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  • 型号: AXK7L30223G
  • 制造商: Panasonic Corporation
  • 库位|库存: xxxx|xxxx
  • 要求:
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AXK7L30223G产品简介:

ICGOO电子元器件商城为您提供AXK7L30223G由Panasonic Corporation设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 AXK7L30223G价格参考。Panasonic CorporationAXK7L30223G封装/规格:矩形连接器 - 阵列,边缘型,夹层式(板对板), 30 位置 连接器 插口,中央触点带 表面贴装 金。您可以下载AXK7L30223G参考资料、Datasheet数据手册功能说明书,资料中有AXK7L30223G 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

连接器,互连器件

描述

CONN SOCKET FPC .4MM 30POS SMD

产品分类

矩形 - 板对板连接器 - 阵列,边缘型,夹层式

品牌

Panasonic Electric Works

数据手册

点击此处下载产品Datasheet

产品图片

产品型号

AXK7L30223G

rohs

无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

F4

产品培训模块

http://www.digikey.cn/PTM/IndividualPTM.page?site=cn&lang=zhs&ptm=25492

其它名称

255-3151-1

其它有关文件

点击此处下载产品Datasheet点击此处下载产品Datasheet

包装

剪切带 (CT)

安装类型

表面贴装

排数

2

接合堆叠高度

0.9mm

板上高度

0.034"(0.86mm)

标准包装

1

特性

固定焊尾

特色产品

http://www.digikey.com/cn/zh/ph/Panasonic/ToughContact.html

触头镀层

触头镀层厚度

-

连接器类型

插口,中央触点带

配套产品

/product-detail/zh/AXK8L30125BG/255-2523-2-ND/1986617/product-detail/zh/AXK8L30125BG/255-2523-1-ND/1986686/product-detail/zh/AXK8L30125BG/255-2523-6-ND/1986746/product-detail/zh/AXK8L30115BG/AXK8L30115BG-ND/2049225/product-detail/zh/AXK8L30124BG/255-3173-2-ND/2793856/product-detail/zh/AXK8L30124BG/255-3173-1-ND/2793906

针脚数

30

间距

0.016"(0.40mm)

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PDF Datasheet 数据手册内容提取

AXK7L, 8L For board-to-FPC F4 Narrow pitch connectors Series (0.4mm pitch) 3. Improved mating strength between 5. Connectors for inspection available the socket and header Connectors for inspection are available The simple locking structures provided that are ideal for modular unit inspection for the soldering terminals and the and inspection in device assembly contact points improve the mating processes. strength and provide tactile feedback when locked. APPLICATIONS 5.0mm Socket 4.1mm Header Socket Header Cphoomnpeasc, tD pVoDr,t aDbSleC ,d eetvci”ces “Cellular Example of connection between a board and an FPC Before mating Compliance with RoHS Directive FPC Reinforcing Locking structure of the soldering terminals F4 plate 4. Easy to design product circuits connector PCB 1) An insulating wall provided for the FEATURES bottom surface of the connector prevents After mating 1. The lowest profile class among two- contact between the pattern on the PC piece connectors in the world (Mated board and the metal pins, enabling 0.9mm height: 0.9mm) pattern wiring under the connector, and Achieved both a 0.4 mm pitch and an thus contributing to the reduction in size ultra low profile of 0.9 mm high when of PC boards. mated, contributing to further thickness <Socket> <Header> reduction of products. 2. Strong resistance to adverse environments! Utilizes construction for high contact reliability. (See Page 6 for details of the structure) Pattern wiring under the connector is possible. ORDERING INFORMATION AXK G AXK: Narrow Pitch Connector Series Series name; 7L: F4 (0.4 mm pitch) Socket 8L: F4 (0.4 mm pitch) Header Number of contacts (2 digits) Mated height <Socket> 2: For mated height 0.9 mm <Header> 1: For mated height 0.9 mm Functions 2: Without positioning bosses Surface treatment (Contact portion / Terminal portion) <Socket> 3: Ni plating on base, Au plating on surface (for Ni barrier available) <Header> 4: Ni plating on base, Au plating on surface Other specifications <Header> B: Soldering terminals with fork type terminal Note 1 Packing G: 3,000 pieces embossed tape and plastic reel × 2 Notes:1.“B” in the 11th digit of the header part number signifies a fork type soldering terminals to lessen the constraint on amount of solder when mounting, and a construction that makes it difficult when mounting for excess solder to interfere with the socket. Although compatible with the previous parts, these parts are not compatible with the recommended PC board pattern and recommended metal mask pattern. panasonic-electric-works.net/ac

