RF Transceiver 1 Device Overview 1.1 Features 1 • High-Performance,Single-ChipTransceiver • AutomaticOutputPowerRamping – ExcellentReceiverSensitivity: • ConfigurableDataRates:1.2to200kbps • –120dBmat1.2kbps • SupportedModulationFormats:2-FSK, • –110dBmat50kbps 2-GFSK,4-FSK,4-GFSK,MSK,OOK – BlockingPerformance:86dBat10MHz • RoHS-Compliant5-mmx5-mmNo-LeadQFN32- PinPackage(RHB) – AdjacentChannelSelectivity:60dB • Regulations –SuitableforSystemsTargeting – VeryLowPhaseNoise: –111dBc/Hzat ComplianceWith 10-kHzOffset – Europe:ETSIEN300220,ETSIEN54-25 • Separate128-ByteRXandTXFIFOs – US:FCCCFR47Part15,FCCCFR47Part24 • WaveMatch:AdvancedDigitalSignalProcessing forImprovedSyncDetectPerformance – Japan:ARIBSTD-T108 • SupportforSeamlessIntegrationWiththeCC1190 • PeripheralsandSupportFunctions DeviceforIncreasedRangeGivingupto3-dB – EnhancedWake-On-RadioFunctionalityfor ImprovementinSensitivityandupto+27-dBm AutomaticLow-PowerReceivePolling OutputPower – IncludesFunctionsforAntennaDiversity • PowerSupply Support – WideSupplyVoltageRange(2.0Vto3.6V) – SupportforRetransmissions – LowCurrentConsumption: – SupportforAuto-AcknowledgeofReceived • RX:2mAinRXSniffMode Packets • RX:17-mAPeakCurrentinLow-Power – TCXOSupportandControl,alsoinPower Mode Modes • RX:22-mAPeakCurrentinHigh- – AutomaticClearChannelAssessment(CCA)for PerformanceMode Listen-Before-Talk(LBT)Systems • TX:45mAat+14dBm – Built-inCodingGainSupportforIncreased RangeandRobustness – PowerDown:0.12 μA(0.5 μAWitheWOR TimerRunning) – DigitalRSSIMeasurement • ProgrammableOutputPowerupto+16dBmWith – TemperatureSensor 0.4-dBStepSize 1.2 Applications • Ultra-LowPowerWirelessSystemsWithChannel • IEEE802.15.4gSystems SpacingDownto50kHz • HomeandBuildingAutomation • 169-,315-,433-,868-,915-,920-,950-MHz • WirelessAlarmandSecuritySystems ISM/SRDBandSystems • IndustrialMonitoringandControl • WirelessMeteringandWirelessSmartGrid(AMR • WirelessHealthcareApplications andAMI) • WirelessSensorNetworksandActiveRFID 1 AnIMPORTANTNOTICEattheendofthisdatasheetaddressesavailability,warranty,changes,useinsafety-criticalapplications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

CC1121 SWRS111F–JUNE2011–REVISEDOCTOBER2014 www.ti.com 1.3 Description The CC1121 device is a fully integrated single-chip radio transceiver designed for high performance at very low-power and low-voltage operation in cost-effective wireless systems. All filters are integrated, thus removing the need for costly external SAW and IF filters. The device is mainly intended for the ISM (Industrial, Scientific, and Medical) and SRD (Short Range Device) frequency bands at 274–320 MHz, 410–480MHz,and820–960MHz. The CC1121 device provides extensive hardware support for packet handling, data buffering, burst transmissions, clear channel assessment, link quality indication, and Wake-On-Radio. The main operating parameters of the CC1121 device can be controlled through an SPI interface. In a typical system, the CC1121devicewillbeusedwithamicrocontrollerandonlyafewexternalpassivecomponents. DeviceInformation(1) PARTNUMBER PACKAGE BODYSIZE CC1121RHB VQFN(32) 5.00mmx5.00mm (1) Formoreinformation,seeSection8,MechanicalPackagingandOrderableInformation 1.4 Functional Diagram Figure1-1showsthesystemblockdiagramoftheCC1121device. CC112X (optcioloncakl 3in2tpkHutz) autUo-ltcraal ilborwa tpeodw ReCr 3o2skcHillza tor Power on reset 4Rk ObyMte MUalitnra R loawdMMi opAC oRCUwCoenrt r1o6l Ubnit it Saenrdia dl acotSanP finiIg tuerrafaticoen CSn (chip select) SI (serial input) System bus Interrupt and SO (serial output) IO handler SCLK (serial clock) EnWhaankcee Ode nuW lRtOraaRd loiow t ipmoewrer Batettmerpy sseennssoorr / Csotnaftiugsu rraetgioisnte arnsd F2IF5bO6u f bfReyArteM aPnadc FkIeFtO h acnodnlterorl (optional GPIO0-3) RF and DSP frontend Output power ramping and OOK / ASK modulation (optional autodetected external XOSC / TCXO) PA e1f4ficdiBemnc yh iPghA QI FuFllyre inqtueegnracyte Sdy Fnrtahcetsioiznearl-N Modulator sDigantaa li ncthearifna caec cweitshs XOSC XXOOSSCC__QQ12 90dB dynamic LNA_P ifamp range ADC (optional bit clock) HighL lNinAearity Channel filter Cordic Highly dfleemxiboldeu FlaStoKr / OOK (optional low jitter serial LNA_N ifamp 90radnBg dey AnDamCic dparotato ocoultsp)ut for legacy AGC (optional GPIO for Automatic Gain Control, 60dB VGA range antenna diversity) RSSI measurements and carrier sense detection Figure1-1.FunctionalBlockDiagram 2 DeviceOverview Copyright©2011–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback ProductFolderLinks:CC1121

CC1121 www.ti.com SWRS111F–JUNE2011–REVISEDOCTOBER2014 Table of Contents 1 DeviceOverview......................................... 1 4.16 32-kHzClockInput.................................. 17 .............................................. ............................... 1.1 Features 1 4.17 32-kHzRCOscillator 17 ........................................... ....................................... 1.2 Applications 1 4.18 I/OandReset 17 ............................................ ................................ 1.3 Description 2 4.19 Temperature Sensor 17 ................................... .............................. 1.4 Functional Diagram 2 4.20 Typical Characteristics 18 2 Revision History......................................... 4 5 DetailedDescription................................... 20 3 TerminalConfigurationandFunctions.............. 5 5.1 BlockDiagram....................................... 20 .......................................... .............................. 3.1 PinDiagram 5 5.2 FrequencySynthesizer 20 ..................................... ............................................. 3.2 PinConfiguration 6 5.3 Receiver 21 4 Specifications ............................................ 7 5.4 Transmitter.......................................... 21 .......................... ................... 4.1 AbsoluteMaximumRatings 7 5.5 RadioControlandUserInterface 21 ..................................... ................ 4.2 Handling Ratings 7 5.6 EnhancedWake-On-Radio(eWOR) 21 4.3 RecommendedOperatingConditions(General 5.7 SniffMode........................................... 22 ....................................... Characteristics) 7 ................................... 5.8 AntennaDiversity 22 4.4 ThermalResistanceCharacteristicsforRHB ........... .............................................. 5.9 Low-PowerandHigh-PerformanceMode 22 Package 7 .......................................... .................................... 5.10 WaveMatch 23 4.5 RF Characteristics 8 6 TypicalApplicationCircuit........................... 24 ................................ 4.6 RegulatoryStandards 9 7 DeviceandDocumentationSupport............... 25 ................. 4.7 CurrentConsumption,StaticModes 9 ...................................... .............. 7.1 DeviceSupport 25 4.8 CurrentConsumption,TransmitModes 9 ............................. .............. 7.2 DocumentationSupport 26 4.9 CurrentConsumption,ReceiveModes 10 .............................. ................................. 7.3 CommunityResources 26 4.10 ReceiveParameters 11 .......................................... ................................ 7.4 Trademarks 26 4.11 Transmit Parameters 14 ..................... ..................................... 7.5 ElectrostaticDischargeCaution 26 4.12 PLLParameters 15 ............................................. ................................ 7.6 Glossary 26 4.13 Wake-upandTiming 16 8 MechanicalPackagingandOrderable ........................... 4.14 32-MHzCrystalOscillator 16 Information.............................................. 27 ....................... 4.15 32-MHzClockInput(TCXO) 16 Copyright©2011–2014,TexasInstrumentsIncorporated TableofContents 3 SubmitDocumentationFeedback ProductFolderLinks:CC1121

