BAT48 Small signal Schottky diode Features ■ Low leakage current losses BAT48ZFILM ■ Negligible switching losses (Single) ■ Low forward and reverse recovery times SOD-123 ■ Extremely fast switching ■ Surface mount device ■ Low capacitance diode BAT48JFILM (Single) Description SOD-323 The BAT48 series uses 40 V Schottky barrier Configurations in top view diodes packaged in SOD-123, SOD-323 or DO-35. This series is general purpose and features very low turn-on voltage and fast A switching. BAT48RL K Band indicates cathode T able 1. Device summary Symbol Value I 350 mA F V 40 V RRM C (typ) 18 pF T (max) 150 °C j July 2011 Doc ID 12634 Rev 2 1/8 www.st.com 8

Characteristics BAT48 1 Characteristics T able 2. Absolute ratings (limiting values at T = 25 °C, unless otherwise specified) j Symbol Parameter Value Unit V Repetitive peak reverse voltage 40 V RRM I Continuous forward current 350 mA F SOD-123, SOD-323 2 Surge non repetitive forward t = 10 ms I p A FSM current sinusoidal DO-35 7.5 T Storage temperature range -65 to +150 °C stg SOD-123, SOD-323 -40 to +150 Maximum operating junction temperature T °C j range DO-35 -40 to +125 SOD-123, SOD-323 260 Maximum temperature for soldering during T °C L 10 s DO-35 at 4 mm from 230 case T able 3. Thermal parameters Symbol Parameter Value Unit SOD-123 500 R Junction to ambient(1) °C/W th(j-a) SOD-323 550 R Junction to lead(2) DO-35 300 °C/W th(j-l) 1. Epoxy printed circuit board with recommended pad layout 2. On infinite heatsink with 4 mm lead length 2/8 Doc ID 12634 Rev 2

BAT48 Characteristics Table 4. S tatic electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit V Breakdown reverse voltage T = 25 °C I = 25 µA 40 V BR j r V = 1.5 V 1 R V = 10 V 2 R T = 25 °C j V = 20 V 5 R V = 40 V 25 I (1) Reverse leakage current R µA R V = 1.5 V 10 R V = 10 V 15 R T = 60 °C j V = 20 V 25 R V = 40 V 50 R I = 0.1 mA 0.25 F I = 1 mA 0.3 F I = 10 mA 0.4 V (2) Forward voltage drop T = 25 °C F V F j I = 50 mA 0.5 F I = 200 mA 0.75 F I = 500 mA 0.9 F 1. Pulse test: t = 5 ms, δ < 2 % p 2. Pulse test: t = 380 µs, δ < 2 % p Table 5. D ynamic characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit V = 0 V, F = 1 MHz 30 R C Diode capacitance pF V = 1 V, F = 1 MHz 18 R Figure 1. A verage forward power dissipation Figure 2. Average forward current versus versus average forward current ambient temperature (δ = 1) P(W) IF(AV)(A) 0.30 0.40 δ= 0.05 δ= 0.1 δ= 0.2 δ= 0.5 0.35 0.25 0.30 0.20 δ= 1 0.25 0.15 0.20 0.15 0.10 T 0.10 T 0.05 0.05 IF(AV)(A) δ=tp/T tp δ=tp/T tp Tamb(°C) 0.00 0.00 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0 25 50 75 100 125 150 Doc ID 12634 Rev 2 3/8

Characteristics BAT48 Figure 3. Reverse leakage current versus Figure 4. Reverse leakage current versus reverse applied voltage junction temperature (typical values) (typical values) IR(µA) IR(µA) 1.E+04 1.E+04 VR=40V 1.E+03 Tj=125°C 1.E+03 1.E+02 Tj=100°C 1.E+02 Tj=75°C 1.E+01 1.E+01 Tj=50°C 1.E+00 1.E+00 Tj=25°C VR(V) Tj(°C) 1.E-01 1.E-01 0 5 10 15 20 25 30 35 40 0 25 50 75 100 125 Figure 5. Junction capacitance versus Figure 6. Forward voltage drop versus reverse applied voltage forward current (typical values) (typical values) C(pF) IFM(A) 35 1.E+00 F=1MHz 30 VOSCT=j=3205m°CVRMS 1.E-01 25 Tj=125°C 20 Tj=25°C 1.E-02 15 10 1.E-03 5 VR(V) VFM(V) 0 1.E-04 0 5 10 15 20 25 30 35 40 0.0 0.2 0.4 0.6 0.8 1.0 Figure 7. Relative variation of thermal Figure 8. Thermal resistance junction to impedance junction to ambient ambient versus copper surface versus pulse duration (SOD-323) under each lead (SOD-323) Zth(j-a)/Rth(j-a) Rth(j-a)(°C/W) 1.00 600 printedcircuitboard,epoxyFR4,e =35µm CU 550 SOD-323 500 Epoxy FR4 SCU= 2.25 mm2 eCU= 35 µm 0.10 Single pulse 450 400 350 epoxy FR4 with recommended pad layout,e = 35 µm tp(s) SCU(mm²) 0.01 CU 300 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 0 5 10 15 20 25 30 35 40 45 50 4/8 Doc ID 12634 Rev 2

BAT48 Package information 2 Package information ● Epoxy meets UL94,V0 ● Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. T able 6. SOD-123 dimensions Dimensions Ref. Millimeters Inches H A2 A1 Min. Max. Min. Max. b A 1.45 0.057 E A1 0 0.1 0 0.004 A2 0.85 1.35 0.033 0.053 D A b 0.55 Typ. 0.022 Typ. c c 0.15 Typ. 0.039 Typ. D 2.55 2.85 0.1 0.112 E 1.4 1.7 0.055 0.067 G G 0.25 0.01 H 3.55 3.75 0.14 0.148 Figure 9. SOD-123 footprint, dimensions in mm (inches) 4.00 (0.157) 0.57 (0.022) 0.65 2.70 0.65 (0.026) (0.106) (0.026) Doc ID 12634 Rev 2 5/8

Package information BAT48 T able 7. SOD-323 dimensions Dimensions H A1 Ref. Millimeters Inches b Min. Max. Min. Max. E A 1.17 0.046 A1 0 0.1 0 0.004 b 0.25 0.44 0.01 0.017 D A c 0.1 0.25 0.004 0.01 c D 1.52 1.8 0.06 0.071 Q1 E 1.11 1.45 0.044 0.057 H 2.3 2.7 0.09 0.106 L L 0.1 0.46 0.004 0.02 Q1 0.1 0.41 0.004 0.016 Figure 10. SOD-323 footprint (dimensions in mm) 3.20 0.54 1.06 1.08 1.06 T able 8. DO-35 dimensions Dimensions C A C Ref. Millimeters Inches Min. Max. Min. Max. ØD A 3.05 4.50 0.120 0.177 ØB B 1.53 2.00 0.060 0.079 C 12.7 0.500 D 0.458 0.558 0.018 0.022 6/8 Doc ID 12634 Rev 2

BAT48 Ordering information 3 Ordering information T able 9. Ordering information Order code Marking Package Weight Base qty Delivery mode BAT48ZFILM Z48 SOD-123 Single 10 mg 3000 Tape and reel BAT48JFILM 48 SOD-323 Single 5 mg 3000 Tape and reel BAT48RL BAT48 DO-35 15 mg 4000 Tape and reel 4 Revision history T able 10. Document revision history Date Revision Changes 08-Aug-2006 1 Initial release. 07-Jul-2011 2 Updated package information for SOD-123. Added DO-35 package. Doc ID 12634 Rev 2 7/8

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