AXK7L, 8L PRODUCT TYPES Part number Packing Mated height Number of contacts Inner carton Socket Header Outer carton (1 reel) 10 AXK7L10223G AXK8L10124BG 12 AXK7L12223G AXK8L12124BG 14 AXK7L14223G AXK8L14124BG 16 AXK7L16223G AXK8L16124BG 20 AXK7L20223G AXK8L20124BG 22 AXK7L22223G AXK8L22124BG 24 AXK7L24223G AXK8L24124BG 26 AXK7L26223G AXK8L26124BG 28 AXK7L28223G AXK8L28124BG 30 AXK7L30223G AXK8L30124BG 32 AXK7L32223G AXK8L32124BG 6,000 pieces 0.9 mm 34 AXK7L34223G AXK8L34124BG 3,000 pieces (2 reels) 36 AXK7L36223G AXK8L36124BG 38 AXK7L38223G AXK8L38124BG 40 AXK7L40223G AXK8L40124BG 44 AXK7L44223G AXK8L44124BG 48 AXK7L48223G AXK8L48124BG 50 AXK7L50223G AXK8L50124BG 54 AXK7L54223G AXK8L54124BG 60 AXK7L60223G AXK8L60124BG 66 AXK7L66223G AXK8L66124BG 70 AXK7L70223G AXK8L70124BG 80 AXK7L80223G AXK8L80124BG Notes:1.Regarding ordering units; During production: Please make orders in 1-reel units. Samples for mounting confirmation: Available in units of 50 pieces. Please contact us. Samples: Available. Please contact us. 2.The above part numbers are for connectors without positioning bosses, which are standard. When ordering connectors with positioning bosses, please contact our sales office. 3.Please contact us regarding different number of contacts. 4.“B” in the 11th digit of the header part number signifies a fork type soldering terminals to lessen the constraint on amount of solder when mounting, and a construction that makes it difficult when mounting for excess solder to interfere with the socket. Although compatible with the previous parts, these parts are not compatible with the recommended PC board pattern and recommended metal mask pattern. SPECIFICATIONS 1. Characteristics Item Specifications Conditions Rated current 0.3A/terminal (Max. 5 A at total terminals) — Rated voltage 60V AC/DC — Rated voltage is applied for one minute and check for Electrical Breakdown voltage 150V AC for 1 min. short circuit or damage with a detection current of 1mA characteristics Insulation resistance Min. 1,000MΩ (Initial) Using 250V DC megger (applied for 1 min.) Contact resistance Max. 90mΩ Based on the contact resistance measurement method specified by JIS C 5402. Ambient temperature –55°C to +85°C No freezing at low temperatures Max. peak temperature of 260°C (on the surface of the Infrared reflow soldering Soldering heat resistance PC board around the connector terminals) 300°C within 5 sec, 350°C within 3 sec. Soldering iron –55°C to +85°C (Product only) Storage temperature –40°C to +50°C (Emboss packing) No freezing at low temperatures Sequence 5 cycles, 1. –550°C, 30 min. Echnavriraocntemriesntitcasl T(hheeardmear l asnhdo csko crekesits mtaantceed) icnosnutlaactito rne sreisstiasntacnec me amxi.n 9. 01m00ΩMΩ, 23.. 8 ~5 +,03 –° 3MC,a 3x.0 5 m minin.. 4. ~ , Max. 5 min. Humidity resistance 1in2s0u lhaotiuorns ,resistance min. 100MΩ, Temperature 40±2°C, (header and socket mated) contact resistance max. 90mΩ humidity 90 to 95% R.H. S(haeltawdaetre ar nsdp rsaoyc rkeesti smtaantecde) 2icno4sn uhtlaoacutitro srne, sreisstiasntacnec me amxi.n 9. 01m00ΩMΩ, Tseamltwpaetreart ucroen 3ce5n±t2r°aCtio,n 5±1% H2S resistance 48 hours, Temperature 40±2°C, (header and socket mated) contact resistance max. 90mΩ gas concentration 3±1 ppm, humidity 75 to 80% R.H. Lifetime Repeated insertion and removal speed of max. 200 Insertion and removal life 50 times characteristics times/hours Unit weight 20 contacts; Socket: 0.03g Header: 0.01g — panasonic-electric-works.net/ac