CC1121 SWRS111F–JUNE2011–REVISEDOCTOBER2014 www.ti.com 2 Revision History NOTE:Pagenumbersforpreviousrevisionsmaydifferfrompagenumbersinthecurrentversion. This data manual revision history highlights the changes made to the SWRS111E device-specific data manualtomakeitanSWRS111Frevision. ChangesfromRevisionE(July2014)toRevisionF Page • AddedAmbienttothetemperaturerangeconditionandremovedTjfromTemperaturerange ........................... 7 • AddeddatatoTCXOtable......................................................................................................... 16 4 RevisionHistory Copyright©2011–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback ProductFolderLinks:CC1121

CC1121 www.ti.com SWRS111F–JUNE2011–REVISEDOCTOBER2014 3 Terminal Configuration and Functions 3.1 Pin Diagram Figure3-1showspinnamesandlocationsfortheCC1121device. P P 2 H H C SC SC NTH D_C D_C OS Q2 Q1 XO XO SY PF PF _X C_ C_ L_ D_ D_ L_ D_ T S S P D D P D X O O C V V C V E X X D A A D A 2 1 0 9 8 7 6 5 3 3 3 2 2 2 2 2 VDD_GUARD 1 24 LPF1 RESET_N 2 23 LPF0 GPIO3 3 22 AVDD_SYNTH1 GPIO2 4 21 DCPL_VCO CC1121 DVDD 5 20 LNA_N DCPL 6 19 LNA_P SI 7 GND 18 TRX_SW SCLK 8 GROUND PAD 17 PA 9 10 11 12 13 14 15 16 S G C D A R A N O (GP PIO0 Sn VDD VDD_ BIAS VDD_ .C. IO IF RF 1 ) Figure3-1.Package5-mm ×5-mmQFN Copyright©2011–2014,TexasInstrumentsIncorporated TerminalConfigurationandFunctions 5 SubmitDocumentationFeedback ProductFolderLinks:CC1121

CC1121 SWRS111F–JUNE2011–REVISEDOCTOBER2014 www.ti.com 3.2 Pin Configuration ThefollowingtableliststhepinoutconfigurationfortheCC1121device. PINNO. PINNAME TYPE/DIRECTION DESCRIPTION 1 VDD_GUARD Power 2.0–3.6VVDD 2 RESET_N Digitalinput Asynchronous,active-lowdigitalreset 3 GPIO3 DigitalI/O General-purposeI/O 4 GPIO2 DigitalI/O General-purposeI/O 5 DVDD Power 2.0–3.6VVDDtointernaldigitalregulator 6 DCPL Power Digitalregulatoroutputtoexternaldecouplingcapacitor 7 SI Digitalinput Serialdatain 8 SCLK Digitalinput Serialdataclock 9 SO(GPIO1) DigitalI/O Serialdataout(general-purposeI/O) 10 GPIO0 DigitalI/O General-purposeI/O 11 CSn DigitalInput Active-lowchipselect 12 DVDD Power 2.0–3.6VVDD 13 AVDD_IF Power 2.0–3.6VVDD 14 RBIAS Analog Externalhigh-precisionR 15 AVDD_RF Power 2.0–3.6VVDD 16 N.C. Notconnected 17 PA Analog Single-endedTXoutput(requiresDCpathtoVDD) TXandRXswitch.ConnectedinternallytoGNDinTXandfloating(high- 18 TRX_SW Analog impedance)inRX. 19 LNA_P Analog DifferentialRXinput(requiresDCpathtoGND) 20 LNA_N Analog DifferentialRXinput(requiresDCpathtoGND) 21 DCPL_VCO Power PinforexternaldecouplingofVCOsupplyregulator 22 AVDD_SYNTH1 Power 2.0–3.6VVDD 23 LPF0 Analog Externalloopfiltercomponents 24 LPF1 Externalloopfiltercomponents 25 AVDD_PFD_CHP Power 2.0–3.6VVDD 26 DCPL_PFD_CHP Power PinforexternaldecouplingofPFDandCHPregulator 27 AVDD_SYNTH2 Power 2.0–3.6VVDD 28 AVDD_XOSC Power 2.0–3.6VVDD 29 DCPL_XOSC Power PinforexternaldecouplingofXOSCsupplyregulator Crystaloscillatorpin1(mustbegroundedifaTCXOorotherexternalclock 30 XOSC_Q1 Analog connectedtoEXT_XOSCisused) Crystaloscillatorpin2(mustbeleftfloatingifaTCXOorotherexternalclock 31 XOSC_Q2 Analog connectedtoEXT_XOSCisused) PinforexternalXOSCinput(mustbegroundedifaregularXOSCconnected 32 EXT_XOSC Digitalinput toXOSC_Q1andXOSC_Q2isused) – GND Groundpad Thegroundpadmustbeconnectedtoasolidgroundplane. 6 TerminalConfigurationandFunctions Copyright©2011–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback ProductFolderLinks:CC1121

