BA891 Band-switching diode Rev. 04 — 8 January 2008 Product data sheet IMPORTANT NOTICE Dear customer, As from October 1st, 2006 Philips Semiconductors has a new trade name -NXPSemiconductors,whichwillbeusedinfuturedatasheetstogetherwithnewcontact details. IndatasheetswherethepreviousPhilipsreferencesremain,pleaseusethenewlinksas shown below. http://www.philips.semiconductors.com use http://www.nxp.com http://www.semiconductors.philips.com use http://www.nxp.com (Internet) sales.addresses@www.semiconductors.philips.com use salesaddresses@nxp.com (email) The copyright notice at the bottom of each page (or elsewhere in the document, depending on the version) - © Koninklijke Philips Electronics N.V. (year). All rights reserved - is replaced with: - © NXP B.V. (year). All rights reserved. - If you have any questions related to the data sheet, please contact our nearest sales office via e-mail or phone (details via salesaddresses@nxp.com). Thank you for your cooperation and understanding, NXP Semiconductors

NXP Semiconductors Product specification Band-switching diode BA891 FEATURES PINNING • Ultra small plastic SMD package PIN DESCRIPTION • Low diode capacitance: max.1.05pF 1 cathode • Low diode forward resistance: max.0.7W 2 anode • Small inductance. APPLICATIONS • Low loss band-switching in VHFtelevision tuners • Surface mount band-switching circuits. handbook, halfpage 1 2 DESCRIPTION Top view MAM405 The BA891 is a planar high performance band-switching diode in the ultra small SOD523 SMD plastic package. (cid:2) MARKING The marking band indicates the cathode. TYPE NUMBER MARKING CODE Fig.1 Simplified outline (SOD523) and symbol. BA891 7 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT V continuous reverse voltage - 35 V R I continuous forward current - 100 mA F P total power dissipation T =90(cid:176) C - 715 mW tot s T storage temperature - 65 +150 (cid:176) C stg T junction temperature - 65 +150 (cid:176) C j Rev. 04 - 8 January 2008 2 of 6

NXP Semiconductors Product specification Band-switching diode BA891 THERMAL CHARACTERISTICS SYMBOL PARAMETER VALUE UNIT R thermal resistance from junction to soldering point 85 K/W thj-s CHARACTERISTICS T = 25(cid:176) C unless otherwise specified. j SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT V forward voltage I =10mA - 1 V F F I reverse current V =30V - 20 nA R R C diode capacitance f=1MHz; note1; seeFig.2 d V =1V 0.8 1.05 pF R V =3V 0.65 0.9 pF R r diode forward resistance f=100MHz; note1; seeFig.3 D I =3mA 0.42 0.7 W F I =10mA 0.28 0.5 W F L series inductance 0.6 - nH S Note 1. Guaranteed on AQL basis; inspection level S4, AQL 1.0. MGL479 MGL478 1 10 handbook, halfpage handbook, halfpage Cd (pF) rD 0.8 (W ) 0.6 1 0.4 0.2 0 10- 1 0 10 20 30 10- 1 1 10 VR (V) IF (mA) f=1MHz; Tj=25(cid:176)C. f=100MHz; Tj=25(cid:176)C. Fig.2 Diodecapacitanceasafunctionofreverse Fig.3 Diode forward resistance as a function of voltage; typical values. forward current; typical values. Rev. 04 - 8 January 2008 3 of 6

NXP Semiconductors Product specification Band-switching diode BA891 PACKAGE OUTLINE Plastic surface-mounted package; 2 leads SOD523 A c HE v M A D A 0 0.5 1 mm scale 1 2 DIMENSIONS (mm are the original dimensions) E bp UNIT A bp c D E HE v 0.65 0.34 0.17 1.25 0.85 1.65 mm 0.1 (1) 0.58 0.26 0.11 1.15 0.75 1.55 Note 1. The marking bar indicates the cathode. OUTLINE REFERENCES EUROPEAN ISSUE DATE VERSION IEC JEDEC JEITA PROJECTION 02-12-13 SOD523 SC-79 06-03-16 Rev. 04 - 8 January 2008 4 of 6

BA891 NXP Semiconductors Band-switching diode Legal information Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] Theproductstatusofdevice(s)describedinthisdocumentmayhavechangedsincethisdocumentwaspublishedandmaydifferincaseofmultipledevices.Thelatestproductstatus information is available on the Internet at URLhttp://www.nxp.com. Definitions malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of Draft —The document is a draft version only. The content is still under NXP Semiconductors products in such equipment or applications and internal review and subject to formal approval, which may result in therefore such inclusion and/or use is at the customer’s own risk. modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of Applications —Applications that are described herein for any of these informationincludedhereinandshallhavenoliabilityfortheconsequencesof products are for illustrative purposes only. NXP Semiconductors makes no use of such information. representation or warranty that such applications will be suitable for the specified use without further testing or modification. Short data sheet —A short data sheet is an extract from a full data sheet withthesameproducttypenumber(s)andtitle.Ashortdatasheetisintended Limiting values —Stress above one or more limiting values (as defined in forquickreferenceonlyandshouldnotbereliedupontocontaindetailedand theAbsoluteMaximumRatingsSystemofIEC60134)maycausepermanent full information. For detailed and full information see the relevant full data damagetothedevice.Limitingvaluesarestressratingsonlyandoperationof sheet, which is available on request via the local NXP Semiconductors sales the device at these or any other conditions above those given in the office. In case of any inconsistency or conflict with the short data sheet, the Characteristics sections of this document is not implied. Exposure to limiting full data sheet shall prevail. values for extended periods may affect device reliability. Terms and conditions of sale —NXP Semiconductors products are sold Disclaimers subjecttothegeneraltermsandconditionsofcommercialsale,aspublished athttp://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless General —Information in this document is believed to be accurate and explicitly otherwise agreed to in writing by NXP Semiconductors. In case of reliable.However,NXPSemiconductorsdoesnotgiveanyrepresentationsor any inconsistency or conflict between information in this document and such warranties,expressedorimplied,astotheaccuracyorcompletenessofsuch terms and conditions, the latter will prevail. information and shall have no liability for the consequences of use of such No offer to sell or license —Nothing in this document may be interpreted information. or construed as an offer to sell products that is open for acceptance or the Right to make changes —NXPSemiconductorsreservestherighttomake grant,conveyanceorimplicationofanylicenseunderanycopyrights,patents changes to information published in this document, including without or other industrial or intellectual property rights. limitation specifications and product descriptions, at any time and without notice.Thisdocumentsupersedesandreplacesallinformationsuppliedprior to the publication hereof. Trademarks Suitability for use —NXP Semiconductors products are not designed, Notice:Allreferencedbrands,productnames,servicenamesandtrademarks authorized or warranted to be suitable for use in medical, military, aircraft, are the property of their respective owners. space or life support equipment, nor in applications where failure or Contact information For additional information, please visit:http://www.nxp.com For sales office addresses, send an email to:salesaddresses@nxp.com Rev. 04 - 8 January 2008 5 of 6

BA891 NXP Semiconductors Band-switching diode Revision history Revision history Document ID Release date Data sheet status Change notice Supersedes BA891_N_4 20080108 Product data sheet - BA891_3 Modifications: • Package outline on page 4 changed BA891_3 20020125 Product specification - BA891_2 (939775009281) BA891_2 19980831 Product specification - BA891_1 (939775004308) BA891_1 19980818 Product specification - - (939775004193) Pleasebeawarethatimportantnoticesconcerningthisdocumentandtheproduct(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 8 January 2008 Document identifier: BA891_N_4

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