AXK7L, 8L 2. Material and surface treatment Part name Material Surface treatment Molded portion LCP resin (UL94V-0) — Contact portion: Ni plating on base, Au plating on surface Terminal portion: Ni plating on base, Au plating on surface (Except for front edge of terminal) Contact/Post Copper alloy However, the area adjacent to the socket terminal is exposed to Ni on base. Soldering terminals: Socket: Ni plating on base, Pd + Au flash plating on surface (Expect for front edge of terminal) Header: Ni plating on base, Au plating on surface (Expect for front edge of terminal) DIMENSIONS (unit: mm) The CAD data of the products with a CAD Data mark can be downloaded from: http://panasonic-electric-works.net/ac • Socket (Mated height 0.9 mm) Dimension table (mm) CAD Data Number of contacts/ A B C Dimensions 10 4.4 1.6 3.0 Terminal coplanarity 12 4.8 2.0 3.4 0.87 0.08 14 5.2 2.4 3.8 (Contact and A This surface soldering terminals) 16 5.6 2.8 4.2 B00±..41005.1±±00..0053F Suctionface 0.80C0.5.0015 4.40 0.60Soldering terminals5.00 222223024680 678678......420864 445345......086642 567556......420086 32 8.8 6.0 7.4 F Soldering 0.10±0.03 34 9.2 6.4 7.8 0.40±0.05 terminals 36 9.6 6.8 8.2 C±0.15 F-F cross section 38 10.0 7.2 8.6 40 10.4 7.6 9.0 0) 5.0 44 11.2 8.4 9.8 ( 48 12.0 9.2 10.6 50 50 12.4 9.6 11.0 0. 54 13.2 10.4 11.8 General tolerance: ±0.2 60 14.4 11.6 13.0 66 15.6 12.8 14.2 70 16.4 13.6 15.0 80 18.4 15.6 17.0 • Header (Mated height: 0.9 mm) Dimension table (mm) CAD Data Number of contacts/ A B C Dimensions 10 4.0 3.74 1.6 12 4.4 4.14 2.0 14 4.8 4.54 2.4 Terminal coplanarity A 30 0.63 0.08 16 5.2 4.94 2.8 C00±..B14050.1±±00..0035 ±0.800.05±1.200.05Suction face 2. 0.65 (sCooldnetrainctg a tnedrm inals) 22220246 6667....0842 6656....19754444 4434....0864 3.36 4.10 2380 78..60 77..7344 55..62 32 8.4 8.14 6.0 Steormldeinrainlsg R0.15 34 8.8 8.54 6.4 R0.15 0.08±0.03 3368 99..26 98..3944 76..28 40 10.0 9.74 7.6 0.27 44 10.8 10.54 8.4 Soldering terminals 48 11.6 11.34 9.2 General tolerance: ±0.2 50 12.0 11.74 9.6 54 12.8 12.54 10.4 60 14.0 13.74 11.6 66 15.2 14.94 12.8 70 16.0 15.74 13.6 80 18.0 17.74 15.6 panasonic-electric-works.net/ac