CC1121 www.ti.com SWRS111F–JUNE2011–REVISEDOCTOBER2014 4 Specifications All measurements performed on CC1120EM_868_915 rev.1.0.1, CC1120EM_955 rev.1.2.1, CC1120EM_420_470rev.1.0.1,orCC1120EM_169rev.1.2. 4.1 Absolute Maximum Ratings(1)(2) overoperatingfree-airtemperaturerange(unlessotherwisenoted) PARAMETER MIN MAX UNIT CONDITION Supplyvoltage(VDD,AVDD_x) –0.3 3.9 V Allsupplypinsmusthavethesamevoltage InputRFlevel +10 dBm Voltageonanydigitalpin –0.3 VDD+0.3 V max3.9V Voltageonanalogpins –0.3 2.0 V (includingDCPLpins) (1) Stressesbeyondthoselistedunderabsolutemaximumratingsmaycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedundergeneralcharacteristicsisnot implied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) AllvoltagevaluesarewithrespecttoV ,unlessotherwisenoted. SS 4.2 Handling Ratings MIN MAX UNIT T Storagetemperaturerange –40 125 °C stg Humanbodymodel(HBM),perANSI/ESDA/JEDECJS001(1) –2 2 kV Electrostaticdischarge VESD (ESD)performance: CCh1a0r1g(e2)ddevicemodel(CDM),perJESD22- Allpins –500 500 V (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess. (2) JEDECdocumentJEP157statesthat250-VHBMallowssafemanufacturingwithastandardESDcontrolprocess. 4.3 Recommended Operating Conditions (General Characteristics) PARAMETER MIN TYP MAX UNIT CONDITION Voltagesupplyrange 2.0 3.6 V Allsupplypinsmusthavethesamevoltage Voltageondigitalinputs 0 VDD V Temperaturerange –40 85 °C Ambient 4.4 Thermal Resistance Characteristics for RHB Package °C/W(1) AIRFLOW(m/s)(2) Rθ Junction-to-case(top) 21.1 0.00 JC Rθ Junction-to-board 5.3 0.00 JB Rθ Junction-to-freeair 31.3 0.00 JA Psi Junction-to-packagetop 0.2 0.00 JT Psi Junction-to-board 5.3 0.00 JB Rθ Junction-to-case(bottom) 0.8 0.00 JC (1) ThesevaluesarebasedonaJEDEC-defined2S2Psystem(withtheexceptionoftheThetaJC[RΘ ]value,whichisbasedona JC JEDEC-defined1S0Psystem)andwillchangebasedonenvironmentaswellasapplication.Formoreinformation,seethese EIA/JEDECstandards: • JESD51-2,IntegratedCircuitsThermalTestMethodEnvironmentalConditions-NaturalConvection(StillAir) • JESD51-3,LowEffectiveThermalConductivityTestBoardforLeadedSurfaceMountPackages • JESD51-7,HighEffectiveThermalConductivityTestBoardforLeadedSurfaceMountPackages • JESD51-9,TestBoardsforAreaArraySurfaceMountPackageThermalMeasurements Powerdissipationof40mWandanambienttemperatureof25ºCisassumed. (2) m/s=meterspersecond Copyright©2011–2014,TexasInstrumentsIncorporated Specifications 7 SubmitDocumentationFeedback ProductFolderLinks:CC1121

CC1121 SWRS111F–JUNE2011–REVISEDOCTOBER2014 www.ti.com 4.5 RF Characteristics PARAMETER MIN TYP MAX UNIT CONDITION 820 960 MHz 410 480 MHz Formoreinformation,seeapplication (273.3) (320) MHz noteAN115,Usingthe Frequencybands CC112x/CC1175at274to320MHz. 164 192 MHz (205) (240) MHz PleasecontactTIformoreinformation abouttheuseofthesefrequency (136.7) (160) MHz bands. 30 Hz In820-to950-MHzband Frequencyresolution 15 Hz In410-to480-MHzband 6 Hz In164-to192-MHzband 0 200 kbps Packetmode Datarate 0 100 kbps Transparentmode Dataratestepsize 1e-4 bps 8 Specifications Copyright©2011–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback ProductFolderLinks:CC1121

CC1121 www.ti.com SWRS111F–JUNE2011–REVISEDOCTOBER2014 4.6 Regulatory Standards PERFORMANCEMODE FREQUENCYBAND SUITABLEFORCOMPLIANCEWITH COMMENTS ARIBT-108 Performancealsosuitable ARIBT-96 forsystemstargeting ETSIEN300220,receivercategory2 maximumallowedoutput 820–960MHz ETSIEN54-25 powerintherespective FCCPART24SubmaskD bands,usingarange FCCPart15.247 extendersuchasthe FCCPart15.249 CC1190device Performancealsosuitable forsystemstargeting High-performancemode maximumallowedoutput 410–480MHz ETSIEN300220,category2 powerintherespective bands,usingarange extender Performancealsosuitable forsystemstargeting maximumallowedoutput 164–192MHz ETSIEN300220,category2 powerintherespective bands,usingarange extender ETSIEN300220,category2 820–960MHz FCCPart15.247 FCCPart15.249 Low-powermode 410–480MHz ETSIEN300220,category2 164–192MHz ETSIEN300220,category2 4.7 Current Consumption, Static Modes T =25°C,VDD=3.0Vifnothingelsestated A PARAMETER MIN TYP MAX UNIT CONDITION 0.12 1 µA Powerdownwithretention 0.5 µA Low-powerRCoscillatorrunning XOFFmode 170 µA Crystaloscillator/TCXOdisabled Clockrunning,systemwaitingwithno IDLEmode 1.3 mA radioactivity 4.8 Current Consumption, Transmit Modes 4.8.1 950-MHz Band (High-Performance Mode) T =25°C,VDD=3.0Vifnothingelsestated A PARAMETER MIN TYP MAX UNIT CONDITION TXcurrentconsumption+10dBm 37 mA TXcurrentconsumption0dBm 26 mA 4.8.2 868-, 915-, and 920-MHz Bands (High-Performance Mode) T =25°C,VDD=3.0Vifnothingelsestated A PARAMETER MIN TYP MAX UNIT CONDITION TXcurrentconsumption+14dBm 45 mA TXcurrentconsumption+10dBm 34 mA Copyright©2011–2014,TexasInstrumentsIncorporated Specifications 9 SubmitDocumentationFeedback ProductFolderLinks:CC1121

CC1121 SWRS111F–JUNE2011–REVISEDOCTOBER2014 www.ti.com 4.8.3 434-MHz Band (High-Performance Mode) T =25°C,VDD=3.0Vifnothingelsestated A PARAMETER MIN TYP MAX UNIT CONDITION TXcurrentconsumption+15dBm 50 mA TXcurrentconsumption+14dBm 45 mA TXcurrentconsumption+10dBm 34 mA 4.8.4 169-MHz Band (High-Performance Mode) T =25°C,VDD=3.0Vifnothingelsestated A PARAMETER MIN TYP MAX UNIT CONDITION TXcurrentconsumption+15dBm 54 mA TXcurrentconsumption+14dBm 49 mA TXcurrentconsumption+10dBm 41 mA 4.8.5 Low-Power Mode T =25°C,VDD=3.0V,f =869.5MHzifnothingelsestated A c PARAMETER MIN TYP MAX UNIT CONDITION TXcurrentconsumption+10dBm 32 mA 4.9 Current Consumption, Receive Modes 4.9.1 High-Performance Mode T =25°C,VDD=3.0V,f =869.5MHzifnothingelsestated A c PARAMETER MIN TYP MAX UNIT CONDITION UsingRXsniffmode,wherethe RXwaitforsync receiverwakesupatregular 2 mA 1.2kbps,4-bytepreamble intervalstolookforanincoming packet RXpeakcurrent Peakcurrentconsumptionduring 433-,868-,915-,920-,and950-MHzbands 22 mA packetreceptionatthesensitivity threshold 169-MHzband 23 mA Averagecurrentconsumption 50kbps,5-bytepreamble,40-kHz Checkfordatapacketevery1second 15 µA RCoscillatorusedassleeptimer usingWake-on-Radio 4.9.2 Low-Power Mode T =25°C,VDD=3.0V,f =869.5MHzifnothingelsestated A c PARAMETER MIN TYP MAX UNIT CONDITION RXpeakcurrentlow-powerRXmode Peakcurrentconsumptionduring packetreceptionatthesensitivity 1.2kbps 17 mA level 10 Specifications Copyright©2011–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback ProductFolderLinks:CC1121