AXK7L, 8L • Socket and header are mated Socket 5 1 Header 0. ± 0 9 0. EMBOSSED TAPE DIMENSIONS (unit: mm) (Common for respective contact type, socket and header) Tape dimensions (Conforming to JIS C 0806-1990. However, Plastic reel dimensions (Conforming to EIAJ ET–7200B) some tapes have mounting hole pitches that do not comply with the standard.) Tape I Tape II A±0.3 A±0.3 D±1 Taping reel C B 1.75 C 1.75 Top cover tape 4 4 dia. Embossed carrier tape Pull out direction 8.02 Pull out direction 8.02 380 Embossed mounting-hole 1.5+00. 1 dia. 1.5+00. 1 dia. TABLE OF DIMENSIONS Mated height Number of contacts Type of taping A B C D Quantity per reel Common for Max. 24 Tape I 16.0 — 7.5 17.4 3000 socket and header: 26 to 70 Tape I 24.0 — 11.5 25.4 3000 0.9mm 80 Tape II 32.0 28.4 14.2 33.4 3000 Connector orientation with respect to direction of progress of embossed tape Type Common for F4 Direction of tape progress Socket Header Note: There is no indication on this product regarding top-bottom or left-right orientation. panasonic-electric-works.net/ac

AXK7L, 8L For board-to-FPC Connectors for F4 inspection usage Series (0.4mm pitch) FEATURES APPLICATIONS 1. 3,000 insertion and removals (when Ideal for module unit inspection and as recommended) equipment assembly inspection 2. Same external dimensions and foot 5.0mm Socket 4.1mm Header p3.a Itmteprnro avse ds tmanadtianrgd type. Insertion and removal have become easier due to a reduction in the mating Compliance with RoHS Directive retention force required by the simple locking structure and also in the amount of force needed for insertion and removal. (We cannot warrant anything regarding mating retention.) TABLE OF PRODUCT TYPES ✩: Available for sale Product name Number of contacts F4 10 12 14 16 20 22 24 26 28 30 32 34 36 38 40 44 48 50 54 60 66 70 80 for inspection ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ Notes:1.Please inquire about numbers of contacts other than those given above. 2.Please inquire with us regarding delivery times. 3.Please keep the minimum unit for ordering no less than 50 pieces per lot. 4.Please inquire for further information. PRODUCT TYPES Specifications Part No. Specifications Part No. Socket Without positioning bosses AXK7LE∗∗26G Header Without positioning bosses AXK8LE∗∗26BG Notes:1.When placing an order, substitute the “∗” (asterisk) in the above part number with the number of contacts for the required connector. 2.The above part numbers are for connectors without positioning bosses, which are standard. When ordering connectors with positioning bosses, please contact our sales office. panasonic-electric-works.net/ac