CC1121 www.ti.com SWRS111F–JUNE2011–REVISEDOCTOBER2014 4.10 Receive Parameters AllRXmeasurementsmadeattheantennaconnector,toabiterrorrate(BER)limitof1%. 4.10.1 General Receive Parameters (High-Performance Mode) T =25°C,VDD=3.0V,f =869.5MHzifnothingelsestated A c PARAMETER MIN TYP MAX UNIT CONDITION Saturation +10 dBm Digitalchannelfilterprogrammable 41.7 200 kHz bandwidth IIP3,normalmode –14 dBm Atmaximumgain Using6-dBgainreductioninfront IIP3,highlinearitymode –8 dBm end Withcarriersensedetection ±12 % enabledandassuming4-byte Datarateoffsettolerance preamble Withcarriersensedetection ±0.2 % disabled Spuriousemissions Radiatedemissionsmeasured 1–13GHz(VCOleakageat3.5GHz) –56 dBm accordingtoETSIEN300220,f = c 869.5MHz 30MHzto1GHz <–57 dBm Optimumsourceimpedance 868-,915-,and920-MHzbands 60+j60/30+j30 Ω (Differentialorsingle-endedRX 433-MHzband 100+j60/50+j30 Ω configurations) 169-MHzband 140+j40/70+j20 Ω 4.10.2 RX Performance in 950-MHz Band (High-Performance Mode) T =25°C,VDD=3.0Vifnothingelsestated A PARAMETER MIN TYP Max UNIT CONDITION –114 dBm 1.2kbps,DEV=20kHzCHF=50kHz(1) Sensitivity Note:Sensitivitycanbeimprovedifthe –107 dBm 50kbps2GFSK,DEV=25kHz,CHF=100kHz(1) TXandRXmatchingnetworksare 200kbps,DEV=83kHz(outersymbols),CHF=200kHz, separated. –100 dBm 4GFSK(2) 47 dB ±50kHz(adjacentchannel) Blockingandselectivity 48 dB +100kHz(alternatechannel) 1.2-kbps2FSK,50-kHzchannel 69 dB ±1MHz separation,20-kHzdeviation, 50-kHzchannelfilter 71 dB ±2MHz 78 dB ±10MHz 43 dB ±200kHz(adjacentchannel) Blockingandselectivity 50-kbps2GFSK,200-kHzchannel 51 dB ±400kHz(alternatechannel) separation,25-kHzdeviation,100-kHz 62 dB ±1MHz channelfilter (Samemodulationformatas802.15.4g 65 dB ±2MHz MandatoryMode) 71 dB ±10MHz 37 dB ±200kHz(adjacentchannel) Blockingandselectivity 44 dB ±400kHz(alternatechannel) 200-kbps4GFSK,83-kHzdeviation 55 dB ±1MHz (outersymbols), 200-kHzchannelfilter,zeroIF 58 dB ±2MHz 64 dB ±10MHz (1) DEVisshortfordeviation,CHFisshortforChannelFilterBandwidth (2) BT=0.5isusedinallGFSKmeasurements Copyright©2011–2014,TexasInstrumentsIncorporated Specifications 11 SubmitDocumentationFeedback ProductFolderLinks:CC1121

CC1121 SWRS111F–JUNE2011–REVISEDOCTOBER2014 www.ti.com 4.10.3 RX Performance in 868-, 915-, and 920-MHz Bands (High-Performance Mode) T =25°C,VDD=3.0Vifnothingelsestated A PARAMETER MIN TYP MAX UNIT CONDITION 1.2kbps,DEV=10kHzCHF=41.7kHz(1),usingincreased –120 dBm RXfiltering –117 dBm 1.2kbps,DEV=20kHzCHF=50kHz(1) –114 dBm 4.8kbpsOOK Sensitivity –110 dBm 38.4kbps,DEV=20kHzCHF=100kHz(1) –110 dBm 50kbps2GFSK,DEV=25kHz,CHF=100kHz(1) 200kbps,DEV=83kHz(outersymbols),CHF=200 –103 dBm kHz(1),4GFSK 48 dB ±50kHz(adjacentchannel) Blockingandselectivity 48 dB ±100kHz(alternatechannel) 1.2-kbps2FSK,50-kHzchannel 69 dB ±1MHz separation,20-kHzdeviation,50-kHz channelfilter 74 dB ±2MHz 81 dB ±10MHz 42 dB +100kHz(adjacentchannel) Blockingandselectivity 43 dB ±200kHz(alternatechannel) 38.4-kbps2GFSK,100-kHzchannel 62 dB ±1MHz separation,20-kHzdeviation,100-kHz channelfilter 66 dB ±2MHz 74 dB ±10MHz 43 dB ±200kHz(adjacentchannel) Blockingandselectivity 50-kbps2GFSK,200-kHzchannel 50 dB ±400kHz(alternatechannel) separation,25-kHzdeviation,100-kHz 61 dB ±1MHz channelfilter (Samemodulationformatas802.15.4g 65 dB ±2MHz MandatoryMode) 74 dB ±10MHz 36 dB ±200kHz(adjacentchannel) Blockingandselectivity 44 dB ±400kHz(alternatechannel) 200-kbps4GFSK,83-kHzdeviation 55 dB ±1MHz (outersymbols),200-kHzchannelfilter, zeroIF 59 dB ±2MHz 67 dB ±10MHz (1) DEVisshortfordeviation,CHFisshortforChannelFilterBandwidth 4.10.4 RX Performance in 434-MHz Band (High-Performance Mode) T =25°C,VDD=3.0Vifnothingelsestated A PARAMETER MIN TYP MAX UNIT CONDITION –109 dBm 50kbps2GFSK,DEV=25kHz,CHF=100kHz(1) Sensitivity –116 dBm 1.2kbps,DEV=20kHzCHF=50kHz(1) 54 dB ±50kHz(adjacentchannel) Blockingandselectivity 54 dB +100kHz(alternatechannel) 1.2-kbps2FSK,50-kHzchannel 74 dB ±1MHz separation,20-kHzdeviation,50-kHz channelfilter 78 dB ±2MHz 86 dB ±10MHz 47 dB +100kHz(adjacentchannel) Blockingandselectivity 50 dB ±200kHz(alternatechannel) 38.4-kbps2GFSK,100-kHzchannel 67 dB ±1MHz separation,20-kHzdeviation,100-kHz channelfilter 71 dB ±2MHz 78 dB ±10MHz (1) DEVisshortfordeviation,CHFisshortforChannelFilterBandwidth 12 Specifications Copyright©2011–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback ProductFolderLinks:CC1121

CC1121 www.ti.com SWRS111F–JUNE2011–REVISEDOCTOBER2014 4.10.5 RX Performance in 169-MHz Band (High-Performance Mode) T =25°C,VDD=3.0Vifnothingelsestated A PARAMETER MIN TYP MAX UNIT CONDITION Sensitivity –117 dBm 1.2kbps,DEV=20kHzCHF=50kHz(1) 60 dB ±50kHz(adjacentchannel) Blockingandselectivity 60 dB +100kHz(alternatechannel) 1.2-kbps2FSK,50-kHzchannel 76 dB ±1MHz separation,20-kHzdeviation,50-kHz channelfilter 77 dB ±2MHz 83 dB ±10MHz (1) DEVisshortfordeviation,CHFisshortforChannelFilterBandwidth 4.10.6 RX Performance in Low-Power Mode T =25°C,VDD=3.0V,f =869.5MHzifnothingelsestated A c PARAMETER MIN TYP MAX UNIT CONDITION –99 dBm 38.4kbps,DEV=50kHzCHF=100kHz(1) Sensitivity –99 dBm 50kbps2GFSK,DEV=25kHz,CHF=100kHz(1) 43 dB ±50kHz(adjacentchannel) Blockingandselectivity 45 dB +100kHz(alternatechannel) 1.2-kbps2FSK,50-kHzchannel 71 dB ±1MHz separation,20-kHzdeviation,50-kHz channelfilter 74 dB ±2MHz 75 dB ±10MHz 37 dB +100kHz(adjacentchannel) Blockingandselectivity 43 dB +200kHz(alternatechannel) 38.4-kbps2GFSK,100-kHzchannel 58 dB ±1MHz separation,20-kHzdeviation,100-kHz channelfilter 62 dB ±2MHz 64 dB +10MHz 43 dB +200kHz(adjacentchannel) Blockingandselectivity 50-kbps2GFSK,200-kHzchannel 52 dB +400kHz(alternatechannel) separation,25-kHzdeviation,100-kHz 60 dB ±1MHz channelfilter (Samemodulationformatas802.15.4g 64 dB ±2MHz MandatoryMode) 65 dB ±10MHz Saturation +10 dBm (1) DEVisshortfordeviation,CHFisshortforChannelFilterBandwidth Copyright©2011–2014,TexasInstrumentsIncorporated Specifications 13 SubmitDocumentationFeedback ProductFolderLinks:CC1121

CC1121 SWRS111F–JUNE2011–REVISEDOCTOBER2014 www.ti.com 4.11 Transmit Parameters T =25°C,VDD=3.0V,f =869.5MHzifnothingelsestated A c PARAMETER MIN TYP MAX UNIT CONDITION +12 dBm At950MHz +14 dBm At915-and920-MHz +15 dBm At915-and920-MHzwithVDD=3.6V +15 dBm At868MHz Maxoutputpower +16 dBm At868MHzwithVDD=3.6V +15 dBm At433MHz +16 dBm At433MHzwithVDD=3.6V +15 dBm At169MHz +16 dBm At169MHzwithVDD=3.6V –11 dBm Withinfinestepsizerange Minoutputpower –40 dBm Withincoarsestepsizerange Outputpowerstepsize 0.4 dB Withinfinestepsizerange 4-GFSK9.6kbpsin12.5-kHzchannel,measuredin100-Hz –75 dBc bandwidthat434MHz(FCCPart90MaskDcompliant) Adjacentchannelpower 4-GFSK9.6kbpsin12.5-kHzchannel,measuredin8.75-kHz –58 dBc bandwidth(ETSI300220compliant) –61 dBc 2-GFSK2.4kbpsin12.5-kHzchannel,1.2-kHzdeviation Spuriousemissions <–60 dBm (notincludingharmonics) Harmonics SecondHarm,169MHz –39 dBm ThirdHarm,169MHz –58 dBm SecondHarm,433MHz –56 dBm ThirdHarm,433MHz –51 dBm Transmissionat+14dBm(ormaximumallowedinapplicable bandwherethisislessthan+14dBm)usingTIreference SecondHarm,450MHz –60 dBm design. ThirdHarm,450MHz –45 dBm EmissionsmeasuredaccordingtoARIBT-96in950-MHz band,ETSIEN300220in169-,433-,and868-MHzbands SecondHarm,868MHz –40 dBm andFCCPart15.247in450-and915-MHzband ThirdHarm,868MHz –42 dBm Fourthharmonicin915-MHzbandwillrequireextrafilteringto meetFCCrequirementsiftransmittingforlongintervals(>50- SecondHarm,915MHz 56 dBuV/m msperiods). ThirdHarm,915MHz 52 dBuV/m FourthHarm,915MHz 60 dBuV/m SecondHarm,950MHz –58 dBm ThirdHarm,950MHz –42 dBm Optimumload Impedance868-,915-,and920- 35+j35 Ω MHzbands 433-MHzband 55+j25 Ω 169-MHzband 80+j0 Ω 14 Specifications Copyright©2011–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback ProductFolderLinks:CC1121

CC1121 www.ti.com SWRS111F–JUNE2011–REVISEDOCTOBER2014 4.12 PLL Parameters 4.12.1 High-Performance Mode T =25°C,VDD=3.0V,f =869.5MHzifnothingelsestated A c PARAMETER MIN TYP MAX UNIT CONDITION –99 dBc/Hz ±10kHzoffset Phasenoisein950-MHzband –99 dBc/Hz ±100kHzoffset –123 dBc/Hz ±1MHzoffset –99 dBc/Hz ±10kHzoffset Phasenoisein868-,915-,and920-MHz –100 dBc/Hz ±100kHzoffset bands –122 dBc/Hz ±1MHzoffset –106 dBc/Hz ±10kHzoffset Phasenoisein433-MHzband –107 dBc/Hz ±100kHzoffset –127 dBc/Hz ±1MHzoffset –111 dBc/Hz ±10kHzoffset Phasenoisein169-MHzband –116 dBc/Hz ±100kHzoffset –135 dBc/Hz ±1MHzoffset 4.12.2 Low-Power Mode T =25°C,VDD=3.0V,f =869.5MHzifnothingelsestated A c PARAMETER MIN TYP MAX UNIT CONDITION –90 dBc/Hz ±10kHzoffset Phasenoisein950-MHzband –92 dBc/Hz ±100kHzoffset –124 dBc/Hz ±1MHzoffset –95 dBc/Hz ±10kHzoffset Phasenoisein868-and915-MHzbands –95 dBc/Hz ±100kHzoffset –124 dBc/Hz ±1MHzoffset –98 dBc/Hz ±10kHzoffset Phasenoisein433-MHzband –102 dBc/Hz ±100kHzoffset –129 dBc/Hz ±1MHzoffset –106 dBc/Hz ±10kHzoffset Phasenoisein169-MHzband –110 dBc/Hz ±100kHzoffset –136 dBc/Hz ±1MHzoffset Copyright©2011–2014,TexasInstrumentsIncorporated Specifications 15 SubmitDocumentationFeedback ProductFolderLinks:CC1121

CC1121 SWRS111F–JUNE2011–REVISEDOCTOBER2014 www.ti.com 4.13 Wake-up and Timing T =25°C,VDD=3.0V,f =869.5MHzifnothingelsestated A c PARAMETER MIN TYP MAX UNIT CONDITION PowerdowntoIDLE 0.4 ms Dependsoncrystal 166 µs Calibrationdisabled IDLEtoRX/TX 461 µs Calibrationenabled RX/TXturnaround 50 µs 296 µs CalibratewhenleavingRX/TXenabled RX/TXtoIDLEtime 0 µs CalibratewhenleavingRX/TXdisabled Frequencysynthesizercalibration 391 µs WhenusingSCALstrobe RequiredforRFfront-endgainsettling Minimumrequirednumberofpreamble 0.5 bytes only.Digitaldemodulationdoesnot bytes requirepreambleforsettling. TimefromstartRXuntilvalidRSSI Includinggainsettling(functionofchannel bandwidth). 0.3 ms 200-kHzchannels Programmablefortrade-offbetweenspeed andaccuracy 4.14 32-MHz Crystal Oscillator T =25°C,VDD=3.0Vifnothingelsestated A PARAMETER MIN TYP MAX UNIT CONDITION Itisexpectedthattherewillbe degradedsensitivityatmultiplesof XOSC/2inRX,andanincreasein spuriousemissionswhentheRF channelisclosetomultiplesofXOSC Crystalfrequency 32 33.6 MHz inTX.WerecommendthattheRF channeliskeptRX_BW/2awayfrom XOSC/2inRX,andthatthelevelof spuriousemissionsbeevaluatedifthe RFchanneliscloserthan1MHzto multiplesofXOSCinTX. Loadcapacitance(C ) 10 pF L ESR 60 Ω Simulatedoveroperatingconditions Start-uptime 0.4 ms Dependsoncrystal 4.15 32-MHz Clock Input (TCXO) T =25°C,VDD=3.0Vifnothingelsestated A PARAMETER MIN TYP MAX UNIT CONDITION Clockfrequency 32 33.6 MHz TCXOwithCMOSoutput TCXOwithCMOSoutputdirectly coupledtopinEXT_OSC Highinputvoltage 1.4 VDD V Lowinputvoltage 0 0.6 V Rise/Falltime 2 ns Clippedsineoutput TCXOclippedsineoutputconnected topinEXT_OSCthroughseries Clockinputamplitude(peak-to-peak) 0.8 1.5 V capacitor 16 Specifications Copyright©2011–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback ProductFolderLinks:CC1121