AXK7L, 8L NOTES 1. Removal by pulling up from an end Socket Header causes the entire connector removal Recommended PC board pattern Recommended PC board pattern force to concentrate on the soldering (Mount pad arrangement pattern) (Mount pad arrangement pattern) terminals and end terminals. 1.40±0.03 1.40±0.03 Tthhee rseidfoer.e D, opilnegas seo l iwfti lal nadls roe mproevvee nfrto m 00..4203±±00..0033 C 0.40 00..2430±±00..0033 0.57±0.03 cracking of the soldered parts. ±3.600.03 ±4.000.03±5.600.03 Max. 2.20 ±4.700.03 333 : Insulation area 000 1.00±0.03 ±0.±0.±0. 000 442 0.1.3. Relation between connector and mounting pad (Max. 2.20) Mounting pad (3.20±0.03) NG (4.70±0.03) : Insulation area Pull Recommended metal mask pattern Recommended metal mask pattern Metal mask thickness: Here, 150 µm Metal mask thickness: Here, 150 µm (Terminal portion opening area ratio: 53 %) (Terminal portion opening area ratio: 52 %) (Metal portion opening area ratio: 100 %) (Metal portion opening area ratio: 80 %) 1.40±0.01 1.40±0.01 1.00±0.01 9) 0.46±0.01 5) 2. PC Boards and Recommended 4 4 0. 0. Metal Mask Patterns ( ( 11 Connectors are mounted with high 00 dmemn.sity, with a pitch interval of 0.4 to 0.5 ±5.600.01±3.600.01 ±4.420.01±5.400.01 ±0.01±0.01 ±3.600.±4.500. In order to reduce solder bridge and 40 40 0.20±0.01 ootfh seorl disesru aerse musaekde. sure the proper levels 1.00) 00..4200±±00..0011 C 0.40 1. 0. 0.40±0.01 ( The figures to the right are recommended Recommended metal mask pattern Recommended metal mask pattern metal mask patterns. Please use them as Metal mask thickness: Here, 120 µm Metal mask thickness: Here, 120 µm a reference. (Terminal portion opening area ratio: 66 %) (Terminal portion opening area ratio: 66 %) (Metal portion opening area ratio: 100 %) (Metal portion opening area ratio: 100 %) Iusnos pelddaer irtniinc tguh letae rhr, meifa iand aelolrst r ,o eitft amsioniglidnhegtr is 11..0400±±00..0011 (0.61) 10..4507±±00..0011 (0.57)±3.360.01 1 interfere with and cause incomplete 11 11 0 socket mating. Therefore, please ±0.0±0.0 ±0.0±0.0 ±00. follow the recommended 5.603.60 4.185.40 0.01 0.01 4.5 ± ± conditions give on the right. 1.00) 00..2400±±00..0011 C 0.40 1.40 0.40 00..4200±±00..0011 ( For other details, please verify with the product specification sheets. panasonic-electric-works.net/ac

NOTES FOR USING SMD TYPE CONNECTORS (Common) NOTES FOR USING SMD TYPE CONNECTORS (Common) Regarding the design of devices and PC board patterns 1) When connecting several connectors Example) Secure in place with screws connector and cause it to come loose. together by stacking, make sure to Therefore, make to design retaining Screw maintain proper accuracy in the design of plates or screws that will fix the connector structure and mounting equipment so in place. that the connectors are not subjected to Spacer Connector PC board 7) The narrow-pitch connector series is Spacer twisting and torsional forces. designed to be compact and thin. 2) With mounting equipment, there may Although ease of handling has been be up to a ±0.2 to 0.3-mm error in When connecting PC boards, take taken into account, take care when positioning. Be sure to design PC boards appropriate measures to prevent the mating the connectors, as displacement and patterns while taking into connector from coming off. or angled mating could damage or consideration the performance and 6) Notes when using a FPC. deform the connector. abilities of the required equipment. (1) When the connector is soldered to an 3) Some connectors have tabs embossed FPC board, during its insertion and on the body to aid in positioning. When removal procedures, forces may be using these connectors, make sure that applied to the terminals and cause the the PC board is designed with positioning soldering to come off. It is recommended holes to match these tabs. to use a reinforcement board on the 4) To ensure the required mechanical backside of the FPC board to which the strength when soldering the connector connector is being connected. Please terminals, make sure the PC board make the reinforcement board meets recommended PC board pattern dimensions bigger than the outer limits of design dimensions given. the recommended PC board pattern 5) For all connectors of the narrow-pitch (should be approximately 1 mm greater series, to prevent the PC board from than the outer limit). coming off during vibrations or impacts, Material should be glass epoxy or and to prevent loads from falling directly polyimide, and the thickness should be on the soldered portions, be sure to between 0.2 and 0.3 mm. design some means to fix the PC board (2) Collisions, impacts, or turning of FPC in place. boards, may apply forces on the Regarding the selection of the connector placement machine and the mounting procedures 1) Select the placement machine taking 4) Depending on the size of the into consideration the connector height, connector being used, self alignment required positioning accuracy, and may not be possible. In such cases, be packaging conditions. sure to carefully position the terminal with 2) Be aware that if the catching force of the PC board pattern. the placement machine is too great, it 5) The positioning bosses give an may deform the shape of the connector approximate alignment for positioning on body or connector terminals. the PC board. For accurate positioning of 3) Be aware that during mounting, the connector when mounting it to the PC external forces may be applied to the board, we recommend using an connector contact surfaces and terminals automatic positioning machine. and cause deformations. panasonic-electric-works.net/ac