CC1121 www.ti.com SWRS111F–JUNE2011–REVISEDOCTOBER2014 4.16 32-kHz Clock Input T =25°C,VDD=3.0Vifnothingelsestated A PARAMETER MIN TYP MAX UNIT CONDITION Clockfrequency 32 kHz 32-kHzclockinputpininputhighvoltage 0.8×VDD V 32-kHzclockinputpininputlowvoltage 0.2×VDD V 4.17 32-kHz RC Oscillator T =25°C,VDD=3.0Vifnothingelsestated A PARAMETER MIN TYP MAX UNIT CONDITION Frequency 32 kHz Aftercalibration Relativetofrequencyreference(that Frequencyaccuracyaftercalibration ±0.1 % is,32-MHzcrystalorTCXO) Initialcalibrationtime 1.6 ms 4.18 I/O and Reset T =25°C,VDD=3.0Vifnothingelsestated A PARAMETER MIN TYP MAX UNIT CONDITION Logicinputhighvoltage 0.8×VDD V Logicinputlowvoltage 0.2×VDD V Logicoutputhighvoltage 0.8×VDD V At4-mAoutputloadorless Logicoutputlowvoltage 0.2×VDD V Power-onresetthreshold 1.3 V VoltageonDVDDpin 4.19 Temperature Sensor T =25°C,VDD=3.0Vifnothingelsestated A PARAMETER MIN TYP MAX UNIT CONDITION Temperaturesensorrange –40 85 °C Changeinsensoroutputvoltage Temperaturecoefficient 2.66 mV/°C versuschangeintemperature TypicalsensoroutputvoltageatT = Typicaloutputvoltage 794 mV A 25°C,VDD=3.0V Changeinsensoroutputvoltage VDDcoefficient 1.17 mV/V versuschangeinVDD The CC1121 device can be configured to provide a voltage proportional to temperature on GPIO1. The temperature can be estimated by measuring this voltage (See Section 4.19, Temperature Sensor). For more information,seethetemperaturesensordesignnote(SWRA415). Copyright©2011–2014,TexasInstrumentsIncorporated Specifications 17 SubmitDocumentationFeedback ProductFolderLinks:CC1121

CC1121 SWRS111F–JUNE2011–REVISEDOCTOBER2014 www.ti.com 4.20 Typical Characteristics T =25°C,VDD=3.0V,f =869.5MHzifnothingelsestated. A c All measurements performed on CC1120EM_868_915 rev.1.0.1, CC1120EM_955 rev.1.2.1, CC1120EM_420_470 rev.1.0.1 orCC1120EM_169rev.1.2. Figure4-6wasmeasuredatthe50-Ωantennaconnector. 60 17 50 m) A) B 16.5 m 40 d nt( er( e 30 w 16 urr Po C X 20 ut T utp 15.5 10 O 0 15 7F 7B 77 73 6F 6B 67 63 5F 5B 57 53 4F 4B 47 43 -40 0 40 80 PApower setting Temperature(ºC) Figure4-1.TXCurrentat868MHz Figure4-2.OutputPowervsTemperature vsPAPowerSetting MaxSetting,170MHz,3.6V 18 20 m) 16 m) 10 B B 0 d 14 d er( er ( -10 Pow 12 Pow -20 utput 10 Output -30 O 8 -40 6 -50 2 2.5 3 3.5 7F 7B 77 73 6F 6B 67 63 5F 5B 57 53 4F 4B 47 43 SupplyVoltage(V) PApower setting Figure4-3.OutputPowervsVoltage Figure4-4.OutputPowerat868MHz MaxSetting,170MHz vsPAPowerSetting Figure4-6.OutputPowervsLoadImpedance(+14-dBmSetting) 200kbps,DEV=83kHz(OuterSymbols),4GFSK Figure4-5.EyeDiagram 18 Specifications Copyright©2011–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback ProductFolderLinks:CC1121

CC1121 www.ti.com SWRS111F–JUNE2011–REVISEDOCTOBER2014 Typical Characteristics (continued) 9.6kbpsin12.5-kHzChannel Figure4-8.PhaseNoisein868-MHzBand Figure4-7.FCCPart90MaskD 3.1 1400 (V) 2.9 mV) 1200 e ( g e ghVolta 22..57 wVoltag 1800000 Hi 2.3 Lo 600 put 2.1 put ut ut 400 O 1.9 O O O 200 PI 1.7 PI G G 1.5 0 0 5 10 15 20 25 30 35 0 5 10 15 20 25 30 35 Current(mA) Current(mA) Figure4-10.GPIOOutputLowVoltagevsCurrentBeingSinked Figure4-9.GPIOOutputHighVoltagevsCurrentBeingSourced Copyright©2011–2014,TexasInstrumentsIncorporated Specifications 19 SubmitDocumentationFeedback ProductFolderLinks:CC1121

CC1121 SWRS111F–JUNE2011–REVISEDOCTOBER2014 www.ti.com 5 Detailed Description 5.1 Block Diagram Figure5-1showsthesystemblockdiagramoftheCC1121device. CC112X (optcioloncakl 3in2tpkHutz) autUo-ltcraal ilborwa tpeodw ReCr 3o2skcHillza tor Power on reset 4Rk ObyMte MUalitnra R loawdMMi opAC oRCUwCoenrt r1o6l Ubnit it Saenrdia dl acotSanP finiIg tuerrafaticoen CSn (chip select) SI (serial input) System bus Interrupt and SO (serial output) IO handler SCLK (serial clock) EnWhaankcee Ode nuW lRtOraaRd loiow t ipmoewrer Batettmerpy sseennssoorr / Csotnaftiugsu rraetgioisnte arnsd F2IF5bO6u f bfReyArteM aPnadc FkIeFtO h acnodnlterorl (optional GPIO0-3) RF and DSP frontend Output power ramping and OOK / ASK modulation (optional autodetected external XOSC / TCXO) PA e1f4ficdiBemnc yh iPghA QI FuFllyre inqtueegnracyte Sdy Fnrtahcetsioiznearl-N Modulator sDigantaa li ncthearifna caec cweitshs XOSC XXOOSSCC__QQ12 90dB dynamic LNA_P ifamp range ADC (optional bit clock) HighL lNinAearity Channel filter Cordic Highly dfleemxiboldeu FlaStoKr / OOK (optional low jitter serial LNA_N ifamp 90radnBg dey AnDamCic dparotato ocoultsp)ut for legacy AGC (optional GPIO for Automatic Gain Control, 60dB VGA range antenna diversity) RSSI measurements and carrier sense detection Figure5-1.SystemBlockDiagram 5.2 Frequency Synthesizer At the center of the CC1121 device there is a fully integrated, fractional-N, ultra-high-performance frequency synthesizer. The frequency synthesizer is designed for excellent phase noise performance, providing very high selectivity and blocking performance. The system is designed to comply with the most stringentregulatoryspectralmasksatmaximumtransmitpower. Either a crystal can be connected to XOSC_Q1 and XOSC_Q2, or a TCXO can be connected to the EXT_XOSC input. The oscillator generates the reference frequency for the synthesizer, as well as clocks for the analog-to-digital converter (ADC) and the digital part. To reduce system cost, CC1121 device has high-accuracy frequency estimation and compensation registers to measure and compensate for crystal inaccuracies. This compensation enables the use of lower cost crystals. If a TCXO is used, the CC1121 device automatically turns on and off the TCXO when needed to support low-power modes and Wake-On- Radiooperation. 20 DetailedDescription Copyright©2011–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback ProductFolderLinks:CC1121

CC1121 www.ti.com SWRS111F–JUNE2011–REVISEDOCTOBER2014 5.3 Receiver The CC1121 device features a highly flexible receiver. The received RF signal is amplified by the low- noise amplifier (LNA) and is down-converted in quadrature (I/Q) to the intermediate frequency (IF). At IF, theI/Qsignalsaredigitizedbythehighdynamic-rangeADCs. An advanced automatic gain control (AGC) unit adjusts the front-end gain, and enables the CC1121 device to receive strong and weak signals, even in the presence of strong interferers. High-attenuation channels and data filtering enable reception with strong neighbor channel interferers. The I/Q signal is convertedtoaphaseandmagnitudesignaltosupportbothFSKandOOKmodulationschemes. NOTE A unique I/Q compensation algorithm removes any problem of I/Q mismatch, thus avoiding timeconsumingandcostlyI/Qimagecalibrationsteps. 5.4 Transmitter The CC1121 transmitter is based on direct synthesis of the RF frequency (in-loop modulation). To use the spectrum effectively, the CC1121 device has extensive data filtering and shaping in TX mode to support high throughput data communication in narrowband channels. The modulator also controls power ramping toremoveissuessuchasspectralsplatteringwhendrivingexternalhigh-powerRFamplifiers. 5.5 Radio Control and User Interface The CC1121 digital control system is built around the main radio control (MARC), which is implemented using an internal high-performance, 16-bit ultra-low-power processor. MARC handles power modes, radio sequencingandprotocoltiming. A 4-wire SPI serial interface is used for configuration and data buffer access. The digital baseband includes support for channel configuration, packet handling, and data buffering. The host MCU can stay in power-down mode until a valid RF packet is received. This greatly reduces power consumption. When the hostMCUreceivesavalidRFpacket,itburst-readsthedata.Thisreducestherequiredcomputingpower. The CC1121 radio control and user interface are based on the widely used the CC1101 transceiver. This relationship enables an easy transition between the two platforms. The command strobes and the main radiostatesarethesameforthetwoplatforms. Forlegacyformats,theCC1121devicealsosupportstwoserialmodes: • Synchronous serial mode: The CC1121 device performs bit synchronization and provides the MCU withabitclockwithassociateddata. • Transparentmode:TheCC1121outputsthedigitalbasebandsignalusingadigitalinterpolationfilterto eliminatejitterintroducedbydigitalfilteringanddemodulation. 5.6 Enhanced Wake-On-Radio (eWOR) eWOR, using a flexible integrated sleep timer, enables automatic receiver polling with no intervention from the MCU. The CC1121 device enters RX mode, it listens and then returns to sleep if a valid RF packet is not received. The sleep interval and duty cycle can be configured to make a trade-off between network latency and power consumption. Incoming messages are time-stamped to simplify timer re- synchronization. The eWOR timer runs off an ultra-low-power 32-kHz RC oscillator. To improve timing accuracy, the RC oscillatorcanbeautomaticallycalibratedtotheRFcrystalinconfigurableintervals. Copyright©2011–2014,TexasInstrumentsIncorporated DetailedDescription 21 SubmitDocumentationFeedback ProductFolderLinks:CC1121

CC1121 SWRS111F–JUNE2011–REVISEDOCTOBER2014 www.ti.com 5.7 Sniff Mode The CC1121 device supports very quick start up times, and requires very few preamble bits. Sniff mode uses these conditions to dramatically reduce the current consumption while the receiver is waiting for data. Because the CC1121 can wake up and settle much faster than the duration of most preambles, it is not required to be in RX mode continuously while waiting for a packet to arrive. Instead, the enhanced Wake- On-Radio feature can be used to put the device into sleep periodically. By setting an appropriate sleep time, the CC1121 device can wake up and receive the packet when it arrives with no performance loss. This sequence removes the need for accurate timing synchronization between transmitter and receiver, andletstheusertotradeoffcurrentconsumptionbetweenthetransmitterandreceiver. Formoreinformation,seethesniffmodedesignnote(SWRA428). 5.8 Antenna Diversity Antenna diversity can increase performance in a multipath environment. An external antenna switch is required. The CC1121 device uses one of the GPIO pins to automatically control the switch. The device alsosupportsdifferentialoutputcontrolsignalstypicallyusedinRFswitches. If antenna diversity is enabled, the GPIO alternates between high and low states until a valid RF input signal is detected. An optional acknowledge packet can be transmitted without changing the state of the GPIO. An incoming RF signal can be validated by received signal strength or by using the automatic preamble detector. Using the automatic preamble detector ensures a more robust system and avoids the need to setadefinedsignalstrengththreshold(suchathresholdsetsthesensitivitylimitofthesystem). 5.9 Low-Power and High-Performance Mode The CC1121 device is highly configurable, enabling trade-offs between power and performance based on the needs of the application. This data sheet describes two modes: low-power mode and high- performance mode. These modes represent configurations where the device is optimized for either power orperformance. 22 DetailedDescription Copyright©2011–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback ProductFolderLinks:CC1121

CC1121 www.ti.com SWRS111F–JUNE2011–REVISEDOCTOBER2014 5.10 WaveMatch Advanced capture logic locks onto the synchronization word and does not require preamble settling bytes. Therefore,receiversettlingtimeisreducedtothesettlingtimeoftheAGC,typically4bits. The WaveMatch feature also greatly reduces false sync triggering on noise, further reducing the power consumption and improving sensitivity and reliability. The same logic can also be used as a high- performancepreambledetectortoreliablydetectavalidpreambleinthechannel. SeeSWRC046formoreinformation. Figure5-2.ReceiverConfiguratorin SmartRF™Studio Copyright©2011–2014,TexasInstrumentsIncorporated DetailedDescription 23 SubmitDocumentationFeedback ProductFolderLinks:CC1121

CC1121 SWRS111F–JUNE2011–REVISEDOCTOBER2014 www.ti.com 6 Typical Application Circuit NOTE Thissectionisintendedonlyasanintroduction. Very few external components are required for the operation of the CC1121 device. Figure 6-1 shows a typical application circuit. The board layout will greatly influence the RF performance of the CC1121 device.Figure6-1doesnotshowdecouplingcapacitorsforpowerpins. Optional 32 MHz XOSC/ crystal TCXO d d d d d d v v v 2 1 0 9 8 7 6 5 3 3 3 2 2 2 2 2 (optionfarol mco CntCro11l 2p1in) vdd 1 VDD_GUARDEXT_XOSC XOSC_Q2 XOSC_Q1 DCPL_XOSC AVDD_XOSC AVDD_SYNTH2 DCPL_PFD_CHP AVDD_PFD_CHP LPF1 24 2 23 RESET_N LPF0 3 22 GPIO3 AVDD_SYNTH1 vdd 4 21 GPIO2 DCPL_VCO CC1121 5 20 vdd DVDD LNA_N 6 19 DCPL LNA_P 7 18 SI TRX_SW 8 17 SCLK PA SO (GPIO1) GPIO0 CSn DVDD AVDD_IF RBIAS AVDD_RF N.C. 9 10 11 12 13 14 15 16 dd v d d d d d d v v v MCU connection SPI interface and optional gpio pins Figure6-1.TypicalApplicationCircuit For more information, see the reference designs available for the CC1121 device in Section 7.2, DocumentationSupport. 24 TypicalApplicationCircuit Copyright©2011–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback ProductFolderLinks:CC1121