NOTES FOR USING SMD TYPE CONNECTORS (Common) Regarding soldering 1. Reflow soldering For products other than the ones above, 4) Be aware that soldering while applying 1) Measure the recommended profile please refer to the latest product a load on the connector terminals may temperature for reflow soldering by specifications. cause improper operation of the placing a sensor on the PC board near 6) The temperatures are measured at the connector. the connector surface or terminals. (The surface of the PC board near the 5) Thoroughly clean the soldering iron. setting for the sensor will differ depending connector terminals. (The setting for the 6) Flux from the solder wire may get on on the sensor used, so be sure to sensor will differ depending on the sensor the contact surfaces during soldering carefully read the instructions that comes used, so be sure to carefully read the operations. After soldering, carefully with it.) instructions that comes with it.) check the contact surfaces and clean off 2) As for cream solder printing, screen 7) The temperature profiles given in this any solder before use. printing is recommended. catalog are values measured when using 7) For soldering of prototype devices 3) See the specifications and drawings the connector on a resin-based PC during product development, you can for the product in question for the metal board. When performed reflow soldering perform soldering at the necessary mask pattern diagrams. on a metal board (iron, aluminum, etc.) or locations by heating with a hot-air gun by 4) When mounting on both sides of the a metal table to mount on a FPC, make applying cream solder to the foot pattern PC board and the connector is mounting sure there is no deformation or beforehand. However, at this time, make on the underside, use adhesives or other discoloration of the connector beforehand sure that the air pressure does not move means to ensure the connector is and then begin mounting. connectors by carefully holding them properly fixed to the PC board. (Double 2. Hand soldering down with tweezers or other similar tool. reflow soldering on the same side is 1) Set the soldering iron so that the tip Also, be careful not to go too close to the possible.) temperature is less than that given in the connectors and melt any of the molded 5) N2 reflow, conducting reflow soldering table below. components. in a nitrogen atmosphere, increases the Table A 8) When soldering the shell terminals of, solder flow too greatly, enabling wicking for example, I/O connectors, avoid Product name Soldering iron temperature to occur. Make sure that the solder feed 300°C within 5 sec. applying an excessive amount of solder, rate and temperature profile are SMD type connectors 350°C within 3 sec. or it may flow into the shell. appropriate. Example: 2) Do not allow flux to spread onto the Soldering conditions Inflidge Industrial, Ltd. connector leads or PC board. This may Please use the reflow temperature profile Super Air Heater lead to flux rising up to the connector conditions recommended below for Digital temperature controller inside. reflow soldering. Please contact us Air heater with internal temperature 3) Touch the soldering iron to the foot before using a temperature profile other sensor pattern. After the foot pattern and than that described below (e.g. lead-free 3. Solder reworking connector terminal are heated, apply the solder). 1) Finish reworking in one operation. solder wire so it melts at the end of the • Narrow-pitch connectors 2) For reworking of the solder bridge, use connector terminals. (except P5 floating and P8 type) a soldering iron with a flat tip. To prevent ULopwpeerr lliimmiitteedd ((SSoollddeerr wheeattta rbeislitisyt)ance) Awpirpel yh ethree solder Soldeirirnogn flsuuxrf afrcoems, cdliom nboint ga dudp mtoo trhee fl cuoxn.tact Temperature 3) Keep the soldering iron tip temperature Peak temperature 226300°°CC Peak tempera2tu2r0e°C Terminal Small angle as below the temperature given in Table A. 118500°°CC P60re toh e12a0ti nsegc. 722050 0ss°eeCcc.. PC board p4o5s dseibglree ueps to 4fao)pr pW elyxhianemgn paslonel ,de Iex/Orcien csgos tnihvneee aschtmoerolslu ,t neatrv moofii dns aollsd eorf,, mation Time Pattern or it may flow into the shell. nfor I • Narrow-pitch connector (P5 floating, P8) Temperature 245°C max. Peak temperature 200°C 155 to 165°C Preheating 60 to 120 sec. Within 30 sec. Time panasonic-electric-works.net/ac