CC1121 www.ti.com SWRS111F–JUNE2011–REVISEDOCTOBER2014 7 Device and Documentation Support 7.1 Device Support 7.1.1 Development Support 7.1.1.1 ConfigurationSoftware The CC1121 device can be configured using the SmartRF Studio software (SWRC046). The SmartRF Studio software is highly recommended for obtaining optimum register settings, and for evaluating performanceandfunctionality. 7.1.2 Device and Development-Support Tool Nomenclature To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all microprocessors (MPUs) and support tools. Each device has one of three prefixes: X, P, or null (no prefix) (for example, CC1121). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development fromengineeringprototypes(TMDX)throughfullyqualifiedproductiondevicesandtools(TMDS). Devicedevelopmentevolutionaryflow: X Experimental device that is not necessarily representative of the final device's electrical specificationsandmaynotuseproductionassemblyflow. P Prototype device that is not necessarily the final silicon die and may not necessarily meet finalelectricalspecifications. null Productionversionofthesilicondiethatisfullyqualified. Supporttooldevelopmentevolutionaryflow: TMDX Development-support product that has not yet completed Texas Instruments internal qualificationtesting. TMDS Fullyqualifieddevelopment-supportproduct. XandPdevicesandTMDXdevelopment-supporttoolsareshippedagainstthefollowingdisclaimer: "Developmentalproductisintendedforinternalevaluationpurposes." Production devices and TMDS development-support tools have been characterized fully, and the quality andreliabilityofthedevicehavebeendemonstratedfully.TI'sstandardwarrantyapplies. Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used. TI device nomenclature also includes a suffix with the device family name. This suffix indicates the packagetype(forexample,RHB)andthetemperaturerange(forexample,blankisthedefaultcommercial temperaturerange)providesalegendforreadingthecompletedevicenameforanyCC1121device. For orderable part numbers of CC1121 devices in the QFN package types, see the Package Option Addendumofthisdocument,theTIwebsite(www.ti.com),orcontactyourTIsalesrepresentative. Copyright©2011–2014,TexasInstrumentsIncorporated DeviceandDocumentationSupport 25 SubmitDocumentationFeedback ProductFolderLinks:CC1121

CC1121 SWRS111F–JUNE2011–REVISEDOCTOBER2014 www.ti.com 7.2 Documentation Support The following documents supplement the CC1121 processor. Copies of these documents are available on theInternetatwww.ti.com.Tip:Entertheliteraturenumberinthesearchboxprovidedatwww.ti.com. SWRR106 CC112xIPC868-and915-MHz2-layerReferenceDesign SWRR107 CC112xIPC868-and915-MHz4-layerReferenceDesign SWRC221 CC1120EM420-to470-MHzReferenceDesign SWRC224 CC1121EM868-to915-MHzReferenceDesign SWRC223 CC1120EM955-MHzReferenceDesign SWRC046 SmartRFStudioSoftware SWRA428 CC112x/CC120xSniffModeApplicationNote 7.3 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; seeTI'sTermsofUse. TIE2E™OnlineCommunity TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, exploreideasandhelpsolveproblemswithfellowengineers. TIEmbeddedProcessorsWiki Texas Instruments Embedded Processors Wiki. Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding thesedevices. 7.4 Trademarks SmartRF,E2EaretrademarksofTexasInstruments. 7.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriateprecautions.Failuretoobserveproperhandlingandinstallationprocedurescancausedamage. ESDdamagecanrangefromsubtleperformancedegradationtocompletedevicefailure.Precisionintegratedcircuitsmaybemore susceptibletodamagebecauseverysmallparametricchangescouldcausethedevicenottomeetitspublishedspecifications. 7.6 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronyms,anddefinitions. 26 DeviceandDocumentationSupport Copyright©2011–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback ProductFolderLinks:CC1121

CC1121 www.ti.com SWRS111F–JUNE2011–REVISEDOCTOBER2014 8 Mechanical Packaging and Orderable Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revisionofthisdocument.Forbrowser-basedversionsofthisdatasheet,refertotheleft-handnavigation. Copyright©2011–2014,TexasInstrumentsIncorporated MechanicalPackagingandOrderableInformation 27 SubmitDocumentationFeedback ProductFolderLinks:CC1121

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) CC1121RHBR ACTIVE VQFN RHB 32 3000 Green (RoHS NIPDAU | NIPDAUAG Level-3-260C-168 HR -40 to 85 CC1121 & no Sb/Br) CC1121RHBT ACTIVE VQFN RHB 32 250 Green (RoHS NIPDAU | NIPDAUAG Level-3-260C-168 HR -40 to 85 CC1121 & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Addendum-Page 2

GENERIC PACKAGE VIEW RHB 32 VQFN - 1 mm max height 5 x 5, 0.5 mm pitch PLASTIC QUAD FLATPACK - NO LEAD Images above are just a representation of the package family, actual package may vary. Refer to the product data sheet for package details. 4224745/A www.ti.com

PACKAGE OUTLINE RHB0032E VQFN - 1 mm max height SCALE 3.000 PLASTIC QUAD FLATPACK - NO LEAD A 5.1 B 4.9 PIN 1 INDEX AREA 5.1 (0.1) 4.9 SIDE WALL DETAIL OPTIONAL ME20.000TAL THICKNESS C 1 MAX SEATING PLANE 0.05 0.00 0.08 C 2X 3.5 3.45 0.1 (0.2) TYP 9 16 EXPOSED THERMAL PAD 28X 0.5 8 17 SEE SIDE WALL DETAIL 2X 33 SYMM 3.5 0.3 32X 0.2 24 0.1 C A B 1 0.05 C 32 25 PIN 1 ID SYMM (OPTIONAL) 0.5 32X 0.3 4223442/B 08/2019 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. www.ti.com

EXAMPLE BOARD LAYOUT RHB0032E VQFN - 1 mm max height PLASTIC QUAD FLATPACK - NO LEAD ( 3.45) SYMM 32 25 32X (0.6) 1 24 32X (0.25) (1.475) 28X (0.5) 33 SYMM (4.8) ( 0.2) TYP VIA 8 17 (R0.05) TYP 9 16 (1.475) (4.8) LAND PATTERN EXAMPLE SCALE:18X 0.07 MAX 0.07 MIN ALL AROUND ALL AROUND SOLDER MASK METAL OPENING SOLDER MASK METAL UNDER OPENING SOLDER MASK NON SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS 4223442/B 08/2019 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. www.ti.com

EXAMPLE STENCIL DESIGN RHB0032E VQFN - 1 mm max height PLASTIC QUAD FLATPACK - NO LEAD 4X ( 1.49) (R0.05) TYP (0.845) 32 25 32X (0.6) 1 24 32X (0.25) 28X (0.5) (0.845) SYMM 33 (4.8) 8 17 METAL TYP 9 16 SYMM (4.8) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 33: 75% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:20X 4223442/B 08/2019 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com

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