NOTES FOR USING SMD TYPE CONNECTORS (Common) Handling Single Cleaning flux from PC board Handling the PC board Components 1) To increase the cleanliness of the • Handling the PC board after cleaning fluid and cleaning operations, mounting the connector 1) Make sure not to drop or allow parts to prepare equipment for a cleaning When cutting or bending the PC board fall from work bench process that begins with boil cleaning, after mounting the connector, be careful 2) Excessive force applied to the ultrasonic cleaning, and then to vapor that the soldered sections are subjected terminals could cause them to warp, cleaning. to excessive forces. come out, or weaken the adhesive 2) Carefully oversee the cleanliness of strength of the solder. Handle with care. Do not the soldered areas to be subjected to forces the cleaning fluids to make sure that the 3) Repeated bending of the terminals contact surfaces do not become dirty may break them. from the cleaning fluid itself. 4) Do not use alcohol for cleaning. Doing 3) Since some powerful cleaning may so may whiten the surface of molded dissolve molded components of the parts. connector and wipe off printed letters, we recommend aqua pura electronic parts cleaners. Consult us if you wish other types of cleaning fluids. 4) Please note that the surfaces of molded parts may whiten when cleaned with alcohol. Storage of connectors 1) To prevent trouble from voids or air different times, and some connectors 4) Avoid storing the connectors in pockets by heat of reflow soldering, avoid more even change color slightly if locations with excessive dust. The dust storing the connectors in areas of high subjected to ultraviolet rays during may accumulate and cause improper humidity. When storing the connectors for storage. This is normal and will not affect connections at the contact surfaces. more than six months, be sure to store the operation of the connector. them in a storage area where the 3) When storing the connectors with the humidity is properly controlled. PC boards assembled and components 2) Depending on the connector type, the alreeady set, be careful not to stack them color of the connector may vary from up so the connectors are subjected to connector to connector if produced at excessive forces. Other Notes 1) These products are made for the 3) Before soldering, try not to insert or used for switching. design of compact and lightweight remove the connector more than 7) Be sure not to allow external pressure devices and therefore the thickness of the absolutely necessary. to act on connectors when assembling molded components has been made very 4) When coating the PC board after PCBs or moving in block assemblies. thin. Therefore, be careful during soldering the connector to prevent the insertion and removal operations for deterioration of insulation, perform the excessive forces applied may damage coating in such a way so that the coating the products. does not get on the connector. 2) Dropping of the products or rugged 5) There may be variations in the colors mishandling may bend or damage the of products from different production lots. terminals and even hinder proper reflow This is normal. soldering. 6) The connectors are not meant to be Regarding sample orders to confirm proper mounting When ordering samples to confirm proper mounting with the placement For other details, please verify with machine, connectors are delivered in 50- the product specification sheets. piece units in the condition given right. Consult a sale representative for ordering sample units. Condition when delivered from factory Reel (Delivery can also be made on a reel by Embossed tape Required number customer request.) of products for amount required for the mounting sample production (Unit 50 pcs.) panasonic-electric-works.net/ac